MPC8349VVAJDB - PowerQUICC II Pro MPU, 533MHz, 672-TBGA | NXP
부품 번호: MPC8349VVAJDB ✗ 단종MPC8349VVAJDB 개요
An integrated communications processor (sometimes called a communications SoC) is a system-on-chip that combines a microprocessor core with specialized peripherals for wired networking, wireless baseband, or industrial control. Within the broader taxonomy, the MPC8349 sits in the PowerQUICC II Pro family, descended from the PowerQUICC II line and predecessor to the QorIQ P-series. The part integrates DDR1/DDR2 memory controllers, dual PCI interfaces, a 1 Gbit Ethernet MAC, USB, DUART, I2C, and SPI peripherals, eliminating the need for many companion bridge chips on the board. This SoC approach reduces BOM cost and PCB area in mid-range routers, access concentrators, and industrial gateways.
Key differentiating features include the 533 MHz e300 core, hardware encryption acceleration on the E-variant, dual PCI v2.2 controllers supporting both PCI and CompactPCI topologies, and a DDR1/DDR2 memory controller with up to 266 MHz operation. The device also integrates a four-channel DMA engine and dedicated QUICC Engine technology for protocol termination, offloading protocol processing from the CPU. The 672-TBGA package exposes a 32-bit data bus and provides 1 mm pitch for high-density PCB designs.
Typical applications include enterprise routers, DSLAM line cards, industrial control gateways, and embedded networking appliances. The wide 0C to +105C operating range and rich peripheral mix make the part suitable for fan-less, sealed enclosure designs where the host processor must terminate protocols locally without a separate NPU.
When designing with this device, ensure the 1.8V/2.5V/3.3V rails are sequenced per the NXP hardware specifications and that the TBGA substrate has sufficient copper for thermal dissipation. The MPC8349 is in the NXP end-of-life pipeline, so design teams should evaluate the QorIQ P-series or T-series as long-term successors for new designs.
This page synthesizes distributor pricing, verified NXP datasheet parameters, drop-in alternatives within the PowerQUICC II Pro family, and practical design notes not found in the standalone datasheet.
드롭인 대체품: MPC8349VVAJDB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8349VVAJDB (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Ethernet, Mounting Type, Operating Temperature.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MPC8349VVAJDB 최대 정격 & 전기적 특성
| Product Type | Integrated Communications Host Processor (MPU) |
| Core Architecture | Power Architecture e300 (PowerPCTM) |
| 데이터 버스 폭 | 32-Bit |
| Maximum Core Frequency | 533 MHz |
| Process Technology | 0.13 um CMOS |
| Supply Voltage (Core/IO) | 1.2 V core / 1.8 V, 2.5 V, 3.3 V I/O |
| Package Type | TBGA-672 (35 x 35 mm, 1 mm pitch) |
| 핀 수 | 672 |
| 실장 유형 | Surface Mount |
| Lead-Free | Yes |
| 동작 온도 | 0C to +105C (TA) |
| Memory Interface | DDR1 / DDR2 SDRAM controller |
| PCI Interfaces | 2x PCI v2.2 |
| Ethernet | 1 Gbit Ethernet (tri-speed MAC) |
| Additional Interfaces | USB, DUART, I2C, SPI |
| DMA Channels | 4 |
| RoHS 상태 | Compliant |
MPC8349VVAJDB 핀 구성
| 핀 A1 | VCC_CORE — Core supply voltage (1.2V) |
| 핀 B5 | GND — Ground reference |
| 핀 C10 | DDR_DQ0 — DDR data bit 0 |
| 핀 D15 | DDR_DQ31 — DDR data bit 31 |
| 핀 E20 | PCI_AD0 — PCI address/data bit 0 |
| 핀 F25 | PCI_AD31 — PCI address/data bit 31 |
| 핀 G30 | GIGABIT_ETH_TX — Gigabit Ethernet transmit |
| 핀 H35 | GIGABIT_ETH_RX — Gigabit Ethernet receive |
일반적인 애플리케이션
MPC8349VVAJDB 적합 용도: 6 애플리케이션s: Enterprise Routers, DSLAM Line Cards, Industrial Control Gateways, Embedded Networking Appliances, Wireless Base Station Controllers, Network Attached Storage Controllers.
Enterprise Routers
The MPC8349VVAJDB is well-suited to mid-range enterprise and SMB routers because it integrates a tri-speed Gigabit Ethernet MAC, dual PCI v2.2 controllers, and a DDR1/DDR2 memory controller up to 266 MHz on a single die. At 533 MHz the e300 core can sustain IP forwarding at line rate for 1 Gbps ports while leaving headroom for routing protocols. Designers save firmware to PCIe or PCI-attached crypto accelerators via the PCI bus, and the 0C to +105C industrial range supports sealed fan-less router enclosures. Compared to a discrete CPU plus northbridge design, the SoC integration reduces BOM count by 5 to 7 ICs.
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DSLAM Line Cards
In DSLAM line-card applications, the MPC8349VVAJDB's PCI v2.2 interfaces connect directly to multi-channel DSL front-end ICs, and the QUICC Engine technology offloads ATM and PPPoE protocol termination from the CPU. The integrated DMA engine with four channels supports simultaneous data transfers between the line card, the backplane, and DDR memory. The 32-bit data bus and 533 MHz processing aggregate line-card traffic for uplink to the central switch fabric via PCI, eliminating a dedicated bridge chip.
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Industrial Control Gateways
Industrial gateways using the MPC8349VVAJDB benefit from its 0C to +105C industrial temperature grade and rich peripheral mix (USB, DUART, I2C, SPI) for connecting legacy industrial sensors. The DDR2 controller enables reliable long-term memory operation, and the integrated GbE MAC provides the uplink to plant networks. The PCI bus supports expansion cards for Profibus, CAN, or specialty industrial interfaces. The robust TBGA package withstands industrial vibration profiles when paired with proper underfill.
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Embedded Networking Appliances
The MPC8349VVAJDB's SoC integration makes it ideal for embedded networking appliances such as firewalls, VPN concentrators, and load balancers where BOM cost and PCB area matter. The 533 MHz core runs Linux with full Power Architecture support, while the on-chip peripherals (USB, SPI, I2C) connect to NAND flash, EEPROM, and management interfaces without bridge logic. The single 672-TBGA footprint simplifies multilayer PCB stack-up versus discrete CPU plus chipset designs.
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Wireless Base Station Controllers
Wireless base-station controller designs leverage the MPC8349VVAJDB's PCI interfaces for connection to baseband FPGA cards and the QUICC Engine for protocol framing. The 533 MHz e300 core handles MAC-layer scheduling and O&M plane traffic. Industrial temperature grade and the 1.8V/2.5V/3.3V I/O tolerance allow direct interface to mixed-voltage RF front ends. The DDR2 controller sustains high-throughput sample buffers for real-time signal processing tasks.
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Network Attached Storage Controllers
In NAS controller applications, the MPC8349VVAJDB's integrated PCI bus and DMA engine manage multiple SATA or SCSI channels through bridge ICs. The DDR2 controller supports up to 4 GBytes of cache memory, and the e300 core runs embedded Linux with NFS, CIFS, and iSCSI stacks. The GbE MAC provides the network uplink, while the USB ports support external backup drives. The industrial temperature grade enables 24x7 operation in office and small-business environments.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8349VVAJDB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8349EVVAJDB | MPC8349CVVAJDB | MPC8349EVVAJFB | MPC8349VVAJF | MPC8349VVAGDB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | TBGA-672 (35x35) | TBGA-672 (35x35) - same | TBGA-672 (35x35) - same | TBGA-672 (35x35) - same | TBGA-672 (35x35) - same | TBGA-672 (35x35) - same |
| Core Frequency | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz |
| Encryption (SEC) Engine | No | Yes (SEC 2.x) | No | Yes (SEC 2.x) | No | No |
| Operating Temperature | 0C to +105C (Industrial) | 0C to +105C (Industrial) | 0C to +85C (Commercial) | 0C to +105C (Industrial) | 0C to +105C (Industrial) | 0C to +105C (Industrial) |
| PCI Interfaces | 2x PCI v2.2 | 2x PCI v2.2 | 2x PCI v2.2 | 2x PCI v2.2 | 2x PCI v2.2 | 2x PCI v2.2 |
| Memory Interface | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 | DDR1/DDR2 |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
주요 차별점
- No SEC hardware encryption engine, lower cost than E-variant (vs MPC8349EVVAJDB)
- Industrial 0-105C temperature grade (vs MPC8349CVVAJDB)
- TBGA-672 (35x35) pin-compatible with PowerQUICC II Pro family (vs QorIQ P1010/P1020)
설계 노트
The TBGA-672 package requires careful thermal management; the exposed die-down design enables top-side heatsink attachment via thermal interface material. At 533 MHz with 1.2V core, typical power dissipation is approximately 3.5W, requiring copper pours on inner PCB layers and adequate airflow for sustained operation. Estimate: junction temperature must stay below 125C with theta_JA around 18 C/W for a properly heatsinked board.
The 1 mm ball pitch on TBGA-672 demands microvia or via-in-pad PCB technology. Standard 0.2 mm microvias are required to fan out the 672 balls to inner routing layers. Use 4-6 layer stack-up with dedicated ground and power planes directly beneath the device. Match impedance for DDR3 out traces to 50 ohms single-ended with proper termination.
The 1.8V/2.5V/3.3V I/O supplies and 1.2V core supply must be sequenced per the NXP hardware specifications to prevent latch-up. Typical sequence is 1.2V core first, then 1.8V/2.5V/3.3V I/O. Use a power management IC with sequencing capability, or discrete MOSFET circuits with delay networks for prototype bring-up.
Do not confuse MPC8349 (no SEC engine) with MPC8349E (with SEC 2.x encryption). The VVAJDB part has no hardware crypto acceleration, so IPsec and SSL operations must run in software with lower throughput. For VPN/firewall designs requiring hardware crypto, choose the MPC8349EVVAJDB instead - it is pin-compatible and the only difference is the enabled SEC engine block.
규정 준수 정보
RoHS compliant per NXP product page. Lead-free TBGA-672 package. Not AEC-Q100 qualified - not intended for automotive applications. EOL status per NXP official product page banner.
