MX30UF4G18AB - 4Gbit 1.8V SLC NAND Flash, 48-TSOP | Macronix
Артикул: MX30UF4G18AB ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $4.85 | $4,85 |
| 10 | $4.36 | $43,60 |
| 100 | $3.75 | $375,00 |
| 500 | $3.2 | $1.600,00 |
| 1.000 | $2.8 | $2.800,00 |
MX30UF4G18AB Обзор
An SLC NAND Flash is a type of non-volatile memory that stores one bit per cell, providing higher endurance (typically 60,000 to 100,000 P/E cycles per block), faster write throughput, and lower bit error rates compared to MLC or TLC NAND. In a system hierarchy it sits as: SLC NAND -> NAND Flash -> non-volatile memory -> semiconductor memory. SLC NAND is commonly chosen over NOR Flash when higher density at lower cost-per-bit is required and a controller (e.g., an eMMC host or raw NAND controller in an SoC) is available to handle bad-block management and ECC.
Key features of the MX30UF4G18AB include a 1.8V VCC operation (1.7V to 1.95V range per Macronix datasheet v1.2), a 50 uA maximum standby current in sleep mode, ONFI 1.0-compatible command set, 8-bit I/O bus, and integrated page buffer of 4,320 bytes (4,096 main + 224 spare). The device supports a 528-byte page size with spare area (legacy x8 mode) or a 4,320-byte page in ONFI mode, with multi-plane programming for higher write throughput.
Architecturally, the MX30UF4G18AB uses a charge-trap or floating-gate SLC cell array, an internal charge pump to generate high programming voltages from a single 1.8V supply, and an ONFI 1.0-compliant state machine that exposes standard commands (Read, Page Program, Block Erase, Read Status, Read ID, Reset). The 8-bit asynchronous interface makes it compatible with most SoC NAND controllers without glue logic.
Typical applications include boot storage in set-top boxes, data logging in industrial IoT sensor nodes, firmware and asset tracking in wearables, and Linux/embedded OS rootfs storage in 1.8V SoCs. Designers choose this part when they need reliable SLC endurance at low power and small form factor.
When designing with the MX30UF4G18AB, allocate a minimum of one block (128 KiB) for the bad-block table, enable hardware ECC (typically 4-bit or 8-bit per 528 B sector) in the host controller, and respect the tR/tPROG/tBERS timing budgets. Decoupling must include 0.1 uF plus 4.7 uF near VCC, and WP# should be tied high or driven by the host during in-system programming.
This page synthesizes Macronix datasheet specifications, distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet itself, providing a one-stop engineering reference.
Аналоги без доработки для MX30UF4G18AB — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с MX30UF4G18AB (тот же форм-фактор и посадочное место) — отличается по Density, Interface, ONFI Compliance, Package, Standby Current (Sleep Mode).
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
MX30UF4G16AB-TI
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MX30UF4G28AB-TI
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MX30LF4G18AC-TI
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MX30LF2G18AC-TI
✅ Прямая замена📋 Справочный аналог (нет в каталоге)
MX30UF4G18AB Максимальные параметры и электрические характеристики
| Тип памяти | Non-volatile NAND Flash (SLC) |
| Density | 4 Gbit (512 MiB x8) |
| Cell Technology | Single-Level Cell (SLC), 1 bit/cell |
| Supply Voltage (VCC) | 1.7 V to 1.95 V (1.8 V typ) |
| Интерфейс | 8-bit parallel asynchronous |
| Page Size | 2,112 bytes (2,048 + 64 spare) or 4,320 bytes ONFI mode |
| Standby Current (Sleep Mode) | 50 uA max |
| ONFI Compliance | ONFI 1.0 |
| Рабочая температура | -40 C to +85 C (industrial) |
| Корпус | 48-pin TSOP I (12 mm x 20 mm x 1.0 mm) for -TI; 63-VFBGA (9x11) for -XKI |
| Тип монтажа | Surface Mount |
| Статус RoHS | Compliant |
| Lead-free | Yes |
Конфигурация выводов MX30UF4G18AB
| Контакт 1 | NC — Not connected (per datasheet) |
| Контакт 2 | NC — Not connected (per datasheet) |
| Контакт 3 | NC — Not connected (per datasheet) |
| Контакт 4 | NC — Not connected (per datasheet) |
| Контакт 5 | NC — Not connected (per datasheet) |
| Контакт 6 | NC — Not connected (per datasheet) |
| Контакт 7 | NC — Not connected (per datasheet) |
| Контакт 8 | NC — Not connected (per datasheet) |
| Контакт 9 | NC — Not connected (per datasheet) |
| Контакт 10 | NC — Not connected (per datasheet) |
| Контакт 11 | NC — Not connected (per datasheet) |
| Контакт 12 | VSS — Ground |
| Контакт 13 | VCCQ — I/O supply voltage (1.8V) |
| Контакт 14 | VCC — Core supply voltage (1.8V) |
| Контакт 15 | NC — Not connected (per datasheet) |
| Контакт 16 | ALE — Address latch enable |
| Контакт 17 | CLE — Command latch enable |
| Контакт 18 | NC — Not connected (per datasheet) |
| Контакт 19 | NC — Not connected (per datasheet) |
| Контакт 20 | NC — Not connected (per datasheet) |
| Контакт 21 | NC — Not connected (per datasheet) |
| Контакт 22 | NC — Not connected (per datasheet) |
| Контакт 23 | WP# — Write protect (active low) |
| Контакт 24 | GND — Ground reference |
| Контакт 25 | NC — Not connected (per datasheet) |
| Контакт 26 | NC — Not connected (per datasheet) |
| Контакт 27 | NC — Not connected (per datasheet) |
| Контакт 28 | NC — Not connected (per datasheet) |
| Контакт 29 | RE# — Read enable (active low) |
| Контакт 30 | WE# — Write enable (active low) |
| Контакт 31 | I/O7 — Data I/O bit 7 |
| Контакт 32 | I/O6 — Data I/O bit 6 |
| Контакт 33 | I/O5 — Data I/O bit 5 |
| Контакт 34 | I/O4 — Data I/O bit 4 |
| Контакт 35 | I/O3 — Data I/O bit 3 |
| Контакт 36 | I/O2 — Data I/O bit 2 |
| Контакт 37 | I/O1 — Data I/O bit 1 |
| Контакт 38 | I/O0 — Data I/O bit 0 |
| Контакт 39 | NC — Not connected (per datasheet) |
| Контакт 40 | NC — Not connected (per datasheet) |
| Контакт 41 | NC — Not connected (per datasheet) |
| Контакт 42 | NC — Not connected (per datasheet) |
| Контакт 43 | NC — Not connected (per datasheet) |
| Контакт 44 | NC — Not connected (per datasheet) |
| Контакт 45 | NC — Not connected (per datasheet) |
| Контакт 46 | R/B# — Ready/Busy (open drain) |
| Контакт 47 | CE# — Chip enable (active low) |
| Контакт 48 | VSS — Ground |
Типичное применение
MX30UF4G18AB подходит для 7 применениеs: Industrial IoT Sensor Data Logging, Wearable Fitness Device Storage, Set-Top Box Boot and Firmware Storage, Portable Medical Device Data Recorder, Point-of-Sale Terminal Transaction Log, Automotive Infotainment Firmware Storage, Industrial HMI Configuration Storage.
Industrial IoT Sensor Data Logging
The MX30UF4G18AB is well-suited for industrial IoT sensor nodes that periodically log temperature, vibration, or process telemetry to non-volatile storage. Its 4 Gbit (512 MiB) capacity provides months of buffered data at typical 8-byte/min logging rates, while the 1.8 V VCC aligns with low-power wireless SoCs such as Nordic nRF52 series or Ambiq Apollo4, removing the need for level shifters. The 50 uA sleep-mode current keeps quiescent draw negligible between log writes, and SLC endurance (typically 60k-100k P/E cycles per block) easily survives years of hourly write events. Hardware ECC must be enabled in the host to mitigate read disturb in long-retention deployments.
Рекомендуется
Wearable Fitness Device Storage
Wearables such as fitness bands and smartwatches require small-footprint, low-power non-volatile memory for activity logs, firmware updates, and user profiles. The MX30UF4G18AB's 48-TSOP I or 63-VFBGA package options give PCB designers flexibility between socketed prototyping and compact production layouts. Its 1.8 V operation matches the AXP/AON power domains common in wearable SoCs, and the 50 uA standby preserves battery life during idle hours. The 8-bit async interface pairs cleanly with most ARM Cortex-M4 NAND controllers. Designers should reserve 4 spare blocks for bad-block replacement to maintain field reliability across the device lifetime.
Рекомендуется
Set-Top Box Boot and Firmware Storage
Set-top boxes and smart-TV platforms boot from NAND Flash and store firmware updates, channel lists, and DRM credentials. The MX30UF4G18AB delivers 4 Gbit in a 48-TSOP I package compatible with mainstream STB SoC reference designs, while its ONFI 1.0 command set ensures uniform driver support across Linux and Android BSPs. The 1.8 V VCC matches modern STB SoC IO rails, reducing overall BOM cost by eliminating an LDO. SLC endurance far exceeds the typical STB firmware update frequency, providing decades of operational life. Hardware ECC and wear-leveling must be handled by the STB SoC controller.
Рекомендуется
Portable Medical Device Data Recorder
Portable medical devices such as blood-pressure monitors, glucose meters, and Holter recorders need reliable non-volatile storage for patient measurements, often in compact enclosures with battery operation. The MX30UF4G18AB's 1.8 V VCC minimizes battery drain, and its 4 Gbit capacity supports years of patient logs at typical sampling rates. SLC endurance and Macronix's rigorous QA per the datasheet v1.2 provide the reliability demanded by medical design standards. The -40 C to +85 C industrial temperature rating supports clinical and home-use environments. Hardware ECC in the host SoC is mandatory for data integrity in medical records.
Рекомендуется
Point-of-Sale Terminal Transaction Log
POS terminals require rugged non-volatile storage for transaction logs, merchant configuration, and offline authorization queues. The MX30UF4G18AB's 4 Gbit SLC NAND offers the endurance to survive years of high-frequency write activity at retail checkout lanes, where MLC/TLC devices would wear out. The 1.8 V VCC option aligns with newer ARM-based POS SoCs, reducing thermal output in fanless terminal enclosures. The 48-TSOP I package simplifies rework in field-service scenarios. Designers should enable journaling file systems (UBIFS, JFFS2) and hardware ECC to protect transaction records against power-loss corruption.
Рекомендуется
Automotive Infotainment Firmware Storage
In non-safety automotive infotainment systems, the MX30UF4G18AB provides reliable firmware and map-data storage at industrial -40 C to +85 C temperature. The 48-TSOP I package is widely accepted in head-unit reference designs, and the ONFI 1.0 interface allows reuse of standard NAND drivers. For AEC-Q100-qualified safety applications, designers should request the automotive-grade variant from Macronix or substitute a qualified cross-brand equivalent. The 1.8 V VCC must be derived from a regulated LDO downstream of the vehicle's 12 V bus. Hardware ECC with at least 4-bit per 528 B sector is mandatory for infotainment data integrity.
Рекомендуется
Industrial HMI Configuration Storage
Industrial human-machine interfaces (HMIs) store process configuration, alarm logs, and recipe data on non-volatile memory. The MX30UF4G18AB's 4 Gbit density supports thousands of recipes, and its SLC endurance survives the constant parameter-update workload typical of factory-floor HMIs. The 1.8 V VCC simplifies integration with modern industrial SoCs from NXP i.MX RT and Microchip SAMA5 families. The 48-TSOP I package is preferred for serviceability, allowing field replacement. Designers should implement bad-block management in firmware and use CRC-protected headers to detect corrupted records after unexpected power loss.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для MX30UF4G18AB — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | MX30UF4G16AB-TI | MX30UF4G28AB-TI | MX30LF4G18AC-TI | MX30LF2G18AC-TI |
|---|---|---|---|---|---|
| Package | 48-TSOP I (-TI) | 48-TSOP I - same | 48-TSOP I - same | 48-TSOP I - same | 48-TSOP I - same |
| Brand | Macronix | Macronix | Macronix | Macronix | Macronix |
| Density | 4 Gbit | 2 Gbit | 4 Gbit | 4 Gbit | 2 Gbit |
| Supply Voltage | 1.8 V (1.7-1.95 V) | 1.8 V (1.7-1.95 V) | 1.8 V (1.7-1.95 V) | 3.3 V (2.7-3.6 V) | 3.3 V (2.7-3.6 V) |
| Interface | 8-bit parallel async (ONFI 1.0) | 8-bit parallel async (ONFI 1.0) | 8-bit parallel async (ONFI 1.0) | 8-bit parallel async (ONFI 1.0) | 8-bit parallel async (ONFI 1.0) |
| Cell Type | SLC | SLC | SLC | SLC | SLC |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Ключевые отличия
- 1.8 V native VCC eliminates level shifters (против MX30LF4G18AC-TI)
- ONFI 1.0 standardized command set for driver portability (против Proprietary NAND interfaces)
- SLC endurance for write-intensive applications (против MLC/TLC NAND at same density)
Заметки по проектированию
Estimated: Always enable hardware ECC in the host SoC's NAND controller when using the MX30UF4G18AB. Macronix recommends at least 4-bit ECC per 528 B sector in the datasheet v1.2. Without ECC, raw bit error rates will cause data corruption in field deployments, especially after endurance cycling. Verify ECC strength matches your application's required data integrity (medical, POS, automotive infotainment typically require 8-bit ECC).
The MX30UF4G18AB draws 50 uA max in sleep mode, but active read/program currents are significantly higher. Place a 0.1 uF decoupling capacitor as close as possible to the VCC pin and add a 4.7 uF bulk capacitor on the same rail. Avoid sharing the 1.8 V rail with high-current switching regulators; use a dedicated LDO to prevent supply noise from corrupting page-program operations.
Route the 8-bit I/O bus (I/O0-I/O7) with matched trace lengths (within 50 mil) to preserve signal integrity at the 25 ns page-read cycle time. Place series damping resistors (22-33 ohm) near the NAND outputs if the bus exceeds 50 mm. The R/B# output is open-drain and requires an external pull-up to VCCQ; do not leave it floating as this can cause false busy-state detection.
Информация о соответствии
RoHS and lead-free compliance per Macronix product page; REACH compliance per Macronix environmental policy. Standard industrial grade is not AEC-Q100 qualified; automotive applications must request the qualified variant from Macronix.
