MPC8569EVJANKGB - PowerQUICC III 800MHz SoC | NXP FCBGA-783
부품 번호: MPC8569EVJANKGB ⚠ 최종 구매MPC8569EVJANKGB 개요
A PowerQUICC III SoC is a member of the communications-processor family that combines one or more Power Architecture cores with specialised on-chip peripherals (the QUICC Engine, security engine, DDR controller, SerDes) to offload packet processing from the CPU. The taxonomy is: communications processor -> embedded processor -> microprocessor (MPU) -> integrated circuit. PowerQUICC III parts target routing, switching, base-station, and gateway designs where deterministic protocol handling matters as much as raw MHz.
Headline features include an e500v2 core at 800 MHz, on-chip DDR2/DDR3 memory controller, dual SerDes supporting SRIO and PCI Express, Gigabit Ethernet (GbE), a Security Engine (SEC), and the QUICC Engine for multi-protocol termination. The wide peripheral mix lets one MPC8569E device replace what previously required a CPU plus several ASICs, reducing board area and BOM cost.
Architecturally, the e500v2 Book-E core implements a superscalar dual-issue pipeline with hardware MMU and 32 KB I/D L1 caches, while the QUICC Engine runs independent RISC microcode for ATM, HDLC, Ethernet, and PPP termination concurrently with the core. Integrated SerDes lanes, a multi-bank DDR2/DDR3 controller with ECC, and the Security Engine supporting DES/3DES/AES/SHA/RSA place the MPC8569E in the 800-1000 MHz class of communications SoCs.
Typical applications include 3G/WiMAX/LTE base-station control-plane processors, radio network controllers (RNC), multiservice gateways, ATM/TDM/IP edge equipment, and routers requiring hardware-accelerated encryption. The combination of GbE plus SRIO plus PCIe makes the part well-suited to mid-range router line-cards and network appliances.
When designing with this part, allocate adequate thermal copper to the 29x29 mm FCBGA to keep junction temperature below the 105C limit, and follow NXP's hardware design checklist for DDR3 trace length matching and SerDes reference-clock routing.
This page synthesises distributor pricing, lifecycle status, and drop-in package-matched alternatives from the MPC8569E PowerQUICC III family not found in the manufacturer datasheet alone.
드롭인 대체품: MPC8569EVJANKGB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8569EVJANKGB (동일 폼 팩터 및 풋프린트) — 차이점: Core, Mounting Type, Operating Temperature, Package.
MPC8569EVJAQKB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8569EVJALKB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8569ECVJANGGB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8569EVJANKGB 최대 정격 & 전기적 특성
| Family | PowerQUICC III (MPC85xx) |
| Core | Power Architecture e500v2 |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| 최대 클록 주파수 | 800 MHz |
| 동작 온도 | 0C to +105C |
| 패키지 | 783-FCBGA (29x29 mm) |
| 실장 유형 | Surface Mount (BGA) |
| On-chip Peripherals | QUICC Engine, GbE, DDR2/DDR3 controller, SEC, SRIO, PCIe, DMA |
| Memory Controller | DDR2/DDR3 with ECC |
| Serial Interfaces | Serial RapidIO, PCI Express, GbE, I2C, SPI, UART |
| Security Engine | SEC (DES/3DES/AES/SHA/RSA) |
| 공급 전압 | 1 V nominal (multi-rail) |
| RoHS 상태 | ROHS3 Compliant |
| Lead Free Status | Lead Free / ROHS3 Compliant per part data |
MPC8569EVJANKGB 783-fcbga (29x29 mm) 핀 구성 가이드
MPC8569EVJANKGB(783-fcbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8569EVJANKGB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8569EVJANKGB 적합 용도: 6 애플리케이션s: 3G/WiMAX/LTE Base Station Control Plane, Multiservice Gateway / Edge Router, Radio Network Controller (RNC), ATM/TDM/IP Carrier Equipment, Industrial Networking / Network Appliance, Secure VPN Aggregator / Encryption Appliance.
3G/WiMAX/LTE Base Station Control Plane
The MPC8569EVJANKGB suits base-station control-plane workloads with its 800 MHz e500v2 core, integrated Security Engine (SEC) for IPsec/3GPP key handling, and Serial RapidIO fabric linking to DSPs and FPGAs on the baseband card. Designers place the SoC between the CPRI fronthaul and backhaul network, where it terminates Layer 2/3, runs OAM, and orchestrates radio resources. The Hardware Understanding of QUICC Engine offload preserves e500v2 headroom for control-plane signalling at modest power budget. Compared with a CPU+ASIC pair, the MPC8569E halves board area while sustaining deterministic, line-rate forwarding.
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Multiservice Gateway / Edge Router
In edge routers and multiservice gateways, the MPC8569EVJANKGB's GbE, PCI Express and QUICC Engine accelerate IP/ATM/TDM traffic concurrently without CPU stall. The DDR2/DDR3 controller with ECC supports deep routing tables and route-cache working sets, while the Security Engine offloads IPsec and TLS for VPN termination. With 800 MHz of e500v2 compute and hardware crypto, the part delivers line-rate multi-protocol forwarding in a single chip - replacing what previously required an MPU plus several ASICs and reducing chassis BOM cost. The 105C thermal ceiling suits outdoor-cabinet edge nodes with adequate airflow.
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Radio Network Controller (RNC)
Radio network controllers rely on the MPC8569EVJANKGB for processing Node-B Iub traffic, terminating ATM and IP, and running RNC signalling state machines. The e500v2 at 800 MHz provides compute for NBAP/RNSAP message handling, while QUICC Engine microcode handles AAL2/AAL5 cell segmentation and reassembly. The Security Engine accelerates Kasumi and Snow3G primitives used in 3G confidentiality, removing crypto bottleneck from the call processing path. SRIO links to base-station cards provide deterministic, low-latency inter-board connectivity.
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ATM/TDM/IP Carrier Equipment
Telecom carrier gear for ATM/TDM/IP hybrid trunks benefits from the MPC8569EVJANKGB's programmable QUICC Engine, which handles ATM AAL2/AAL5, HDLC and PPP termination without burdening the e500v2 core. The DDR2/DDR3 controller supports large channelised TDM buffers, while the SRIO fabric aggregates traffic onto a higher-tier switch. Hardware ECC in the DDR path gives the reliability required for central-office deployment. Compared to discrete protocol ASICs, the MPC8569E consolidates protocol offload, control-plane CPU and security into a single 783-FCBGA footprint.
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Industrial Networking / Network Appliance
Industrial network appliances use the MPC8569EVJANKGB for firewalling, VPN, and IPv4/IPv6 routing in harsh environments, leveraging its GbE ports, hardware Security Engine and 0C-105C industrial temperature grade. The 32-bit e500v2 runs a hardened Linux stack with NXP's BSP, while the SEC handles IPsec/SSL encryption on multi-GbE links. Multi-port GbE plus PCIe to expansion NICs provide scalable port density. Industrial users get long-life production-grade silicon paired with deterministic interrupt response critical for SCADA and protocol gateway nodes.
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Secure VPN Aggregator / Encryption Appliance
Dedicated VPN and encryption appliances rely on the MPC8569EVJANKGB's Security Engine to push IPsec and TLS at multi-GbE line rate while the e500v2 core handles management, policy and IKE key exchange. The SerDes-based PCI Express link to crypto acceleration cards or to line cards enables modular scaling, while the DDR2/DDR3 controller with ECC supports large IPsec SA tables. Compared with running encryption purely on the CPU, the SEC offload saves 10-20 W per device and unlocks higher concurrent tunnel counts per rack unit.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8569EVJANKGB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8569EVJAQKB | MPC8569EVJALKB | MPC8569ECVJANGGB |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Core | Power Architecture e500v2 | Power Architecture e500v2 | Power Architecture e500v2 | Power Architecture e500v2 |
| Maximum Core Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Core Count | 1 | 1 | 1 | 1 |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Security Engine (SEC) | Yes | Yes | Yes | Yes |
| Serial RapidIO / PCIe | Yes / Yes | Yes / Yes | Yes / Yes | Yes / Yes |
| Operating Temperature | 0C to +105C | 0C to +105C (verify Q-suffix grade) | 0C to +105C (verify L-suffix grade) | 0C to +105C |
| RoHS Compliance | ROHS3 Compliant | ROHS3 Compliant (verify) | ROHS3 Compliant (verify) | ROHS3 Compliant |
| Lifecycle Status | EOL / Last Time Buy | EOL (same family) | EOL (same family) | EOL (same family) |
주요 차별점
- QUICC Engine programmable protocol accelerator (vs TI KeyStone II)
- Integrated Security Engine (SEC) for line-rate crypto (vs MPC8536CVJAULA)
- Power Architecture software ecosystem (vs ARM Cortex-A9 SOCs)
설계 노트
The 783-FCBGA (29x29 mm) dissipates significant heat at 800 MHz with all SerDes lanes active. Allocate at least 6 thermal vias in a 3x3 array under the centre die region, paired with a 4-layer PCB top-side copper pour under the BGA to keep junction-to-ambient below 105C. Estimate: 4-7 W typical, 9 W worst-case - bench-verify with thermocouple on top-side die centre after warm-up.
Follow NXP's hardware design checklist for the MPC8569E PowerQUICC III: DDR3 data/address/control traces must be length-matched within +/-25 mil, SerDes reference clocks must be routed with controlled impedance of 100-ohm differential, and the JTAG chain needs a 33-ohm termination at the boundary-scan header. Place decoupling capacitors as close to each BGA power/ground ball pair as physically possible - 0402 ceramic caps in a star layout are typical.
Do not attempt to substitute a non-NXP MPN as a drop-in for the MPC8569EVJANKGB - the Power Architecture instruction set, QUICC Engine microcode, and 783-FCBGA footprint are unique to the NXP PowerQUICC III family. Migration to TI KeyStone/Sitara or other vendors is a redesign, not a footprint swap. Plan a last-time-buy forecast early because the part is in EOL phase per NXP.
The MPC8569EVJANKGB's SerDes lanes are sensitive to power-rail noise; isolate the SerDes supply from the digital core supply with a ferrite bead plus bulk capacitor PI filter, and keep the 1.0 V core plane solid under the BGA. Use reference-clock jitter under 1 ps RMS to keep SRIO and PCIe links stable at their rated line rates - poor clock quality is the most common cause of intermittent link-down events on these parts.
규정 준수 정보
ROHS3 Compliant and Lead Free per Heisener listing and What-is-IC product data; Reach, halogen and conflict-mineral status not stated in available web data - set to unknown.