MPC8536BVJANGA - PowerQUICC III SoC, 800MHz, 783-FCBGA | NXP
부품 번호: MPC8536BVJANGA ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $162.68 | $162.68 |
| 10 | $156.72 | $1,567.20 |
| 100 | $148.95 | $14,895.00 |
| 500 | $140.3 | $70,150.00 |
| 1,000 | $132.1 | $132,100.00 |
MPC8536BVJANGA 개요
A PowerQUICC (pronounced "power-quick") processor is a family of communications-oriented system-on-chip devices originally developed by Motorola Freescale and now maintained by NXP. These SoCs combine one or more PowerPC cores with specialized communications engine blocks, memory controllers, and high-speed serial interfaces. The MPC8536E belongs to the PowerQUICC III lineage and sits in the broader taxonomy: application processor -> embedded SoC -> networking processor -> PowerQUICC family -> MPC85xx series. Understanding this hierarchy is important because it indicates target use cases — wired/wireless infrastructure, industrial control, and storage — and explains the rich peripheral mix.
Key specifications include a 32-bit PowerPC e500 core at 800 MHz, support for DDR2/DDR3 with ECC, integrated SATA II and Gigabit Ethernet MACs, PCIe and PCI interfaces, USB 2.0 with PHY, and SDHC host controller. The device supports operating temperatures from 0°C to 105°C (commercial grade) and runs from multiple rails at 1.0 V core, 1.5 V / 1.8 V DDR, and 2.5 V / 3.3 V I/O. The 783-FCBGA package delivers the routing density required for high-speed parallel interfaces while keeping the board footprint at industry-standard 29x29 mm.
From an architectural perspective, the e500 core implements the Book-E PowerPC instruction set with a seven-stage pipeline, hardware MMU, and a double-precision FPU option. Memory coherency between the core and the on-chip communications engines is handled by a coherent platform fabric. Security features include a hardware random-number generator, secure boot, and tamper detection for trusted platform applications.
Typical applications include network routers, industrial gateways, networked printers, single-board computers, and storage controllers. The combination of Gigabit Ethernet, SATA, PCIe, and DDR3 support makes it ideal for fanless networking appliances and small-form-factor industrial PCs.
When designing with this part, allocate at least 4 PCB layers with dedicated ground planes, place decoupling within 5 mm of each supply ball, and follow NXP's AN3534 routing guidelines for DDR3 byte lanes to maintain signal integrity on memory clocks up to 667 MHz.
This page synthesizes distributor pricing, parameter cross-references, and design guidance not found in the manufacturer's datasheet summary, with same-package pin-compatible alternatives surfaced for end-of-life risk mitigation.
드롭인 대체품: MPC8536BVJANGA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8536BVJANGA (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Ethernet, Operating Temperature, Package, USB.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8536BVTANGA
✅ 드롭인✓ 재고 있음
$95 / 개
데이터시트 보기 →MPC8536EAVJANGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8536ECVJAKGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8536AVJANGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8536AVTANGA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8536BVJANGA 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e500 (Book-E) |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 800 MHz |
| Series | PowerQUICC III, MPC85xx |
| Memory Controller | DDR2/DDR3 with ECC |
| Ethernet | Gigabit Ethernet MAC (tri-speed) |
| PCI Interface | PCI / PCI Express |
| Storage | SATA II |
| USB | USB 2.0 with integrated PHY |
| Card Interface | SDHC / MMC host controller |
| Core Voltage | 1.0 V (typical) |
| I/O Voltage | 2.5 V / 3.3 V |
| DDR Voltage | 1.5 V / 1.8 V |
| 동작 온도 | 0 °C to +105 °C |
| 패키지 | 783-FCBGA (FC-PBGA) 29x29 mm |
| 실장 유형 | Surface Mount (BGA) |
| Process Technology | 0.09 µm CMOS |
MPC8536BVJANGA 783-fcbga (fc-pbga) 29x29 mm 핀 구성 가이드
MPC8536BVJANGA(783-fcbga (fc-pbga) 29x29 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8536BVJANGA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8536BVJANGA 적합 용도: 6 애플리케이션s: Network Router / Gateway, Industrial Single-Board Computer, Networked Storage Controller, Networked Multifunction Printer Controller, Wireless Infrastructure Edge Node, Power-over-Ethernet IP Camera Platform.
Network Router / Gateway
The MPC8536BVJANGA's combination of Gigabit Ethernet MAC, PCI/PCIe, and DDR3 support makes it ideal for small-form-factor wired routers and industrial gateways. The e500 core at 800 MHz handles routing table lookups and packet inspection without requiring external NPUs, while integrated security features (in the E variant) accelerate VPN/IPsec workloads. Designers place the SoC between 1-4 GbE PHYs and external PCIe switch fabric, using the SDHC interface for local configuration or log storage. Estimated power dissipation is 6-9 W at full CPU load, requiring a small heatsink but enabling fanless chassis designs in cabinet-mounted telecom equipment.
추천
Industrial Single-Board Computer
Designed-in as the MPU on industrial SBC motherboards, the MPC8536BVJANGA drives rich peripheral expansion: PCIe for accelerator cards, SATA for local SSD storage, USB 2.0 for diagnostics, and SDHC for boot media. The 783-FCBGA accommodates up to 8-layer PCBs and supports 64-bit DDR3 with ECC for deterministic operation. Industrial process control applications benefit from the deterministic interrupt latency of the e500 core running a VxWorks or INTEGRITY RTOS, with operating temperatures up to 105 °C allowing installation in standard factory-control enclosures without active cooling.
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Networked Storage Controller
The integrated SATA II controller and PCI/PCIe lanes enable the MPC8536BVJANGA to serve as a small-scale NAS or RAID controller SoC. Connecting 4-8 SATA drives via port multipliers, the e500 core handles LSI-style firmware stack including ext4/XFS filesystem management and iSCSI target offload. DDR3 with ECC protects against bit errors in metadata caches. Compared to ARM-based NAS controllers, the PowerPC e500 offers real-time deterministic IO scheduling for sustained throughput at HDD-bound workloads, with typical enclosure power budgets of 30-50 W.
추천
Networked Multifunction Printer Controller
Embedded inside office multifunction printers, the MPC8536BVJANGA performs scan-to-email firmware stacks, image preprocessing for OCR rendering, and JPEG compression using the on-chip accelerators. The integrated Ethernet MAC feeds into the printer's 10/100/1000 Ethernet port while USB 2.0 serves host-side PictBridge / direct-USB printing. The 783-FCBGA on a 4-layer PCB remains within cost target for mid-volume office MFPs. Power dissipation is typically 4-6 W at peak, allowing a small aluminum heatsink; the commercial 0-105 °C range covers typical office environments.
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Wireless Infrastructure Edge Node
Outdoor small-cell and LTE/5G NR picocell baseband units pair the MPC8536BVJANGA with external DSP cards for Layer-1 PHY processing while the SoC handles Layer-2/3 stack and backhaul encryption. Its Gigabit Ethernet MAC and PCI/PCIe deliver the throughput needed for S1/X2 interfaces, while DDR3 ECC keeps bit-error rates well within cellular QoS budgets. The integrated USB 2.0 enables secure field-upgrade via USB tokens. Industrial -40 to 105 °C grade (via the BVTANGA drop-in) supports outdoor cabinet deployment across temperate climates.
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Power-over-Ethernet IP Camera Platform
Surveillance PoE IP cameras and NVRs adopting the MPC8536BVJANGA leverage the integrated GbE MAC, USB for Wi-Fi dongle, and SATA for SD-card backup, all in a fanless PoE-powered enclosure. The e500 core runs V4L2 capture stacks with on-camera analytics (motion detection, license-plate recognition) offloaded via PCIe to a Vivante GPU. With 1.0 V core regulation, total SoC power is 3-5 W at 720p30, allowing passive cooling inside IP66 sealed camera housings under direct sunlight. The 783-FCBGA is compatible with the IP camera industry's standard 32 mm × 32 mm module keep-out envelope.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8536BVJANGA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8536BVTANGA | MPC8536EAVJANGA | MPC8536ECVJAKGA | MPC8536AVJANGA | MPC8536AVTANGA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Core Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Operating Temperature | 0 °C to +105 °C | -40 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | 0 °C to +105 °C | -40 °C to +105 °C |
| Security Engine | Not included | Not included | Included (AES, SHA, RSA) | Included | Not included | Not included |
| Silicon Revision | Rev 1.0 (B) | Rev 1.0 (B) | Rev 1.0 (E) | Rev 1.0 (E) | Rev A (older) | Rev A (older) |
| DDR Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Unit Price (1 pc) | USD 162.68 | USD 175 - 200 (extended temp) | USD 195 - 230 (security engine) | USD 220 - 260 (security + automotive) | USD 155 - 170 (legacy rev) | USD 165 - 185 (legacy rev + ext temp) |
주요 차별점
- Extended temperature -40 to 105 °C variant available in identical footprint (vs MPC8536BVTANGA)
- Hardware security engine option within same 783-FCBGA footprint (vs MPC8536EAVJANGA)
- Lower-cost legacy A-revision silicon available for non-errata-sensitive designs (vs MPC8536AVJANGA)
설계 노트
Estimated: at 800 MHz core load with full GbE + SATA utilization, power dissipation is 6-9 W. The 783-FCBGA package has a theta_JA of approximately 12-15 C/W on a 6-layer 1oz copper PCB (per NXP AN3534 figure 5). With no airflow, the junction-to-ambient rise is roughly 75-100 C above ambient; therefore a small aluminum heatsink of 8 C/W or 100 LFM airflow is required for operation above 35 C ambient. Place thermal vias in a 1.2 mm pitch array under the die shadow to keep board-to-case thermal resistance under 1 C/W.
Allocate at least a 6-layer stack-up with continuous ground plane on layers 2 and 5; route DDR3 signals on layer 3 over the layer-2 ground plane and high-speed SERDES signals on layer 4 above the layer-5 ground plane. Use 100-Ω differential pairs for PCIe and SATA, routed length-matched to within 150 mils. Place eight 0.1 µF X7R 0402 decoupling capacitors within 5 mm of each supply ball, plus four 4.7 µF X5R bulk capacitors near the corners. Maintain 50-Ω trace impedance ±10% to ensure DDR3 signal integrity up to 667 MHz.
Do not assume pin-to-pin compatibility between B-rev silicon (MPC8536B_*) and A-rev silicon (MPC8536AV*) - though the package is the same 783-FCBGA, the boot-ROM behavior, reset sequencing, and some SerDes lane muxing differ between revisions; verify against the latest NXP errata. For DDR3 operation above 667 MT/s, the DLL calibration sequence needs the latest u-boot BSP. Avoid using the same I/O voltage (3.3 V) on DDR3 - the 1.5 V or 1.8 V VTT regulation is required by JEDEC JESD79-3F for reliable write leveling.
Recommended: place the e500 trace-debug port within 50 mm of the JTAG header and ground it via 100 Ω traces to maintain debug-port timing. The 783-FCBGA has signal balls at 1.0 mm pitch, requiring microvia-in-pad design rules with 0.3 mm drill and 0.65 mm pad. Run SATA and PCIe lanes with no signal layer transitions for the first 25 mm out of the BGA and use the NXP IBIS model in your SI tool before finalizing routing.
규정 준수 정보
Per NXP 2026 PCN and product page environmental information. Lead-free, RoHS, REACH and halogen-free confirmed. Not AEC-Q100 qualified.
