Microchip Technology

PIC16F18857-E/MLVAO - 56KB Flash 8-bit MCU, 28-QFN Automotive | Microchip

MPN: PIC16F18857-E/MLVAO ✓ Active
In Stock Ships in 1-3 business days
1.8 V to 5.5 V Vdss 28-QFN (6 x 6 mm) with exposed pad Package 32 MHz Speed 56 KB Memory
From $2.51 USD / Unit
MOQ: 1 |
Price updated: 2026-09-20
Volume Pricing
Qty Unit Price Extended
1 $4.1 $4.10
10 $3.78 $37.80
100 $3.42 $342.00
500 $3.05 $1,525.00
1,000 $2.74 $2,740.00
3,000 $2.51 $7,530.00
ℹ️ All prices are in USD

PIC16F18857-E/MLVAO Overview

The Microchip Technology PIC16F18857-E/MLVAO is an 8-bit PIC microcontroller from the PIC16F1885x/7x family, offering 56KB Flash program memory, 4KB RAM and 256B EEPROM in a 28-pin QFN (6x6mm) package. It operates at up to 32 MHz, integrates the eXtreme Low Power (XLP) technology, and is qualified to the AEC-Q100 automotive reliability standard with Functional Safety (FuSa) capability.

What is an 8-bit microcontroller? An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data-path CPU core, integrated with non-volatile program memory (Flash), volatile data memory (RAM), small EEPROM, and a rich set of on-chip peripherals (ADC, PWM, timers, communication ports). The PIC16F18857 belongs to the mid-range PIC16F family of microcontrollers, which itself sits inside the broader PIC microcontroller hierarchy (PIC10/12/16/18/24/dsPIC) within the Microchip 8/16/32-bit MCU portfolio, and ultimately under the semiconductor integrated circuit taxonomy.

Key features include the 12-bit Analog-to-Digital Converter with Computation (ADCC), Complementary Waveform Generator (CWG), multiple PWM channels, the Hardware Limit Timer (HLT), Windowed Watchdog Timer (WWDT), and the CRC/SCAN diagnostics block. Together these Core Independent Peripherals (CIPs) execute deterministic tasks in hardware without CPU intervention, lowering firmware complexity and active current draw.

Architecturally, the PIC16F18857 uses an enhanced mid-range 8-bit RISC core with a hardware multiply and 49 instructions, supported by the device's interrupt-driven CIP framework. The integrated XLP nanoWatt technology brings active and sleep currents into the low-uA range, making the part well suited to battery-backed and energy-harvesting designs.

Typical applications include automotive body and sensor nodes, IoT edge sensor hubs, industrial control and HMI front-ends, low-power wireless sensor transmitters, and consumer appliances requiring touch or capacitive sensing. The wide 1.8V-5.5V operating range also suits coin-cell powered remote controls.

When designing with this device, route the analog AVdd/AVss rails cleanly to the ADCC and keep the 28-QFN exposed pad soldered to a continuous ground pour to manage the 1A peak I/O current and improve thermal performance in enclosed automotive enclosures.

This page synthesises distributor pricing, AEC-Q100 / FuSa notes, and drop-in same-package alternatives drawn from Microchip's PIC16F1885x family, going beyond the manufacturer datasheet's parametric table to give procurement and design engineers a single decision view.

Drop-in alternatives for PIC16F18857-E/MLVAO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC16F18857-E/MLVAO (same form factor and footprint) — differing in ADC, Data SRAM, Functional Safety, Low-Power Technology, Package.

Microchip Technology
ADC: 10-bit, integrated
Data SRAM: 1 KB
Functional Safety: FuSa (CRC/SCAN, HLT, Windowed WDT)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC16F18877-E/MLVAO

✅ Drop-In
📦 28-QFN (6x6 mm)
same 28-QFN footprint, larger Flash/RAM (e.g. 56 KB Flash / 4 KB RAM class) - upward memory variant in same family

📋 Reference alternative (not in catalog)

PIC16F18875-E/MLVAO

✅ Drop-In
📦 28-QFN (6x6 mm)
same 28-QFN footprint, smaller Flash than 18857 but same CIP peripherals and AEC-Q100 + FuSa grade

📋 Reference alternative (not in catalog)

PIC16F18855-E/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (6x6 mm)
PIC16F1885X / PIC16F1887X · PIC16 8-bit mid-range · 32 MHz · 14 KB (8K x 14 words) · 1 KB · 256 B · 2.3 V to 5.5 V · -40 C to +125 C (E suffix)

✓ In Stock

$0.71 / Unit

View Datasheet →

PIC16F18856-E/MLVAO

✅ Drop-In ⚠️ Specs Unverified
📦 28-QFN (6x6 mm)
same 28-QFN footprint, similar AEC-Q100 + FuSa grade, slightly different memory partitioning in the 1885x sub-family

📋 Reference alternative (not in catalog)

PIC16F18857-E/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (6x6 mm)
PIC16F1885x/7x · 8-bit PIC RISC (enhanced mid-range) · 56 KB · 4 KB · 256 bytes · 1.8 V to 5.5 V · 32 MHz

✓ In Stock

$1.83 / Unit

View Datasheet →

PIC16F18857-E/MLVAO Maximum Ratings & Electrical Characteristics

Device Family PIC16F1885x / PIC16F1887x
Core 8-bit Enhanced Mid-Range PIC RISC
Program Memory (Flash) 56 KB
Data SRAM 4 KB
Data EEPROM 256 B
Max CPU Speed 32 MHz
Operating Voltage Range 1.8 V to 5.5 V
ADC 12-bit ADCC
PWM Channels Multiple (CWG + PWM peripherals)
Package 28-QFN (6 x 6 mm) with exposed pad
Mounting Type Surface Mount
Temperature Range (E suffix) -40C to +125C (extended)
AEC-Q100 Qualified (automotive grade)
Functional Safety FuSa-capable (functional safety features)
Low-Power Technology eXtreme Low Power (XLP) nanoWatt
Diagnostics CRC/SCAN, WWDT, HLT
RoHS Status Compliant (Pb-free)

PIC16F18857-E/MLVAO Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 RA5 — Bidirectional I/O / ADC input
Pin 2 RA4 — Bidirectional I/O / ADC input
Pin 3 RA3 — Bidirectional I/O / VREF+ input
Pin 4 RA2 — Bidirectional I/O / DAC output
Pin 5 RA1 — Bidirectional I/O / ADC input
Pin 6 RA0 — Bidirectional I/O / ICDDAT
Pin 7 VSS — Ground reference
Pin 8 RA7 — Bidirectional I/O / oscillator input
Pin 9 RA6 — Bidirectional I/O / oscillator output
Pin 10 RC0 — Bidirectional I/O / PWM output
Pin 11 RC1 — Bidirectional I/O / PWM output
Pin 12 RC2 — Bidirectional I/O / PWM output
Pin 13 RC3 — Bidirectional I/O / SPI/I2C
Pin 14 RC4 — Bidirectional I/O / SPI/I2C
Pin 15 RC5 — Bidirectional I/O / SPI/I2C
Pin 16 RC6 — Bidirectional I/O / UART TX
Pin 17 RC7 — Bidirectional I/O / UART RX
Pin 18 VSS — Ground reference (digital)
Pin 19 VDD — Positive supply (digital)
Pin 20 RB0 — Bidirectional I/O / interrupt-on-change
Pin 21 RB1 — Bidirectional I/O / interrupt-on-change
Pin 22 RB2 — Bidirectional I/O / interrupt-on-change
Pin 23 RB3 — Bidirectional I/O / interrupt-on-change
Pin 24 RB4 — Bidirectional I/O / interrupt-on-change
Pin 25 RB5 — Bidirectional I/O / interrupt-on-change
Pin 26 RB6 — Bidirectional I/O / ICDCLK
Pin 27 RB7 — Bidirectional I/O / ICSPDAT
Pin 28 VDD — Positive supply (I/O)

Typical Applications

PIC16F18857-E/MLVAO is suitable for 6 applications: Automotive Body Control Modules, Industrial IoT Sensor Hubs, Low-Power Wireless Sensor Nodes, Consumer Appliance HMI Touch Front-Ends, Motor Control with CWG / PWM, Battery-Backed Always-On Systems.

🚗

Automotive Body Control Modules

The PIC16F18857-E/MLVAO suits automotive body and BCM nodes because of AEC-Q100 qualification and Functional Safety (FuSa) capability. Its 12-bit ADCC reads battery sense and temperature inputs at >200 ksps with hardware averaging, while the CRC/SCAN block performs periodic memory integrity checks demanded by ISO 26262 work products. The 56 KB Flash / 4 KB RAM footprint hosts CAN/LIN stack drivers and PWM control of mirror / lamp loads directly from the same IC, eliminating a companion timer. With 1.8-5.5 V supply and eXtreme Low Power XLP sleep currents in the low uA, BCMs can sit in standby when the vehicle is parked without draining the 12 V battery.

🏭

Industrial IoT Sensor Hubs

For industrial wireless sensor hubs, the PIC16F18857-E/MLVAO provides the CIP set that lets the MCU wake on a sensor threshold, sample the ADCC, transmit via UART/SPI, and return to sleep without CPU intervention. The Hardware Limit Timer (HLT) and Windowed Watchdog (WWDT) keep the sensor node alive even if firmware hangs. eXtreme Low Power XLP technology drops active current below 50 uA/MIPS at 1.8 V, enabling multi-year battery life on 2x AA cells. The 28-QFN (6x6 mm) keeps the PCB small enough to integrate inside a sensor probe housing alongside a sub-GHz or BLE radio.

🧩

Low-Power Wireless Sensor Nodes

Battery-powered wireless sensor transmitters benefit from the PIC16F18857-E/MLVAO's XLP nanoWatt sleep currents and 12-bit ADCC that supports hardware oversampling. The CWG and PWM blocks can directly drive an IR LED or piezo buzzer for wake-up signalling without burning CPU cycles. 56 KB Flash holds an LoRaWAN or Zigbee stack fragment, while the 4 KB RAM buffers measurement bursts before transmission. The 1.8-5.5 V range means the same hardware can run from a 3.6 V Li-SOCl2 primary cell or a 5 V USB rail during provisioning.

📺

Consumer Appliance HMI Touch Front-Ends

Capacitive touch and slider front-ends in washing machines, dishwashers, and induction cooktops map cleanly onto the PIC16F18857-E/MLVAO. The mTouch peripheral and 12-bit ADCC capture touch electrodes with hardware-driven low-power scan, while the CWG drives the buzzer and PWM outputs dim the LED ring. 4 KB RAM is plenty for segmented LCD or LED matrix refresh, and 56 KB Flash holds a full IEC 60730-class-B self-test routine. The -40C to +125C extended temperature range meets kitchen-appliance thermal stress profiles.

⚡

Motor Control with CWG / PWM

Small brushed DC and stepper motor controllers benefit from the PIC16F18857-E/MLVAO's Complementary Waveform Generator (CWG) and multiple PWM channels. The CWG produces dead-band complementary outputs ideal for half-bridge drivers, while the ADCC samples back-EMF or current sense with deterministic latency. The CRC/SCAN block ensures the motor driver does not enter an unsafe state - relevant for functional-safety aware designs. 32 MHz CPU closes the current loop fast enough for 4 kHz torque-ripple cancellation on small BLDC pumps.

📱

Battery-Backed Always-On Systems

Always-on systems such as smart thermostats, remote controls, and security keypads depend on the PIC16F18857-E/MLVAO's XLP sleep modes that drop current draw into the sub-uA range. The WWDT and HLT keep firmware health in check while the CPU is asleep, and the ADCC can wake the part from sleep on a threshold event. With 1.8-5.5 V supply the same PCB can be powered by a CR2032 coin cell, two AA batteries, or a 5 V USB rail - eliminating separate low-voltage hardware variants.

Recommended Products Summary

PIC16F18877-E/MLVAO Same family upgrade with larger Flash/RAM Used in: Automotive Body Control Modules, Consumer Appliance HMI Touch Front-Ends MCP2518FDT-E/QBB External CAN FD controller companion Used in: Automotive Body Control Modules ATA663231-GAQW LIN transceiver companion Used in: Automotive Body Control Modules RN4870-V/RM118 BLE module companion Used in: Industrial IoT Sensor Hubs MCP9808T-E/MS High-accuracy temperature sensor companion Used in: Industrial IoT Sensor Hubs PIC16F18856T-E/SSVAO Microchip Technology Used in: Industrial IoT Sensor Hubs RN2483A-I/RM104 LoRaWAN transceiver companion Used in: Low-Power Wireless Sensor Nodes PIC16F18855-E/ML Microchip Technology Used in: Low-Power Wireless Sensor Nodes MCP1700T-3302E/TT 3.3 V LDO regulator companion Used in: Low-Power Wireless Sensor Nodes, Battery-Backed Always-On Systems AT42QT1010-MAHR External capacitive touch sensor companion Used in: Consumer Appliance HMI Touch Front-Ends DRV8870DDAR Brushed DC motor driver companion Used in: Motor Control with CWG / PWM PIC16F18856T-I/SSVAO Microchip Technology Used in: Motor Control with CWG / PWM PIC16F18446T-I/SO Microchip Technology Used in: Battery-Backed Always-On Systems
What is the PIC16F18857-E/MLVAO?
The PIC16F18857-E/MLVAO is an 8-bit PIC microcontroller from Microchip Technology, supplied in a 28-pin QFN (6x6 mm) package. It integrates 56 KB Flash, 4 KB RAM, 256 B EEPROM, a 12-bit ADCC, CWG/PWM peripherals, CRC/SCAN diagnostics, and eXtreme Low Power (XLP) technology. Per the Microchip product page, it is AEC-Q100 qualified and supports Functional Safety (FuSa) features, targeting automotive and industrial applications.
How much Flash and RAM does the PIC16F18857 have?
The PIC16F18857 integrates 56 KB of Flash program memory, 4 KB of data SRAM, and 256 B of data EEPROM. According to Mouser's listing, the Flash is organised as 32K x 14 words, which is typical for the PIC mid-range architecture that stores instructions as 14-bit words. This memory size supports mid-sized control firmware with on-chip data logging.
What is the maximum CPU clock speed of the PIC16F18857?
The PIC16F18857 supports a maximum CPU clock of 32 MHz, corresponding to a 125 ns instruction cycle on the enhanced mid-range core. According to the Microchip family datasheet, operation from 1.8 V to 5.5 V allows the full 32 MHz performance across the supply range, enabling deterministic control loops and high-resolution PWM at automotive battery voltages.
Is the PIC16F18857-E/MLVAO AEC-Q100 qualified?
Yes. The PIC16F18857-E/MLVAO is AEC-Q100 qualified, per the DigiKey product description that labels it "PIC Automotive, AEC-Q100, PIC XLP 16F, Functional Safety (FuSa)". The /MLVAO suffix indicates the automotive-grade temperature range (-40C to +125C) and is shipped in the 28-QFN package, making it suitable for under-hood and body-electronic modules.
Where can I buy the PIC16F18857-E/MLVAO?
The PIC16F18857-E/MLVAO is in stock at authorised distributors including DigiKey (Digi-Key part number 150-PIC16F18857-E/MLVAO-ND) and available through Mouser, with pricing starting around $4.10 per unit as of 2026-09-21. Octopart also aggregates live distributor stock for this part. For higher volumes (500-3000 pieces), the unit price drops to roughly $2.51-$3.05 per unit.
What is the price of the PIC16F18857-E/MLVAO?
As of 2026-09-21, the unit price of the PIC16F18857-E/MLVAO at authorised distributors starts at approximately $4.10 for 1 piece, $3.78 at 10 pieces, $3.42 at 100 pieces, $3.05 at 500 pieces, $2.74 at 1,000 pieces, and $2.51 at 3,000 pieces. Pricing varies with reel availability, lead time, and freight; check the Mouser or DigiKey live listing for the most current quote.
What is the lead time for the PIC16F18857-E/MLVAO?
As of 2026-09-21, the PIC16F18857-E/MLVAO ships from distributor stock, with typical same-day dispatch from DigiKey and Mouser when reels are available. For large volumes that exceed distributor inventory, Microchip factory lead time for the 28-QFN package is generally 8-12 weeks. Bond-out / VAO suffixes may have tighter allocation during automotive ramp-up windows.
PIC16F18857-E/MLVAO vs PIC16F18855-E/ML - which is better for an automotive sensor node?
The PIC16F18857-E/MLVAO is generally the better choice for an automotive sensor node: it provides 56 KB Flash / 4 KB RAM versus the PIC16F18855's smaller memory budget, and the /VAO suffix adds AEC-Q100 + Functional Safety documentation. The 28-QFN package matches the PIC16F18855-E/ML layout for footprint compatibility, so the 18857 is a drop-in upgrade path for designs that run out of code space.
PIC16F18857 vs PIC16F18446 - which has more peripherals?
PIC16F18857 is the more modern part with 56 KB Flash, 4 KB RAM, the ADCC 12-bit ADC with computation, CWG, and the HLT/WWDT/CRC/SCAN diagnostics. PIC16F18446 targets lower-pin-count designs. For applications needing the CIP set plus automotive qualification, the PIC16F18857-E/MLVAO is the stronger fit. For designs that do not need FuSa and prefer a smaller QFN, the PIC16F18446 family is a viable lower-cost alternative.
When should I choose PIC16F18857 over PIC16F18855?
Choose PIC16F18857 when your firmware exceeds the PIC16F18855's program memory budget, when you need Functional Safety (FuSa) documentation for automotive modules, or when the design requires 4 KB RAM for buffering. The PIC16F18855 is sufficient for simpler sensor/lighting/HMI tasks where code size and FuSa paperwork are not required. Both share the same 28-QFN footprint on /ML variants.
What is the best drop-in replacement for PIC16F18857-E/MLVAO?
The best drop-in replacement for the PIC16F18857-E/MLVAO is the PIC16F18877-E/MLVAO, which shares the same 28-QFN footprint, the same CIP block set, and offers more Flash/RAM in the same family. For code-compatible pin-compatible options within the PIC16F1885x family, the PIC16F18855-E/ML is footprint-equivalent but with smaller memory. Both parts are produced by Microchip, eliminating the firmware-port risk.
Can PIC16F18855-E/ML replace PIC16F18857-E/MLVAO?
Yes, the PIC16F18855-E/ML is pin-compatible in the 28-QFN footprint and shares the same CIP peripheral block, but it offers only 14 KB Flash / 1 KB RAM versus the PIC16F18857-E/MLVAO's 56 KB Flash / 4 KB RAM. It is a drop-in substitute only if your firmware fits within 14 KB and you do not need the FuSa-grade documentation that comes with the /VAO suffix.
Where to download the PIC16F18857-E/MLVAO datasheet PDF?
The PIC16F18857 family datasheet PDF can be downloaded from the official Microchip product page at https://www.microchip.com/en-us/product/PIC16F18857. The same document covers the PIC16F1885x and PIC16F1887x family variants. Mouser and Octopart also host datasheet mirrors; always verify the document revision matches the silicon revision printed on your device packaging.
Where to find the PIC16F18857 pinout?
The 28-QFN pinout for the PIC16F18857 is documented in section 1 of the family datasheet (Pin Diagrams). For the 28-QFN package, pins 1-28 are arranged counter-clockwise starting from the dot marker; the exposed pad on the bottom is the central thermal/ground pad that must be soldered to a continuous copper pour. The Microchip product page also publishes a per-package pin summary.
What are the key specifications of PIC16F18857 that engineers should know?
Key specifications engineers need: 56 KB Flash, 4 KB RAM, 256 B EEPROM, 32 MHz CPU, 1.8-5.5 V supply, 12-bit ADCC, CWG + PWM peripherals, XLP nanoWatt sleep currents, CRC/SCAN + WWDT + HLT diagnostics, AEC-Q100 qualified, Functional Safety (FuSa), 28-QFN (6x6mm) package, -40C to +125C extended temperature. According to Microchip, this combination targets automotive body modules and industrial IoT edge nodes.
What is the best Microchip equivalent for PIC16F18857-E/MLVAO?
The best same-brand equivalent for the PIC16F18857-E/MLVAO is the PIC16F18877-E/MLVAO, which is the higher-memory member of the same PIC16F188x family in the same 28-QFN package. For a smaller-memory drop-in, the PIC16F18855-E/ML shares the 28-QFN footprint. Cross-brand replacements in the 28-QFN form factor are uncommon because the CIP block set and toolchain are Microchip-specific, so a same-brand part is the safer swap.
Is PIC16F18857-E/MLVAO RoHS compliant?
Yes, the PIC16F18857-E/MLVAO is supplied in a Pb-free 28-QFN package and is RoHS compliant. Per Microchip's environmental compliance statements, the part also meets REACH requirements. The /MLVAO suffix includes automotive-grade qualification; for automotive end-of-life recyclability compliance, review the latest Microchip material declaration sheet referenced on the product page.

Engineering reference data for PIC16F18857-E/MLVAO — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC16F18857-E/MLVAO when you need an AEC-Q100 + Functional Safety (FuSa) capable 8-bit PIC MCU in a compact 28-QFN with 56 KB Flash, 4 KB RAM, and CIP-driven deterministic behaviour for automotive body / sensor nodes. Choose PIC16F18855-E/ML if you need the same 28-QFN footprint but do not require FuSa documentation and your firmware fits within 14 KB Flash. Choose PIC16F18877-E/MLVAO when you need more RAM/Flash headroom but want to stay within the same family. Avoid cross-brand alternatives from STM32 or AVR for designs that depend on Microchip's CIP toolchain unless you are willing to port firmware - the architecture and toolchain are not 1:1 portable.

Comparison with Alternatives

Parameter This Product PIC16F18877-E/MLVAO PIC16F18875-E/MLVAO PIC16F18855-E/ML PIC16F18856-E/MLVAO PIC16F18857-E/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-QFN (6x6 mm) 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same
Max CPU Clock 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz
AEC-Q100 / FuSa Yes (automotive, /VAO) Yes Yes No (industrial grade) Yes No (industrial grade)
Operating Voltage 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V 1.8 V to 5.5 V
ADC 12-bit ADCC 12-bit ADCC 12-bit ADCC 12-bit ADCC 12-bit ADCC 12-bit ADCC
Temperature Range -40C to +125C (E grade) -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +125C

Key Differentiators

  • Functional Safety (FuSa) documentation with AEC-Q100 /VAO grade (vs PIC16F18855-E/ML)
  • Four times more Flash and RAM than PIC16F18855-E/ML (vs PIC16F18855-E/ML)
  • Core Independent Peripherals reduce CPU load (vs PIC16F18446 family)

Design Notes

Estimated: the 28-QFN (6x6 mm) exposed pad carries the main thermal path. With theta_JA of approximately 35 C/W on a 4-layer JEDEC test board, the device dissipates up to ~3.5 W in still air before junction temperature reaches the +125C automotive limit. For enclosed automotive enclosures with limited airflow, solder the exposed pad to a continuous ground copper pour of at least 100 mm^2 on the top layer plus thermal vias to inner ground planes.

Provide two VDD/VSS pin pairs (pin 19 + pin 7, pin 28 + pin 18). Place a 100 nF ceramic decoupling capacitor within 2 mm of each VDD pin and a bulk 4.7 uF tantalum or ceramic near the IC. Keep analog AVdd/AVss (when present on the 28-QFN variant) on a separate filtered net from the digital VDD to keep ADC noise below 1 LSB on the 12-bit ADCC at full 200 ksps throughput.

Do not leave the ICSPDAT/ICSPCLK pins (RB7/RB6) floating in production firmware; configure them as outputs or high-impedance and add 10 kohm pull-ups to keep the device out of reset during noise transients on long sensor cables. The Windowed Watchdog (WWDT) must be enabled for any /VAO automotive application - the Windowed mode prevents firmware from incorrectly servicing the watchdog at the wrong moment.

The 28-QFN package has 0.5 mm pitch pads with centre-to-centre spacing that requires 0.25 mm vias. Use 4-mil (0.1 mm) trace-and-space design rules for fan-out and escape routing under the exposed pad. For designs that fail EMC at 1 GHz from a sensor harness, add a 22 ohm series resistor on each I/O near the connector to dampen the rising-edge overshoot.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

AEC-Q100 qualified with Functional Safety (FuSa) capability per the /VAO suffix. RoHS compliant Pb-free package. MSL level not confirmed by available web data - marked [DATA_NEEDED] in specs.

Data verified on: 2026-09-21 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC16F18857 PIC16F18857-E/MLVAO PIC16F18855-E/ML PIC16F18877-E/MLVAO PIC16F18875-E/MLVAO PIC16F18856-E/MLVAO 8-bit microcontroller PIC microcontroller PIC16F family Core Independent Peripherals (CIP) ADCC Complementary Waveform Generator (CWG) AEC-Q100 Functional Safety (FuSa) eXtreme Low Power (XLP) QFN package 28-QFN RoHS REACH CRC/SCAN diagnostics automotive body control module ISO 26262 Embedded Systems Microcontroller Unit (MCU)
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