PIC16F18857-E/MLVAO - 56KB Flash 8-bit MCU, 28-QFN Automotive | Microchip
부품 번호: PIC16F18857-E/MLVAO ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.1 | $4.10 |
| 10 | $3.78 | $37.80 |
| 100 | $3.42 | $342.00 |
| 500 | $3.05 | $1,525.00 |
| 1,000 | $2.74 | $2,740.00 |
| 3,000 | $2.51 | $7,530.00 |
PIC16F18857-E/MLVAO 개요
What is an 8-bit microcontroller? An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data-path CPU core, integrated with non-volatile program memory (Flash), volatile data memory (RAM), small EEPROM, and a rich set of on-chip peripherals (ADC, PWM, timers, communication ports). The PIC16F18857 belongs to the mid-range PIC16F family of microcontrollers, which itself sits inside the broader PIC microcontroller hierarchy (PIC10/12/16/18/24/dsPIC) within the Microchip 8/16/32-bit MCU portfolio, and ultimately under the semiconductor integrated circuit taxonomy.
Key features include the 12-bit Analog-to-Digital Converter with Computation (ADCC), Complementary Waveform Generator (CWG), multiple PWM channels, the Hardware Limit Timer (HLT), Windowed Watchdog Timer (WWDT), and the CRC/SCAN diagnostics block. Together these Core Independent Peripherals (CIPs) execute deterministic tasks in hardware without CPU intervention, lowering firmware complexity and active current draw.
Architecturally, the PIC16F18857 uses an enhanced mid-range 8-bit RISC core with a hardware multiply and 49 instructions, supported by the device's interrupt-driven CIP framework. The integrated XLP nanoWatt technology brings active and sleep currents into the low-uA range, making the part well suited to battery-backed and energy-harvesting designs.
Typical applications include automotive body and sensor nodes, IoT edge sensor hubs, industrial control and HMI front-ends, low-power wireless sensor transmitters, and consumer appliances requiring touch or capacitive sensing. The wide 1.8V-5.5V operating range also suits coin-cell powered remote controls.
When designing with this device, route the analog AVdd/AVss rails cleanly to the ADCC and keep the 28-QFN exposed pad soldered to a continuous ground pour to manage the 1A peak I/O current and improve thermal performance in enclosed automotive enclosures.
This page synthesises distributor pricing, AEC-Q100 / FuSa notes, and drop-in same-package alternatives drawn from Microchip's PIC16F1885x family, going beyond the manufacturer datasheet's parametric table to give procurement and design engineers a single decision view.
드롭인 대체품: PIC16F18857-E/MLVAO — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16F18857-E/MLVAO (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Low-Power Technology, Package, Program Memory (Flash), RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16F18877-E/MLVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F18875-E/MLVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F18855-E/ML
✅ 드롭인✓ 재고 있음
$0.71 / 개
데이터시트 보기 →PIC16F18856-E/MLVAO
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC16F18857-E/ML
✅ 드롭인✓ 재고 있음
$1.83 / 개
데이터시트 보기 →PIC16F18857-E/MLVAO 최대 정격 & 전기적 특성
| Device Family | PIC16F1885x / PIC16F1887x |
| Core | 8-bit Enhanced Mid-Range PIC RISC |
| Program Memory (Flash) | 56 KB |
| Data SRAM | 4 KB |
| Data EEPROM | 256 B |
| Max CPU Speed | 32 MHz |
| Operating Voltage Range | 1.8 V to 5.5 V |
| ADC | 12-bit ADCC |
| PWM Channels | Multiple (CWG + PWM peripherals) |
| 패키지 | 28-QFN (6 x 6 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| Temperature Range (E suffix) | -40C to +125C (extended) |
| AEC-Q100 | Qualified (automotive grade) |
| Functional Safety | FuSa-capable (functional safety features) |
| Low-Power Technology | eXtreme Low Power (XLP) nanoWatt |
| Diagnostics | CRC/SCAN, WWDT, HLT |
| RoHS 상태 | Compliant (Pb-free) |
PIC16F18857-E/MLVAO 핀 구성
| 핀 1 | RA5 — Bidirectional I/O / ADC input |
| 핀 2 | RA4 — Bidirectional I/O / ADC input |
| 핀 3 | RA3 — Bidirectional I/O / VREF+ input |
| 핀 4 | RA2 — Bidirectional I/O / DAC output |
| 핀 5 | RA1 — Bidirectional I/O / ADC input |
| 핀 6 | RA0 — Bidirectional I/O / ICDDAT |
| 핀 7 | VSS — Ground reference |
| 핀 8 | RA7 — Bidirectional I/O / oscillator input |
| 핀 9 | RA6 — Bidirectional I/O / oscillator output |
| 핀 10 | RC0 — Bidirectional I/O / PWM output |
| 핀 11 | RC1 — Bidirectional I/O / PWM output |
| 핀 12 | RC2 — Bidirectional I/O / PWM output |
| 핀 13 | RC3 — Bidirectional I/O / SPI/I2C |
| 핀 14 | RC4 — Bidirectional I/O / SPI/I2C |
| 핀 15 | RC5 — Bidirectional I/O / SPI/I2C |
| 핀 16 | RC6 — Bidirectional I/O / UART TX |
| 핀 17 | RC7 — Bidirectional I/O / UART RX |
| 핀 18 | VSS — Ground reference (digital) |
| 핀 19 | VDD — Positive supply (digital) |
| 핀 20 | RB0 — Bidirectional I/O / interrupt-on-change |
| 핀 21 | RB1 — Bidirectional I/O / interrupt-on-change |
| 핀 22 | RB2 — Bidirectional I/O / interrupt-on-change |
| 핀 23 | RB3 — Bidirectional I/O / interrupt-on-change |
| 핀 24 | RB4 — Bidirectional I/O / interrupt-on-change |
| 핀 25 | RB5 — Bidirectional I/O / interrupt-on-change |
| 핀 26 | RB6 — Bidirectional I/O / ICDCLK |
| 핀 27 | RB7 — Bidirectional I/O / ICSPDAT |
| 핀 28 | VDD — Positive supply (I/O) |
일반적인 애플리케이션
PIC16F18857-E/MLVAO 적합 용도: 6 애플리케이션s: Automotive Body Control Modules, Industrial IoT Sensor Hubs, Low-Power Wireless Sensor Nodes, Consumer Appliance HMI Touch Front-Ends, Motor Control with CWG / PWM, Battery-Backed Always-On Systems.
Automotive Body Control Modules
The PIC16F18857-E/MLVAO suits automotive body and BCM nodes because of AEC-Q100 qualification and Functional Safety (FuSa) capability. Its 12-bit ADCC reads battery sense and temperature inputs at >200 ksps with hardware averaging, while the CRC/SCAN block performs periodic memory integrity checks demanded by ISO 26262 work products. The 56 KB Flash / 4 KB RAM footprint hosts CAN/LIN stack drivers and PWM control of mirror / lamp loads directly from the same IC, eliminating a companion timer. With 1.8-5.5 V supply and eXtreme Low Power XLP sleep currents in the low uA, BCMs can sit in standby when the vehicle is parked without draining the 12 V battery.
추천
Industrial IoT Sensor Hubs
For industrial wireless sensor hubs, the PIC16F18857-E/MLVAO provides the CIP set that lets the MCU wake on a sensor threshold, sample the ADCC, transmit via UART/SPI, and return to sleep without CPU intervention. The Hardware Limit Timer (HLT) and Windowed Watchdog (WWDT) keep the sensor node alive even if firmware hangs. eXtreme Low Power XLP technology drops active current below 50 uA/MIPS at 1.8 V, enabling multi-year battery life on 2x AA cells. The 28-QFN (6x6 mm) keeps the PCB small enough to integrate inside a sensor probe housing alongside a sub-GHz or BLE radio.
추천
Low-Power Wireless Sensor Nodes
Battery-powered wireless sensor transmitters benefit from the PIC16F18857-E/MLVAO's XLP nanoWatt sleep currents and 12-bit ADCC that supports hardware oversampling. The CWG and PWM blocks can directly drive an IR LED or piezo buzzer for wake-up signalling without burning CPU cycles. 56 KB Flash holds an LoRaWAN or Zigbee stack fragment, while the 4 KB RAM buffers measurement bursts before transmission. The 1.8-5.5 V range means the same hardware can run from a 3.6 V Li-SOCl2 primary cell or a 5 V USB rail during provisioning.
추천
Consumer Appliance HMI Touch Front-Ends
Capacitive touch and slider front-ends in washing machines, dishwashers, and induction cooktops map cleanly onto the PIC16F18857-E/MLVAO. The mTouch peripheral and 12-bit ADCC capture touch electrodes with hardware-driven low-power scan, while the CWG drives the buzzer and PWM outputs dim the LED ring. 4 KB RAM is plenty for segmented LCD or LED matrix refresh, and 56 KB Flash holds a full IEC 60730-class-B self-test routine. The -40C to +125C extended temperature range meets kitchen-appliance thermal stress profiles.
추천
Motor Control with CWG / PWM
Small brushed DC and stepper motor controllers benefit from the PIC16F18857-E/MLVAO's Complementary Waveform Generator (CWG) and multiple PWM channels. The CWG produces dead-band complementary outputs ideal for half-bridge drivers, while the ADCC samples back-EMF or current sense with deterministic latency. The CRC/SCAN block ensures the motor driver does not enter an unsafe state - relevant for functional-safety aware designs. 32 MHz CPU closes the current loop fast enough for 4 kHz torque-ripple cancellation on small BLDC pumps.
추천
Battery-Backed Always-On Systems
Always-on systems such as smart thermostats, remote controls, and security keypads depend on the PIC16F18857-E/MLVAO's XLP sleep modes that drop current draw into the sub-uA range. The WWDT and HLT keep firmware health in check while the CPU is asleep, and the ADCC can wake the part from sleep on a threshold event. With 1.8-5.5 V supply the same PCB can be powered by a CR2032 coin cell, two AA batteries, or a 5 V USB rail - eliminating separate low-voltage hardware variants.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16F18857-E/MLVAO — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16F18877-E/MLVAO | PIC16F18875-E/MLVAO | PIC16F18855-E/ML | PIC16F18856-E/MLVAO | PIC16F18857-E/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Max CPU Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| AEC-Q100 / FuSa | Yes (automotive, /VAO) | Yes | Yes | No (industrial grade) | Yes | No (industrial grade) |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| ADC | 12-bit ADCC | 12-bit ADCC | 12-bit ADCC | 12-bit ADCC | 12-bit ADCC | 12-bit ADCC |
| Temperature Range | -40C to +125C (E grade) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
주요 차별점
- Functional Safety (FuSa) documentation with AEC-Q100 /VAO grade (vs PIC16F18855-E/ML)
- Four times more Flash and RAM than PIC16F18855-E/ML (vs PIC16F18855-E/ML)
- Core Independent Peripherals reduce CPU load (vs PIC16F18446 family)
설계 노트
Estimated: the 28-QFN (6x6 mm) exposed pad carries the main thermal path. With theta_JA of approximately 35 C/W on a 4-layer JEDEC test board, the device dissipates up to ~3.5 W in still air before junction temperature reaches the +125C automotive limit. For enclosed automotive enclosures with limited airflow, solder the exposed pad to a continuous ground copper pour of at least 100 mm^2 on the top layer plus thermal vias to inner ground planes.
Provide two VDD/VSS pin pairs (pin 19 + pin 7, pin 28 + pin 18). Place a 100 nF ceramic decoupling capacitor within 2 mm of each VDD pin and a bulk 4.7 uF tantalum or ceramic near the IC. Keep analog AVdd/AVss (when present on the 28-QFN variant) on a separate filtered net from the digital VDD to keep ADC noise below 1 LSB on the 12-bit ADCC at full 200 ksps throughput.
Do not leave the ICSPDAT/ICSPCLK pins (RB7/RB6) floating in production firmware; configure them as outputs or high-impedance and add 10 kohm pull-ups to keep the device out of reset during noise transients on long sensor cables. The Windowed Watchdog (WWDT) must be enabled for any /VAO automotive application - the Windowed mode prevents firmware from incorrectly servicing the watchdog at the wrong moment.
The 28-QFN package has 0.5 mm pitch pads with centre-to-centre spacing that requires 0.25 mm vias. Use 4-mil (0.1 mm) trace-and-space design rules for fan-out and escape routing under the exposed pad. For designs that fail EMC at 1 GHz from a sensor harness, add a 22 ohm series resistor on each I/O near the connector to dampen the rising-edge overshoot.
규정 준수 정보
AEC-Q100 qualified with Functional Safety (FuSa) capability per the /VAO suffix. RoHS compliant Pb-free package. MSL level not confirmed by available web data - marked [DATA_NEEDED] in specs.
