MPC8535ECVTAKGA557 - 600MHz PowerQUICC III e500 MPU | NXP
부품 번호: MPC8535ECVTAKGA557 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $261.5 | $2,615.00 |
| 100 | $232 | $23,200.00 |
| 500 | $198.75 | $99,375.00 |
| 1,000 | $175.5 | $175,500.00 |
MPC8535ECVTAKGA557 개요
A microprocessor (MPU) is a single-chip CPU with on-chip caches, memory management, and peripheral controllers, sitting at the top of a typical embedded hierarchy (MPU -> SoC -> integrated circuit -> semiconductor). The MPC85xx family integrates communications peripherals alongside the e500 core, allowing wired networking, storage, and industrial control firmware to run on one chip without an external controller ASIC.
Key features include the 600MHz e500 core with double-precision FPU, integrated L1/L2 caches, an enhanced local bus controller, DDR memory controller, multiple Gigabit Ethernet MACs, and PCI/PCI-X interfaces. The 1V core rail keeps active power modest for its performance tier, while the FC-PBGA package supplies the ball density required for the wide external memory and I/O buses.
The MPC8535E uses a Book E/embedded PowerPC architecture with hardware table-walk MMU and tightly coupled SRAM, supporting deterministic interrupt latency for real-time protocol stacks. Integrated security and SEC engines (where enabled by device derivative) provide protocol offload for IPsec, SSL/TLS, and IPSec-accelerated VPN gateways, which historically drove the part's adoption in mid-range routers and security appliances.
Typical applications include industrial networking routers, network attached storage controllers, telecom line cards, and embedded control planes. The 29x29 mm FC-PBGA requires a multilayer PCB with controlled-impedance routing for DDR and SerDes lanes.
When designing the power tree, allocate at least 2A peak headroom on the 1V core rail to absorb e500 core activity bursts. Place a minimum 22uF bulk + 0.1uF high-frequency decoupling distribution across the BGA balls, and follow NXP layout guidelines for DDR termination to avoid signal-integrity re-spins.
This page consolidates distributor inventory, datasheet references, same-family order codes, and engineering trade-offs that the bare manufacturer datasheet does not summarize.
드롭인 대체품: MPC8535ECVTAKGA557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8535ECVTAKGA557 (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8535ECVTAKGA
✅ 드롭인✓ 재고 있음
$81.2 / 개
데이터시트 보기 →MPC8535ECVJAQGA
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8535ECZQAGD
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8535VTAKGA
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8535EVTALGA
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8535ECVTAKGA557 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC III (MPC85xx) |
| Core Architecture | PowerPC e500 |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 600 MHz |
| Core Voltage | 1 V |
| 패키지 | 783-ball FC-PBGA (29x29 mm) |
| 실장 유형 | Surface Mount |
| Packaging | Tray |
| Lead Free Status | Lead Free |
MPC8535ECVTAKGA557 783-ball fc-pbga (29x29 mm) 핀 구성 가이드
MPC8535ECVTAKGA557(783-ball fc-pbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8535ECVTAKGA557.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8535ECVTAKGA557 적합 용도: 6 애플리케이션s: Industrial Networking Router, Network Attached Storage Controller, Telecom Line Card Controller, Embedded Industrial Control Plane, Wireless Backhaul Aggregation, VoIP Media Gateway.
Industrial Networking Router
The MPC8535ECVTAKGA557 integrates an e500 core with up to four Gigabit Ethernet MACs and a DDR controller, collapsing what traditionally required an MPU plus an external switching ASIC onto a single FC-PBGA. At 600MHz the part comfortably runs a Linux networking stack with IPsec / TLS offload provided by the integrated SEC engine, suiting industrial VPN gateways and protocol-converting routers. The 783-ball FC-PBGA carries four RGMII lanes, an enhanced local bus, and PCI/PCI-X for legacy mezzanine cards, so most router PCBs reuse the exact footprint with reduced BOM cost. Compared with a discrete MPC8560 + Vitesse switch design, this part saves roughly 30% board area while sustaining line-rate packet forwarding at under 1.5W core power at the 1V rail.
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Network Attached Storage Controller
The MPC8535ECVTAKGA557's DDR1/DDR2 memory controller handles the working-set of a mid-range NAS RAID stack, and the integrated PCI-X bus glues to a hardware RAID controller or to multiple SATA bridges. At 600MHz the e500 core can saturate a GigE link while running SMB/CIFS, NFS, and HTTP frontends concurrently, with the SEC engine offloading TLS for HTTPS management. The 1V core rail keeps the FC-PBGA within passive-heatsink thermal envelopes for shallow 1U enclosures. Compared with a discrete x86-based NAS SoC, the PowerQUICC III part consumes roughly 4-5W under typical RAID scrubbing loads and removes dependency on a CR2032 battery-backed BIOS.
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Telecom Line Card Controller
Telecom line cards historically pair the MPC8535ECVTAKGA557 with a framer or TDM mapper through PCI or the enhanced local bus, using the e500 core to run ATM/Ethernet/TDM adaptation code. Deterministic interrupt response from the Book E MMU and tightly coupled SRAM makes this part suitable for tight latency budgets in TDM cross-connect and DSLAM line cards. The 783-ball FC-PBGA provides the ball density to break out up to four RGMII links plus the local bus for legacy framers, in a single BGA footprint. Compared with newer DSP-based line-card controllers, the MPC8535E is preferred where existing firmware investment amortizes across telecom SKUs and where SEC-accelerated MACsec on the backplane is required.
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Embedded Industrial Control Plane
Programmable logic controllers, substation controllers, and SCADA front-ends use the MPC8535ECVTAKGA557 as the secure management plane, offloading deterministic Ethernet/IP or PROFINET traffic to companion FPGAs. The single 32-bit e500 core at 600MHz, combined with 32KB L1 instruction / data caches, runs a Linux PREEMPT-RT kernel for sub-100us deterministic response. The 1V core rail and on-chip SERDES free designers from external clock-cleaning parts. Compared with ARM Cortex-A5 implementations, the PowerQUICC III part offers tighter interrupt latency and a more mature U-Boot ecosystem, easing IEC 61850 substation compliance work.
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Wireless Backhaul Aggregation
Microwave and LTE small-cell backhaul aggregators use the MPC8535ECVTAKGA557 for synchronizing Ethernet traffic with IEEE 1588 hardware timestamping, leveraging the integrated Ethernet MACs to deliver TDM pseudowire services. The e500 core runs IPsec-secured MPLS with hardware offload, allowing the part to terminate multi-tunnel VPNs without software bottlenecks. The 783-ball FC-PBGA keeps the layout single-chip, removing the need for an external encryption accelerator. Compared with a Layer-2-only switch with a separate management MPU, this design reduces unit cost and lets integrators deliver synchronized backhaul with strict SLA timing.
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VoIP Media Gateway
The MPC8535ECVTAKGA557 is the historical workhorse of DSP-fronted VoIP media gateways, pairing its Ethernet MACs with external TDM/VoIP DSPs over PCI or HMI bus. The e500 core handles SIP/H.323 signalling, RTP packetization, and SEC-accelerated TLS / SRTP secure signalling, while the 600MHz headroom sustains hundreds of concurrent secure voice channels. The FC-PBGA's high-pin count exposes the local bus, USB, and two SPI ports needed for glue logic on mid-density gateways. Compared with a pure-software DSP platform, the PowerQUICC III saves roughly 20-25% per-channel BOM by eliminating dedicated signalling processors.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8535ECVTAKGA557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8535ECVTAKGA | MPC8535ECVJAQGA | MPC8535ECZQAGD | MPC8535VTAKGA | MPC8535EVTALGA |
|---|---|---|---|---|---|---|
| Package | 783-ball FC-PBGA (29x29 mm) | 783-ball FC-PBGA (29x29 mm) - same | 783-ball FC-PBGA (29x29 mm) - same | 783-ball FC-PBGA (29x29 mm) - same | 783-ball FC-PBGA (29x29 mm) - same | 783-ball FC-PBGA (29x29 mm) - same |
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Core Voltage | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
| SEC Security Engine | Yes (E-suffix) | Yes | Yes | Yes | No (non-E variant) | Yes |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| Ordering Suffix | A557 (customer-specific) | base order code | different option string | different option string | different option string | different option string |
주요 차별점
- Customer-specific ordering suffix with Rochester Electronics fulfillment (vs MPC8535ECVTAKGA)
- SEC security engine integrated on-chip (vs MPC8535VTAKGA)
- Drop-in 783-ball FC-PBGA footprint across the MPC85xx family (vs QorIQ P1010/P1020)
설계 노트
The MPC8535ECVTAKGA557 needs at least a 2A peak headroom on the 1V core rail because the e500 core draws in current spikes during cache-fill and DDR refresh bursts; a 4-phase buck regulator is recommended over a single-phase LDO to absorb load transients. Place a 22uF bulk + 0.1uF high-frequency decoupling distribution across the FC-PBGA balls following NXP's PowerQUICC layout guide, and sequence the core rail before the I/O rail to avoid power-on-reset lockups.
The 29x29 mm FC-PBGA requires a multilayer PCB (at least 6 layers) with impedance-controlled 50-ohm single-ended and 100-ohm differential routing for DDR and SerDes lanes. Match length within +/-25 mil across the DDR byte lanes and keep reference planes unbroken under the BGA escape region; via-in-pad is recommended for the inner-row power balls to minimize loop inductance.
Estimated: at 600MHz and a typical application power of about 5W, the FC-PBGA junction-to-ambient theta_JA of around 12 C/W (with a 4-layer JEDEC test board) yields a junction rise of roughly 60C above ambient. Designers targeting 85C ambient must size the copper pour / forced-air cooling to keep junction below 105C, and a thermal pad is mandatory under the spreader ball field.
Do not assume the MPC8535VTAKGA (non-E) drop-in replaces an E-suffix design unconditionally: the SEC register map and interrupt vector for the security engine change, breaking IPsec/TLS drivers. Verify boot ROM source for security-engine pin states and re-run cryptographic stack regression before swapping E/non-E variants in production.
규정 준수 정보
Lead-free status confirmed by the Freescale datasheet (per digchip.com). RoHS and halogen-free status for the specific Rochester “A557” order code are quote-driven and must be requested from Rochester Electronics.
