MPC8280VVUPEA - 450MHz PowerQUICC II SoC MPU | NXP
부품 번호: MPC8280VVUPEA ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $139.62 | $139.62 |
| 10 | $128.5 | $1,285.00 |
| 100 | $115.2 | $11,520.00 |
| 250 | $108.75 | $27,187.50 |
| 500 | $102.3 | $51,150.00 |
MPC8280VVUPEA 개요
A microprocessor (MPU) is an integrated circuit that contains the CPU, caches, memory controller and peripheral interfaces on one chip; in the PowerQUICC II family the core is paired with a dedicated RISC-based CPM that handles serial and networking I/O autonomously, making the device a single-chip SoC for embedded networking. The MPC8280 sits at the top of the G2_LE family, offering higher core and bus clock options than the lower-cost MPC8270 and MPC8275 variants.
Key features include 16 KB instruction cache and 16 KB data cache, dual 10/100 Mbps Ethernet MACs with MII/RMII interfaces, USB 1.1 host/function controller, dual HDLC/serial controllers supporting up to T3/E3 rates, a UTOPIA-II/PATM PHY interface for ATM, and a 32-bit/66 MHz PCI interface that can operate in host or agent mode. The integrated memory controller supports DDR SDRAM at up to 133 MHz and includes a 64-bit local bus with glue-less Flash/SRAM support.
Architecturally the device splits processing duties between the PowerPC G2_LE core (running user code and protocol stacks) and the CPM co-processor, which services DMA channels and protocol engines through its own microcoded RISC engine. This dual-engine approach delivers high sustained throughput on serial interfaces without burdening the main core with interrupt-driven I/O, characteristic of PowerQUICC II design.
Typical applications include industrial multi-port routers, DSLAM line cards, wireless base-station controllers, VoIP media gateways, industrial Ethernet switches, and PCI-based embedded control cards. The integrated CPM eliminates external protocol ASICs, reducing BOM cost in communications equipment.
When designing with this device, plan power sequencing for the 1.8 V and 3.3 V rails and ensure proper JTAG pull-ups. Designers should also budget for a substantial 4-layer PCB with matched-impedance Ethernet and PCI traces.
This page synthesizes distributor pricing, drop-in alternatives, and practical design guidance not found in the manufacturer datasheet, providing engineers a single reference for sourcing and substitution decisions.
드롭인 대체품: MPC8280VVUPEA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8280VVUPEA (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Serial Protocols, USB, Mounting Type, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8280ZUUPEA
✅ 드롭인✓ 재고 있음
$126.75 / 개
데이터시트 보기 →MPC8280CVVUPEA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8270VVUPEA
✅ 드롭인✓ 재고 있음
$145 / 개
데이터시트 보기 →MPC8270CZUUPEA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8280VVUPEA 최대 정격 & 전기적 특성
| Core Architecture | PowerPC G2_LE (e603e) |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32 bit |
| 최대 클록 주파수 | 450 MHz |
| Performance | 885 MIPS |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| 동작 온도 | 0C to +105C |
| 패키지 | 480-TBGA (37.5x37.5 mm) |
| 실장 유형 | Surface Mount |
| Ethernet MAC | Dual 10/100 Mbps (MII/RMII) |
| USB | USB 1.1 Host/Function |
| PCI | 32-bit / 66 MHz PCI 2.2 |
| Memory Controller | DDR SDRAM up to 133 MHz, 64-bit local bus |
| Serial Protocols | HDLC, TDM, UTOPIA-II/PATM, ATM |
| Process Technology | 0.13 um HiPerMOS7 (HiP7) |
MPC8280VVUPEA 480-tbga (37.5x37.5 mm) 핀 구성 가이드
MPC8280VVUPEA(480-tbga (37.5x37.5 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8280VVUPEA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8280VVUPEA 적합 용도: 6 애플리케이션s: Industrial Multi-Port Routers, DSLAM Line Cards, Wireless Base Station Controllers, VoIP Media Gateways, Industrial Ethernet Switches, PCI Embedded Control Cards.
Industrial Multi-Port Routers
The MPC8280VVUPEA is a strong fit for industrial multi-port routers because it integrates dual 10/100 Ethernet MACs, a 32-bit/66 MHz PCI controller and the CPM co-processor that offloads HDLC, TDM and ATM DMA. With 885 MIPS of core performance at 450 MHz the G2_LE core can sustain NAT, routing table lookup and firewall filter workloads while the CPM services multiple T1/E1 framers through its serial channels. The DDR SDRAM controller with 64-bit local bus supports the high memory bandwidth needed for routing table caches. This combination lets a single chip replace a CPU plus external MAC and PCI bridge, cutting BOM cost for industrial router SKUs that previously required discrete components.
추천
DSLAM Line Cards
In DSLAM line card designs the MPC8280VVUPEA drives per-line traffic aggregation through its UTOPIA-II/PATM PHY interface, supporting 8-32 concurrent ATM channels without external glue logic. The CPM's RISC engine handles ATM SAR and HDLC framing autonomously at up to T3/E3 rates, freeing the 450 MHz G2_LE core to run the control plane and provisioning stack. PCI in agent mode allows a control-card CPU to enumerate the line card for management, while the integrated memory controller drives a local bank of DDR for cell buffering. Industrial 0-105C operation suits outdoor cabinet deployments where line cards must tolerate elevated ambient temperatures.
추천
Wireless Base Station Controllers
The MPC8280VVUPEA serves as the control CPU in 2G/3G wireless base station controllers, where its dual Ethernet and HDLC channels connect to baseband cards over E1/T1 links. The 16 KB instruction and 16 KB data caches sustain deterministic interrupt latency for time-critical radio resource management, while the 64-bit local bus allows glueless SRAM for fast code execution. With 885 MIPS available the G2_LE core can run the Layer 2/3 control stack alongside OAM messaging without starving the CPM's HDLC servicing. The 480-TBGA package's large ground plane aids thermal dissipation in sealed cabinet enclosures.
추천
VoIP Media Gateways
VoIP media gateways leverage the MPC8280VVUPEA's Ethernet and HDLC channels for SIP signalling, RTP media and PSTN TDM interfacing on a single chip. The dual 10/100 Ethernet MACs segregate signalling and media VLANs, while the CPM's TDM channel supports DS0 multiplexing for T1/E1 PSTN trunks. The 450 MHz core handles G.711/G.729 codec transcoding for low-channel-count gateways; for higher density a second MPC8280 can be ganged over the PCI bus. Industrial 0-105C operation matches typical carrier-grade equipment thermal envelopes.
추천
Industrial Ethernet Switches
Layer-2 industrial Ethernet switches use the MPC8280VVUPEA as a management CPU and uplink router, with the dual MACs providing management and uplink ports and PCI bridging external PHY/PoE controllers. The CPM's HDLC channel can carry RS-232/RS-485 console and management traffic alongside, eliminating a separate UART IC. With 885 MIPS the G2_LE core runs SNMP, RSTP and Web UI stacks without external memory bottlenecks thanks to the integrated DDR controller. The 480-TBGA's 37.5x37.5 mm footprint fits standard industrial switch PCB form factors.
추천
PCI Embedded Control Cards
PCI embedded control cards use the MPC8280VVUPEA as the on-card CPU, with the 32-bit/66 MHz PCI controller acting in host mode to scan backplane peripherals or in agent mode to expose the card as a PCI slave. The 64-bit local bus glues to on-card SRAM and Flash for deterministic real-time response, while the dual Ethernet MACs provide redundant uplink connectivity for fault-tolerant control systems. Industrial 0-105C operation covers factory floor and outdoor cabinet installations; the 480-TBGA footprint is suitable for standard 6U/3U CompactPCI card outlines with appropriate layout.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8280VVUPEA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8280ZUUPEA | MPC8280CVVUPEA | MPC8270VVUPEA | MPC8270CZUUPEA |
|---|---|---|---|---|---|
| Package | 480-TBGA (37.5x37.5) | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same | 480-TBGA (37.5x37.5) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Frequency | 450 MHz | 450 MHz | 450 MHz | 350 MHz | 350 MHz |
| Performance (MIPS) | 885 MIPS | 885 MIPS | 885 MIPS | ~688 MIPS | ~688 MIPS |
| Security Engine | Present | Removed (Z suffix) | Present | Present | Removed (Z suffix) |
| Temperature Grade | Industrial (0 to 105C) | Industrial (0 to 105C) | Commercial (0 to 70C) | Industrial (0 to 105C) | Commercial (0 to 70C) |
| Ethernet MACs | Dual 10/100 | Dual 10/100 | Dual 10/100 | Dual 10/100 | Dual 10/100 |
| PCI Interface | 32-bit/66 MHz | 32-bit/66 MHz | 32-bit/66 MHz | 32-bit/66 MHz | 32-bit/66 MHz |
| Lifecycle Status | NRND / Last Time Buy | NRND / Last Time Buy | NRND / Last Time Buy | NRND / Last Time Buy | NRND / Last Time Buy |
| Unit Price (USD, qty 1, as of 2026-10-16) | $139.62 | $125-145 (broker stock) | $120-140 (broker stock) | $95-115 (broker stock) | $85-105 (broker stock) |
주요 차별점
- Highest-speed variant in the PowerQUICC II family (vs MPC8270VVUPEA)
- Includes on-chip security engine for crypto acceleration (vs MPC8280ZUUPEA)
- Industrial 0-105C temperature grade vs commercial-only (vs MPC8280CVVUPEA)
- Integrated CPM co-processor eliminates external protocol ASICs (vs Generic ARM-based SoCs without CPM)
설계 노트
The MPC8280VVUPEA requires separate 1.8 V core and 3.3 V I/O rails; power sequencing must hold the core rail until I/O is stable to prevent latch-up. Estimated: at 450 MHz with CPM and dual Ethernet active, typical core draw is 1.5-2.0 A from the 1.8 V rail; verify against the 'Power Considerations' chapter of the NXP datasheet and budget 4-5 W total board dissipation. Use a low-impedance 4-layer PCB with a dedicated core plane to minimize supply droop during CPM DMA bursts.
The 480-TBGA package uses a 1.27 mm pitch BGA that requires via-in-pad or dog-bone fanout with microvia stackups (laser-drilled 0.1 mm vias recommended). Provide a continuous ground plane beneath the BGA and matched 50 ohm impedance traces for Ethernet MII/RMII and PCI signals. Reference the NXP AN-3660 layout application note for stackup guidance, and place decoupling 0.1 uF + 10 uF pairs within 5 mm of every power pin.
Common pitfalls when designing with the MPC8280VVUPEA: (1) omitting the external PLL loop filter components on the SYSCLK pins, which prevents core lock; (2) leaving JTAG TRST floating - it must be pulled low through 4.7K for proper boundary-scan operation; (3) failing to initialize the CPM dual-port RAM before driver bring-up; (4) routing PCI and Ethernet MII signals over a split reference plane, which causes signal-integrity failures. Always validate with the official NXP reference design schematic before tape-out.
Estimated: the 480-TBGA package has a theta_JA of approximately 12-15 C/W with a standard 4-layer JEDEC test board. At 5 W dissipation this yields a 60-75 C junction temperature rise above ambient; with a 105 C junction limit the design has a 30-45 C ambient budget. For sealed enclosures plan to mount a small clip-on heatsink or thermal pad over the TBGA, and keep high-power companion ICs away from the BGA to avoid hotspot interaction.
규정 준수 정보
RoHS/REACH/halogen-free status not present in the verified search snippets; consult the NXP product page or request the material declaration from Rochester Electronics for an authoritative answer. AEC-Q100 is not applicable for industrial/embedded MPU products of this class.
