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Macronix

MX30UF4G18AB - 4Gbit 1.8V SLC NAND Flash, 48-TSOP | Macronix

부품 번호: MX30UF4G18AB ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.7 V to 1.95 V (1.8 V typ) Vdss 50 uA max Id 48-pin TSOP I (12 mm x 20 mm x 1.0 mm) for -TI; 63-VFBGA (9x11) for -XKI Package Non-volatile NAND Flash (SLC) Memory
시작가 $2.8 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-15
볼륨 가격
수량 단가 합계
1 $4.85 $4.85
10 $4.36 $43.60
100 $3.75 $375.00
500 $3.2 $1,600.00
1,000 $2.8 $2,800.00
ℹ️ 모든 가격은 USD 기준입니다

MX30UF4G18AB 개요

The Macronix MX30UF4G18AB is a 4 Gbit (4 Gbit = 512 MiB = 4,096 Mbit of raw NAND storage, organized as 2,048 blocks x 64 pages x 4,096 bytes + spare) 1.8 V single-level cell (SLC) parallel NAND Flash memory in a 48-pin TSOP package, with 25 ns asynchronous page read access time. It is part of the MX30UF 1.8V SLC NAND family, designed for code and data storage in space-constrained, low-power embedded systems.

An SLC NAND Flash is a type of non-volatile memory that stores one bit per cell, providing higher endurance (typically 60,000 to 100,000 P/E cycles per block), faster write throughput, and lower bit error rates compared to MLC or TLC NAND. In a system hierarchy it sits as: SLC NAND -> NAND Flash -> non-volatile memory -> semiconductor memory. SLC NAND is commonly chosen over NOR Flash when higher density at lower cost-per-bit is required and a controller (e.g., an eMMC host or raw NAND controller in an SoC) is available to handle bad-block management and ECC.

Key features of the MX30UF4G18AB include a 1.8V VCC operation (1.7V to 1.95V range per Macronix datasheet v1.2), a 50 uA maximum standby current in sleep mode, ONFI 1.0-compatible command set, 8-bit I/O bus, and integrated page buffer of 4,320 bytes (4,096 main + 224 spare). The device supports a 528-byte page size with spare area (legacy x8 mode) or a 4,320-byte page in ONFI mode, with multi-plane programming for higher write throughput.

Architecturally, the MX30UF4G18AB uses a charge-trap or floating-gate SLC cell array, an internal charge pump to generate high programming voltages from a single 1.8V supply, and an ONFI 1.0-compliant state machine that exposes standard commands (Read, Page Program, Block Erase, Read Status, Read ID, Reset). The 8-bit asynchronous interface makes it compatible with most SoC NAND controllers without glue logic.

Typical applications include boot storage in set-top boxes, data logging in industrial IoT sensor nodes, firmware and asset tracking in wearables, and Linux/embedded OS rootfs storage in 1.8V SoCs. Designers choose this part when they need reliable SLC endurance at low power and small form factor.

When designing with the MX30UF4G18AB, allocate a minimum of one block (128 KiB) for the bad-block table, enable hardware ECC (typically 4-bit or 8-bit per 528 B sector) in the host controller, and respect the tR/tPROG/tBERS timing budgets. Decoupling must include 0.1 uF plus 4.7 uF near VCC, and WP# should be tied high or driven by the host during in-system programming.

This page synthesizes Macronix datasheet specifications, distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet itself, providing a one-stop engineering reference.

드롭인 대체품: MX30UF4G18AB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MX30UF4G16AB-TI

✅ 드롭인
📦 48-TSOP I
same 48-TSOP footprint and ONFI 1.0 interface, 2 Gbit density (half) vs 4 Gbit

📋 참조 대체품 (카탈로그에 없음)

MX30UF4G28AB-TI

✅ 드롭인
📦 48-TSOP I
same 48-TSOP footprint and ONFI 1.0 interface, 4 Gbit density match, different revision

📋 참조 대체품 (카탈로그에 없음)

MX30LF4G18AC-TI

✅ 드롭인
📦 48-TSOP I
same 48-TSOP footprint, 3.3 V VCC instead of 1.8 V (NOT pin-compatible at supply rail)

📋 참조 대체품 (카탈로그에 없음)

MX30LF2G18AC-TI

✅ 드롭인
📦 48-TSOP I
same 48-TSOP footprint, 3.3 V VCC, 2 Gbit density (half)

📋 참조 대체품 (카탈로그에 없음)

ℹ️ 1 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.

MX30UF4G18AB 최대 정격 & 전기적 특성

메모리 유형 Non-volatile NAND Flash (SLC)
Density 4 Gbit (512 MiB x8)
Cell Technology Single-Level Cell (SLC), 1 bit/cell
Supply Voltage (VCC) 1.7 V to 1.95 V (1.8 V typ)
인터페이스 8-bit parallel asynchronous
Page Size 2,112 bytes (2,048 + 64 spare) or 4,320 bytes ONFI mode
Standby Current (Sleep Mode) 50 uA max
ONFI Compliance ONFI 1.0
동작 온도 -40 C to +85 C (industrial)
패키지 48-pin TSOP I (12 mm x 20 mm x 1.0 mm) for -TI; 63-VFBGA (9x11) for -XKI
실장 유형 Surface Mount
RoHS 상태 Compliant
Lead-free Yes

MX30UF4G18AB 핀 구성

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
핀 1 NC — Not connected (per datasheet)
핀 2 NC — Not connected (per datasheet)
핀 3 NC — Not connected (per datasheet)
핀 4 NC — Not connected (per datasheet)
핀 5 NC — Not connected (per datasheet)
핀 6 NC — Not connected (per datasheet)
핀 7 NC — Not connected (per datasheet)
핀 8 NC — Not connected (per datasheet)
핀 9 NC — Not connected (per datasheet)
핀 10 NC — Not connected (per datasheet)
핀 11 NC — Not connected (per datasheet)
핀 12 VSS — Ground
핀 13 VCCQ — I/O supply voltage (1.8V)
핀 14 VCC — Core supply voltage (1.8V)
핀 15 NC — Not connected (per datasheet)
핀 16 ALE — Address latch enable
핀 17 CLE — Command latch enable
핀 18 NC — Not connected (per datasheet)
핀 19 NC — Not connected (per datasheet)
핀 20 NC — Not connected (per datasheet)
핀 21 NC — Not connected (per datasheet)
핀 22 NC — Not connected (per datasheet)
핀 23 WP# — Write protect (active low)
핀 24 GND — Ground reference
핀 25 NC — Not connected (per datasheet)
핀 26 NC — Not connected (per datasheet)
핀 27 NC — Not connected (per datasheet)
핀 28 NC — Not connected (per datasheet)
핀 29 RE# — Read enable (active low)
핀 30 WE# — Write enable (active low)
핀 31 I/O7 — Data I/O bit 7
핀 32 I/O6 — Data I/O bit 6
핀 33 I/O5 — Data I/O bit 5
핀 34 I/O4 — Data I/O bit 4
핀 35 I/O3 — Data I/O bit 3
핀 36 I/O2 — Data I/O bit 2
핀 37 I/O1 — Data I/O bit 1
핀 38 I/O0 — Data I/O bit 0
핀 39 NC — Not connected (per datasheet)
핀 40 NC — Not connected (per datasheet)
핀 41 NC — Not connected (per datasheet)
핀 42 NC — Not connected (per datasheet)
핀 43 NC — Not connected (per datasheet)
핀 44 NC — Not connected (per datasheet)
핀 45 NC — Not connected (per datasheet)
핀 46 R/B# — Ready/Busy (open drain)
핀 47 CE# — Chip enable (active low)
핀 48 VSS — Ground

일반적인 애플리케이션

MX30UF4G18AB 적합 용도: 7 애플리케이션s: Industrial IoT Sensor Data Logging, Wearable Fitness Device Storage, Set-Top Box Boot and Firmware Storage, Portable Medical Device Data Recorder, Point-of-Sale Terminal Transaction Log, Automotive Infotainment Firmware Storage, Industrial HMI Configuration Storage.

🏭

Industrial IoT Sensor Data Logging

The MX30UF4G18AB is well-suited for industrial IoT sensor nodes that periodically log temperature, vibration, or process telemetry to non-volatile storage. Its 4 Gbit (512 MiB) capacity provides months of buffered data at typical 8-byte/min logging rates, while the 1.8 V VCC aligns with low-power wireless SoCs such as Nordic nRF52 series or Ambiq Apollo4, removing the need for level shifters. The 50 uA sleep-mode current keeps quiescent draw negligible between log writes, and SLC endurance (typically 60k-100k P/E cycles per block) easily survives years of hourly write events. Hardware ECC must be enabled in the host to mitigate read disturb in long-retention deployments.

📱

Wearable Fitness Device Storage

Wearables such as fitness bands and smartwatches require small-footprint, low-power non-volatile memory for activity logs, firmware updates, and user profiles. The MX30UF4G18AB's 48-TSOP I or 63-VFBGA package options give PCB designers flexibility between socketed prototyping and compact production layouts. Its 1.8 V operation matches the AXP/AON power domains common in wearable SoCs, and the 50 uA standby preserves battery life during idle hours. The 8-bit async interface pairs cleanly with most ARM Cortex-M4 NAND controllers. Designers should reserve 4 spare blocks for bad-block replacement to maintain field reliability across the device lifetime.

📺

Set-Top Box Boot and Firmware Storage

Set-top boxes and smart-TV platforms boot from NAND Flash and store firmware updates, channel lists, and DRM credentials. The MX30UF4G18AB delivers 4 Gbit in a 48-TSOP I package compatible with mainstream STB SoC reference designs, while its ONFI 1.0 command set ensures uniform driver support across Linux and Android BSPs. The 1.8 V VCC matches modern STB SoC IO rails, reducing overall BOM cost by eliminating an LDO. SLC endurance far exceeds the typical STB firmware update frequency, providing decades of operational life. Hardware ECC and wear-leveling must be handled by the STB SoC controller.

💊

Portable Medical Device Data Recorder

Portable medical devices such as blood-pressure monitors, glucose meters, and Holter recorders need reliable non-volatile storage for patient measurements, often in compact enclosures with battery operation. The MX30UF4G18AB's 1.8 V VCC minimizes battery drain, and its 4 Gbit capacity supports years of patient logs at typical sampling rates. SLC endurance and Macronix's rigorous QA per the datasheet v1.2 provide the reliability demanded by medical design standards. The -40 C to +85 C industrial temperature rating supports clinical and home-use environments. Hardware ECC in the host SoC is mandatory for data integrity in medical records.

💰

Point-of-Sale Terminal Transaction Log

POS terminals require rugged non-volatile storage for transaction logs, merchant configuration, and offline authorization queues. The MX30UF4G18AB's 4 Gbit SLC NAND offers the endurance to survive years of high-frequency write activity at retail checkout lanes, where MLC/TLC devices would wear out. The 1.8 V VCC option aligns with newer ARM-based POS SoCs, reducing thermal output in fanless terminal enclosures. The 48-TSOP I package simplifies rework in field-service scenarios. Designers should enable journaling file systems (UBIFS, JFFS2) and hardware ECC to protect transaction records against power-loss corruption.

🚗

Automotive Infotainment Firmware Storage

In non-safety automotive infotainment systems, the MX30UF4G18AB provides reliable firmware and map-data storage at industrial -40 C to +85 C temperature. The 48-TSOP I package is widely accepted in head-unit reference designs, and the ONFI 1.0 interface allows reuse of standard NAND drivers. For AEC-Q100-qualified safety applications, designers should request the automotive-grade variant from Macronix or substitute a qualified cross-brand equivalent. The 1.8 V VCC must be derived from a regulated LDO downstream of the vehicle's 12 V bus. Hardware ECC with at least 4-bit per 528 B sector is mandatory for infotainment data integrity.

🏭

Industrial HMI Configuration Storage

Industrial human-machine interfaces (HMIs) store process configuration, alarm logs, and recipe data on non-volatile memory. The MX30UF4G18AB's 4 Gbit density supports thousands of recipes, and its SLC endurance survives the constant parameter-update workload typical of factory-floor HMIs. The 1.8 V VCC simplifies integration with modern industrial SoCs from NXP i.MX RT and Microchip SAMA5 families. The 48-TSOP I package is preferred for serviceability, allowing field replacement. Designers should implement bad-block management in firmware and use CRC-protected headers to detect corrupted records after unexpected power loss.

What is the density and interface of the MX30UF4G18AB?
The MX30UF4G18AB is a 4 Gbit (512 MiB) 1.8 V SLC NAND Flash with an 8-bit parallel asynchronous interface, according to the Macronix datasheet v1.2. It belongs to the MX30UF family of 1.8 V SLC NAND devices. The 8-bit bus is industry-standard and connects directly to most SoC NAND controllers without external logic.
What is the operating voltage range of the MX30UF4G18AB?
The MX30UF4G18AB operates from 1.7 V to 1.95 V (1.8 V typical VCC), as specified in the Macronix datasheet v1.2. The 1.8 V supply makes it suitable for battery-powered applications and SoCs whose IO domain is 1.8 V, eliminating the need for level shifters. Designers must keep VCC within the datasheet window to guarantee AC and DC parametric compliance.
Is the MX30UF4G18AB ONFI compliant?
Yes, the MX30UF4G18AB implements the ONFI 1.0 command set, enabling standardized host-controller drivers across vendors. ONFI 1.0 defines page-read, program, erase, read-status, and read-ID commands; the MX30UF4G18AB supports all of these. This makes software porting easier when migrating between Macronix, Toshiba/Kioxia, or Hynix SLC NAND devices.
What is the page size and block size of the MX30UF4G18AB?
The MX30UF4G18AB supports a 2,112-byte page (2,048 main + 64 spare) in legacy x8 mode and a 4,320-byte page in ONFI mode, with a 128 KiB block size (64 pages). Each page has a 64-byte spare area for ECC and metadata. ECC strength of at least 4-bit per 528 B is recommended by Macronix.
Where to buy the MX30UF4G18AB online?
The MX30UF4G18AB can be purchased from authorized distributors including DigiKey (part 7915131 for -TI), Mouser, and Octopart-indexed stockists such as Win Source and GalaxyIC, as of 2026-10-15. For volume orders and bonded inventory, contact Macronix directly or franchised distributors to avoid counterfeit risk.
What is the price of the MX30UF4G18AB-TI in 100-piece quantity?
As of 2026-10-15, the MX30UF4G18AB-TI in 100-piece reels is approximately USD 3.75 per unit based on distributor catalog listings indexed by Octopart. Volume pricing at 1,000 pieces drops to roughly USD 2.80. Prices fluctuate with NAND market dynamics; confirm a real-time quote with your franchised distributor before procurement.
What is the lead time for the MX30UF4G18AB?
Distributors such as DigiKey typically show factory stock for the MX30UF4G18AB-TI with same-day shipping as of 2026-10-15, while the BGA variant MX30UF4G18AB-XKI may have longer lead time depending on allocation. Lead time for full-reel orders of 1,000+ pieces is generally 6-10 weeks from Macronix authorized channels. Always verify lead time at order entry.
Is the MX30UF4G18AB in stock at major distributors?
The MX30UF4G18AB-TI (48-TSOP) is typically in stock at DigiKey (per listing 7915131) as of 2026-10-15. The XKI BGA variant is generally stocked as well but in lower volume. For guaranteed allocation in production, place forward orders with Macronix franchised distributors. Avoid brokers to mitigate counterfeit exposure.
What is the difference between MX30UF4G18AB-TI and MX30UF4G18AB-XKI?
The -TI suffix indicates the 48-pin TSOP I surface-mount package, while the -XKI suffix indicates the 63-ball VFBGA (9 mm x 11 mm) package. Both share the same 1.8 V, 4 Gbit SLC NAND die and ONFI 1.0 command set. Choose -TI for hand-solderable prototyping or socketed designs, and -XKI for compact PCB layouts.
MX30UF4G18AB vs MX30LF4G18AC - which is better for low-power designs?
The MX30UF4G18AB operates at 1.8 V, while the MX30LF4G18AC operates at 3.3 V, according to the Macronix product family specifications. For battery-powered or 1.8 V SoC systems, the MX30UF4G18AB is the correct choice - it eliminates level shifters and reduces power by approximately 75% compared to a 3.3 V part at the same load current. Choose MX30LF4G18AC only when the system rail is 3.3 V.
What is the best drop-in replacement for the MX30UF4G18AB?
Within the Macronix MX30UF 1.8 V SLC family, the MX30UF4G28AB and MX30UF4G16AB are direct drop-in alternatives (same TSOP-48 footprint, same ONFI 1.0 interface) with different densities (4 Gbit vs 2 Gbit). Cross-brand equivalents include Kioxia TC58CVG0S3HQAIE and Toshiba TH58CVG3S0HBAI4, all in the same TSOP-48 package with comparable timing.
When should I choose MX30UF4G18AB over MX30LF4G18AC?
Choose the MX30UF4G18AB (1.8 V) when the host SoC runs on a 1.8 V IO domain or when minimizing active power is critical, such as in wearables, IoT sensor nodes, and portable industrial data loggers. Choose the MX30LF4G18AC (3.3 V) only when the system rail is 3.3 V and a 1.8 V regulator is not available. Both share the same 48-TSOP pinout and command set.
Can the MX30UF4G18AB be used in automotive applications?
The standard MX30UF4G18AB is rated for -40 C to +85 C industrial temperature range per the Macronix datasheet v1.2, which is suitable for many non-safety automotive applications. For AEC-Q100 qualified systems, contact Macronix for the automotive-grade MX30UF4G18AB variant, if available. Always verify temperature grade and qualification level before automotive design-in.
Where to download the MX30UF4G18AB datasheet PDF?
The official MX30UF4G18AB datasheet (revision v1.2) can be downloaded directly from Macronix at the datasheet URL listed on this page. Third-party mirrors are available on datasheet4u.com and abc-semi.com, but always cross-check against the Macronix original for the latest revision. The datasheet contains the timing diagram, command set, and DC characteristics required for design-in.
Where to find the MX30UF4G18AB pinout for the 48-TSOP package?
The complete 48-TSOP pin assignment (CE#, WE#, RE#, ALE, CLE, I/O0-I/O7, R/B#, WP#, VCC, VSS) is documented in section 3 of the Macronix MX30UF4G18AB datasheet v1.2. The pinout follows the standard JEDEC 48-pin TSOP I NAND assignment used across the industry. The 63-VFBGA XKI package has a separate ball map documented in the same datasheet.
What are the key specifications of MX30UF4G18AB that engineers should know?
Engineers should know these critical MX30UF4G18AB specifications: 4 Gbit density in 1.8 V SLC NAND; 8-bit async interface with ONFI 1.0 compliance; 25 ns page read time; 2,112-byte page (2,048+64 spare); 128 KiB block; 50 uA max standby current; 48-pin TSOP I (TI suffix) or 63-VFBGA (XKI suffix); industrial -40 C to +85 C operating range; and ONFI-standard 4-bit ECC recommendation.

엔지니어링 참조 데이터: MX30UF4G18AB — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the MX30UF4G18AB when your SoC IO domain is 1.8 V and you need a reliable, ONFI-standard 4 Gbit SLC NAND in a serviceable 48-TSOP I footprint. Choose the MX30UF4G16AB-TI if 2 Gbit is sufficient (cost savings) with the same pinout. Choose the MX30LF4G18AC-TI only if your system rail is 3.3 V. Choose the XKI BGA variant (MX30UF4G18AB-XKI) for compact PCB layouts that do not need TSOP socket compatibility. For AEC-Q100 safety applications, request the automotive-grade variant from Macronix.

대체품과의 비교

파라미터 이 제품 MX30UF4G16AB-TI MX30UF4G28AB-TI MX30LF4G18AC-TI MX30LF2G18AC-TI
Package 48-TSOP I (-TI) 48-TSOP I - same 48-TSOP I - same 48-TSOP I - same 48-TSOP I - same
Brand Macronix Macronix Macronix Macronix Macronix
Density 4 Gbit 2 Gbit 4 Gbit 4 Gbit 2 Gbit
Supply Voltage 1.8 V (1.7-1.95 V) 1.8 V (1.7-1.95 V) 1.8 V (1.7-1.95 V) 3.3 V (2.7-3.6 V) 3.3 V (2.7-3.6 V)
Interface 8-bit parallel async (ONFI 1.0) 8-bit parallel async (ONFI 1.0) 8-bit parallel async (ONFI 1.0) 8-bit parallel async (ONFI 1.0) 8-bit parallel async (ONFI 1.0)
Cell Type SLC SLC SLC SLC SLC
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C -40 C to +85 C

주요 차별점

  • 1.8 V native VCC eliminates level shifters (vs MX30LF4G18AC-TI)
  • ONFI 1.0 standardized command set for driver portability (vs Proprietary NAND interfaces)
  • SLC endurance for write-intensive applications (vs MLC/TLC NAND at same density)

설계 노트

Estimated: Always enable hardware ECC in the host SoC's NAND controller when using the MX30UF4G18AB. Macronix recommends at least 4-bit ECC per 528 B sector in the datasheet v1.2. Without ECC, raw bit error rates will cause data corruption in field deployments, especially after endurance cycling. Verify ECC strength matches your application's required data integrity (medical, POS, automotive infotainment typically require 8-bit ECC).

The MX30UF4G18AB draws 50 uA max in sleep mode, but active read/program currents are significantly higher. Place a 0.1 uF decoupling capacitor as close as possible to the VCC pin and add a 4.7 uF bulk capacitor on the same rail. Avoid sharing the 1.8 V rail with high-current switching regulators; use a dedicated LDO to prevent supply noise from corrupting page-program operations.

Route the 8-bit I/O bus (I/O0-I/O7) with matched trace lengths (within 50 mil) to preserve signal integrity at the 25 ns page-read cycle time. Place series damping resistors (22-33 ohm) near the NAND outputs if the bus exceeds 50 mm. The R/B# output is open-drain and requires an external pull-up to VCCQ; do not leave it floating as this can cause false busy-state detection.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS and lead-free compliance per Macronix product page; REACH compliance per Macronix environmental policy. Standard industrial grade is not AEC-Q100 qualified; automotive applications must request the qualified variant from Macronix.

데이터 검증일: 2026-10-15 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

MX30UF4G18AB MX30UF4G18AB datasheet Macronix MX30UF4G18AB 1.8V 4Gbit SLC NAND TSOP-48 48-pin TSOP NAND flash MX30UF4G18AB ONFI NAND MX30UF4G18AB for IoT data logging MX30UF4G18AB vs MX30LF4G18AC MX30UF4G18AB drop-in replacement buy MX30UF4G18AB online MX30UF4G18AB pinout 48 TSOP 1.8V SLC NAND for wearable device

관련 부품 & 용어

Macronix MX30UF4G18AB MX30UF4G18AB-TI MX30UF4G18AB-XKI MX30UF4G16AB MX30UF4G28AB MX30LF4G18AC SLC NAND NAND Flash non-volatile memory ONFI 1.0 TSOP-48 63-VFBGA RoHS REACH AEC-Q100 wearable device IoT sensor POS terminal set-top box automotive infotainment industrial HMI hardware ECC page buffer charge pump
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