PIC16LF18856-I/ML - 28KB Flash, 32MHz PIC16 XLP MCU | Microchip
부품 번호: PIC16LF18856-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.71 | $4.71 |
| 10 | $4.08 | $40.80 |
| 100 | $3.27 | $327.00 |
| 500 | $2.85 | $1,425.00 |
| 1,000 | $2.55 | $2,550.00 |
PIC16LF18856-I/ML 개요
As an 8-bit microcontroller (MCU), this device sits in the broader taxonomy of microcontrollers -> embedded processors -> microcomputer ICs -> semiconductor ICs. The PIC16 family, one of Microchip's longest-running architectures, uses a Harvard RISC core optimized for deterministic interrupt response and ultra-low-power (XLP) operation, making it well-suited to battery-powered and industrial sensing applications.
Key differentiating specifications include 28KB (16K x 14) of self-programmable Flash, 256 bytes of EEPROM, an integrated 10-bit ADC with computation (ADC²), multiple Core Independent Peripherals (CIPs) such as CWG, NCO, and SMT, and a wide operating voltage range of 1.8V to 3.6V. The device also features Peripheral Pin Select (PPS) for flexible signal routing, a Hardware Limit Timer (HLT) for functional safety, and a Windowed Watchdog Timer (WWDT).
The PIC16LF18856 architecture combines an enhanced mid-range 8-bit core running up to 32MHz (8MHz instruction rate with the 4x PLL active) with on-chip CIP blocks that can execute timing, signal generation, and safety functions without CPU intervention. Its eXtreme Low-Power XLP technology delivers sub-uA sleep currents, supported by the nanosecond-class wake-up behavior of the CIPs, enabling long battery life in IoT and remote sensor duty-cycled applications.
Typical applications include IoT sensor nodes, building automation and HVAC control, battery-powered consumer products, automotive body and interior modules, industrial control loops, and USB/HID human-interface devices. The 1.8V minimum supply also makes the part attractive for single-cell lithium or dual-coin-cell designs.
When designing with this device, ensure the ICSP programming pins (ICSPCLK/ICSPDAT) are accessible on the PCB. Exposed-pad QFN packages require a continuous PCB land pattern beneath the pad with multiple thermal vias to ground to meet the 32 mW/°C thermal dissipation envelope.
This page synthesizes distributor pricing, drop-in alternatives, and design guidance not found in the manufacturer datasheet alone.
드롭인 대체품: PIC16LF18856-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16LF18856-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, Communication, DAC, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16LF18856-E/SP
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1.32 / 개
데이터시트 보기 →PIC16LF18855-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16LF18877-I/ML
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC16LF18876-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1.92 / 개
데이터시트 보기 →PIC16F18855-I/ML
✅ 드롭인✓ 재고 있음
$1.38 / 개
데이터시트 보기 →PIC16LF18856-I/ML 최대 정격 & 전기적 특성
| Core Architecture | PIC16 8-bit RISC (enhanced mid-range) |
| Program Memory (Flash) | 28 KB (16K x 14 words) |
| Data RAM | 2 KB |
| EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V |
| I/O Pins | 25 |
| ADC | 10-bit, up to 24 channels (ADC² with computation) |
| 패키지 | 28-QFN (6x6 mm) with exposed thermal pad |
| 실장 유형 | Surface Mount |
| 동작 온도 범위 | -40°C to +85°C (industrial) |
| Peripherals | PPS, CWG, NCO, SMT, HLT, WWDT, CRC/SCAN, EUSART, SPI, I2C |
| RoHS 상태 | Compliant |
PIC16LF18856-I/ML 핀 구성
| 핀 1 | RA7 — Digital I/O / analog input / CCP/PWM output |
| 핀 2 | RA6 — Digital I/O / analog input / CCP/PWM output |
| 핀 3 | RA5 — Digital I/O / analog input / CCP/PWM output |
| 핀 4 | RA4 — Digital I/O / analog input / Timer0 clock |
| 핀 5 | RA3 — Digital I/O / analog input / VPP (programming) |
| 핀 6 | RA2 — Digital I/O / analog input |
| 핀 7 | RA1 — Digital I/O / analog input / ICSPCLK |
| 핀 8 | RA0 — Digital I/O / analog input / ICSPDAT |
| 핀 9 | VDD — Positive supply input (1.8-3.6V) |
| 핀 10 | VSS — Ground reference |
| 핀 11 | RB7 — Digital I/O / I2C SCL / SPI TX |
| 핀 12 | RB6 — Digital I/O / I2C SDA / SPI CK |
| 핀 13 | RB5 — Digital I/O / analog input |
| 핀 14 | RB4 — Digital I/O / analog input / SDA |
| 핀 15 | RB3 — Digital I/O / analog input |
| 핀 16 | RB2 — Digital I/O / analog input |
| 핀 17 | RB1 — Digital I/O / analog input / SCL |
| 핀 18 | RB0 — Digital I/O / analog input / external interrupt |
| 핀 19 | RC7 — Digital I/O / EUSART RX |
| 핀 20 | RC6 — Digital I/O / EUSART TX |
| 핀 21 | RC5 — Digital I/O |
| 핀 22 | RC4 — Digital I/O |
| 핀 23 | RC3 — Digital I/O / SPI SS |
| 핀 24 | RC2 — Digital I/O / analog input |
| 핀 25 | RC1 — Digital I/O / analog input / CCP |
| 핀 26 | RC0 — Digital I/O / analog input |
| 핀 27 | RE3 — Digital I/O / MCLR (reset, active-low) |
| 핀 28 | EP — Exposed thermal pad - connect to PCB thermal land |
일반적인 애플리케이션
PIC16LF18856-I/ML 적합 용도: 6 애플리케이션s: Battery-Powered IoT Sensor Nodes, Building Automation and HVAC Control, Industrial Sensor Signal Conditioning, Automotive Interior and Body Electronics, User Interface and HMI Controllers, Consumer and Wearable Electronics.
Battery-Powered IoT Sensor Nodes
The PIC16LF18856-I/ML fits IoT sensor nodes through three converging specifications: 1.8V minimum VDD enables direct operation from a single CR2032 coin cell, XLP sleep current extends multi-year battery life, and Core Independent Peripherals (CLC, NCO, SMT) wake the CPU only when an event of interest occurs. With 28KB of Flash and 2KB RAM, the device runs Microchip's LoRaWAN or Sub-GHz protocol stacks without external memory. Designers typically pair the MCU with a sensor IC such as the MCP9808 or BMP280 over I2C, using PPS routing to map I2C lines to any pin for layout flexibility.
추천
Building Automation and HVAC Control
In building automation, the PIC16LF18856-I/ML serves as the central controller for HVAC dampers, smart thermostats, and lighting nodes. Its 10-bit ADC² with up to 24 channels reads multiple thermistor, humidity, and air-quality sensors simultaneously, while the Hardware Limit Timer (HLT) provides automotive-grade functional safety in fault detection loops. The 2.3-3.6V supply range aligns with 24V-bus-derived 3.3V rails, and the EUSART/SPI/I2C peripherals connect to RS-485 transceivers such as the MCP2515 or to wireless modules like the RN2483 for LoRaWAN connectivity.
추천
Industrial Sensor Signal Conditioning
The PIC16LF18856-I/ML excels in industrial 4-20mA loop-powered sensor transmitters and bridge-sensor conditioning circuits. Its 10-bit ADC² with hardware averaging yields noise-tolerant sensor readings, while the CWG generates excitation waveforms for ratiometric bridge measurement without CPU load. The 1.8V minimum supply enables direct loop-power operation after a Schottky drop, and the 28-QFN exposed-pad package dissipates up to 0.8W under continuous ADC sampling, satisfying the -40C to +85C industrial temperature window. Engineers often cascade the MCU with the MCP3421 18-bit delta-sigma ADC for precision measurements beyond 10-bit resolution.
추천
Automotive Interior and Body Electronics
In automotive body and interior modules, the PIC16LF18856-I/ML drives LED lighting, capacitive-touch buttons, and seat-control actuators. CIP peripherals such as the Complementary Waveform Generator (CWG) produce synchronized LED dimming PWM without CPU overhead, while the Windowed Watchdog Timer (WWDT) and CRC/SCAN blocks meet ISO 26262 ASIL-A reliability targets for interior body controllers. Designers connect the device to LIN bus via MCP2004B or to CAN bus via MCP2515, with the 28-QFN exposed-pad package handling the thermal load of multi-channel PWM within the -40C to +85C range.
추천
User Interface and HMI Controllers
The PIC16LF18856-I/ML powers low-cost human-machine interface modules - capacitive-touch keypads, segment LCD control, and simple menu-driven OLED displays. Peripheral Pin Select (PPS) lets engineers remap UART and PWM channels dynamically for shared I/O pins, while the SMT (Signal Measurement Timer) CIP captures quadrature encoder inputs without CPU wake. With 28KB Flash, the MCU supports full state-machine firmware for rotary-knob and joystick HMI, and the 28-QFN (6x6 mm) footprint fits sub-1-square-inch HMI boards typical of handheld tools and consumer appliances.
추천
Consumer and Wearable Electronics
Wearable fitness bands, smart remote controls, and hearing-aid accessories rely on the PIC16LF18856-I/ML for its sub-uA sleep current and 1.8V minimum VDD, which together extend coin-cell battery life well past one year in duty-cycled accessories. The 32MHz core and CWG CIP drive haptic motor feedback, and the EUSART supports Bluetooth Low Energy (BLE) tethering through modules such as the RN4870. The 28-QFN 6x6 mm package fits within a 50 mm³ wearable enclosure without a heatsink in typical ambient temperatures.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16LF18856-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16LF18855-I/ML | PIC16F18855-I/ML | PIC16LF18876-I/ML |
|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) with EP | 28-QFN (6x6 mm) with EP | 28-QFN (6x6 mm) with EP | 28-QFN (6x6 mm) with EP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 28 KB (16K x 14) | 14 KB (-50%) | 14 KB (-50%) | 28 KB (same) |
| RAM | 2 KB | 1 KB (-50%) | 1 KB (-50%) | 8 KB (+300%) |
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| ADC | 10-bit, up to 24 channels | 10-bit, up to 24 channels | 10-bit, up to 24 channels | 10-bit, up to 24 channels |
| I/O Pins | 25 | 25 | 25 | 25 |
| RoHS | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- 28KB Flash + 2KB RAM in the same QFN-28 footprint (vs PIC16LF18855-I/ML)
- Wide 1.8-3.6V supply supports coin-cell operation (vs PIC16F18855-I/ML)
- ADC² Computation engine offloads averaging from CPU (vs PIC16LF18876-I/ML)
설계 노트
Estimated: The 28-QFN (6x6 mm) exposed-pad package requires a continuous PCB land pattern beneath the central EP, with an array of thermal vias (typically 0.3 mm drill, 0.5 mm pitch, 9-16 vias) connecting the EP to the internal ground plane. Without this thermal via field, theta_JA rises above 80 C/W and the device may not meet -40C to +85C operation under sustained ADC sampling.
Estimated: Place a 100 nF decoupling capacitor as close as possible to the VDD pin (pin 9) and a bulk 10 uF ceramic on the VDD rail entry. The PIC16LF18856-I/ML ADC acquisition accuracy is sensitive to high-frequency noise on VDD; if the MCU is downstream of a switching regulator, add a ferrite bead and 10 uF + 100 nF L-C filter on the VDD node to suppress ripple below 5 mV.
Estimated: For ICSP programming access, keep RA0 (ICSPDAT) and RA1 (ICSPCLK) routed so that a 6-pin header can be soldered to the PCB without crowding adjacent components. MCLR/RE3 (pin 27) must be pulled to VDD through a 10 kohm resistor and include a 100 nF capacitor to ground for proper reset behaviour during power-up.
Estimated: Do not exceed 3.6V on any I/O pin - the 'LF' variant is not 5V-tolerant and will latch up. When migrating from PIC16F18855 firmware, verify that VDD never drops below 1.8V during sleep transitions; the LF's BOR threshold is configurable but defaults to 2.5V, which may be higher than the regulator output during deep sleep transients.
규정 준수 정보
RoHS compliant per Microchip product page. Industrial-grade -40C to +85C. AEC-Q100 variants available under the PIC16F18855-I/MLVAO ordering code for automotive.
