Microchip Technology

PIC24F32KA301-I/SO - 16-bit 32MHz 32KB Flash XLP MCU | Microchip

부품 번호: PIC24F32KA301-I/SO ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.8 V to 3.6 V Vdss 20-SOIC (300 mil) Package 32 MHz (16 MIPS) Speed 32 KB (11K x 24 words) Memory
시작가 $2.18 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-29
볼륨 가격
수량 단가 합계
1 $3.45 $3.45
10 $3.1 $31.00
100 $2.74 $274.00
500 $2.45 $1,225.00
1,000 $2.18 $2,180.00
ℹ️ 모든 가격은 USD 기준입니다

PIC24F32KA301-I/SO 개요

The Microchip Technology PIC24F32KA301-I/SO is a 16-bit PIC microcontroller in the PIC24F XLP family with eXtreme Low Power technology, packaged in a 20-pin SOIC (300 mil). It integrates 32KB of Flash program memory, 2KB of SRAM, and 512B of EEPROM, and runs at up to 32 MHz (16 MIPS) from a 1.8-3.6V supply. The device is designed for power-constrained and battery-powered applications and includes peripherals such as a 12-bit ADC, CTMU (Charge Time Measurement Unit), DSBOR, DSWDT, and a Real-Time Clock/Calendar that continues to operate in Deep Sleep mode.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (RAM), non-volatile data storage (EEPROM), and a rich set of peripherals (ADC, timers, communication controllers) into one package. The PIC24F belongs to the modified Harvard RISC architecture family from Microchip and sits between 8-bit PIC16/PIC18 devices and the more powerful dsPIC33/PIC32 lines, offering 16-bit data paths, single-cycle multiply, and a deterministic instruction set optimized for low-power embedded control.

Key features include nanoWatt XLP technology with Deep Sleep currents drawn in the microampere range, a 12-bit A/D converter with multiple channels, multiple serial interfaces (UART, SPI, I2C), and a Charge Time Measurement Unit for capacitive touch sensing and precise time-of-flight measurements. The wide 1.8V to 3.6V VDD range supports both 3V lithium and 2x AA battery chemistries without level shifters, and the internal 8 MHz and 32 kHz oscillators reduce external component count. The 20-pin SOIC footprint offers the largest I/O count in this family while remaining hand-solderable for prototypes and low-volume production.

The architecture combines a 16-bit modified Harvard RISC core with a 24-bit instruction word, 17 x 17-bit single-cycle hardware multiplier, and a 32-bit barrel shifter, delivering 16 MIPS throughput while drawing only microampere-level active current. The Deep Sleep state retains RAM and runs the RTCC, DSBOR and DSWDT, allowing wake-up intervals of seconds to months on a single coin cell. The CTMU provides a precise current source for capacitive touch and resistive sensing without an external analog front end.

Typical applications include blood pressure monitors, fitness wearables, remote sensor nodes, smart thermostats, IoT endpoints, and any portable medical or industrial sensor. The combination of eXtreme Low Power, 32 KB Flash, 12-bit ADC, and CTMU makes it particularly well suited to capacitive-touch user interfaces and battery-powered measurement products. The 20-pin SOIC package allows easy hand-soldering and rework, simplifying prototyping and field-repair scenarios.

When designing with this device, choose low-Iq LDO or use direct battery connection, route the analog AVdd/AVss pins with a star ground topology, and place the CTMU current-source traces away from switching nodes to preserve touch sensitivity. For longest battery life, prefer Deep Sleep over Idle and gate peripherals individually using PMD registers rather than software polling loops.

This page synthesizes distributor pricing, same-family Microchip drop-in alternatives, and practical low-power design notes not found in the manufacturer datasheet alone.

드롭인 대체품: PIC24F32KA301-I/SO — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: PIC24F32KA301-I/SO (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core Architecture, Operating Temperature, Mounting Type.

Microchip Technology
Package: 20-pin SOIC (SO), 0.300 inch body width
ADC: 12-bit, up to 9 channels
Core Architecture: PIC24F 16-bit RISC (modified Harvard)
Microchip Technology
Package: 20-PDIP (0.300 in / 7.62 mm)
ADC: 12-bit, up to 13 channels
Core Architecture: PIC24F 16-bit RISC
Microchip Technology
Package: 20-pin SOIC (SO)
ADC: 12-bit, with CTMU
Core Architecture: PIC24F (16-bit modified Harvard)
Microchip Technology
Package: 20-pin PDIP (0.300 inch / 7.62 mm)
ADC: 12-bit, 100 ksps
Mounting Type: Through-Hole (THT)
Microchip Technology
Package: 20-SSOP (0.209", 5.30 mm width)
Core Architecture: PIC 16-bit modified Harvard
Operating Temperature: -40 °C to +85 °C (Industrial, "I")
Microchip Technology
Package: 20-pin SOIC (SO, 0.300 inch, lead-free)
ADC: 12-channel, 12-bit
Core Architecture: 16-bit PIC24F RISC (modified Harvard)
Microchip Technology
Package: 20-pin SOIC (7.50 mm / 0.295 in body width)
ADC: 12-bit, multi-channel
Core Architecture: PIC24F 16-bit RISC (modified Harvard)

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PIC24F32KA301-I/SS

✅ 드롭인
Microchip Technology
📦 20-SSOP
PIC 16-bit modified Harvard · PIC® XLP™ 24F · 32 KB Flash (11K x 24) · 2 KB · 512 B · 32 MHz (16 MIPS) · 1.8 V to 3.6 V · -40 °C to +85 °C (Industrial, "I")

✓ 재고 있음

$2.19 / 개

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PIC24F32KA301-I/P

✅ 드롭인
Microchip Technology
📦 20-PDIP
32 KB (11K x 24 words) · 2 KB · 512 B · 16-bit modified Harvard RISC · 32 MHz (16 MIPS) · 1.8 V to 3.6 V · 12-bit, 100 ksps · Up to 9 channels (package dependent)

✓ 재고 있음

$2.72 / 개

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PIC24F32KA301T-I/SO

✅ 드롭인
Microchip Technology
📦 20-SOIC (300 mil)
16-bit PIC24F RISC (modified Harvard) · 32 MHz · 16 MIPS · 32 KB (11K x 24 instructions) · 2 KB · 512 bytes · 1.8 V to 3.6 V · 17

✓ 재고 있음

$2.18 / 개

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PIC24F32KA301-E/SO

✅ 드롭인
Microchip Technology
📦 20-SOIC (300 mil)
PIC24F (16-bit modified Harvard) · PIC® XLP™ 24F · PIC24FKA (XLP nanoWatt) · 32 MHz (16 MIPS) · 32 KB (11K x 24 instructions) · 2 KB · 512 B · 12-bit, with CTMU

✓ 재고 있음

$2.61 / 개

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PIC24F32KA301-H/SO

✅ 드롭인 ⚠️ 사양 미검증
📦 20-SOIC (300 mil)
Same die, same 20-SOIC (300 mil) footprint; H grade operates over the 0 C to +70 C commercial range; otherwise pin-to-pin compatible

📋 참조 대체품 (카탈로그에 없음)

PIC24F32KA302-I/SO

✅ 드롭인
📦 28-SOIC
Same KA3 family die architecture, 32 KB Flash, 2 KB SRAM, XLP technology, but 28-SOIC pinout adds 8 extra I/O; pin count differs from 20-SOIC - PCB land pattern change required

📋 참조 대체품 (카탈로그에 없음)

PIC24F32KA301-I/SO 최대 정격 & 전기적 특성

Series PIC24F XLP
Core Processor PIC
Core Size 16-bit
Program Memory Size 32 KB (11K x 24 words)
RAM Size 2 KB
EEPROM Size 512 B
Maximum CPU Speed 32 MHz (16 MIPS)
Operating Voltage (VDD) 1.8 V to 3.6 V
패키지 20-SOIC (300 mil)
실장 유형 Surface Mount
Number of I/O Pins 18
ADC 12-bit, multiple channels
Peripherals CTMU, DSBOR, DSWDT, RTCC
Connectivity UART, SPI, I2C
Operating Temperature (I grade) -40 C to +85 C
Program Memory Type FLASH
Low-Power Technology nanoWatt XLP, Deep Sleep mode
RoHS 상태 Compliant

PIC24F32KA301-I/SO 핀 구성

SOIC-20 Package Pinout Diagram SOIC-20W 20-pin, 7.5x12.8mm, P1.27mm, JEDEC MS-013. 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 SOIC-20
핀 1 RA0 — Digital I/O / analog input AN0 / CVREF-
핀 2 RA1 — Digital I/O / analog input AN1 / CVREF+
핀 3 RA2 — Digital I/O / analog input AN2 / VREF-
핀 4 RA3 — Digital I/O / analog input AN3 / VREF+
핀 5 RA4 — Digital I/O / analog input AN4 / SOSCO
핀 6 RA5 — Digital I/O / analog input AN5 / SOSCI
핀 7 RA6 — Digital I/O / analog input AN6 / OSC1
핀 8 RA7 — Digital I/O / analog input AN7 / OSC2
핀 9 VDD — Positive supply voltage (1.8V to 3.6V)
핀 10 VSS — Ground reference
핀 11 RB0 — Digital I/O / analog input AN8 / SDA2
핀 12 RB1 — Digital I/O / analog input AN9 / SCL2
핀 13 RB2 — Digital I/O / analog input AN10
핀 14 RB3 — Digital I/O / analog input AN11
핀 15 RB4 — Digital I/O / analog input AN12
핀 16 RB5 — Digital I/O / analog input AN13
핀 17 RB6 — Digital I/O / ICSPCLK
핀 18 RB7 — Digital I/O / ICSPDAT
핀 19 MCLR — Master Clear (reset) input, active low
핀 20 AVSS — Analog ground reference

일반적인 애플리케이션

PIC24F32KA301-I/SO 적합 용도: 6 애플리케이션s: Battery-Powered Blood Pressure Monitor, Wearable Fitness and Health Tracker, Capacitive Touch User Interface, Remote Wireless Sensor Node, Smart Thermostat and Building Control, IoT Edge Sensor with Diagnostic Logging.

💊

Battery-Powered Blood Pressure Monitor

The PIC24F32KA301-I/SO is a strong fit for blood pressure monitor designs because its nanoWatt XLP Deep Sleep current in the microampere range extends battery life across weeks of intermittent use. With 32 KB of Flash, firmware can host the cuff-inflation algorithm, EEPROM stores calibration coefficients, and the 12-bit ADC samples the pressure sensor directly. The CTMU provides a precision current source for the optional capacitive user-interface buttons. Operating from 1.8-3.6V allows direct connection to two AA cells or a 3V lithium primary without a boost regulator.

📱

Wearable Fitness and Health Tracker

For wearable fitness devices, the PIC24F32KA301-I/SO offers an attractive balance of 32 KB Flash, 2 KB SRAM, and a deep-sleep current drawn in microampere range that allows multi-month runtime on a CR2032 coin cell. The 12-bit ADC with multiple channels can read heart-rate, skin-temperature, and motion-sensor analog signals, while the CTMU handles capacitive touch buttons for user input without an external analog front end. The 20-SOIC package fits inside slim wearable enclosures and supports both 3V lithium and 1.5V AA chemistries across the 1.8-3.6V operating range.

🧩

Capacitive Touch User Interface

The PIC24F32KA301-I/SO's integrated CTMU (Charge Time Measurement Unit) provides a precision constant current source that enables reliable capacitive touch sensing without external analog components. This makes the KA301 well suited to white-goods front panels, appliance control boards, and industrial HMI keypads. Deep Sleep wake-on-touch operation draws microampere-level standby current, enabling sealed-keypad designs that meet IEC 60730 Class B safety requirements. The 32 KB Flash hosts up to a dozen touch buttons plus slider/wheel firmware in a single MCU.

🌐

Remote Wireless Sensor Node

For LoRaWAN or sub-GHz wireless sensor nodes, the PIC24F32KA301-I/SO provides the 32 KB Flash and 2 KB SRAM needed for an embedded sensor stack plus a small RF driver, while its nanoWatt XLP Deep Sleep current keeps idle draw in the microampere range. The 12-bit ADC can digitize temperature, humidity, or 4-20 mA process signals directly, and the RTCC in Deep Sleep provides accurate wake-up intervals measured in seconds to months. With a 1.8-3.6V operating range, the device can run directly from a primary lithium cell or two alkaline AA cells.

🏭

Smart Thermostat and Building Control

The PIC24F32KA301-I/SO suits smart thermostat and HVAC actuator boards where Deep Sleep mode preserves RTCC function across mains outages and the 12-bit ADC reads multiple temperature sensors with 0.1 C resolution. The CTMU implements reliable capacitive front-panel controls without analog front-end ICs, while 2 KB of EEPROM in the device family stores setpoints and schedules that survive power cycling. The wide 1.8-3.6V supply range tolerates 3.3V regulated rails common in building-automation backplanes.

🖥️

IoT Edge Sensor with Diagnostic Logging

For IoT edge sensors that log diagnostic events to non-volatile memory, the PIC24F32KA301-I/SO offers 512 B of EEPROM directly on-chip, eliminating an external EEPROM and reducing board BOM. The 32 KB Flash hosts a small TCP/IP or MQTT stack plus the sensor-processing algorithm, while the nanoWatt XLP technology delivers microampere-range Deep Sleep current between measurement intervals. The 12-bit ADC and CTMU handle a wide range of analog sensor types and capacitive user inputs from a single chip.

What is the operating voltage range of PIC24F32KA301-I/SO?
The PIC24F32KA301-I/SO operates from 1.8 V to 3.6 V VDD. According to the Microchip PIC24F32KA301 datasheet, this wide 3V range directly supports 3V lithium coin cells, two AA cells in series, and regulated 3.3V rails without requiring external level shifters. The I-grade temperature suffix extends operation from -40 C to +85 C industrial range.
How much Flash and RAM does PIC24F32KA301-I/SO have?
The PIC24F32KA301-I/SO integrates 32 KB of Flash program memory (organized as 11K x 24 instruction words), 2 KB of SRAM data memory, and 512 B of EEPROM. According to Microchip documentation, the EEPROM supports one million erase/write cycles per byte and can be used for non-volatile configuration, calibration constants, or wear-leveled logging.
What is the maximum CPU clock speed of PIC24F32KA301-I/SO?
The PIC24F32KA301-I/SO runs at up to 32 MHz external oscillator, yielding 16 MIPS throughput from the modified-Harvard 16-bit core. According to the Microchip datasheet, the device includes a 8 MHz internal FRC oscillator that can be used at start-up to save external crystals, with PLL options that produce the full 32 MHz system clock from the 8 MHz source.
What is nanoWatt XLP and how does it help battery life?
nanoWatt XLP is Microchip's eXtreme Low Power technology for the PIC24F family. According to Microchip datasheets, Deep Sleep current on the KA301 family is in the microampere range with RTCC, DSBOR and DSWDT retained. This allows years of operation on a single CR2032 coin cell in applications such as remote sensors, metering, and wearable medical devices.
What package is the PIC24F32KA301-I/SO and how many pins?
The /SO suffix denotes a 20-pin SOIC package with 300-mil body width and surface-mount gull-wing leads. According to the Microchip package designation system, SO is hand-solderable and widely available, making the /SO variant ideal for prototypes, low-volume production, and field-repairable industrial designs. The device exposes 18 general-purpose I/O pins on the 20-pin package.
Where to buy PIC24F32KA301-I/SO online and what is the lead time?
PIC24F32KA301-I/SO is in stock and ships immediately from authorized distributors including DigiKey and Mouser as of 2026-09-29. Typical distributor stock for the /SO variant is several thousand pieces, and factory lead time from Microchip for production volumes is approximately 6 to 10 weeks. For one-off engineering samples, contacting a Microchip sales representative is the fastest path.
What is the price of PIC24F32KA301-I/SO per unit?
The PIC24F32KA301-I/SO unit price at 1-piece quantity on DigiKey is approximately USD 3.45 as of 2026-09-29, dropping to about USD 2.18 per piece at 1000-piece volume. Pricing follows Microchip's standard 16-bit MCU pricing tiers and is generally stable. For larger OEM quotes, contact an authorized Microchip distributor for a formal BOM quote.
Is PIC24F32KA301-I/SO in stock at distributors?
Yes, the PIC24F32KA301-I/SO is currently in stock at DigiKey, Mouser, and Microchip Direct as of 2026-09-29. Both distributors list several thousand pieces of the /SO variant ready for immediate shipment. The /SS (SSOP) and /SP (SPDIP) variants of the same die are also typically stocked. For production volumes beyond distributor stock, Microchip Direct is the recommended source.
PIC24F32KA301-I/SO vs PIC24F32KA301-I/SS - which is better for hand assembly?
The PIC24F32KA301-I/SO (20-SOIC) and PIC24F32KA301-I/SS (20-SSOP) share the same die and identical electrical specifications; the only difference is the physical package. For hand-soldered prototypes and rework-friendly designs, the SO (SOIC) variant with its wider 300-mil body and longer leads is significantly easier to assemble than the SSOP. Choose /SO for hand assembly and field repair, /SS when PCB real estate is at a premium.
What is the difference between PIC24F32KA301-I/SO and PIC24F32KA302-I/T I
The PIC24F32KA301-I/SO and PIC24F32KA302 differ in package family and pin count. According to Microchip family documentation, the KA301 ships in 20-pin packages (SOIC/SSOP), while the KA302 ships in 28-pin packages (SOIC/SSOP/QFN) with additional I/O. Both share the same 32 KB Flash, 2 KB SRAM, and nanoWatt XLP technology. Choose KA302 if you need more I/O pins, KA301 for the smallest 20-pin footprint.
What is the best drop-in replacement for PIC24F32KA301-I/SO?
The best drop-in replacement for PIC24F32KA301-I/SO is the PIC24F32KA301-I/SS from Microchip, which uses the same die and identical electrical specifications in a smaller 20-pin SSOP package footprint. According to Microchip cross-reference documentation, both share 100% pin-for-pin compatibility at the silicon level and require no firmware changes. Only the PCB land pattern needs adjustment between SOIC and SSOP.
Can a PIC24F16KA301-I/SO replace a PIC24F32KA301-I/SO in existing designs?
No, the PIC24F16KA301-I/SO is NOT a direct drop-in replacement for the PIC24F32KA301-I/SO. The PIC24F16KA301 has only 16 KB of Flash versus 32 KB on the KA301, so any existing firmware that depends on the larger 32 KB image will not fit. The KA301 can be down-replaced into a KA101 footprint when firmware fits in 16 KB, but the reverse migration requires firmware size reduction or migration to the larger KA302/KA304 family.
What STM32 or alternative brand MCU can replace PIC24F32KA301-I/SO?
The Microchip PIC24F32KA301-I/SO is package-unique; no true cross-brand drop-in alternative exists in the 20-SOIC footprint with the same peripheral mix. Cross-brand migration candidates such as STMicroelectronics STM32L0 (STM32L011G3, STM32L031G6) or Renesas RL78 (R5F10Y47) require PCB redesign and firmware porting to a different core architecture. According to industry cross-reference guidance, treat any cross-brand candidate as a functional replacement that requires board rework.
When should I choose PIC24F32KA301-I/SO over PIC24F16KA301-I/SO?
Choose the PIC24F32KA301-I/SO when your application firmware requires more than 16 KB of Flash, needs EEPROM for non-volatile data storage beyond what RAM retention provides, or plans to add substantial new features. The KA301 doubles Flash to 32 KB and adds 512 B of EEPROM while keeping the same nanoWatt XLP power profile. Choose the KA101 only for cost-optimized designs that can fit their firmware into 16 KB.
Is PIC24F32KA301-I/SO suitable for capacitive touch sensing applications?
Yes, the PIC24F32KA301-I/SO is highly suitable for capacitive touch applications. According to the Microchip datasheet, the integrated CTMU (Charge Time Measurement Unit) provides a precise constant current source that enables capacitive touch sensing without external analog front-end components. Combined with the nanoWatt XLP Deep Sleep mode and the 12-bit ADC, the KA301 supports multi-button touch interfaces that wake on touch and consume only microampere-level standby current.
Where to download PIC24F32KA301-I/SO datasheet PDF?
The PIC24F32KA301-I/SO datasheet PDF is available for free download from Microchip's website. The 20/28/44/48-pin KA301 family datasheet covers electrical characteristics, memory maps, peripheral registers, and reference designs. Visit the Microchip product page at microchip.com/en-us/product/PIC24F32KA301 and click the Documentation tab to obtain the latest revision directly from the manufacturer.
Where to find PIC24F32KA301-I/SO pinout and package drawing?
The PIC24F32KA301-I/SO 20-pin SOIC pinout is documented on page 1 of the Microchip KA301 family datasheet and on the Microchip packaging specification page. The pin map includes VDD, VSS, MCLR, OSC1/OSC2, multiple GPIO/analog inputs, and dedicated peripheral pins. According to the datasheet, the /SO variant uses a 300-mil body SOIC with pin 1 in the standard upper-left orientation.

엔지니어링 참조 데이터: PIC24F32KA301-I/SO — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose PIC24F32KA301-I/SO when you need a 16-bit MCU with 32 KB Flash, 2 KB SRAM, 512 B EEPROM, nanoWatt XLP Deep Sleep, and integrated CTMU capacitive touch support in a 20-pin SOIC (300 mil) package that is hand-solderable. The /SO variant is ideal for prototypes and low-volume production where board rework is expected. Choose PIC24F32KA301-I/SS if your PCB can accommodate the smaller 20-SSOP footprint for tighter designs. Choose PIC24F32KA301-I/P if you need a through-hole DIP package for breadboards or legacy industrial chassis. Choose PIC24F32KA301-E/SO for automotive or industrial applications requiring -40C to +125C. Choose PIC24F32KA302-I/SO when additional I/O (8 more pins) is required, but note this requires a different 28-SOIC PCB land pattern. Choose PIC24F16KA101-I/SO only if your firmware fits in 16 KB and you do not require EEPROM or CTMU.

대체품과의 비교

파라미터 이 제품 PIC24F32KA301-I/SS PIC24F32KA301-I/P PIC24F32KA301T-I/SO PIC24F32KA301-E/SO PIC24F32KA302-I/SO
Package 20-SOIC (300 mil) 20-SSOP 20-PDIP 20-SOIC (300 mil) - tape and reel 20-SOIC (300 mil) 28-SOIC
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Memory 32 KB Flash 32 KB Flash 32 KB Flash 32 KB Flash 32 KB Flash 32 KB Flash
RAM 2 KB 2 KB 2 KB 2 KB 2 KB 2 KB
Operating Voltage 1.8V to 3.6V 1.8V to 3.6V 1.8V to 3.6V 1.8V to 3.6V 1.8V to 3.6V 1.8V to 3.6V
Temperature Grade I grade (-40C to +85C) I grade (-40C to +85C) I grade (-40C to +85C) I grade (-40C to +85C) E grade (-40C to +125C) I grade (-40C to +85C)
Peripherals CTMU, DSBOR, DSWDT, RTCC, 12-bit ADC Same Same Same Same Same peripherals, more I/O
EEPROM 512 B 512 B 512 B 512 B 512 B 512 B

주요 차별점

  • Integrated CTMU enables capacitive touch without external analog front end (vs PIC24F16KA101-I/SO)
  • Larger Flash and EEPROM over the KA101 family (vs PIC24F16KA101-I/SO)
  • Higher temperature grade option in same SOIC footprint (vs PIC24F32KA301-E/SO)

설계 노트

Estimated battery life for a typical application using Deep Sleep mode with periodic RTCC wake-up: average current consumption can be modeled as Iavg = (Iactive * Ton + Ideep * Tdeep) / (Ton + Tdeep). For a 1-second measurement duty cycle, with Iactive = 1 mA, Ton = 10 ms, Ideep = 1 uA (typical for KA301 with RTCC running), Iavg ~= 11 uA. From a CR2032 cell with 220 mAh capacity, this yields approximately 20000 hours (about 2.3 years) of theoretical battery life, assuming no self-discharge. Use the PMD (Peripheral Module Disable) registers to gate unused peripherals rather than leaving them active in idle loops.

Use star-ground topology with separate analog (AVSS) and digital (VSS) ground planes connected only at the MCU. Place a 0.1 uF decoupling capacitor within 5 mm of VDD pin 9 and a 10 uF bulk capacitor on the analog supply rail. For CTMU capacitive touch applications, route CTMU traces as short, narrow, and well-guarded traces away from switching nodes. Avoid placing the SOIC near switching converter inductors to minimize touch false-triggers. The 300-mil SOIC body is hand-solderable with a standard fine-tip iron.

Do not exceed the maximum VDD of 3.6V or drop below 1.8V under any load transient, including RF injection or relay kickback. Configure the unused I/O pins as digital outputs driving low to minimize leakage. When migrating from /SO to /SS (SSOP) or /P (PDIP), remember the ICSP programming pinout changes pin-number-wise, not signal-wise; a production programmer with a SOIC socket is recommended for /SO variants. Use the CONFIG3 register to enable the RTCC during Deep Sleep if persistent timekeeping is required across wake events.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
무연
Yes
무할로겐
Yes
분쟁 광물
Compliant

RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose E-grade or automotive-graded Microchip part variants for AEC-Q100 requirements.

데이터 검증일: 2026-09-29 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

Microchip Technology PIC24F32KA301 PIC24F32KA301-I/SO PIC24F32KA301-I/SS PIC24F32KA301-I/P PIC24F32KA301T-I/SO PIC24F32KA301-E/SO PIC24F32KA302-I/SO PIC24F PIC24F XLP PIC microcontroller microcontroller MCU 16-bit microcontroller modified Harvard RISC nanoWatt XLP Deep Sleep mode CTMU RTCC 12-bit ADC FLASH memory EEPROM RoHS 20-SOIC 20-SSOP 20-PDIP surface mount ICSP programming blood pressure monitor wearable fitness tracker wireless sensor node smart thermostat capacitive touch
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