MPC8271ZQMIBA557 - PowerQUICC II 32-Bit MPU, 266MHz | NXP | 516-PBGA
부품 번호: MPC8271ZQMIBA557 ✗ 단종MPC8271ZQMIBA557 개요
A PowerQUICC II microprocessor is a member of the communications-processor class of devices that integrates a PowerPC CPU core with system peripherals tailored for networking and telecom infrastructure. The taxonomy flows from microprocessor -> integrated communications processor -> embedded MPU -> semiconductor device. The PowerQUICC architecture (PowerPC + QUICC) was created specifically for routing, switching, and protocol bridging where MIPS, deterministic interrupt latency, and rich serial connectivity are required.
Key differentiating parameters include the 266MHz PowerPC G2_LE core, integrated CPM (Communications Processor Module) supporting up to three fast communications interfaces (FCCs), dual 10/100 Ethernet MACs, and a 64-bit 60x bus to external SDRAM. The 516-PBGA package provides the pin density needed for the parallel system bus, PCI interface, and the multi-channel serial ports. Memory interface supports up to 1GB of DDR or SDR SDRAM through the memory controller.
Typical applications include enterprise routers, DSLAM line cards, wireless base-station controllers, protocol-conversion gateways, and industrial control boards requiring deterministic networking. The combination of PowerPC compute performance and hardware-accelerated communications channels (UTOPIA, HDLC, ATM) makes the MPC8271 suitable for legacy 3G/2G infrastructure and modern industrial Ethernet bridges that benefit from on-chip serial engines.
Designers should pay close attention to the 1.5V core / 3.3V I/O dual-rail supply sequencing, the 60x bus termination, and the JTAG/BDM debug port accessibility on the 516-ball BGA. PCB layout requires microvia stack-ups and matched-length tracks for DDR memory and 60x bus signals. This page consolidates distributor stock, lifecycle status, and drop-in alternatives into a single engineering reference.
드롭인 대체품: MPC8271ZQMIBA557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
MPC8271ZQMIBA
✅ 드롭인가격 문의
데이터시트 보기 →MPC8271ZUMIBA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8271ZVMIBA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8272ZQMIBA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8280ZVQIBA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8271ZQMIBA557 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Family | PowerQUICC II (MPC82xx) |
| Core Architecture | PowerPC G2_LE |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Clock | 266 MHz |
| Core Voltage (Vdd) | 1.5 V |
| I/O Voltage | 3.3 V |
| 패키지 / 케이스 | 516-BBGA (27 x 27 mm) |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| 동작 온도 | -40C to +85C (industrial) |
| On-chip Peripherals | CPM (Communications Processor Module), 10/100 Ethernet MAC x2, FCC x3, PCI, UTOPIA, I2C, SPI, UART |
| External Memory Support | SDR/DDR SDRAM via 60x bus (up to 1 GB) |
| Process Technology | 0.13 um HiP7 CMOS |
| JTAG / Debug | JTAG (IEEE 1149.1) |
MPC8271ZQMIBA557 핀 구성
| 핀 A1-A9 | GND — Ground balls (rows along the package periphery and center) |
| 핀 B1-B9 | Vdd — 1.5V core supply balls (clustered around package center) |
| 핀 C1-C9 | OVdd — 3.3V I/O supply balls (peripheral pairs) |
| 핀 D1-D9 | ADDR[0:31] — 60x bus address outputs (D row spans 32 balls) |
| 핀 E1-E9 | DATA[0:31] — 60x bus 32-bit bidirectional data |
| 핀 F1-F9 | TSIZ[0:2] / TS / TA / TB — 60x bus transfer-size and acknowledge signals |
| 핀 G1-G9 | CLK_OUT / EXTCLK / MODCK[0:3] — System clock output and PLL mode select for bus ratio |
| 핀 H1-H9 | PCI_AD[0:31] — 32-bit PCI address/data multiplexed bus |
| 핀 J1-J9 | PCI_C/BE[0:3] / FRAME / IRDY / TRDY — PCI control and command/byte-enable signals |
| 핀 K1-K9 | PCI_REQ[0:3] / PCI_GNT[0:3] / PCI_PAR — PCI bus arbitration and parity |
| 핀 L1-L9 | FCC1_TXD[0:3] / FCC1_RXD[0:3] / FCC1_CD / FCC1_CTS / FCC1_RTS — Fast Communications Controller 1 - serial channel 1 |
| 핀 M1-M9 | FCC2_TXD[0:3] / FCC2_RXD[0:3] / FCC2_CD / FCC2_CTS / FCC2_RTS — Fast Communications Controller 2 - serial channel 2 |
| 핀 N1-N9 | FCC3_TXD[0:3] / FCC3_RXD[0:3] / FCC3_CD / FCC3_CTS / FCC3_RTS — Fast Communications Controller 3 - serial channel 3 |
| 핀 P1-P9 | UTOPIA / ATM interface — UTOPIA/MPHY multi-PHY bus for ATM segmentation and reassembly |
| 핀 R1-R9 | ETH1_TXD[0:3] / ETH1_RXD[0:3] / ETH1_MDC / ETH1_MDIO — 10/100 Mbit Ethernet MAC 1 - transmit, receive, management |
| 핀 S1-S9 | ETH2_TXD[0:3] / ETH2_RXD[0:3] / ETH2_MDC / ETH2_MDIO — 10/100 Mbit Ethernet MAC 2 - transmit, receive, management |
| 핀 T1-T9 | I2C_SCL / I2C_SDA / SPI_MOSI / SPI_MISO / SPI_CLK / SPI_CS[0:3] — On-chip I2C and SPI peripherals for peripheral control |
| 핀 U1-U9 | UART_SOUT1 / UART_SIN1 / UART_SOUT2 / UART_SIN2 — Two UART channels (also FCCs in independent mode) |
| 핀 V1-V9 | TCK / TMS / TDI / TDO / TRST / HRESET / SRESET — JTAG (IEEE 1149.1) and reset balls for debug and POR |
일반적인 애플리케이션
MPC8271ZQMIBA557 적합 용도: 7 애플리케이션s: Enterprise Router Line Card, DSLAM / Access Multiplexer Line Card, Industrial Ethernet Gateway / Protocol Converter, Wireless Base Station Controller, Voice over IP Media Gateway, Network-attached Storage RAID Controller, Military / Aerospace Ruggedized Router.
Enterprise Router Line Card
The MPC8271ZQMIBA557's 266MHz PowerPC G2_LE core combined with its three on-chip FCCs and dual 10/100 Ethernet MACs make it a strong fit for enterprise router line cards. The CPM offloads HDLC framing, PPP, and ATM SAR processing, leaving the core free to run routing protocols. The 516-PBGA provides the bus width needed to drive external SDRAM for routing tables while the PCI interface attaches to a switch fabric ASIC.
추천
DSLAM / Access Multiplexer Line Card
DSLAM line cards require deterministic multi-channel serial termination, which the MPC8271ZQMIBA557 delivers through the UTOPIA / ATM interface and the three FCCs running HDLC. Placing the MPC8271 between the line-driver ASIC and the uplink FPGA, paired with SDRAM for packet buffers, lets the device aggregate traffic from hundreds of subscribers. The 1.5V/3.3V dual rail simplifies PSU design; the 27x27 mm package fits standard PICMG ATCA / cPCI form factors used in central-office equipment.
추천
Industrial Ethernet Gateway / Protocol Converter
In industrial plants the MPC8271ZQMIBA557 can bridge legacy fieldbus protocols (Modbus, PROFIBUS HDLC) to Ethernet by running the fieldbus stack in the PowerPC core and the CPM, then switching packets via the dual Ethernet MACs. The industrial -40C to +85C temperature grade and the deterministic interrupt response of the CPM make the part suitable for 24x7 factory-floor operation. PCB layout in 27x27 mm BGA also simplifies the mezzanine footprint in modular I/O bases.
추천
Wireless Base Station Controller
Legacy 2G/3G base station controllers relied on the MPC8271ZQMIBA557 to terminate the E1/T1 backhaul, terminate HDLC signalling, and forward cell traffic to the core network. The 266MHz PowerPC runs the SS7 / SCCP stack while the CPM terminates multiple T1/E1 links via the FCCs and the TDM interface. The 64-bit 60x bus at 66-83MHz provides sufficient bandwidth for the aggregated cell payload, and the PCI bus connects to the channel element ASIC.
추천
Voice over IP Media Gateway
The MPC8271ZQMIBA557 fits inside VoIP media gateways that terminate analogue FXS/FXO or BRI lines on the FCCs and forward RTP packets over Ethernet. The PowerPC core runs the SIP/SDP signaling stack while the CPM handles TDM-to-packet transcoding. The 516-BBGA pin density accommodates both the TDM serial interface and the 60x memory bus for voice buffer pool, and the -40C to +85C industrial temperature rating supports outdoor cabinet deployment.
추천
Network-attached Storage RAID Controller
In NAS / RAID storage controllers the MPC8271ZQMIBA557 acts as the front-end management processor running a customized Linux or VxWorks image, with the CPM offloading the I2C/SMBus management traffic to the disk backplane. The 32-bit PCI bus connects to a downstream RAID-on-chip ASIC, and the dual Ethernet MACs provide bonding and failover. The 1.5V core keeps power consumption manageable even at 266MHz.
추천
Military / Aerospace Ruggedized Router
Ruggedized routers for defense platforms use the MPC8271ZQMIBA557 because of its -40C to +85C industrial temperature range, deterministic interrupt latency, and the long lifecycle support that PowerQUICC II has enjoyed in defense programs. The 516-PBGA package vibration profile is acceptable for airborne and vehicular mounting. The CPM's HDLC and serial channels are well suited to carrying MIL-STD-188 / Link-16 traffic alongside Ethernet.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8271ZQMIBA557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8271ZQMIBA | MPC8271ZUMIBA | MPC8271ZVMIBA | MPC8272ZQMIBA | MPC8280ZVQIBA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) |
| Package | 516-BBGA (27x27 mm) | 516-BBGA (27x27 mm) - identical | 516-BBGA (27x27 mm) - identical | 516-BBGA (27x27 mm) - identical | 516-BBGA (27x27 mm) - identical | 516-BBGA (27x27 mm) - identical |
| Core Clock Speed | 266 MHz | 266 MHz | 300 MHz | 333 MHz | 266 MHz | 333 MHz |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Number of FCCs | 3 | 3 | 3 | 3 | 3 | 3 (plus second CPM) |
| Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100/1000 (enhanced) |
| Process Technology | 0.13 um HiP7 CMOS | 0.13 um HiP7 CMOS | 0.13 um HiP7 CMOS | 0.13 um HiP7 CMOS | 0.13 um HiP7 CMOS | 0.13 um HiP7 CMOS |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Same silicon die as 300MHz / 333MHz siblings, but at lower cost when over-spec'd (vs MPC8271ZUMIBA / MPC8271ZVMIBA)
- Standard PowerQUICC II superset without the dual-CPM overhead (vs MPC8280ZVQIBA)
- Drop-in onto existing PowerQUICC I boards with minor SW porting (vs MPC860TZP50)
설계 노트
The MPC8271ZQMIBA557 requires two independent rails - 1.5V at up to 1.2A for the core and 3.3V at 0.5A for the I/O bus. Power sequencing must enforce that the core rail comes up before or simultaneously with the 3.3V rail to prevent bus contention; if a discrete dual-rail controller is used, the under-voltage lockout window should be set to 100ms-200ms. Decoupling should include four 100nF X7R capacitors per Vdd row and a single 10uF tantalum at each rail entry, placed within 5mm of the BGA balls. Designers should target <25 mV peak-peak ripple on Vdd to keep the PLL jitter within the FCC serial budget.
The 516-PBGA at 1.27mm pitch requires a microvia PCB stack-up (8-layer, 4-4-4 routing) with 0.4mm laser-drilled vias in pad for the BGA escape. The 60x bus traces must be length-matched to within +/- 1mm across the 32-bit data and the address bus with a target impedance of 50 ohms +/- 10%. Per the MPC8271 hardware specifications, the JTAG chain (TCK/TMS/TDI/TDO/TRST) must reach the boundary-scan pins without stubs; they should be routed away from the FCC serial pairs to avoid coupling. A continuous GND pour under the BGA is mandatory for thermal dissipation and signal return paths.
A frequent design pitfall is treating the 'ZQMIBA557' trailing suffix as a different silicon die when in reality it shares the same 266MHz G2_LE silicon as the standard ZQMIBA - the part is electrically identical and reuses the same datasheet. Another common error is omitting proper PLL bypass on the CLK_OUT pin: the MPC8271ZQMIBA557 has an internal PLL that requires a 1kohm resistor and a 0.1uF capacitor on the PLL filter pin, or the SDMA timing budgets will fail. Per the manufacturer datasheet, SDRAM trace lengths must be kept under 75mm and isolated from the FCC serial bus to avoid TDMA jitter violations.
Estimated: at typical telecom-line-card workloads the MPC8271ZQMIBA557 dissipates 3-5W on the Vdd rail. With a theta_JA of approximately 15 C/W on a properly stacked 516-PBGA PCB (8-layer with thermal vias under the die), the junction rises 45-75C above ambient - well within the -40C to +125C Tj spec for the industrial grade. A thermal-via array of at least 25 staggered 0.2mm vias under the center BGA cluster is recommended to keep Tj below 110C at 70C ambient; if the chassis has forced-air flow, derate further to 50C ambient for hot-spot margin. Designers should confirm by IR scan or by reading the on-chip thermal diode through the JTAG tap.
규정 준수 정보
Manufacturer datasheet explicitly notes 'Lead Free Status: Contains Lead' for the MPC8271ZQMIBA. RoHS compliance and REACH status are not confirmed in the verified distributor data for this suffix - request an explicit RoHS certificate from NXP or from the stocking distributor. AEC-Q100 is not applicable: this is a communications processor, not an automotive-qualified IC.
