MT29F1G08ABAEAH4-AATX:E - 1Gb SLC NAND Flash, x8 | Micron
부품 번호: MT29F1G08ABAEAH4-AATX:E ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.18 | $2.18 |
| 10 | $1.95 | $19.50 |
| 100 | $1.62 | $162.00 |
| 500 | $1.38 | $690.00 |
| 1,000 | $1.22 | $1,220.00 |
MT29F1G08ABAEAH4-AATX:E 개요
An SLC NAND Flash is a non-volatile memory that stores one bit per cell, giving higher endurance, faster write throughput, and lower bit error rates than MLC/TLC NAND at the cost of lower density per die. SLC NAND belongs to the broader class of non-volatile memory (NVM) -> Flash memory -> NAND Flash -> raw NAND hierarchy, typically paired with an external controller or host MCU that performs bad-block management, wear leveling, and ECC. SLC parts are favored over MLC NAND in industrial and automotive designs where data retention and write endurance matter more than cost-per-gigabit.
Key features of the MT29F1G08ABAEAH4-AATX:E include read-buffer mode for cache-style reads, an OTP region with hardware and software write protection, a hardware WP# pin, a hardware RESET# pin, copy-back program operation, and an operating temperature range of -40C to +85C (industrial grade). The parallel interface uses 8 I/O lines and is the industry's standard x8 async NAND command set (ONFI-compatible legacy commands). The 63-ball VFBGA package, marked with FBGA code RW182, supports compact PCB layouts below 100 mm^2 including the keep-out.
Internally, the die is organized as 1024 blocks of 64 pages, with 2112 bytes per page (2048 data + 64 spare). Page reads complete in 25 us typical, supporting a sustained read bandwidth exceeding 60 MB/s in burst mode when paired with a controller. The integrated static and dynamic wear-leveling logic is left to the host controller, and ONFI parameter pages can be read from the device for software identification.
Typical applications for the MT29F1G08ABAEAH4-AATX:E include industrial data loggers, factory automation controllers, point-of-sale terminals, networking equipment (boot + data storage), automotive infotainment subsystems, IoT gateways, and firmware storage for FPGAs and SoCs that need reliable, repeatable write cycles. In boot-and-storage designs it commonly stores the bootloader, calibration tables, and system logs.
Designers should note that the absence of an on-die controller means the host MCU/SoC must run an FTL or a simple bad-block table. Decoupling should follow the JEDEC JESD8C 3.3 V LVCMOS guideline for HBM/ESD tolerance. Industrial temperature grade -40C to +85C is suitable for outdoor enclosures and most factory-floor deployments.
This page consolidates Micron datasheet specs, real-time distributor pricing, and pin-compatible SLC NAND alternatives in the 63-VFBGA footprint - information often scattered across disti websites and individual datasheets.
드롭인 대체품: MT29F1G08ABAEAH4-AATX:E — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MT29F1G08ABAEAH4-AATX:E TR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT29F1G08ABAEAH4-ITX:E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT29F1G08ABAEAH4-ITX:E TR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT29F2G08ABAEAH4-AATX:E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT29F1G08ABAEAH4-AITX:E
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT29F1G08ABAEAH4-AATX:E 최대 정격 & 전기적 특성
| 메모리 유형 | SLC NAND Flash (non-volatile) |
| Density | 1 Gbit (128 MB) |
| 메모리 구성 | 128 M x 8 |
| 인터페이스 | Parallel asynchronous (x8) |
| Supply Voltage (VCC) | 2.7 V to 3.6 V |
| Page Size | 2112 bytes (2048 + 64 spare) |
| Block Size | 64 pages (132 KB) |
| Block Count | 1024 |
| Endurance (P/E Cycles) | 100,000 per block |
| Page Program Time (typical) | 200 us |
| Block Erase Time (typical) | 700 us |
| Page Read Time (typical) | 25 us |
| ECC Requirement | 1-bit ECC per 528 bytes |
| 동작 온도 | -40C to +85C (industrial) |
| 패키지 | 63-ball VFBGA, 9 mm x 11 mm |
| FBGA Code | RW182 |
| Special Features | Read buffer, OTP area, hardware WP, hardware RESET, copy-back |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
MT29F1G08ABAEAH4-AATX:E 63-ball vfbga, 9 mm x 11 mm 핀 구성 가이드
MT29F1G08ABAEAH4-AATX:E(63-ball vfbga, 9 mm x 11 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MT29F1G08ABAEAH4-AATX:E.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MT29F1G08ABAEAH4-AATX:E 적합 용도: 7 애플리케이션s: Industrial Data Logger Storage, Bootloader and Firmware Storage for SoC/FPGA Designs, Automotive Infotainment Data Partition, Networking Equipment and Router Storage, Point-of-Sale (POS) Terminal Storage, Edge IoT Gateway and Sensor Aggregator, Test and Measurement Instrument Storage.
Industrial Data Logger Storage
The MT29F1G08ABAEAH4-AATX:E serves as the primary non-volatile storage bank in industrial data loggers that capture sensor, vibration, or process telemetry. Its 100,000 P/E endurance per block allows continuous high-rate logging across years of deployment without flash wear-out, and the 1-bit ECC requirement per 528 bytes is easily handled by even low-cost industrial MCUs. The 2.7V to 3.6V supply aligns with 3.3V rail designs common in factory-floor equipment, and the 63-ball VFBGA footprint keeps the storage area below 100 mm^2. Compared with MLC NAND the 200 us page-program time reduces write latency when bursts of telemetry must be committed under real-time constraints, and the -40C to +85C operating range covers outdoor enclosures and unheated cabinets.
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Bootloader and Firmware Storage for SoC/FPGA Designs
The MT29F1G08ABAEAH4-AATX:E provides reliable 128 MB non-volatile storage for bootloader images, golden firmware, and calibration tables in SoC and FPGA designs. Its parallel x8 asynchronous NAND interface pairs naturally with most microcontroller external memory controllers (FSMC on STM32, EBI on NXP Kinetis, x8 host on Zynq), and the OTP area combined with the hardware WP# pin lets the firmware implement a secure boot chain that prevents rollback to older images. The 25 us typical page-read time supports sub-second cold-boot times for 1 MB firmware images, while the 100K P/E endurance tolerates frequent OTA updates during development and field provisioning. Operating from 2.7V to 3.6V and -40C to +85C ensures compatibility with industrial SBC and FPGA board voltage rails.
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Automotive Infotainment Data Partition
The MT29F1G08ABAEAH4-AATX:E is used in automotive infotainment head units and telematics control units (TCUs) to store map tiles, audio buffering, and diagnostic logs. Although the part itself does not carry an automotive AEC-Q100 grade, designers typically pair it with system-level qualification and leverage its industrial -40C to +85C specification for non-safety-critical infotainment partitions. The 1 Gbit capacity fits a region for offline maps, voice prompts, and BLT (boot, log, trace) buffers, while the parallel x8 interface connects directly to the application processor external memory interface. The 100,000 P/E endurance accommodates frequent log writes from CAN/LIN capture, and the small 63-VFBGA 9x11 mm package suits space-constrained head-unit PCBs.
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Networking Equipment and Router Storage
The MT29F1G08ABAEAH4-AATX:E provides 128 MB of non-volatile storage in enterprise and industrial routers, firewalls, and switches where it holds the routing firmware, VPN certificates, configuration tables, and log archives. Its 3.3V LVCMOS compatible I/O simplifies connection to network SoCs that drive x8 NAND, and the 1-bit ECC requirement is trivial for the embedded firmware to handle. The 63-ball VFBGA footprint enables compact router boards where height and PCB real estate are at a premium, and the 100K P/E endurance easily tolerates daily configuration rollbacks during operational lifecycles. Compared with raw NOR flash, the SLC NAND delivers 100x the capacity at comparable per-bit cost.
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Point-of-Sale (POS) Terminal Storage
The MT29F1G08ABAEAH4-AATX:E serves as the local data partition in point-of-sale terminals that must record transactions offline, queue credit/debit authorizations, and store firmware for kiosk-mode operations. Its 1 Gbit (128 MB) capacity is sufficient for transaction queues, signature buffers, and Linux root filesystems in compact POS form factors, and the 200 us typical page-program time captures each transaction record quickly to prevent queue overflow during high-volume sales periods. The hardware WP# and OTP area help protect cryptographic key material and tamper-evident logs, while the 1-bit ECC per 528 bytes minimizes soft-error risk in environments with intermittent ESD exposure. The package's 9x11 mm VFBGA footprint fits beneath the main display board in slim POS designs.
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Edge IoT Gateway and Sensor Aggregator
The MT29F1G08ABAEAH4-AATX:E provides non-volatile buffering for edge IoT gateways that aggregate data from multiple industrial sensor networks (Modbus, CAN, 4-20 mA) before forwarding to cloud infrastructure. With 100,000 P/E cycles per block the device tolerates days of continuous buffered writes without wear-out, and the 128 MB capacity accommodates circular log buffers plus a Linux JFFS2/UBI root filesystem. The device's -40C to +85C operating temperature allows installation in factory cabinets, outdoor enclosures, and refrigerated warehouses where edge gateways must operate reliably. The asynchronous parallel x8 interface simplifies integration with low-power industrial MCUs that lack the clocking requirements of QSPI or eMMC.
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Test and Measurement Instrument Storage
The MT29F1G08ABAEAH4-AATX:E is used inside test and measurement instruments (oscilloscopes, protocol analyzers, RF recorders) as the bulk storage for sampled waveforms, calibration certificates, and instrument firmware. The 200 us page-program time lets sweep captures be written quickly between successive acquisitions, while the 25 us page-read time keeps firmware-launch time minimal. The 100K P/E endurance handles repeated write of large log files across years of lab use, and the industrial -40C to +85C temperature range ensures operation in non-climate-controlled production environments. The 63-ball VFBGA 9x11 mm package packs 128 MB into a footprint that fits on the main instrument PCB next to ADC and FPGA devices.
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추천 제품 요약
엔지니어링 참조 데이터: MT29F1G08ABAEAH4-AATX:E — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MT29F1G08ABAEAH4-AATX:E TR | MT29F1G08ABAEAH4-ITX:E | MT29F1G08ABAEAH4-ITX:E TR | MT29F2G08ABAEAH4-AATX:E | MT29F1G08ABAEAH4-AITX:E |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 63-VFBGA (9x11) | 63-VFBGA (9x11) - same | 63-VFBGA (9x11) - same | 63-VFBGA (9x11) - same | 63-VFBGA (9x11) - same | 63-VFBGA (9x11) - same |
| Density | 1 Gbit (128 MB) | 1 Gbit (same) | 1 Gbit (same) | 1 Gbit (same) | 2 Gbit (2x) | 1 Gbit (same) |
| Organization | 128 M x 8 | 128 M x 8 | 128 M x 8 | 128 M x 8 | 256 M x 8 | 128 M x 8 |
| Interface | Parallel x8 async | Parallel x8 async | Parallel x8 async | Parallel x8 async | Parallel x8 async | Parallel x8 async |
| Supply Voltage | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V |
| Endurance (P/E Cycles) | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 | 100,000 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| ECCN / Sub-class | 3A991.b.1.a | 3A991.b.1.a | 3A991.b.1.a | 3A991.b.1.a | 3A991.b.1.a | 3A991.b.1.a |
주요 차별점
- Industrial -40C to +85C operating range (vs Commercial-grade 0C to +70C SLC NAND parts)
- Drop-in 2 Gbit density upgrade in same package (vs MT29F1G08ABAEAH4-AATX:E base part vs MT29F2G08ABAEAH4-AATX:E 2 Gbit upgrade)
- 100,000 P/E endurance vs MLC NAND typically 3K-10K (vs Equivalent density MLC/TLC raw NAND parts)
설계 노트
The MT29F1G08ABAEAH4-AATX:E does not contain an on-die controller - the host MCU/SoC must implement bad-block management (BBM), wear leveling, and a Flash Translation Layer (FTL) or simple static mapping. Skipping this step causes premature blocks to be reused and silent data corruption. Pair the NAND with a controller that implements JEDEC ONFI-compliant reset, read ID, page read, page program, and block erase command sequences.
Place at least one 0.1 uF X7R ceramic capacitor adjacent to every VCC ball and one 1 uF tantalum or ceramic bulk capacitor near the package. Route the 8-bit DQ bus with matched trace lengths (mismatch under 50 mil) to meet the 25 ns typical tRC timing budget. Keep the WP#, R/B#, and CE# traces short, and provide a 0 ohm jumper to lift the WP# signal to VCC during firmware development.
During a 700 us block-erase or 200 us page-program operation the device draws brief inrush currents up to 30 mA peak across VCC. Ensure your regulator can supply at least 100 mA peak on the 3.3V rail, with 1 ms of holdup margin. A ferrite bead between the regulator and the NAND helps isolate inrush noise from the host MCU power domain.
규정 준수 정보
RoHS compliant per Micron product page. ECCN 3A991.b.1.a as observed on distributor listings. The part is industrial-grade -40C to +85C but is not AEC-Q100 qualified; choose AEC-Q100 qualified SLC NAND variants for safety-critical automotive applications.
