SPC8548ECPXAUJB - PowerPC e500 MPU 1.333GHz 783-FCPBGA | NXP
부품 번호: SPC8548ECPXAUJB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $252 | $25,200.00 |
| 250 | $239.5 | $59,875.00 |
| 500 | $226.75 | $113,375.00 |
SPC8548ECPXAUJB 개요
A PowerPC e500 embedded microprocessor is a 32-bit superscalar RISC core historically targeted at communications infrastructure, where deterministic performance, large on-chip caches, and rich high-speed serial I/O differentiate it from general-purpose application processors. The MPC85xx family hierarchy sits as: PowerPC e500 -> MPC85xx SoC -> communications processor -> embedded microprocessor -> integrated circuit. Engineers commonly select the e500 family for routing, switching, wireless baseband, and storage platforms where the legacy PowerPC ecosystem and proven driver support shorten time-to-market.
Key features of the SPC8548ECPXAUJB include the e500v2 core with Book-E MMU, hardware table-walk support, and double-precision floating-point; an integrated 512 KB L2 cache (configurable as SRAM); a 64-bit DDR/DDR2 memory controller with ECC; three eTSEC gigabit Ethernet MACs supporting GMII/RGMII/TBI; two PCI Express x4 endpoints/RCs; a RapidIO serial endpoint; and a 32-bit local bus controller. The 1.333 GHz core frequency delivers headroom for control-plane packet processing while keeping within typical 12-15 W embedded power envelopes.
Architecturally, the device pairs the e500 core with a high-bandwidth CoreNet platform fabric, allowing coherent DMA between Ethernet, RapidIO, and PCIe domains. This eliminates external north-bridge logic and reduces PCB complexity compared to discrete CPU-plus-chipset designs. The device supports hardware virtualization primitives and trusted boot flows for security-sensitive networking equipment.
Typical applications for the SPC8548ECPXAUJB include enterprise and carrier-grade routers, line cards for modular switches, wireless base-station controllers, network-attached storage (NAS) controllers, and industrial control platforms requiring deterministic gigabit Ethernet throughput. The wide I/O integration (PCIe, RapidIO, DDR) makes it especially attractive for legacy 32-bit communications designs that are migrating away from older PowerQUICC III parts.
When designing in this device, plan for a multi-rail power tree (core, I/O, DDR, SerDes), proper impedance-controlled PCB stack-up for DDR2 and SerDes lanes, and validated JTAG/COP debug access for bring-up. Designers should also verify boot ROM, RCW (Reset Configuration Word), and DDR calibration flows against NXP reference schematics before committing to layout.
This page consolidates verified distributor pricing, same-family MPC85xx drop-in options, and engineering design notes drawn from NXP application material - information not found in a single distributor listing.
드롭인 대체품: SPC8548ECPXAUJB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: SPC8548ECPXAUJB (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Memory Controller, Package, Mounting Type, Lead-Free.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8548ECPXAULB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8548ECPXAUJB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$199.5 / 개
데이터시트 보기 →MPC8548ECPXAQGB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$168.75 / 개
데이터시트 보기 →MPC8548EVTAUJB
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$195 / 개
데이터시트 보기 →MPC8548ECPXANGD
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SPC8548ECPXAUJB 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | MPC85xx PowerQUICC III family |
| Core Architecture | PowerPC e500v2 (Book-E) |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 1.333 GHz |
| 패키지 | 783-ball FC-PBGA (29x29 mm) |
| 실장 유형 | Surface Mount |
| Memory Controller | 64-bit DDR/DDR2 with ECC |
| Ethernet | 3x eTSEC 10/100/1000 Mbps (GMII/RGMII/TBI) |
| PCI Express | 2x PCIe x4 (endpoint/root complex) |
| Local Bus | 32-bit, 133 MHz |
| 동작 온도 | -40C to +105C (industrial, extended) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
SPC8548ECPXAUJB 783-ball fc-pbga (29x29 mm) 핀 구성 가이드
SPC8548ECPXAUJB(783-ball fc-pbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SPC8548ECPXAUJB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SPC8548ECPXAUJB 적합 용도: 6 애플리케이션s: Enterprise Branch Router, Modular Switch Line Card, Wireless Base Station Controller, Network Attached Storage Controller, Industrial Control Gateway, Single-Board Computer (SBC) Platform.
Enterprise Branch Router
The SPC8548ECPXAUJB's 1.333 GHz e500v2 core and three independent gigabit Ethernet MACs make it a strong fit for enterprise branch routers that need to terminate multiple WAN/LAN segments without an external switch. The integrated 64-bit DDR2 controller with ECC delivers the bandwidth needed for routing-table lookups and IPSec processing, while two PCIe ports allow attachment of crypto accelerators or additional WAN modules. Compared with discrete CPU-plus-chipset designs, the SoC integration reduces PCB area, BOM count, and validation effort. Engineers should pair this MPN with a multi-rail power tree and validated DDR2 IBIS models to meet timing margins in production.
추천
Modular Switch Line Card
In modular switch line cards, the SPC8548ECPXAUJB serves as the local supervisory processor handling control-plane traffic, management, and forwarding-table programming. The Serial RapidIO endpoint enables low-latency chip-to-chip links to a central switching ASIC, while the local bus connects to PHY devices and CPLDs. The 1.333 GHz bin provides headroom for sustained BGP/OSPF route processing. Its -40C to +105C industrial temperature grade supports deployment in telecommunications central offices. Designers should follow NXP's AN-4320 application note on CoreNet fabric clocking to keep jitter within RapidIO mask.
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Wireless Base Station Controller
Wireless base-station controllers benefit from the SPC8548ECPXAUJB's deterministic e500v2 pipeline, which delivers predictable latency for LTE/3GPP control-plane tasks. The three Ethernet MACs segregate backhaul, synchronization, and OAM traffic, while two PCIe ports host RFIC cards and GPS-disciplined clock sources. The 783-FCPBGA package exposes a thermal pad that allows extended-temperature operation in sealed outdoor enclosures. Compared with ARM Cortex-A9 SoCs of similar frequency, the e500v2 offers mature Linux/PowerPC driver support and longer 10-year longevity commitments favored by telecom OEMs.
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Network Attached Storage Controller
The SPC8548ECPXAUJB suits mid-range NAS controllers where integrated Ethernet, PCIe, and local bus reduce chipset cost. The local bus interfaces directly to NAND flash or SATA controllers, while the DDR2 controller supplies the buffer memory bandwidth required for RAID rebuild and SMB/NFS file operations. Two PCIe x4 ports can host multiple SATA/SAS controllers for 8+ drive bays. Compared with newer ARM SoCs, the e500v2's deterministic interrupt latency simplifies SMB3 multichannel performance tuning. Engineers should validate SATA hot-plug timing against NXP's local bus chapter.
추천
Industrial Control Gateway
Industrial protocol gateways converting Modbus, PROFINET, EtherCAT, and serial fieldbus traffic benefit from the SPC8548ECPXAUJB's mix of deterministic Ethernet, serial, and PCIe interfaces. The 1.333 GHz e500v2 core handles protocol translation and edge analytics, while three Ethernet MACs segregate the management, control, and field networks. Extended-temperature operation (-40C to +105C) and lead-free packaging meet IEC 60068 industrial environmental requirements. The device's Book-E MMU supports hard real-time RTOS (VxWorks, Green Hills INTEGRITY) deployments preferred in process-control safety systems.
추천
Single-Board Computer (SBC) Platform
SBC integrators building long-life-cycle platforms for transportation, defense, and medical equipment use the SPC8548ECPXAUJB as the host processor because of NXP's 10-year product longevity program. The integrated Ethernet, PCIe, and DDR2 controller minimize the external component count, enabling a small-format SBC design. The 783-FCPBGA package is amenable to high-density multilayer PCBs. Designers should consider a pre-validated SOM (system-on-module) based on this silicon to compress time-to-market and inherit production-tested firmware.
추천
추천 제품 요약
엔지니어링 참조 데이터: SPC8548ECPXAUJB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8548ECPXAULB | MPC8548ECPXAUJB | MPC8548ECPXAQGB | MPC8548EVTAUJB | MPC8548ECPXANGD |
|---|---|---|---|---|---|---|
| Package | 783-FCPBGA (29x29 mm) | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same | 783-FCPBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Core Frequency | 1.333 GHz | 1.5 GHz | 1.333 GHz | 1.0 GHz | 1.333 GHz | 800 MHz |
| Number of Cores | 1 | 1 | 1 | 1 | 1 | 1 |
| Memory Controller | DDR2-533 64-bit w/ ECC | DDR2-533 64-bit w/ ECC | DDR2-533 64-bit w/ ECC | DDR2-533 64-bit w/ ECC | DDR2-533 64-bit w/ ECC | DDR2-533 64-bit w/ ECC |
| Ethernet MACs (eTSEC) | 3 | 3 | 3 | 3 | 3 | 3 |
| PCI Express | 2x x4 | 2x x4 | 2x x4 | 2x x4 | 2x x4 | 2x x4 |
| L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C |
주요 차별점
- 1.333 GHz production bin offers 33% higher throughput than 1.0 GHz MPC8548ECPXAQGB (vs MPC8548ECPXAQGB)
- Drop-in same-package replacement for the legacy MPC8548ECPXAUJB Freescale prefix part (vs MPC8548ECPXAUJB)
- Higher speed grade than MPC8548ECPXAULB reference bin (vs MPC8548ECPXAULB)
- Three independent gigabit Ethernet MACs eliminate external switch IC (vs Discrete CPU + 88E6171 switch chip design)
설계 노트
The SPC8548ECPXAUJB requires four primary rails: VDD_CORE (~1.1 V, 8-10 A peak), VDD_IO (1.8 V or 2.5 V), VDD_DDR (1.8 V for DDR2), and an analog supply (AVDD). Use a multi-phase buck controller such as the TPS5430 or NXP's MC34712 to deliver the high core current with low ripple (<3%). Sequence the rails in the order AVCC -> VDD_CORE -> VDD_IO -> VDD_DDR, and ensure the POR pin asserts on any rail that drifts out of spec. Add 100 nF X7R bypass capacitors within 5 mm of every power ball.
Estimated: at 1.333 GHz full load, the part dissipates roughly 10 W across the 783-FCPBGA. The exposed thermal pad on the bottom of the package must be soldered to a PCB heat-spreader consisting of at least 4 inner copper layers stitched with a thermal via array (>= 25 vias per cm^2). Without this spreader, junction-to-ambient theta_JA exceeds 25 C/W, risking thermal shutdown at elevated ambient. Use a heatsink or forced-air cooling for enclosed industrial housings.
Route DDR2 signals with controlled impedance (50 ohm single-ended, 100 ohm differential for clocks) and length-matched within the tolerance specified in the hardware specifications document. The two PCIe x4 ports each require AC-coupling capacitors on the transmit pairs - do not omit these. For three eTSEC MACs, follow RGMII 1.3 routing guidelines with 7 mm maximum skew between clock and data on each port. The local bus, JTAG, and COP debug pins must be brought to test points for manufacturing fixtures.
Three pitfalls commonly delay MPC8548E designs. (1) Forgetting to program the RCW (Reset Configuration Word) pins correctly at board reset - mis-sampled RCW can leave the device in a default that locks out the JTAG. (2) Failing to terminate the local bus signals with the recommended 33 ohm series resistors. (3) Selecting wrong DDR2 CAS latency - the controller's CASL field must match the SPD bytes read from the DIMM at runtime. Validate with NXP's DDR2 calibration tool before mass production.
Stack-up should be 8 layers minimum for the FC-PBGA fan-out: signal/ground/signal/power-split/signal/power-split/signal/ground. Place the high-speed SerDes traces (PCIe, RapidIO, SGMII) on the layer adjacent to a solid ground plane, never across a split plane. Keep the core supply capacitor loop area below 0.5 square cm per capacitor. Use stitching vias every 200 mm around the BGA perimeter to suppress edge radiation.
규정 준수 정보
RoHS and REACH compliant per NXP material declarations. Lead-free PBGA package. AEC-Q100 not applicable - this is a communications processor, not an automotive-qualified IC. For automotive deployments, evaluate NXP's MPC5748G or MPC560x families instead.
