MPC8547VTAUJB - PowerPC e500 MPU 1.333GHz 783-FCBGA | NXP
부품 번호: MPC8547VTAUJB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $188.3 | $188.30 |
| 10 | $175.5 | $1,755.00 |
| 100 | $162 | $16,200.00 |
| 500 | $148.75 | $74,375.00 |
| 1,000 | $135 | $135,000.00 |
MPC8547VTAUJB 개요
A microprocessor (MPU) is a single-chip CPU that fetches, decodes, and executes instructions from external memory, and Power Architecture-based MPUs belong to the broader category of embedded processors that also includes microcontrollers, DSPs, and SoCs. The e500 core implements the Book E instruction set with signal-processing extensions, and the MPC85xx platform augments the core with system logic that would otherwise require a chipset. Within the NXP taxonomy, the MPC8547 is positioned as a cost-optimized variant of the higher-end MPC8548, trading off some peripheral bandwidth for lower power and smaller die area.
Key features include a 32 KB L1 instruction cache and 32 KB L1 data cache per core, a 256 KB (or larger) unified L2 cache, integrated DDR2 memory controller with ECC support, dual 10/100/1000 Ethernet MACs, four SerDes lanes configurable for PCI Express or RapidIO, local bus controller for NAND/NOR flash, and hardware encryption acceleration on selected revisions. The device is rated for industrial temperature operation and supports JTAG boundary scan and run-control debug through the standard Power Architecture COP/JTAG interface.
Typical applications include multiservice routers, DSLAM line cards, network attached storage controllers, industrial control gateways, and printing/imaging controllers. The integrated dual Gigabit Ethernet and PCI Express make it especially attractive for routers and switching line cards where BOM cost and power matter more than raw throughput.
When designing with this device, pay close attention to PCB stack-up and via-in-pad design rules for the 783-ball FCBGA; the 1 mm pitch requires at least 4-6 routing layers with microvia or via-in-pad construction. Plan for thermal management because the device can dissipate several watts under sustained packet-processing loads.
드롭인 대체품: MPC8547VTAUJB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8547VTAUJB (동일 폼 팩터 및 풋프린트) — 차이점: PCI Express, RoHS Status, Package, L2 Cache, Security Engine.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8547EVTAUJC
✅ 드롭인✓ 재고 있음
$138.4 / 개
데이터시트 보기 →MPC8547EVTAUJD
✅ 드롭인✓ 재고 있음
$118.4 / 개
데이터시트 보기 →MPC8548EPXAUJB
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →MPC8548EVTAUJC
✅ 드롭인✓ 재고 있음
$185 / 개
데이터시트 보기 →MPC8544VJALFA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8547VTAUJB 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Product Family | PowerQUICC III / MPC85xx |
| Core Architecture | Power Architecture e500 (Book E) |
| Core Count | 1 |
| Data Width | 32-bit |
| Maximum Core Frequency | 1.333 GHz |
| 패키지 | 783-FCBGA (29x29 mm) |
| Ball Pitch | 1.0 mm |
| L1 Instruction Cache | 32 KB |
| L1 Data Cache | 32 KB |
| L2 Cache | 256 KB (unified) |
| Memory Controller | DDR2 SDRAM with ECC |
| Integrated Ethernet | Dual 10/100/1000 MAC |
| High-Speed I/O | PCI Express, RapidIO (SerDes) |
| RoHS 상태 | Compliant (PB Free variant available) |
| 동작 온도 | -40C to +85C (industrial) |
MPC8547VTAUJB 783-fcbga (29x29 mm) 핀 구성 가이드
MPC8547VTAUJB(783-fcbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8547VTAUJB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8547VTAUJB 적합 용도: 6 애플리케이션s: Multiservice Router Line Cards, DSLAM / Access Aggregation Equipment, Network Attached Storage (NAS) Controllers, Industrial IoT Gateways, Printing and Imaging Controllers, Wireless Base Station Controllers.
Multiservice Router Line Cards
The MPC8547VTAUJB's 1.333 GHz e500 core and integrated dual Gigabit Ethernet make it a strong fit for multiservice router line cards that aggregate multiple WAN links. Its DDR2 controller with ECC supports wire-speed packet buffering at line rate, while the integrated GbE MACs eliminate external bridge chips and reduce BOM cost. Compared with discrete CPU-plus-chipset designs, the integrated SoC cuts board area by 30-40% and lowers idle power. Designers place the device between PHY transceivers and switch fabric ASICs, configuring PCI Express or RapidIO SerDes to uplink to the fabric. Power dissipation typically stays in the 5-8 W range under full load, manageable with a small heatsink in a 1U line card.
추천
DSLAM / Access Aggregation Equipment
For DSLAM and access aggregation equipment, the MPC8547VTAUJB's e500 core plus PCI Express SerDes enables high-density subscriber line termination. The 32-bit core handles ATM, PPP, and IPoE encapsulation at line rate, while the integrated GbE uplinks connect to the aggregation switch. Compared with MPC8560 predecessors, the MPC8547 consumes roughly 20% less power per port, important for dense central-office shelves. Hardware encryption acceleration offloads IPSec and MACsec from the main core, freeing CPU cycles for subscriber session management. Industrial temperature rating (-40C to +85C) supports outdoor cabinet deployments in unconditioned environments.
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Network Attached Storage (NAS) Controllers
The MPC8547VTAUJB serves well as a NAS controller SoC, combining dual GbE for LAG bonding, PCI Express for SATA/SAS host bus adapters, and DDR2 with ECC for reliable write-cache memory. Its 32 KB L1 plus 256 KB L2 cache hierarchy keeps metadata operations fast under multi-user SMB/NFS workloads. Versus a generic x86 SBC, the MPC8547 reduces idle power to under 3 W while delivering enough throughput for small-office RAID. Designers typically pair it with an external SATA multiplier and a small NOR boot flash via the local bus. Industrial temperature rating supports 24/7 operation in uncooled enclosures.
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Industrial IoT Gateways
For industrial IoT gateways, the MPC8547VTAUJB's combination of Gigabit Ethernet, PCI Express for cellular modems or Wi-Fi cards, and the local bus for NOR/NAND flash makes it ideal for protocol translation between fieldbuses and IP networks. The e500 core runs Linux with PREEMPT_RT for hard-real-time response to Modbus, PROFINET, or EtherCAT traffic. Industrial temperature rating supports deployment in factory floors and outdoor cabinets. Compared with ARM Cortex-A5 gateways, the MPC8547 offers roughly 2x single-thread performance, important for processing multiple industrial protocols concurrently on a single SoC.
추천
Printing and Imaging Controllers
The MPC8547VTAUJB's high-speed e500 core and DDR2 bandwidth make it suitable for high-page-per-minute printing and imaging controllers where page rendering must keep pace with the marking system. The PCI Express interface connects to scanner CCD/CMOS sensor front ends, while USB and Ethernet handle host connectivity. Hardware encryption acceleration secures print jobs at rest on optional HDD storage. Versus dedicated image processors, the integrated SoC reduces controller board cost by combining CPU, memory controller, and networking in one chip. The 783-FCBGA footprint suits the compact controller board typically found in A3 multifunction printers.
추천
Wireless Base Station Controllers
For small-cell and picocell wireless base station controllers, the MPC8547VTAUJB provides enough processing headroom for layer-2/3 termination with the integrated dual GbE connecting to the backhaul network. The e500 core runs RTOS or Linux for protocol stacks including GTP-U, SCTP, and IPsec, with hardware encryption accelerating secure backhaul. The PCI Express interface connects to DSP arrays for physical-layer baseband processing. Compared with general-purpose ARM Cortex-A9 solutions, the MPC8547 delivers stronger deterministic performance for real-time packet scheduling, which is critical for meeting latency budgets in voice-over-LTE traffic.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8547VTAUJB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8547EVTAUJC | MPC8547EVTAUJD | MPC8548EPXAUJB | MPC8548EVTAUJC | MPC8544VJALFA |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Maximum Core Frequency | 1.333 GHz | 1.333 GHz | 1.333 GHz | 1.5 GHz | 1.5 GHz | 1.0 GHz |
| Memory Controller | DDR2 with ECC | DDR2 with ECC | DDR2 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2 with ECC |
| Integrated Ethernet | Dual GbE | Dual GbE | Dual GbE | Dual GbE | Dual GbE | Dual GbE |
| SerDes / High-Speed I/O | PCIe + RapidIO | PCIe + RapidIO | PCIe + RapidIO | PCIe + RapidIO (more lanes) | PCIe + RapidIO (more lanes) | PCIe + RapidIO (fewer lanes) |
| Approximate Unit Price (qty 1) | $188.30 | $190-$200 | $190-$200 | $220-$260 | $220-$260 | $95-$120 |
주요 차별점
- Cost-optimized PowerQUICC III integration (vs MPC8548EPXAUJB)
- Higher core frequency than entry-level siblings (vs MPC8544VJALFA)
- Integrated DDR2 controller with ECC (vs MPC8560VT833LC)
설계 노트
The 783-FCBGA at 1.0 mm pitch requires a high-density PCB stack-up with microvia or via-in-pad construction. Use at least 6 routing layers with the BGA escape routed on the top two layers plus dedicated ground/power planes directly under the device. Decoupling capacitors should be placed on the bottom side of the PCB directly beneath the BGA footprint using 0201 or 0402 size X7R MLCCs for high-frequency transient load response.
Estimated: at sustained 1.333 GHz with full GbE and PCIe activity, power dissipation is typically 5-8 W. The 29x29 mm FCBGA has a thermal resistance in the range of 15-20 C/W with standard 2 oz copper and adequate via stitching. Plan a heatsink or top-side heat spreader for industrial temperature operation. Validate with a thermal probe under worst-case packet-processing workload before finalizing the mechanical design.
DDR2 memory routing must follow strict length-matching rules: data lanes matched within 25 mil and clock within 50 mil of the strobe group. Place DDR2 chips on the same side of the PCB as the MPC8547 if possible, and use ground-referenced stripline for all DDR signals above 200 MHz. Series damping resistors on address and command lines are recommended for designs with more than 4 DDR2 devices.
Do not confuse the Freescale-branded MPC8547VTAUJB with the NXP-branded equivalent - although functionally identical after the 2015 acquisition, lot traceability and warranty terms may differ. Always confirm the date code and country of origin with your distributor. Also verify the JTAG COP header pinout matches your debugger; the 14-pin ribbon header pin assignments are standard but can be confused with other Power Architecture JTAG variants.
규정 준수 정보
PB Free variant available per NXP datasheet. RoHS/REACH compliance per NXP product page. Not AEC-Q100 qualified - this is a networking MPU, not an automotive part.