MPC860ENCVR50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP
부품 번호: MPC860ENCVR50D4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $76.5 | $765.00 |
| 100 | $68.25 | $6,825.00 |
| 500 | $60.1 | $30,050.00 |
| 1,000 | $52.4 | $52,400.00 |
MPC860ENCVR50D4 개요
A PowerQUICC microprocessor is a member of the integrated communications processor family — it is, in system hierarchy, a microprocessor (MPU) that integrates CPU core, system controller, and dedicated communications peripherals (FCC, SCC, SMC, SPI, I2C) on a single die. PowerQUICC MPUs are widely used in networking equipment where deterministic serial-channel handling must coexist with general-purpose control processing; the MPC860 sub-family sits within NXP/Freescale's MPC8xx line, beneath the higher-end MPC8260/MPC8280 and above the simpler MPC850.
Key features of the MPC860ENCVR50D4 include a 50 MHz core clock, integrated CPM (Communications Processor Module) supporting multiple HDLC/SCC channels, 357-ball PBGA packaging for high-density board designs, and full PowerPC instruction-set compatibility. The device includes 4 KB instruction cache and 4 KB data cache, dual UART-style serial channels, and parallel I/O ports. The 357-pin BGA provides the high pin count required to expose all of the integrated communications peripherals while keeping board area manageable.
The architecture pairs a PowerPC core with the CPM co-processor that offloads serial DMA, HDLC framing, and time-slot management, freeing the core for protocol and routing tasks. This dual-processor internal structure is what differentiates PowerQUICC from general-purpose MPUs and is why legacy telecom, industrial control, and routing platforms standardized on this family. The EN suffix in the part number typically denotes the Ethernet-enabled variant within the MPC860 sub-family, complementing the integrated serial channels with 10 Mbps Ethernet MAC support.
Typical applications include WAN/LAN routers, ISDN terminal adapters, ATM edge devices, industrial serial-bridges, and legacy telecommunications line cards. Engineers continue to deploy this part in long-lifecycle industrial platforms where the PowerQUICC ecosystem (toolchain, RTOS support, reference designs) is mature and revalidation cost is high.
When designing with this MPU, designers should plan for a multi-rail supply (3.3V core plus I/O), adequate BGA decoupling, and signal-integrity work on the parallel bus. The 357-pin BGA requires X-ray inspection and careful reflow profiling, and most engineers keep the manufacturer's reference schematics as a starting point rather than designing the bus interface from scratch.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in a single datasheet - so procurement and engineering teams can decide between the MPC860ENCVR50D4 and its same-package MPC860 family members in one place.
드롭인 대체품: MPC860ENCVR50D4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC860ENCVR50D4 (동일 폼 팩터 및 풋프린트) — 차이점: Processor Type, RoHS Status, Core Architecture, Process Technology, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC860SRCVR50D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860PVR50D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860TCVR50D4
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MPC860DTVR50D4
✅ 드롭인✓ 재고 있음
$59.8 / 개
데이터시트 보기 →MPC860ENCVR50D4 최대 정격 & 전기적 특성
| Processor Type | MPU PowerQUICC MPC8xx |
| Core Architecture | 32-Bit PowerPC |
| Core Count | 1 |
| 최대 클록 주파수 | 50 MHz |
| 동작 공급 전압 | 3.3 V |
| Process Technology | 0.32 um CMOS |
| 패키지 / 케이스 | 357-BBGA (PBGA, 25 x 25 mm) |
| 실장 유형 | Surface Mount |
| Instruction Cache | 4 KB |
| Data Cache | 4 KB |
| On-chip Peripherals | CPM (Communications Processor Module), SCC, FCC, SMC, SPI, I2C, Ethernet MAC |
| Packaging | Tray |
| Lead Free Status | Lead Free |
| RoHS 상태 | RoHS Compliant |
| Series | MPC8xx PowerQUICC |
MPC860ENCVR50D4 357-bbga (pbga, 25 x 25 mm) 핀 구성 가이드
MPC860ENCVR50D4(357-bbga (pbga, 25 x 25 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC860ENCVR50D4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC860ENCVR50D4 적합 용도: 6 애플리케이션s: WAN/LAN Router Control Plane, ISDN Terminal Adapter, Industrial Serial Bridge / Protocol Converter, ATM Edge Device / DSLAM Line Card, Legacy Telecom Line Card Controller, Embedded Industrial Controller with Ethernet.
WAN/LAN Router Control Plane
The MPC860ENCVR50D4 fits WAN/LAN router control-plane designs because its integrated 10 Mbps Ethernet MAC and CPM-driven SCC/FCC serial channels provide the deterministic multi-channel serial handling that router line cards require, all on a single die. With a 50 MHz PowerPC core and on-chip 4 KB instruction / 4 KB data caches, the device can run a routing protocol stack (RIP, OSPF, or BGP-lite) while the CPM offloads HDLC framing, PPP, and time-slot management. The 357-BGA package exposes the full bus and peripheral set needed for a router control card without external glue logic. Power dissipation at 50 MHz / 3.3V is low enough for fanless industrial enclosures, and the mature PowerQUICC toolchain (gcc, Green Hills, Wind River VxWorks) means engineers can leverage existing reference designs and BSPs from NXP.
추천
ISDN Terminal Adapter
ISDN terminal adapters rely on the MPC860ENCVR50D4's integrated HDLC controllers, SCC channels, and time-slot assigner within the CPM to handle the BRI/PRI D-channel signaling without burdening the PowerPC core. The 50 MHz clock grade is sufficient for the call-control state machine, and the integrated Ethernet MAC simplifies the LAN-side bridge. Designers can use the manufacturer's reference application note to map BRI U-interface transceivers directly to the SCC pins. The 357-BGA keeps the adapter board small while still exposing enough I/O for an ISDN S/T interface, an Ethernet PHY, and a host-side parallel port for management.
추천
Industrial Serial Bridge / Protocol Converter
Industrial protocol converters (Modbus, PROFIBUS, DF1, ASCII gateways) benefit from the MPC860ENCVR50D4's multiple SCC/FCC channels that can each run a different serial protocol concurrently under CPM DMA. The 50 MHz PowerPC core handles the protocol-conversion state machine and TCP/IP uplink over Ethernet. The 3.3V supply rail and 357-BGA footprint fit standard industrial SBC form factors, and the part's NRD lifecycle status has not yet constrained long-life industrial platforms because authorized distributors like Rochester Electronics continue to ship. Engineers typically pair the MPU with an external PHY and isolated RS-485 transceivers to build a hardened industrial gateway.
추천
ATM Edge Device / DSLAM Line Card
ATM edge devices and early-generation DSLAM line cards use the MPC860ENCVR50D4 because the CPM's AAL segmentation and reassembly offload, combined with the PowerPC core running routing/signaling, fit the ATM adaptation layer requirements. The 50 MHz clock grade handles the cell-rate pacing for low-density DSL ports, and the integrated Ethernet MAC provides the upstream uplink. The 357-BGA allows direct bonding to ATM framer ICs and DSL PHY chips on the same board. Reference designs from NXP cover the AAL5 SAR configuration, which substantially shortens development time.
추천
Legacy Telecom Line Card Controller
Telecom line cards (T1/E1 framers, channel banks) leverage the MPC860ENCVR50D4's CPM-driven HDLC controllers and time-slot assigner to handle DS0 grooming and per-channel signaling at line rate. The 50 MHz core runs the central call-processing state machine while the CPM services up to multiple T1/E1 framers via dedicated serial channels. The integrated Ethernet MAC simplifies OAM&P connectivity back to the shelf controller. The 357-BGA provides enough balls to interface directly with framer ICs, line-interface units, and management EEPROM without external mux logic.
추천
Embedded Industrial Controller with Ethernet
Long-lifecycle embedded industrial controllers (factory automation, substation controllers, building-automation gateways) standardize on the MPC860ENCVR50D4 because of the mature toolchain, BSP availability, and field-proven reliability. The 50 MHz PowerPC core runs control logic and a small RTOS, while the integrated Ethernet MAC and serial channels expose multiple industrial fieldbuses. The 3.3V supply and 357-BGA footprint make it straightforward to design a compact controller board that fits IP65 enclosures. Many platform owners have already taken lifetime buys, so the part continues to ship through 2030+ loss windows.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC860ENCVR50D4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC860SRCVR50D4 | MPC860PVR50D4 | MPC860TCVR50D4 | MPC860DTVR50D4 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-BBGA (PBGA, 25x25 mm) | 357-BBGA (PBGA, 25x25 mm) - same | 357-BBGA (PBGA, 25x25 mm) - same | 357-BBGA (PBGA, 25x25 mm) - same | 357-BBGA (PBGA, 25x25 mm) - same |
| Core Clock | 50 MHz | 50 MHz - same | 50 MHz - same | 50 MHz - same | 50 MHz - same |
| Integrated Ethernet MAC | Yes (10 Mbps) | No (serial-telecom focused) | No | No | No |
| Sub-Family Suffix | EN (Ethernet-enabled) | SRC (serial telecom) | PV (base variant) | TC | DT |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Core Architecture | 32-bit PowerPC + CPM | 32-bit PowerPC + CPM | 32-bit PowerPC + CPM | 32-bit PowerPC + CPM | 32-bit PowerPC + CPM |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Integrated 10 Mbps Ethernet MAC on a 50 MHz PowerQUICC (vs MPC860PVR50D4)
- Same-package drop-in within the MPC860 50 MHz family (vs MPC860TCVR50D4)
- 50 MHz clock grade balances CPM throughput and power (vs MPC860TZQ66D4)
설계 노트
Estimated: at 3.3V supply and 50 MHz core clock, the MPC860ENCVR50D4 typically draws under 1W active power, well within the 357-BGA's thermal envelope with standard 4-layer PCB thermal via array under the package. For sealed industrial enclosures, validate junction temperature with the manufacturer's thermal model rather than relying on ambient-only measurements. Place at least a 6x6 thermal via array (0.3 mm drill, 1.0 mm pitch) directly under the BGA die-shadow region to spread heat into inner copper planes.
BGA escape routing on the MPC860ENCVR50D4 must use microvia or 4-mil line/space fan-out on the top layer. Place 0.1 uF decoupling caps on every power/ground ball pair within 1 mm of the package. Use a continuous ground plane on layer 2 directly beneath the BGA to control return-current paths and reduce simultaneous-switching noise on the parallel bus. X-ray inspection after reflow is mandatory because BGA solder joints cannot be visually inspected.
Do not confuse the MPC860ENCVR50D4 with the higher-frequency MPC860TZQ66D4 (66 MHz) or MPC860ENCVR80D4 (80 MHz); the firmware's bus-derivation register settings assume a 50 MHz core clock and must be re-tuned if a faster part is substituted. Also verify the CPM interrupt vector table when migrating between EN/SRC/PV/TC/DT sub-family suffixes, because the integrated Ethernet MAC presence changes the CPM interrupt map and driver initialization sequence.
The MPC860ENCVR50D4 is in NRD (Not Recommended for New Designs) status per NXP/Freescale's MPC8xx family PCN. For new designs, evaluate the follow-on PowerQUICC II (MPC8250/MPC8260) or PowerQUICC III (MPC8540) families, which require PCB rework. For ongoing production of existing designs, plan lifetime buys and confirm continuity supply through authorized distributors like Rochester Electronics. Do not begin a new design on this part without securing multi-year inventory.
규정 준수 정보
RoHS compliant and lead-free per NXP/Mouser listings. AEC-Q100 not applicable - this is a communications MPU, not an automotive-grade part. Operating temperature range not explicitly published in indexed snippets; refer to NXP datasheet for full thermal specs.
