PIC24EP256GP204-I/ML - 70 MIPS 256KB Flash 16-bit MCU | Microchip
부품 번호: PIC24EP256GP204-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.42 | $6.42 |
| 10 | $5.78 | $57.80 |
| 100 | $5.04 | $504.00 |
| 500 | $4.55 | $2,275.00 |
| 1,000 | $4.13 | $4,130.00 |
PIC24EP256GP204-I/ML 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data RAM, and a rich set of programmable peripherals on one die. The PIC24EP family is a 16-bit digital signal controller (DSC) line that bridges conventional 8-bit MCUs and full DSPs, combining the deterministic real-time control of a microcontroller with DSP-class math performance. Within the broader taxonomy, the PIC24EP belongs to Microcontroller > 16-bit MCU > dsPIC33/PIC24E family > Semiconductor, and inherits the wide PIC ecosystem of MPLAB X IDE, XC16 compilers, and Curiosity/Explorer development boards.
Key differentiating features of the PIC24EP256GP204 include a 12-bit ADC with up to 10 Msps sampling, three op-amps and three comparators that can be routed internally to the ADC, configurable logic cells, and a 4-channel DMA controller that offloads data movement from the CPU. The 70 MIPS core executes most instructions in one cycle, and hardware multiply/divide support accelerates math-heavy control loops common in motor control and digital power conversion.
Architecturally, the PIC24EP uses a modified Harvard structure with separate program and data paths to the CPU, accelerating simultaneous fetches. The on-chip CTMU allows constant-current time measurement for capacitive touch sensing, while the PTG orchestrates complex peripheral sequences without CPU intervention, reducing firmware complexity and improving timing precision in real-time applications.
Typical applications for the PIC24EP256GP204-I/ML include industrial motor control, digital power conversion (LLC, PFC, buck/boost controllers), capacitive touch human-machine interfaces, multi-loop sensor conditioning, and general-purpose embedded control. The integrated op-amps and comparators make it especially attractive for sensor interfaces and analog front-ends where PCB area and BOM cost matter.
When designing with this part, consider that the 44-QFN package requires thermal vias under the exposed pad for proper heat dissipation. Developers should also evaluate the available pin-compatible family members (PIC24EP512GP204 with more Flash, or PIC24EP128GP204 for cost-down) to optimize the BOM. The PTG feature is enabled via MPLAB Code Configurator, simplifying code generation.
This page synthesizes distributor pricing, drop-in compatible alternatives from Microchip's PIC24 family, and practical design notes not consolidated in the manufacturer datasheet, helping engineers select and source the right MCU with confidence.
드롭인 대체품: PIC24EP256GP204-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24EP256GP204-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Operating Temperature, Core Architecture, Program Memory (Flash).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24EP512GP204-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24EP256GP204T-I/ML
✅ 드롭인✓ 재고 있음
$6.1 / 개
데이터시트 보기 →PIC24EP256GP204-E/ML
✅ 드롭인✓ 재고 있음
$4.1 / 개
데이터시트 보기 →PIC24EP256GP204-I/ML 최대 정격 & 전기적 특성
| Core | PIC24E 16-bit MCU |
| CPU Performance | 70 MIPS |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| Data SRAM | 32 KB |
| Operating Voltage (VDD) | 3.0 V to 3.6 V |
| 동작 온도 | -40C to +85C (Industrial) |
| 패키지 | 44-QFN (8x8 mm) |
| 실장 유형 | Surface Mount |
| ADC | 12-bit, up to 10 Msps |
| Integrated Op-Amps | 3 |
| Integrated Comparators | 3 |
| CTMU (Capacitive Touch) | Yes |
| Peripheral Trigger Generator (PTG) | Yes |
| DMA Channels | 4 |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (168 hours) |
| 핀 수 | 44 |
PIC24EP256GP204-I/ML 핀 구성
| 핀 1 | RP5/RB5 — Remappable I/O / Port B bit 5 |
| 핀 2 | RP6/RB6 — Remappable I/O / Port B bit 6 |
| 핀 3 | RP7/RB7 — Remappable I/O / Port B bit 7 |
| 핀 4 | RP8/RB8 — Remappable I/O / Port B bit 8 |
| 핀 5 | RP9/RB9 — Remappable I/O / Port B bit 9 |
| 핀 6 | VSS — Ground reference |
| 핀 7 | VDD — Positive supply voltage (3.3V) |
| 핀 8 | RP10/RB10 — Remappable I/O / Port B bit 10 |
| 핀 9 | RP11/RB11 — Remappable I/O / Port B bit 11 |
| 핀 10 | RP12/RB12 — Remappable I/O / Port B bit 12 |
| 핀 11 | RP13/RB13 — Remappable I/O / Port B bit 13 |
| 핀 12 | RP14/RB14 — Remappable I/O / Port B bit 14 |
| 핀 13 | RP15/RB15 — Remappable I/O / Port B bit 15 |
| 핀 14 | AVSS — Analog ground reference |
| 핀 15 | AVDD — Analog positive supply voltage (3.3V) |
| 핀 16 | AN0/RA0 — Analog input 0 / Port A bit 0 |
| 핀 17 | AN1/RA1 — Analog input 1 / Port A bit 1 |
| 핀 18 | AN2/RA2 — Analog input 2 / Port A bit 2 |
| 핀 19 | AN3/RA3 — Analog input 3 / Port A bit 3 |
| 핀 20 | AN4/RA4 — Analog input 4 / Port A bit 4 |
| 핀 21 | AN5/RA5 — Analog input 5 / Port A bit 5 |
| 핀 22 | VREF+/VREF- — ADC voltage reference pins (configured per QA) |
| 핀 23 | OSC1/CLKI — Crystal oscillator input / external clock in (configured per QA) |
| 핀 24 | OSC2/CLKO — Crystal oscillator output / clock out (configured per QA) |
| 핀 25 | MCLR — Master Clear reset input (active low) |
| 핀 26 | PGEC1/PGED1 — ICSP programming clock/data pair 1 (configured per QA) |
| 핀 27 | PGEC2/PGED2 — ICSP programming clock/data pair 2 (configured per QA) |
| 핀 28 | RP0/RA0 — Remappable I/O / Port A bit 0 alternate (configured per QA) |
| 핀 29 | RP1/RA1 — Remappable I/O / Port A bit 1 alternate (configured per QA) |
| 핀 30 | RP2/RA2 — Remappable I/O / Port A bit 2 alternate (configured per QA) |
| 핀 31 | RP3/RA3 — Remappable I/O / Port A bit 3 alternate (configured per QA) |
| 핀 32 | RP4/RA4 — Remappable I/O / Port A bit 4 alternate (configured per QA) |
| 핀 33 | VSS — Ground reference |
| 핀 34 | VDD — Positive supply voltage (3.3V) |
| 핀 35 | SDO1/RP6 — SPI1 data out / remappable peripheral (configured per QA) |
| 핀 36 | SDI1/RP7 — SPI1 data in / remappable peripheral (configured per QA) |
| 핀 37 | SCK1/RP8 — SPI1 clock / remappable peripheral (configured per QA) |
| 핀 38 | U1TX/RP9 — UART1 transmit / remappable peripheral (configured per QA) |
| 핀 39 | U1RX/RP10 — UART1 receive / remappable peripheral (configured per QA) |
| 핀 40 | SCL1/RP11 — I2C1 clock / remappable peripheral (configured per QA) |
| 핀 41 | SDA1/RP12 — I2C1 data / remappable peripheral (configured per QA) |
| 핀 42 | TMS/RP13 — JTAG test mode select (configured per QA) |
| 핀 43 | TCK/RP14 — JTAG test clock (configured per QA) |
| 핀 44 | EP — Exposed thermal pad - tie to VSS for thermal dissipation |
일반적인 애플리케이션
PIC24EP256GP204-I/ML 적합 용도: 6 애플리케이션s: Industrial Motor Control, Digital Power Conversion (PFC, LLC, Buck/Boost), Capacitive Touch HMI, Multi-Loop Sensor Conditioning, General-Purpose Embedded Control, Automotive Body and Comfort Modules.
Industrial Motor Control
The PIC24EP256GP204-I/ML's 70 MIPS core, 12-bit ADC, and integrated op-amps make it ideal for FOC (Field-Oriented Control) and trapezoidal commutation of BLDC, PMSM, and AC induction motors. The PTG orchestrates ADC sampling with PWM timing-critical sequencing without CPU intervention, reducing firmware latency. Three integrated op-amps can directly condition shunt current signals, eliminating external amplifiers and shrinking PCB area in industrial motor drives, robotic actuators, and small servo drives operating from a single 3.3V rail.
추천
Digital Power Conversion (PFC, LLC, Buck/Boost)
Digital power supply designs use the PIC24EP256GP204-I/ML's 70 MIPS performance to run digital compensators, current-mode control loops, and PFC algorithms at switching frequencies up to several hundred kHz. The high-speed 10 Msps ADC samples current and voltage with sub-microsecond latency, while DMA offloads data movement so the CPU stays free for control math. Integrated comparators implement cycle-by-cycle current limiting and the PTG synchronizes ADC with PWM edges for deterministic switching performance in telecom rectifiers, server PSU modules, and LED drivers.
추천
Capacitive Touch HMI
The CTMU (Charge Time Measurement Unit) inside PIC24EP256GP204-I/ML enables robust capacitive touch sensing for buttons, sliders, and proximity sensors without external touch ICs. Combined with the 12-bit ADC and configurable logic cells, the MCU implements projected-capacitive touchpads and waterproof touch panels with self-calibration. The 32 KB SRAM supports capacitive touch firmware plus a real-time UI state machine. Typical deployments include appliance control panels, industrial HMI terminals, and consumer device interfaces where touch replaces mechanical switches.
추천
Multi-Loop Sensor Conditioning
The PIC24EP256GP204-I/ML integrates three op-amps and three comparators that handle analog sensor front-ends (load cells, RTDs, thermocouples, strain gauges) before ADC digitization, replacing discrete op-amp chains. The 12-bit ADC achieves better than 0.024% resolution, suitable for precision industrial instrumentation. DMA channels stream conversion results directly to SRAM without CPU wakeup, enabling low-power multi-channel monitoring in process control transmitters, weighing scales, and environmental sensor nodes. The wide 3.0V-3.6V supply tolerance supports 3.3V industrial backplanes.
추천
General-Purpose Embedded Control
The PIC24EP256GP204-I/ML's combination of 256 KB Flash, 32 KB SRAM, UART/SPI/I2C peripherals, and 70 MIPS throughput serves as a powerful general-purpose controller for industrial gateways, building automation nodes, and consumer appliances. MPLAB X IDE and XC16 compiler support accelerate development with rich libraries (TCP/IP, USB, graphics). The 44-QFN 8x8 mm package fits small form-factor designs. With GPIO counts and DMA for offloading I/O, the part handles multiple communication stacks plus user interface code in a single chip.
추천
Automotive Body and Comfort Modules
The PIC24EP256GP204-E/ML extended-temperature variant is qualified for automotive body electronics applications including HVAC controls, seat controllers, lighting modules, and door-zone modules. The integrated op-amps and comparators handle sensor inputs from NTC thermistors and position sensors, while the LIN/UART peripherals interface with automotive body networks. AEC-Q100 considerations are addressed by selecting the -E grade part. The 70 MIPS core runs body-control state machines and diagnostics, replacing legacy 8-bit PIC16/PIC18 designs with more code space and DSP capability.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24EP256GP204-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24EP512GP204-I/ML | PIC24EP256GP204T-I/ML | PIC24EP256GP204-E/ML |
|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Program Memory (Flash) | 256 KB | 512 KB (+100%) | 256 KB (identical) | 256 KB (identical) |
| Data SRAM | 32 KB | 48 KB (+50%) | 32 KB (identical) | 32 KB (identical) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Integrated Op-Amps | 3 | 3 | 3 | 3 |
| ADC Resolution/Speed | 12-bit, 10 Msps | 12-bit, 10 Msps | 12-bit, 10 Msps | 12-bit, 10 Msps |
주요 차별점
- Doubles Flash memory within same footprint (vs PIC24EP512GP204-I/ML)
- Industrial temperature grade only (vs PIC24EP256GP204-E/ML)
- Tray packaging for low-volume prototyping (vs PIC24EP256GP204T-I/ML)
설계 노트
The 44-QFN package exposes a thermal pad (pin 44 / EP) that must be soldered to a copper pour on the PCB for proper heat dissipation. Use thermal vias under the EP to conduct heat to internal or backside copper planes. Estimated: with EP connected to 1 sq-inch copper pour on a 4-layer FR-4 board, theta_JA is approximately 30 C/W; without the EP properly soldered, junction temperature may exceed 100C at moderate workloads, causing thermal shutdown or accelerated wear.
Decouple VDD and AVDD separately with 100 nF ceramic capacitors placed as close as possible to each pin, plus a 10 uF bulk capacitor on each supply rail. Keep analog traces (ADC inputs, op-amp in/out, VREF) routed away from PWM and switching signals, and use a ground pour under analog sections. The MCLR pin requires a 10 kohm pull-up to VDD and a 100 nF cap to ground for noise-free reset; omit the cap only if reset timing constraints are relaxed.
Do not exceed absolute maximum VDD of 4.0 V (the part is not 5V tolerant). When migrating from PIC24FJ family, note that the PIC24E core has different configuration bit settings - use MPLAB X IDE's configuration bit window to set fuses correctly, otherwise the device may not start. The Peripheral Trigger Generator (PTG) module requires careful step sequencing in MPLAB Code Configurator; mis-sequenced steps can cause runaway peripheral operation without CPU visibility.
Route the crystal oscillator traces (OSC1/OSC2) with short, symmetric lengths and guard them with a ground pour to minimize EMI pickup. Place the crystal within 5 mm of the OSC pins, with no digital signals crossing beneath. For ADC accuracy better than 10 ENOB, route ADC inputs as differential pairs where possible, and avoid routing them near PWM outputs. The ICSP programming pins (PGEC1/PGED1, PGEC2/PGED2) should be accessible from the board edge for in-circuit programming.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. The standard I-grade part is NOT AEC-Q100 qualified - select PIC24EP256GP204-E/ML extended temperature grade for automotive under-hood applications requiring higher thermal tolerance.