MPC8572ECPXAVND - 1.5GHz Dual-Core PowerPC e500 MPU | NXP
부품 번호: MPC8572ECPXAVND ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $499.81 | $499.81 |
| 10 | $450 | $4,500.00 |
| 100 | $405 | $40,500.00 |
| 250 | $382.93 | $95,732.50 |
| 500 | $365 | $182,500.00 |
MPC8572ECPXAVND 개요
A microprocessor (MPU) is a single-chip CPU that integrates one or more processor cores, cache memory, memory controllers, and peripheral interfaces onto a single silicon die. Within the broader taxonomy, the MPC8572E sits at the hierarchy MPU -> microprocessor -> processor -> integrated circuit -> semiconductor, and is classified as an embedded communications processor rather than a general-purpose CPU such as those used in PCs. The PowerQUICC III family specifically targets routers, switches, base stations, and storage area network controllers where deterministic latency and rich I/O integration outweigh raw single-thread speed.
Key features include dual e500 cores at 1.5 GHz, on-chip L2 cache, integrated DDR2/DDR3 memory controller with ECC, four GbE ports, four SerDes lanes configurable for PCI Express or Serial RapidIO, and a programmable QUICC Engine for protocol termination. The 1023-ball FCBGA package exposes the full complement of address, data, and high-speed serial interfaces required by line-card designs. Extended temperature grade screening (AVND suffix) supports industrial operating ranges from -40C to +105C ambient, addressing outdoor and ruggedized networking equipment.
Architecturally, the MPC8572E combines two scalar e500 cores with a 512 KB shared L2 cache, a 64-bit DDR2/DDR3 memory controller with ECC, and a high-bandwidth system bus that ties the cores to the multi-port Ethernet switch fabric and QUICC Engine block. The on-chip hardware accelerators offload cryptographic operations (AES, 3DES, SHA, Kasumi), packet parsing, and QoS queue management, freeing the cores for routing and control-plane software. This level of integration reduces board BOM count and simplifies multi-PCB designs that would otherwise require discrete ASSPs.
Typical applications include enterprise and carrier-grade routers, multi-service switching platforms, wireless base stations (especially LTE NodeB and femtocell implementations), storage area network controllers, and industrial control systems requiring deterministic performance with rich I/O. The extended temperature rating also makes the part suitable for outdoor industrial gateways and ruggedized defense networking gear.
When designing with this device, allocate generous power decoupling and thermal management - peak power dissipation in the dual-core 1.5 GHz configuration can exceed 25 W and the 33x33 mm FCBGA requires a multi-layer PCB with via-in-pad thermal vias to keep junction temperature within the extended temperature range. Designers should follow NXP application notes for power sequencing, DDR3 trace matching, and reference clock distribution.
This page synthesizes distributor pricing for NXP part MPC8572ECPXAVND, drop-in alternatives from the same PowerQUICC III family and competing MPU families, and practical design notes not consolidated on the manufacturer datasheet front page.
드롭인 대체품: MPC8572ECPXAVND — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8572ECPXAVND (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Mounting Type, Series, Co-Processors / DSP, Core Architecture.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8572EPXAVND
✅ 드롭인✓ 재고 있음
$191.67 / 개
데이터시트 보기 →MPC8572EVTAVND
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8548ECPXAUJC
✅ 드롭인✓ 재고 있음
$189.9 / 개
데이터시트 보기 →MPC8572ECPXAVND 최대 정격 & 전기적 특성
| Manufacturer | NXP USA Inc. |
| Series | MPC85xx (PowerQUICC III) |
| Core Processor | PowerPC e500 |
| Number of Cores | 2 |
| Core Architecture | 32-Bit |
| Maximum CPU Clock | 1.5 GHz |
| 패키지 / 케이스 | 1023-BFBGA, FCBGA (33x33 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +105C (Extended Temp, AVND suffix) |
| Memory Controller | DDR2/DDR3 with ECC (per datasheet) |
| Ethernet Interfaces | Multiple Gigabit Ethernet (per datasheet) |
| High-Speed Serial | PCI Express and/or Serial RapidIO SerDes (per datasheet) |
| Hardware Acceleration | QUICC Engine, security acceleration (per datasheet) |
| Packaging | Tray |
MPC8572ECPXAVND 1023-bfbga, fcbga (33x33 mm) 핀 구성 가이드
MPC8572ECPXAVND(1023-bfbga, fcbga (33x33 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8572ECPXAVND.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8572ECPXAVND 적합 용도: 6 애플리케이션s: Carrier-Grade Routers, LTE Base Station Baseband Processing, Multi-Service Switching Platforms, Storage Area Network Controllers, Industrial Control and Ruggedized Networking, Wireless Infrastructure Backhaul.
Carrier-Grade Routers
The MPC8572ECPXAVND's dual e500 cores at 1.5 GHz and on-chip hardware accelerators make it a fit for control-plane and data-plane routing in carrier-grade edge routers. The integrated DDR2/DDR3 controller with ECC and multiple Gigabit Ethernet ports deliver the throughput required for line-rate packet forwarding, while the QUICC Engine offloads protocol termination. Compared with discrete ASSP plus CPU designs, the integrated SoC reduces board area, BOM cost, and software complexity. Place the device on a multi-layer PCB with via-in-pad thermal vias; ensure the DDR3 traces are length-matched per the NXP hardware specifications datasheet for the 1.5 GHz speed grade.
추천
LTE Base Station Baseband Processing
Within an LTE NodeB or femtocell base station, the MPC8572ECPXAVND serves as the baseband processor handling Layer 2/3 protocol stacks, MAC scheduling, and hardware-accelerated cipher operations. The Kasumi and Snow3G engines on-chip deliver the cipher throughput required for secure air interfaces at 4G data rates, while the dual e500 cores provide headroom for Layer 3 routing and OAM processing. The -40C to +105C temperature range supports outdoor small-cell deployments and ruggedized radio units. DDR3 bandwidth, SerDes-based backhaul (PCIe or RapidIO), and the Quad GbE ports enable connection to RF front ends and aggregation switches.
추천
Multi-Service Switching Platforms
The MPC8572ECPXAVND is engineered for multi-service switching platforms that must terminate Ethernet, MPLS, ATM, and TDM traffic concurrently. The QUICC Engine block provides the multi-protocol termination capability NXP inherited from the PowerQUICC legacy, while the four SerDes lanes support PCI Express fabric connectivity to companion ASICs or FPGAs. The dual e500 cores handle routing, ACL enforcement, and management-plane tasks without overloading a single core. Power dissipation in this configuration can exceed 20 W at full load, requiring substantial copper pours and active cooling.
추천
Storage Area Network Controllers
In iSCSI, NAS, and Fibre-Channel-over-Ethernet controllers, the MPC8572ECPXAVND delivers the protocol-processing throughput and I/O bandwidth required to saturate multi-GigE storage interfaces. The dedicated QUICC Engine offloads iSCSI and TCP/IP protocol handling, freeing the dual e500 cores to run file-system stacks, RAID management, and authentication. DDR3 with ECC protects data integrity during transient errors, while the extended temperature rating supports enterprise RAID shelves operating at elevated ambient. Reference designs from NXP demonstrate quad-GbE plus PCIe to a host RAID controller.
추천
Industrial Control and Ruggedized Networking
Extended-temperature MPC8572ECPXAVND parts serve industrial gateways and defense networking equipment deployed in uncontrolled environments. The -40C to +105C ambient rating, combined with the device's deterministic interrupt response, suits SCADA aggregators, substation routers, and tactical communications. Hardware AES/3DES/SHA engines handle encrypted control-plane links on the same SoC. Designers must follow NXP application notes on power sequencing and DDR3 trace matching; the 1023-FCBGA requires strict PCB layout discipline to maintain signal integrity over the industrial temperature range.
추천
Wireless Infrastructure Backhaul
Wireless backhaul aggregation nodes use the MPC8572ECPXAVND to terminate multiple GbE links and forward aggregated traffic over 10G uplinks via the SerDes lanes. The dual e500 cores run routing protocols and QoS schedulers concurrently with traffic engineering, while the integrated security engines handle MACsec encryption on aggregation trunks. The 1023-FCBGA supports the high-bandwidth memory subsystem required to avoid head-of-line blocking across aggregated streams. Compared with switch-ASIC plus external CPU designs, the integrated SoC consolidates functions and reduces bill-of-materials cost.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8572ECPXAVND — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8572EPXAVND | MPC8572EVTAVND | MPC8548ECPXAUJC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33 mm) | 1023-FCBGA (33x33 mm) - same | 1023-FCBGA (33x33 mm) - same | Smaller FCBGA - not pin-compatible footprint |
| Core | Dual PowerPC e500 | Dual PowerPC e500 | Dual PowerPC e500 | Single PowerPC e500 |
| Max CPU Clock | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.33 GHz |
| Operating Temperature | -40C to +105C (Extended) | 0C to +105C (Commercial) | 0C to +105C (Commercial) | -40C to +105C (Extended) |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2 with ECC |
| Packaging Media | Tray | Tray | Tray | Tray |
| Lead Time | To be confirmed by quote | To be confirmed by quote | To be confirmed by quote | To be confirmed by quote |
주요 차별점
- Extended temperature grade for industrial-grade environments (vs MPC8572EPXAVND)
- Dual-core architecture for higher throughput (vs MPC8548ECPXAUJC)
- On-chip hardware security engines (vs MPC8572EPXAVND)
설계 노트
Estimated: at 1.5 GHz dual-core load the MPC8572ECPXAVND power dissipation can reach approximately 25 W. The 1023-FCBGA 33x33 mm package requires a multi-layer PCB with a dense via-in-pad thermal array under the die, plus copper pours on inner and outer layers. Active cooling (heatsink with airflow) is recommended for sustained workloads above 20 W to keep junction temperature within the -40C to +105C extended-grade envelope.
The 1023-ball FCBGA demands strict PCB design discipline. Route DDR3 address, command, and data traces with matched lengths within the tolerances given in the MPC8572E hardware specifications datasheet. Use buried capacitors under the BGA for power decoupling; place 0402 ceramic bypass capacitors within 5 mm of each power pin. Reference the NXP AN-4326 application note for the recommended stackup and via pattern.
Do not substitute the commercial-grade MPC8572EPXAVND into designs qualified for -40C operation; the AVND suffix indicates the extended-temperature test flow. Conversely, avoid paying the extended-temp premium for indoor commercial deployments. Confirm the speed-grade bin against the platform clock and DDR clock required; over-specifying wastes cost and over-driving can cause timing violations at extreme temperatures.
규정 준수 정보
Compliance fields are unknown because the verified web data did not include RoHS, REACH, lead-free, or halogen-free declarations for this MPN. NXP product pages or distributor compliance statements should be consulted for authoritative values.
