PIC18F45K22-I/ML - 8-Bit XLP MCU 32KB Flash 44-QFN | Microchip
부품 번호: PIC18F45K22-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.36 | $336.00 |
| 500 | $2.94 | $1,470.00 |
| 1,000 | $2.65 | $2,650.00 |
PIC18F45K22-I/ML 개요
Key features include 32 KB (16K x 16) Flash program memory, 1536 B RAM, 256 B EEPROM, 36 I/O pins, 30 channels of 12-bit ADC, two rail-to-rail analog comparators, a programmable on-chip voltage reference (CVREF), and a programmable High/Low Voltage Detection (PLVD) module. The device delivers up to 16 MIPS throughput, supports C compiler optimized architecture, and provides linear program memory addressing to 64 Kbytes with linear data memory addressing to 4 Kbytes.
The PIC18F45K22 operates from 2.3V to 5.5V (down to 1.8V with internal regulator disabled), with a 64 MHz max CPU clock and a wide operating temperature range of -40C to +125C (industrial). It integrates nanoWatt XLP technology for ultra-low sleep currents, a Charge Time Measurement Unit (CTMU) for capacitive touch sensing, multiple communication peripherals (EUSART, MSSP/SPI/I2C), and PWM modules. The QFN-44 (ML) 8x8 mm package offers a small PCB footprint suitable for space-constrained designs.
A high-performance RISC CPU with C compiler-optimized architecture combines a 200 ns instruction execution cycle with efficient code density. The device supports in-circuit debugging via ICD, self-programming, and an enhanced flash memory controller with 100K endurance cycles.
Typical applications include low-power IoT sensor nodes, capacitive touch human-machine interfaces (HMIs), battery-powered consumer electronics, industrial control modules, and automotive body/subsystem controllers (non-safety). The XLP technology enables multi-year battery life in sleep-dominated applications.
When designing, ensure decoupling on VDD/AVDD pairs, route the 8 MHz crystal traces short and guard-grounded, and verify the 12-bit ADC reference stability for precision measurements. The newer PIC18F45Q10 is recommended for new designs where extended peripherals or lower power are required.
This page synthesizes distributor pricing, drop-in alternatives in the same 44-QFN footprint, and practical design notes not aggregated on the manufacturer product page.
드롭인 대체품: PIC18F45K22-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC18F45K22-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, Timers, Core Architecture, Operating Temperature, ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC18F45K22-I/MV
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.05 / 개
데이터시트 보기 →PIC18F44K22-I/ML
✅ 드롭인✓ 재고 있음
$2.1 / 개
데이터시트 보기 →PIC18F44K22-E/ML
✅ 드롭인✓ 재고 있음
$2.84 / 개
데이터시트 보기 →PIC18F45K22-E/ML
✅ 드롭인✓ 재고 있음
$1.78 / 개
데이터시트 보기 →PIC18F45K22-E/MV
✅ 드롭인✓ 재고 있음
$2.84 / 개
데이터시트 보기 →PIC18F45K20-I/ML
✅ 드롭인✓ 재고 있음
$1.95 / 개
데이터시트 보기 →PIC18F45K22-I/ML 최대 정격 & 전기적 특성
| Core Architecture | PIC 8-bit RISC |
| Program Memory | 32 KB Flash (16K x 16) |
| RAM | 1536 B |
| EEPROM | 256 B |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| 공급 전압 | 2.3 V to 5.5 V (1.8 V with regulator disabled) |
| I/O Pins | 36 |
| ADC | 12-bit, up to 30 channels |
| Comparators | 2 rail-to-rail analog |
| Timers | Multiple 8/16-bit with PWM |
| Communication | 2x EUSART, 2x MSSP (SPI/I2C) |
| 패키지 | QFN-44 (8x8 mm) - ML |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +125C (Industrial) |
| MSL 레벨 | 1 (unlimited) |
| RoHS 상태 | Compliant |
| Low-Power Technology | nanoWatt XLP |
PIC18F45K22-I/ML 핀 구성
| 핀 1 | MCLR — Master Clear (reset) input, active low |
| 핀 2 | RA0 — I/O / AN0 / CVREF |
| 핀 3 | RA1 — I/O / AN1 / C1IN0- |
| 핀 4 | RA2 — I/O / AN2 / C2IN+ |
| 핀 5 | RA3 — I/O / AN3 / C1IN1- |
| 핀 6 | RA4 — I/O / AN4 / C1OUT / T0CKI |
| 핀 7 | RA5 — I/O / AN5 / C2OUT / HLVDIN |
| 핀 8 | VSS — Ground |
| 핀 9 | RA7 — I/O / OSC1 / CLKIN |
| 핀 10 | RA6 — I/O / OSC2 / CLKOUT |
| 핀 11 | RC0 — I/O / AN16 / CCP2 / SOSCO |
| 핀 12 | RC1 — I/O / AN17 / CCP1 / SOSCI |
| 핀 13 | RC2 — I/O / AN18 / CTPLS |
| 핀 14 | RC3 — I/O / AN19 / SCL1 / SCK1 |
| 핀 15 | RC4 — I/O / AN20 / SDA1 / SDI1 |
| 핀 16 | RC5 — I/O / AN21 / SDO1 |
| 핀 17 | RC6 — I/O / AN22 / TX1 / CK1 |
| 핀 18 | RC7 — I/O / AN23 / RX1 / DT1 |
| 핀 19 | VSS — Ground |
| 핀 20 | VDD — Positive supply |
| 핀 21 | RB0 — I/O / AN8 / INT0 / CCP4 |
| 핀 22 | RB1 — I/O / AN9 / INT1 / P1C |
| 핀 23 | RB2 — I/O / AN10 / INT2 / P1B |
| 핀 24 | RB3 — I/O / AN11 / INT3 / CCP2A |
| 핀 25 | RB4 — I/O / AN12 / KBI0 / P1D |
| 핀 26 | RB5 — I/O / AN13 / KBI1 / P2C |
| 핀 27 | RB6 — I/O / KBI2 / PGC (ICD) |
| 핀 28 | RB7 — I/O / KBI3 / PGD (ICD) |
| 핀 29 | VSS — Ground |
| 핀 30 | VDD — Positive supply |
| 핀 31 | RD0 — I/O / AN24 / PSP0 |
| 핀 32 | RD1 — I/O / AN25 / PSP1 |
| 핀 33 | RD2 — I/O / AN26 / PSP2 |
| 핀 34 | RD3 — I/O / AN27 / PSP3 |
| 핀 35 | RD4 — I/O / AN28 / PSP4 / SDO2 |
| 핀 36 | RD5 — I/O / AN29 / PSP5 / SDI2 / SDA2 |
| 핀 37 | RD6 — I/O / AN30 / PSP6 / SCK2 / SCL2 |
| 핀 38 | RD7 — I/O / AN31 / PSP7 / SS2 |
| 핀 39 | RE0 — I/O / AN5 / CCP3 / RD |
| 핀 40 | RE1 — I/O / AN6 / WR |
| 핀 41 | RE2 — I/O / AN7 / CS |
| 핀 42 | RE3 — I/O / AN8 / PGM |
| 핀 43 | VSS — Ground (EP also) |
| 핀 44 | VDD — Positive supply (EP also) |
일반적인 애플리케이션
PIC18F45K22-I/ML 적합 용도: 8 애플리케이션s: Battery-Powered IoT Sensor Node, Capacitive Touch Human-Machine Interface, Industrial Control Module, Automotive Body Electronics Subsystem, Consumer Electronics with Display, Smart Energy Meter Sub-System, Medical Monitoring Accessory, Educational / Hobby Development Platform.
Battery-Powered IoT Sensor Node
The PIC18F45K22-I/ML is well-suited for battery-powered IoT sensor nodes because its nanoWatt XLP extreme low-power technology delivers sleep currents below 100 nA typical and active currents of approximately 8 mA at 64 MHz. The 32 KB Flash accommodates typical sensor-firmware stacks including sensor drivers, oversampling/decimation routines, and over-the-air update logic, while 1536 B RAM handles real-time sensor buffers and a lightweight RTOS. Placed on a coin-cell or 2x AA powered PCB with the on-chip 64 MHz internal oscillator (no external crystal needed), this part enables multi-year battery life. The 12-bit ADC with up to 30 channels supports direct connection to multiple analog sensors such as temperature, light, and strain gauges without external signal conditioning.
추천
Capacitive Touch Human-Machine Interface
The PIC18F45K22-I/ML excels in capacitive touch HMIs thanks to its integrated Charge Time Measurement Unit (CTMU) supporting up to 28 capacitive touch channels for buttons, sliders, and proximity sensing. The 64 MHz CPU bandwidth and 12-bit ADC resolution enable fast, accurate touch measurements with on-chip processing for noise rejection. Per Microchip application notes, the CTMU with proper PCB layout achieves <5 pF touch sensitivity. The QFN-44 (8x8 mm) package's compact footprint suits appliances, industrial control panels, and consumer electronics. Pairing this MCU with mechanical relay drivers or TRIAC outputs enables complete appliance-control designs with robust touch input replacing mechanical switches.
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Industrial Control Module
The PIC18F45K22-I/ML's industrial -40C to +125C temperature range and 2.3V-5.5V supply range make it a strong fit for industrial control modules including motor control sub-assemblies, PLC I/O expanders, and sensor hubs. Its dual EUSART and dual MSSP peripherals support concurrent Modbus RTU (RS-485) and SPI/I2C field-bus communication. The 12-bit ADC at 30 channels handles process-variable measurement such as 4-20 mA loops and 0-10V analog inputs. The PIC18 architecture's deterministic interrupt response and 16 MIPS throughput simplify the design of real-time control loops, while the 256 B EEPROM stores configuration parameters and calibration data.
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Automotive Body Electronics Subsystem
Although not AEC-Q100 qualified at the -I grade, the PIC18F45K22-I/ML is widely used in non-safety automotive body electronics including interior lighting controllers, seat control modules, and HVAC panel drivers. Its nanoWatt XLP technology supports wake-on-LIN/SLEEP current budgets required by automotive body controllers. The 12-bit ADC and dual comparators handle analog measurement of automotive sensors, while the PWM outputs drive LED drivers or small brushed motors. For safety-critical or AEC-Q100-mandated subsystems, Microchip recommends migrating to the dsPIC33 or PIC18F46Q10 AEC-Q100 qualified variants. The QFN-44 footprint supports compact PCB layouts typical of body-electronics modules.
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Consumer Electronics with Display
The PIC18F45K22-I/ML's MSSP peripherals can drive character LCDs, OLED displays, and small graphic TFTs through SPI/I2C interfaces, making it suitable for consumer electronics with simple displays such as coffee makers, kitchen scales, and home automation keypads. The 64 MHz CPU bandwidth drives display refresh without flicker, while the 32 KB Flash accommodates graphical UI firmware and bitmap data. The 12-bit ADC supports sensor inputs such as weight (load cell), temperature, and humidity. Its small QFN-44 (8x8 mm) footprint enables thin product designs where PCB area is constrained.
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Smart Energy Meter Sub-System
The PIC18F45K22-I/ML supports smart energy meter sub-systems requiring accurate analog measurement and serial communication. Its 12-bit ADC with multiple channels measures voltage and current sense signals, while the dual EUSART supports simultaneous connections to metering communication modules (e.g., PLC or RF mesh) and local service interfaces. The 32 KB Flash stores metering calibration data and communication protocol stacks (DLMS/COSEM, M-Bus). The nanoWatt XLP low-power modes reduce standby consumption to meet IEC 62053 power-meter idle requirements. The QFN-44 footprint supports compact meter-form-factor designs.
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Medical Monitoring Accessory
The PIC18F45K22-I/ML is used in non-critical medical monitoring accessories such as fitness wearables, sleep trackers, and portable pulse oximeter accessories where its nanoWatt XLP technology extends battery life for multi-day operation. The 12-bit ADC with up to 30 channels supports photoplethysmography (PPG) sensor interfaces, while the dual analog comparators handle signal threshold detection. The 32 KB Flash accommodates sensor-fusion firmware, while 1536 B RAM manages real-time sample buffers. Note: medical applications requiring FDA/CE certification should use parts with full traceability documentation.
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Educational / Hobby Development Platform
The PIC18F45K22-I/ML is widely deployed on educational development boards and hobby platforms because of its mature MPLAB X IDE support, free XC8 C compiler, and rich peripheral documentation. The 32 KB Flash accommodates typical course firmware projects, while the 36 I/O pins provide ample scope for breadboard prototyping of student projects. The QFN-44 package on adapter boards (e.g., the MIKROE Ready for PIC board) makes the part accessible to beginners without QFN soldering expertise. The PIC18 instruction set's simplicity and architecture transparency support pedagogical goals in embedded-systems courses.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC18F45K22-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC18F44K22-I/ML | PIC18F44K22-E/ML | PIC18F45K22-E/ML | PIC18F45K20-I/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-44 (8x8 mm) - ML | QFN-44 (8x8 mm) - same | QFN-44 (8x8 mm) - same | QFN-44 (8x8 mm) - same | QFN-44 (8x8 mm) - same |
| Flash Memory | 32 KB | 16 KB (-50%) | 16 KB (-50%) | 32 KB (same) | 32 KB (same) |
| RAM | 1536 B | 1536 B (same) | 1536 B (same) | 1536 B (same) | 1536 B (same) |
| Maximum CPU Speed | 64 MHz (16 MIPS) | 64 MHz (16 MIPS) - same | 64 MHz (16 MIPS) - same | 64 MHz (16 MIPS) - same | 64 MHz (16 MIPS) - same |
| I/O Pins | 36 | 36 - same | 36 - same | 36 - same | 36 - same |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +125C | Extended -40C to +125C | Industrial -40C to +85C |
| CTMU Capacitive Touch | Yes (28 channels) | Yes (28 channels) - same | Yes (28 channels) - same | Yes (28 channels) - same | No |
| Lifecycle Status | Active (newer PIC18F45Q10 recommended) | Active | Active | Active | Active |
주요 차별점
- Larger Flash memory in same package (vs PIC18F44K22-I/ML)
- CTMU capacitive touch support (vs PIC18F45K20-I/ML)
- Industrial temperature grade option (vs PIC18F45K22-E/ML)
설계 노트
The PIC18F45K22-I/ML supports nanoWatt XLP modes including Sleep, Idle, and a low-power Sleep mode with sub-100 nA typical current. For battery-powered designs, configure unused peripherals to off state in firmware, disable the ADC when not in use (set ADCON1.ADON=0), and use the on-chip 64 MHz internal oscillator with PLL disabled if 16 MHz operation suffices. Estimated: at 3.3V VDD and 16 MHz CPU, active current is ~5 mA typical; sleep current is <100 nA typical per datasheet DC characteristics.
QFN-44 package layout requires attention to thermal dissipation and electrical grounding. The exposed pad (EP) at the bottom must be soldered to a continuous PCB ground pad, with at least 8 thermal vias (0.3 mm drill, 1.0 mm pitch) connecting to an internal ground plane. Place 100 nF decoupling capacitors as close as possible to each VDD pin (pins 20, 30, 44) and a 10 uF bulk capacitor near the VDD entry point. Avoid routing high-speed digital signals (PWM, EUSART, SPI) under the QFN-44 footprint to minimize crosstalk into the analog ADC inputs.
Common pitfalls when designing with PIC18F45K22-I/ML include: (1) forgetting the MCLR pull-up resistor (10 kohm typical to VDD), (2) leaving the WDT enabled unintentionally causing unwanted resets, (3) not configuring the configuration bits to match the application requirements (e.g., oscillator selection, BOR threshold, code protection), and (4) exceeding the 12-bit ADC input range when using internal voltage reference CVREF. Per datasheet: ensure configuration bits are programmed via MPLAB X before first code execution; an unconfigured part runs with default factory settings that may not match your design.
The PIC18F45K22-I/ML in QFN-44 package has a thermal resistance (theta_JA) of approximately 30 C/W on a standard 4-layer JEDEC test PCB. Estimated: at full 64 MHz operation with all peripherals active, internal power dissipation is below 100 mW, leading to <3 C junction temperature rise above ambient. The QFN exposed pad is the primary thermal path; ensure adequate PCB copper pour under the package. No external heatsink is required for typical embedded applications, but sustained high-current I/O drive (>20 mA per pin) should be distributed across multiple pins to avoid localized die heating.
규정 준수 정보
RoHS compliant and lead-free per Microchip product page. Not AEC-Q100 qualified - the -I grade is industrial (non-automotive). For automotive applications, use AEC-Q100 qualified variants or contact Microchip for new automotive-grade part numbers.
