PIC18LF4510-I/ML - 8-bit MCU, 32KB Flash, 40MHz | Microchip
부품 번호: PIC18LF4510-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.84 | $4.84 |
| 10 | $4.36 | $43.60 |
| 100 | $3.69 | $369.00 |
| 500 | $3.3 | $1,650.00 |
| 1,000 | $2.95 | $2,950.00 |
| 3,000 | $2.62 | $7,860.00 |
PIC18LF4510-I/ML 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM), and peripheral interfaces. PIC18F microcontrollers use an enhanced Harvard RISC architecture with a modified 16-bit instruction word that allows single-cycle execution for most instructions, placing them in the 8-bit MCU product hierarchy: 8-bit MCU -> microcontroller -> embedded processor -> semiconductor IC. The PIC18F family balances code density, deterministic interrupt latency, and broad peripheral integration, making it a workhorse tier above baseline PIC16 parts and below 16-bit PIC24/dsPIC devices.
Key features include the 10-bit A/D converter with up to 13 input channels, nanoWatt sleep/Idle modes that drop quiescent current into the microampere range, an enhanced CCP module for PWM motor drive, and self-programming Flash for bootloader-style field updates. The wide 2.0 V to 5.5 V operating window lets the same firmware and PCB serve battery, 3.3 V logic, and 5 V legacy systems without rework.
The PIC18F4510 uses an enhanced Harvard architecture with separate code and data buses, a hardware multiplier, and prioritized interrupts that service ADC, PWM, and communication peripherals with deterministic latency. The 8-level hardware stack and 32 KB of linear Flash support C-compiled firmware up to roughly 16 K instructions, with self-programming under firmware control.
Typical applications include industrial control, automotive body and sensor subsystems (LF grade, -40 to +85 °C), consumer white goods and small appliances, low-power remote sensor nodes, and USB-/serial-bridge gateway boards where 36 I/O pins and 10-bit ADC simplify mixed-signal front-end integration.
When designing with this part, plan input protection on ADC channels, use the exposed pad as the primary thermal and ground return, and choose decoupling per the MCU's datasheet. Pin 1 orientation, the exposed pad footprint, and 44-QFN land pattern must be respected to avoid assembly defects on reflow.
This page consolidates distributor pricing, same-family Microchip drop-in alternatives, package-aware comparisons, and design notes not aggregated on any single vendor listing, giving procurement and design engineers a single decision-ready reference.
드롭인 대체품: PIC18LF4510-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC18LF4510-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Operating Temperature, Core Architecture, MSL Level.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC18LF4510T-I/ML
✅ 드롭인✓ 재고 있음
$4.1 / 개
데이터시트 보기 →PIC18F45K22-I/ML
✅ 드롭인✓ 재고 있음
$2.65 / 개
데이터시트 보기 →PIC18LF46K22-I/ML
✅ 드롭인✓ 재고 있음
$4.22 / 개
데이터시트 보기 →PIC18F44K22-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2.1 / 개
데이터시트 보기 →PIC18LF4620-I/ML
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8.65 / 개
데이터시트 보기 →PIC18LF4510-I/ML 최대 정격 & 전기적 특성
| Family | PIC18F |
| Core Size | 8-bit |
| Core Architecture | PIC / RISC (enhanced Harvard) |
| Maximum CPU Frequency | 40 MHz |
| Program Memory (Flash) | 32 KB (16K x 16) |
| Data RAM | 1536 bytes |
| Number of I/O Pins | 36 |
| Supply Voltage (Vdd) | 2.0 V to 5.5 V |
| 동작 온도 | -40 °C to +85 °C (Industrial, "I") |
| 패키지 | 44-QFN (8x8 mm) with Exposed Pad |
| 실장 유형 | Surface Mount |
| Connectivity | I2C, SPI, UART/USART |
| Peripherals | Brown-out Detect/Reset, HLVD, POR, PWM, WDT |
| RoHS 상태 | Compliant (per distributor listings) |
PIC18LF4510-I/ML 핀 구성
| 핀 1 | RA0/AN0 — Digital I/O / Analog input channel 0 |
| 핀 2 | RA1/AN1 — Digital I/O / Analog input channel 1 |
| 핀 3 | RA2/AN2/VREF- — Digital I/O / Analog input 2 / ADC negative reference |
| 핀 4 | RA3/AN3/VREF+ — Digital I/O / Analog input 3 / ADC positive reference |
| 핀 5 | RA4/T0CKI — Digital I/O / Timer0 clock input |
| 핀 6 | RA5/AN4/SS1 — Digital I/O / Analog input 4 / SPI1 slave select |
| 핀 7 | RA6/OSC2 — Digital I/O / Oscillator output |
| 핀 8 | RA7/OSC1 — Digital I/O / Oscillator input |
| 핀 9 | RE0/RD — Digital I/O / Parallel port |
| 핀 10 | RE1/WR — Digital I/O / Parallel port write |
| 핀 11 | RE2/CS — Digital I/O / Parallel port chip select |
| 핀 12 | VDD — Positive supply voltage |
| 핀 13 | VSS — Ground reference |
| 핀 14 | RB0/INT0 — Digital I/O / External interrupt 0 |
| 핀 15 | RB1/INT1 — Digital I/O / External interrupt 1 |
| 핀 16 | RB2/INT2 — Digital I/O / External interrupt 2 |
| 핀 17 | RB3/CCP2 — Digital I/O / Capture/Compare/PWM 2 |
| 핀 18 | RB4 — Digital I/O |
| 핀 19 | RB5/PGM — Digital I/O / Low-voltage programming |
| 핀 20 | RB6/PGC — Digital I/O / ICSP clock |
| 핀 21 | RB7/PGD — Digital I/O / ICSP data |
| 핀 22 | RC0/T1OSO — Digital I/O / Timer1 oscillator output |
| 핀 23 | RC1/T1OSI/CCP2 — Digital I/O / Timer1 oscillator input |
| 핀 24 | RC2/CCP1 — Digital I/O / Capture/Compare/PWM 1 |
| 핀 25 | RC3/SCK1/SCL1 — Digital I/O / SPI1 clock / I2C1 clock |
| 핀 26 | RC4/SDI1/SDA1 — Digital I/O / SPI1 data in / I2C1 data |
| 핀 27 | RC5/SDO1 — Digital I/O / SPI1 data out |
| 핀 28 | RC6/TX1/CK1 — Digital I/O / UART1 transmit / clock |
| 핀 29 | RC7/RX1/DT1 — Digital I/O / UART1 receive / data |
| 핀 30 | RD0 — Digital I/O / Parallel port |
| 핀 31 | RD1 — Digital I/O / Parallel port |
| 핀 32 | RD2 — Digital I/O / Parallel port |
| 핀 33 | RD3 — Digital I/O / Parallel port |
| 핀 34 | RD4 — Digital I/O / Parallel port |
| 핀 35 | RD5 — Digital I/O / Parallel port |
| 핀 36 | RD6 — Digital I/O / Parallel port |
| 핀 37 | RD7 — Digital I/O / Parallel port |
| 핀 38 | VSS — Ground reference |
| 핀 39 | VDD — Positive supply voltage |
| 핀 40 | RF0 — Digital I/O |
| 핀 41 | RF1 — Digital I/O |
| 핀 42 | RF2 — Digital I/O |
| 핀 43 | RF3 — Digital I/O |
| 핀 44 | MCLR/RE3 — Master clear reset / Digital I/O |
| 핀 EP | EP (Exposed Pad) — Thermal/ground return - must be soldered to ground plane |
일반적인 애플리케이션
PIC18LF4510-I/ML 적합 용도: 6 애플리케이션s: Industrial Control & Automation, Automotive Body & Sensor Subsystems, Consumer Appliances (White Goods), Low-Power Sensor Nodes & IoT Edge, USB-to-Serial Bridge / Gateway Boards, Test & Measurement Front-End.
Industrial Control & Automation
The PIC18LF4510-I/ML's 40 MHz PIC18F core, 36 I/O pins, and 10-bit ADC make it well suited for industrial control PLCs, motor starters, and process sensor nodes. Its 2.0 V to 5.5 V operating window lets the same PCB run from 24 V industrial rails stepped down to 3.3 V or 5 V without redesign. The 1536 bytes of RAM and 32 KB Flash handle typical PID control loops, Modbus RTU stacks over UART/USART, and on-board diagnostics. The 44-QFN (8x8 mm) exposed pad provides a thermal path for factory-floor enclosures with limited airflow, and the nanoWatt sleep modes drop standby current into the microampere range for energy-harvesting sensor taps.
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Automotive Body & Sensor Subsystems
The PIC18LF4510-I/ML "LF" grade operates across -40 °C to +85 °C and tolerates the 12 V automotive battery rail stepped down to 5 V, making it a fit for body controllers, seat and mirror modules, climate sensor nodes, and lighting drivers. The 10-bit ADC reads thermistor, current-shunt, and battery-voltage signals with sufficient resolution for body-domain sensing, while the PWM channels drive LED dimmers and small DC loads. Its 32 KB Flash holds LIN-stack or basic J1850 firmware, and 1536 bytes of RAM is enough for protocol state machines. For under-hood or AEC-Q100-grade automotive applications, designers should migrate to PIC18F "E" suffix variants or dsPIC33 families.
추천
Consumer Appliances (White Goods)
The PIC18LF4510-I/ML is widely deployed in washing machines, dishwashers, refrigerators, and small kitchen appliances where its PIC18F ecosystem (MPLAB X IDE, XC8 compiler, free Microchip libraries) accelerates time-to-market. The 36 I/O drive keypads, seven-segment or character LCDs, relay coils, and triac interfaces for heater and motor control. The 10-bit ADC reads NTC temperature sensors, water level, and door-latch switches directly, reducing BOM cost. Wide 2.0 V to 5.5 V Vdd accepts rectified mains-derived rails with simple LDO regulation, and the 44-QFN (8x8 mm) footprint fits compact appliance PCBs. nanoWatt modes help meet ENERGY STAR standby budgets.
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Low-Power Sensor Nodes & IoT Edge
The PIC18LF4510-I/ML's nanoWatt technology and 2.0 V minimum Vdd qualify it for battery-powered wireless sensor nodes that wake, measure, and sleep on duty cycles below 1%. With Sleep currents in the microampere range and a wide supply window, it runs directly from 2xAA alkaline, CR2032 coin cells with boost, or energy-harvested supplies. UART/SPI/I2C peripherals interface directly to sub-GHz transceivers (MRF89XA), BLE modules (RN4871), or LoRa modems for remote telemetry. The 10-bit ADC reads environmental sensors, and 36 I/O accommodate multi-sensor boards. The 32 KB Flash holds application state machines plus Microchip's free MiWi/LoRa P2P stacks.
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USB-to-Serial Bridge / Gateway Boards
The PIC18LF4510-I/ML's UART/USART, SPI, and I2C peripherals make it a flexible bridge MCU for USB-to-UART, USB-to-SPI, or USB-to-I2C gateway boards that expose legacy peripherals to a host PC. With 32 KB Flash and 1536 bytes of RAM it can host CDC class drivers, command parsers, and protocol converters for industrial and laboratory equipment. The 40 MHz core sustains software-rate baud up to 1 Mbaud with low interrupt latency. The 36 I/O leave headroom for status LEDs, GPIO pass-through, and configuration straps. The 44-QFN (8x8 mm) package fits compact dongle-format enclosures while the exposed pad provides the thermal/ground return needed for hot environments.
추천
Test & Measurement Front-End
The PIC18LF4510-I/ML's 10-bit ADC, 36 I/O, and 40 MHz core support bench-instrument front-ends for low-cost multimeters, signal generators, lab power supplies, and educational kits. The ADC multiplexes voltage, current, and temperature inputs through resistive dividers, and PWM combined with low-pass filters synthesizes arbitrary waveforms. UART/USART outputs measurement data to a host display or PC terminal, while SPI drives DACs (MCP4921) and I2C drives character LCDs (PCF8574 + HD44780). The wide 2.0-5.5 V supply is convenient for USB-powered instruments; 1536 bytes RAM holds sample buffers. The 44-QFN (8x8 mm) layout is friendly to mixed-signal PCB stack-ups with isolated analog/digital grounds.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC18LF4510-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC18LF4510T-I/ML | PIC18F45K22-I/ML | PIC18LF46K22-I/ML | PIC18F44K22-I/ML | PIC18LF4620-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8) with EP | 44-QFN (8x8) with EP - same | 44-QFN (8x8) with EP - same | 44-QFN (8x8) with EP - same | 44-QFN (8x8) with EP - same | 44-QFN (8x8) with EP - same |
| Max CPU Frequency | 40 MHz | 40 MHz | 64 MHz (+60%) | 64 MHz (+60%) | 64 MHz (+60%) | 40 MHz |
| Flash Program Memory | 32 KB | 32 KB | 32 KB | 64 KB (+100%) | 16 KB (-50%) | 64 KB (+100%) |
| Data RAM | 1536 bytes | 1536 bytes | 1536 bytes | 3896 bytes (+159%) | 768 bytes (-50%) | 3968 bytes (+164%) |
| Operating Voltage (Vdd) | 2.0 V to 5.5 V (LF) | 2.0 V to 5.5 V (LF) | 1.8 V to 5.5 V | 1.8 V to 5.5 V (LF) | 1.8 V to 5.5 V | 2.0 V to 5.5 V (LF) |
| Number of I/O | 36 | 36 | 36 | 36 | 36 | 36 |
| ADC Resolution | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit | 10-bit |
| PWM Channels | 5 (CCP/ECCP) | 5 (CCP/ECCP) | 16 (enhanced CCP) | 16 (enhanced CCP) | 14 (enhanced CCP) | 5 (CCP/ECCP) |
| I/O Drive Strength | Standard | Standard | 30 mA source/sink (high-current) | 30 mA source/sink (high-current) | 30 mA source/sink (high-current) | Standard |
| Operating Temperature | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) | -40 °C to +85 °C (I) |
| Lifecycle Status | active | active | active | active | active | active |
주요 차별점
- Only Microchip 44-QFN part combining 40 MHz LF core with 32 KB Flash at sub-$3 qty 1000 pricing (vs PIC18F45K22-I/ML)
- Wide 2.0 V to 5.5 V operating voltage covers 3.3 V and 5 V rails in one BOM line (vs PIC18F44K22-I/ML)
- Larger 1536-byte RAM vs PIC16F baseline family for protocol-stack workloads (vs PIC18LF44J10-I/ML)
설계 노트
The 44-QFN (8x8 mm) exposed pad MUST be soldered to a continuous, grounded copper plane with at least 4 thermal via arrays (0.3 mm drill, 0.5 mm pitch) to the inner ground layer for thermal and electrical return-path performance. Skip-via or starved thermal paste will starve the central pad and risk intermittent reset or JTAG failure under thermal stress. Per the PIC18F4510 datasheet, the EP should be tied directly to Vss with multiple low-inductance vias.
Place a 100 nF decoupling capacitor as close as possible to each Vdd/Vss pair (pins 12/13 and 38/39 on the 44-QFN) and add a bulk 10 µF tantalum or ceramic on the main Vdd rail. MCLR (pin 44) requires a 10 kΩ pull-up to Vdd and a 100 nF cap to ground for proper reset, unless the internal MCLR is disabled in configuration bits. Use a low-ESR LDO such as MCP1700 for 3.3 V rails to minimize core-voltage ripple that can degrade ADC readings.
Do not exceed 40 MHz at Vdd below 4.0 V - the PIC18F4510 datasheet voltage-frequency curve shows Fmax derates at lower Vdd. Configuring CONFIG1L for an external oscillator without populating the XTAL circuit will lock the part in reset. The 10-bit ADC requires a 1 µs acquisition time minimum; sample-rate selection in ADCON2 must be set accordingly. Finally, ISP programming via PGC/PGD (RB6/RB7) must keep these pins free of external loads that exceed 25 pF or programming will fail.
When using the PIC18LF4510-I/ML in mixed-signal designs, route ADC traces away from PWM and high-current switching signals to avoid coupling. Use a star-ground topology with the MCU EP as the central tie point, and reserve a quiet analog ground island for the ADC VREF+/VREF- pins (RA3/RA2). A 100 nF + 10 µF decoupling pair on AVdd (if used) plus a small ferrite bead from Vdd to AVdd will reduce digital switching noise injection by 15-20 dB.
Estimated: at full 40 MHz CPU, all peripherals active, and 36 I/O sourcing 20 mA total, the PIC18LF4510-I/ML dissipates approximately 250 mW worst case. With the 44-QFN exposed pad soldered to a 4-layer 1 oz copper ground plane, theta_JA is roughly 28 °C/W, giving a 7 °C junction rise above ambient - well within the 125 °C absolute max. Without the EP soldered correctly, theta_JA rises above 60 °C/W and 250 mW causes a 15 °C rise; this is still safe but board-level reliability decreases.
규정 준수 정보
RoHS compliant per DigiKey listing. The "I" temperature suffix indicates industrial -40 °C to +85 °C grade, not AEC-Q100 qualified. Microchip publishes conflict-minerals compliance on their product compliance portal.