MPC8548ECPXAUJB - PowerPC e500 MPU, 1.333GHz, 783-FCBGA | NXP
부품 번호: MPC8548ECPXAUJB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $222.75 | $111,375.00 |
| 1,000 | $199.5 | $199,500.00 |
MPC8548ECPXAUJB 개요
A microprocessor (MPU) such as this MPC85xx device sits at the top of the embedded compute hierarchy: it is a System-on-Chip (SoC) that combines a CPU core, memory controllers, and high-speed I/O into a single BGA package. PowerQUICC III specifically refers to NXP's third-generation Power Architecture communications processors, descended from the PowerQUICC II (MPC82xx) family and positioned as the mid-tier successor that adds DDR2 plus Gigabit Ethernet while keeping the QUICC Engine for protocol acceleration. Within NXP's portfolio, MPC85xx sits above the entry-level MPC83xx (which used the e300 core) and below the later P4080/QorIQ P-series octal-core parts, while still being preferred over generic ARM Cortex-A parts in many telecom backplane designs because of the QUICC Engine's deterministic protocol offload. This hypernym chain (PowerQUICC III -> PowerQUICC -> Power Architecture -> MPU -> embedded SoC) helps locate the part inside the broader semiconductor taxonomy.
Headline features include a 32-bit e500 core with double-precision FPU, integrated L1/L2 caches, four TSEC Gigabit Ethernet MACs, three PCI Express interfaces, one serial RapidIO interface, four DDR/DDR2 controllers with ECC, eight DMA channels, and a QUICC Engine block for protocol termination. The device operates from 1.0 V/1.1 V core supplies with 1.8 V/2.5 V/3.3 V I/O support and is specified for industrial temperatures. The 0.09 µm CMOS process allows the 1.333 GHz core to fit inside the 783-FCBGA thermal envelope without exotic cooling. Designers use the integrated DDR2 controller and hardware ECC for high-availability packet processing where bit errors are unacceptable.
Typical applications include enterprise routers and switches, line cards for multiservice access platforms, industrial automation controllers, telecom base-station control-plane processors, military/aerospace ruggedized networking, and storage-area network (SAN) controllers. In each case, the e500 core runs a real-time or Linux-based control plane while the QUICC Engine offloads wire-speed ATM, HDLC, Ethernet, or POS (Packet over SONET) channels. Compared to a discrete CPU + ASIC solution, the keep it all on one chip reduces board area, BOM cost, and BOM risk for long-life programs.
When designing with the MPC8548ECPXAUJB, allow the user to allocate adequate PCB area for the 1.0 mm pitch FCBGA and follow NXP's hardware specifications document for power-rail sequencing, DDR2 topology, and SerDes reference clock routing. The high pin count (783 balls) and BGA-only assembly mean prototypes almost always go on a six- or eight-layer PCB with controlled-impedance stack-up; hand assembly is impractical and the device is considered a pre-application sample for new designs unless the user already has BGA process capability.
드롭인 대체품: MPC8548ECPXAUJB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8548ECPXAUJB (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, RoHS Status, Ethernet, Memory Controller, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8548EVTAUJB
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →MPC8548EPXAUJB
✅ 드롭인✓ 재고 있음
$215 / 개
데이터시트 보기 →MPC8548ECVTAUJB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8548EVXAUJB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8548ECPXAUJB 최대 정격 & 전기적 특성
| Core Architecture | PowerPC e500 (32-bit) |
| Core Count | 1 |
| Maximum Core Frequency | 1.333 GHz |
| Process Technology | 0.09 µm CMOS |
| Family | PowerQUICC III / MPC85xx |
| 패키지 | 783-FCBGA (29 x 29 mm, 1.0 mm pitch) |
| 실장 유형 | Surface Mount (BGA) |
| Core Supply Voltage | 1.0 V / 1.1 V |
| I/O Supply Voltage | 1.8 V / 2.5 V / 3.3 V |
| Memory Controller | DDR / DDR2 with ECC |
| Ethernet Interfaces | 4 × TSEC (10/100/1000 Mbps) |
| PCI Express Interfaces | 3 × PCIe (v1.0a) |
| RapidIO Interface | 1 × Serial RapidIO |
| DMA Channels | 8 |
| QUICC Engine | Integrated (multiproto acceleration) |
| 동작 온도 | -40°C to +85°C (industrial) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
MPC8548ECPXAUJB 783-fcbga (29 x 29 mm, 1.0 mm pitch) 핀 구성 가이드
MPC8548ECPXAUJB(783-fcbga (29 x 29 mm, 1.0 mm pitch) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8548ECPXAUJB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8548ECPXAUJB 적합 용도: 6 애플리케이션s: Enterprise Router Line Card, Multiservice Access Platform (MSAN), Telecom Base-Station Control Plane, Industrial Automation Controller, Storage Area Network (SAN) Controller, Military / Aerospace Ruggedized Networking.
Enterprise Router Line Card
The MPC8548ECPXAUJB fits enterprise router line cards because its four TSEC Gigabit Ethernet MACs deliver four GbE ports from one chip while the e500 core at 1.333 GHz runs the routing control plane and the QUICC Engine offloads ATM/HDLC/POS channels for legacy WAN aggregation. Placed as the central CPU on the line card, it replaces an external CPU plus Ethernet switch ASIC, shrinking BOM and reducing board area. The integrated DDR2 controller with ECC keeps packet memory reliable under sustained traffic, and the 783-FCBGA footprint consolidates all SerDes lanes on one BGA site, simplifying layout. Compared to a discrete CPU + NIC design, the integrated solution cuts power roughly 28-50% and removes one chip from the bill of materials. Engineers should follow the Freescale/NXP hardware specifications document for DDR2 trace length matching and SerDes reference-clock routing to hit GbE signal-integrity margins.
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Multiservice Access Platform (MSAN)
The MPC8548ECPXAUJB is well suited to multiservice access platforms because the QUICC Engine handles legacy TDM/ATM/PPP protocols while the e500 core runs a Linux or VxWorks control plane for service provisioning. Its three PCI Express ports let designers attach DSP or framer ASICs for VoIP and DSL aggregation, and the four TSEC GbE MACs uplink to the access-aggregation switch. The 1.333 GHz core delivers enough headroom for routing-table lookups even at full line-rate ACL filtering, and the industrial temperature grade (-40°C to +85°C) supports outdoor cabinet deployment. Compared to a board with discrete CPU plus communication ASIC, this SoC shrinks PCB real estate and BOM by roughly 28-50% while keeping firmware portability across the MPC85xx family.
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Telecom Base-Station Control Plane
The MPC8548ECPXAUJB serves as the control-plane processor in 2G/3G/LTE base stations where deterministic Power Architecture performance and the QUICC Engine's protocol offload simplify software development for telecom vendors with legacy firmware investments. The 32-bit e500 core at 1.333 GHz runs the real-time operating system plus OAM stack, while the integrated DDR2 controller with ECC keeps configuration memory reliable under continuous write cycles. Three PCI Express lanes attach baseband or radio-unit ASICs, while serial RapidIO provides a low-latency backhaul to the baseband card. Compared to an ARM Cortex-A9 alternative, the e500 platform offers mature firmware libraries and longer vendor support windows preferred in carrier-grade programs. Designers should follow NXP's hardware specifications document for power-rail sequencing and baseband-card clock topology.
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Industrial Automation Controller
The MPC8548ECPXAUJB fits industrial automation controllers because its industrial temperature grade (-40°C to +85°C), ECC-protected DDR2 controller, and rich peripheral set (PCIe, RapidIO, four TSEC GbE) deliver deterministic compute plus deterministic I/O for PLCs, motion controllers, and SCADA masters. The e500 core runs deterministic real-time control loops at 1.333 GHz while the QUICC Engine handles fieldbus-style legacy protocols on the same chip. The 783-FCBGA package consolidates all I/O onto one BGA site, which simplifies ruggedized conformal-coated PCB assembly. Compared to a discrete CPU + communication ASIC stack, this single-chip solution cuts BOM count by one or two parts and reduces mean-time-between-failure in long-life industrial programs.
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Storage Area Network (SAN) Controller
The MPC8548ECPXAUJB serves as a SAN controller CPU because the e500 core runs the storage stack (iSCSI, FCoE, NFS) while the four TSEC Gigabit Ethernet MACs and three PCI Express ports attach to multiple front-end host channels plus back-end RAID HBAs. Hardware ECC on the integrated DDR2 controller protects metadata from soft errors, which is critical for 24/7 storage operation, and the QUICC Engine handles legacy T1/E1 service-channel aggregation where needed. The 0.09 µm CMOS process keeps power consumption manageable for redundant controller pairs in 1U or 2U chassis. Compared to a discrete CPU plus Ethernet NIC, this integrated SoC reduces board area and BOM by roughly 28-50%, which is valuable for dense controller shelves. Designers should follow NXP's hardware specifications document for PCIe link-training topology.
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Military / Aerospace Ruggedized Networking
The MPC8548ECPXAUJB targets ruggedized military and aerospace platforms because its industrial temperature grade, hardware ECC on DDR2, and mature PowerQUICC III firmware ecosystem meet the long-life support requirements of defense programs. The e500 core at 1.333 GHz runs encrypted networking stacks while the QUICC Engine handles legacy tactical-radio protocols on the same chip. The 783-FCBGA package consolidates all I/O onto one BGA site, which simplifies the ruggedized PCB stack-up and reduces connector count. Compared to a board with discrete CPU plus communication ASIC, this single-chip solution reduces BOM and improves mean-time-between-failure in long-life defense programs. Designers must follow NXP's hardware specifications document for ruggedized thermal management and conformal-coating-compatible land pads.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8548ECPXAUJB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8548EVTAUJB | MPC8548EPXAUJB | MPC8548ECVTAUJB | MPC8548EVXAUJB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29) | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same | 783-FCBGA (29x29) - same |
| Core Architecture | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 | PowerPC e500 |
| Maximum Core Frequency | 1.333 GHz | 1.333 GHz | 1.333 GHz | 1.333 GHz | 1.333 GHz |
| Process Technology | 0.09 µm CMOS | 0.09 µm CMOS | 0.09 µm CMOS | 0.09 µm CMOS | 0.09 µm CMOS |
| Ethernet Interfaces | 4 × TSEC (10/100/1000) | 4 × TSEC (10/100/1000) | 4 × TSEC (10/100/1000) | 4 × TSEC (10/100/1000) | 4 × TSEC (10/100/1000) |
| PCI Express Interfaces | 3 × PCIe v1.0a | 3 × PCIe v1.0a | 3 × PCIe v1.0a | 3 × PCIe v1.0a | 3 × PCIe v1.0a |
| Ordering Suffix Differentiator | ECPX (industrial + security) | EVT (different temp/security suffix) | EPX (different security-engine suffix) | ECVT (different speed bin suffix) | EVX (different security suffix) |
주요 차별점
- Integrated QUICC Engine for protocol offload (vs MPC8560CVT667JC)
- Industrial temperature grade with hardware ECC (vs MPC8548EVXAUJB)
- Single-chip SoC consolidating CPU, MACs, and memory controller (vs Discrete CPU + Ethernet NIC design)
설계 노트
Estimated: the 783-FCBGA (29×29 mm, 1.0 mm pitch) requires a minimum six-layer PCB stack-up with continuous ground planes under the BGA to control impedance for DDR2 and SerDes signals. Allocate at least 4 oz copper or heavy copper pours under the BGA for thermal dissipation (the SoC dissipates on the order of single-digit watts at 1.333 GHz). Per the NXP hardware specifications document, route DDR2 traces as 50 Ω single-ended with length-matched byte lanes (typically ±25 ps skew budget) and keep SerDes reference-clock traces short and reference-clock-clean to avoid GbE link-training failures. Hand assembly is not practical for the 1.0 mm pitch BGA; design the PCB for reflow profiling only.
The MPC8548ECPXAUJB requires a 1.0 V/1.1 V core rail plus separate 1.8 V/2.5 V/3.3 V I/O rails, all sequenced per the NXP hardware specifications document. Use a multi-rail PMIC or dedicated switching regulators with power-good feedback to the SoC's reset input. Estimated: total board power is typically 5-12 W depending on core activity and SerDes link utilization. Decoupling caps should be placed as close as possible to each BGA power pin with a mix of 0.1 µF and 1 µF ceramics plus bulk polymer capacitors on each rail.
Estimated: at 1.333 GHz core clock with all four TSEC GbE MACs active, junction temperature rise is on the order of 30-40°C above ambient with a properly designed thermal pad and copper pour under the BGA. Use the BGA's center power/ground balls as a thermal conduction path to inner copper layers, and consider a small heatsink for high-ambient (>70°C) enclosures. The industrial temperature grade (-40°C to +85°C) refers to ambient, so derate junction temperature accordingly. Conformal coating is compatible with the FCBGA land pattern if applied per NXP's coating specifications.
Common pitfalls include: (1) mismatched DDR2 byte-lane trace lengths causing ECC errors and intermittent boot failures; (2) failing to sequence power rails per the hardware specifications document, leading to latch-up or unrecoverable reset; (3) placing the QUICC Engine reset strapping pins in the wrong state at power-up, which prevents the CPM block from initializing; (4) using a non-ECC DIMM in designs that rely on hardware ECC, which silently disables the ECC feature; and (5) attempting to migrate to MPC8560CVT667JC as a drop-in replacement when the peripheral mix differs - that migration requires a full board redesign.
규정 준수 정보
RoHS and REACH compliance per NXP product page; 'EC' suffix confirms lead-free, Pb-free, industrial-temperature grade. AEC-Q100 not applicable (MPU/SoC, not automotive-qualified discrete). Halogen-free status not stated in current product page.
