PIC24FV16KM202-E/ML - 16-bit XLP MCU 16KB Flash | Microchip
부품 번호: PIC24FV16KM202-E/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3.45 | $3.45 |
| 10 | $3.1 | $31.00 |
| 100 | $2.65 | $265.00 |
| 500 | $2.3 | $1,150.00 |
| 1,000 | $1.95 | $1,950.00 |
PIC24FV16KM202-E/ML 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a rich set of programmable peripherals. The PIC24F family belongs to the modified Harvard 16-bit RISC architecture, sitting between 8-bit PIC16/PIC18 MCUs and the 32-bit PIC32MX/ARM Cortex-M families in the Microchip portfolio. Within this hierarchy, XLP variants specifically target battery-powered designs where nano-amp sleep currents and micro-amp active currents are critical.
Key features of the PIC24FV16KM202 include integrated 12-bit ADC with up to 500 ksps conversion, dual rail-to-rail op-amps, an 8-bit DAC, multiple Capture/Compare/PWM modules, a Configurable Logic Cell (CLC), a real-time clock calendar (RTCC), and multiple serial interfaces including I2C, SPI, and UART. The V in FV indicates the wide-voltage variant capable of running directly from a 5 V regulated supply. The 28-QFN (6 x 6 mm) package is optimized for compact PCB layouts requiring high analog integration.
Typical applications include low-power IoT sensor hubs, battery-powered instrumentation, portable medical peripherals, sensor signal conditioning nodes, and industrial 4-20 mA loop transmitters. Combined with peripherals for connectivity and analog signal conditioning, this device reduces BOM cost by eliminating external op-amps and references.
Designers should plan their PCB footprint to expose the EP pad, which carries the analog ground return and thermal path for high-reliability noise-sensitive signal chains. The extended -40 C to +125 C operating range (-E suffix) makes the device suited for industrial environments. Pricing for the PIC24FV16KM202-E/ML reflects current distributor data as of 2026-09-30 and should be verified against the live quote at order time. This page synthesizes drop-in alternatives, package-compatible variants, and practical design guidance beyond the manufacturer datasheet.
드롭인 대체품: PIC24FV16KM202-E/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24FV16KM202-E/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Voltage Range, Maximum CPU Speed, ADC, DAC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24FV16KM202-I/ML
✅ 드롭인✓ 재고 있음
$2.45 / 개
데이터시트 보기 →PIC24F16KM202-E/ML
✅ 드롭인✓ 재고 있음
$2.55 / 개
데이터시트 보기 →PIC24FV16KM202-E/SO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24FV16KM202-E/SP
✅ 드롭인✓ 재고 있음
$2.71 / 개
데이터시트 보기 →PIC24FV16KM202-E/SS
✅ 드롭인✓ 재고 있음
$2.05 / 개
데이터시트 보기 →PIC24FV16KM202-E/ML 최대 정격 & 전기적 특성
| Core Architecture | PIC24F (16-bit modified Harvard RISC) |
| Program Memory (Flash) | 16 KB (5.5K x 24 instruction words) |
| Data Memory (SRAM) | 2 KB |
| EEPROM | 512 B |
| Maximum CPU Speed | 32 MIPS at 32 MHz |
| Operating Voltage Range | 2.0 V to 5.5 V |
| Typical Operating Voltages | 2.5 V / 3.3 V / 5 V |
| ADC | 12-bit, up to 500 ksps |
| DAC | 8-bit integrated |
| Op-Amps | 2 x integrated rail-to-rail |
| Comparators | Multiple on-chip |
| PWM Modules | MCCP + SCCP Capture/Compare/PWM |
| Configurable Logic Cell (CLC) | Yes |
| RTCC | Real-Time Clock Calendar with alarm |
| Communication Interfaces | I2C, SPI, UART |
| 패키지 | 28-pin VQFN (ML) 6x6 mm with exposed pad |
| 동작 온도 | -40 C to +125 C (Extended, -E suffix) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
PIC24FV16KM202-E/ML 핀 구성
| 핀 1 | RA0 — PORTA analog/digital pin 0; AN0/U1CTS/RP0 |
| 핀 2 | RA1 — PORTA analog/digital pin 1; AN1/C1IN+/RP1 |
| 핀 3 | RA2 — PORTA analog/digital pin 2; AN2/CVREF+/RP2 |
| 핀 4 | RA3 — PORTA analog/digital pin 3; AN3/CVREF-/RP3 |
| 핀 5 | RA4 — PORTA analog/digital pin 4; AN4/C1OUT/RP4 |
| 핀 6 | RA5 — PORTA analog/digital pin 5; AN5/C2IN+/RP6 |
| 핀 7 | RA6 — PORTA analog/digital pin 6; AN6/C2IN-/RP7/OSC2 |
| 핀 8 | RA7 — PORTA analog/digital pin 7; AN7/C2OUT/RP8/OSC1 |
| 핀 9 | VSS — Digital ground |
| 핀 10 | RB0 — PORTB digital pin 0; PGED1/AN8 |
| 핀 11 | RB1 — PORTB digital pin 1; PGEC1/AN9 |
| 핀 12 | RB2 — PORTB digital pin 2; AN10/RP9 |
| 핀 13 | RB3 — PORTB digital pin 3; AN11/RP10 |
| 핀 14 | RB4 — PORTB digital pin 4; AN12/RP11 |
| 핀 15 | RB5 — PORTB digital pin 5; AN13/RP12 |
| 핀 16 | RB6 — PORTB digital pin 6; RP13/PGC2 |
| 핀 17 | RB7 — PORTB digital pin 7; RP14/PGD2 |
| 핀 18 | RB8 — PORTB digital pin 8; SCL1/RP15 |
| 핀 19 | RB9 — PORTB digital pin 9; SDA1/RP16 |
| 핀 20 | VCAP — Filter capacitor for internal core voltage regulator |
| 핀 21 | VSS — Digital ground |
| 핀 22 | VDD — Positive digital supply |
| 핀 23 | RC0 — PORTC digital pin 0; RP17 |
| 핀 24 | RC1 — PORTC digital pin 1; RP18 |
| 핀 25 | RC2 — PORTC digital pin 2; RP19 |
| 핀 26 | RC3 — PORTC digital pin 3; RP20 |
| 핀 27 | RC4 — PORTC digital pin 4; RP21 |
| 핀 28 | RC5 — PORTC digital pin 5; RP22 |
일반적인 애플리케이션
PIC24FV16KM202-E/ML 적합 용도: 6 애플리케이션s: Battery-Powered IoT Sensor Node, Portable Medical Peripheral, Industrial 4-20 mA Loop Transmitter, Low-Power Data Logger, USB-Capable Smart Sensor Hub, Capacitive Touch HMI Module.
Battery-Powered IoT Sensor Node
The PIC24FV16KM202-E/ML fits IoT sensor hubs because its XLP nanoamp sleep current extends multi-year coin-cell life. With 16 KB Flash and 2 KB SRAM it runs lightweight RTOS-free sensor stacks, while 12-bit ADC at 500 ksps digitizes analog front-end outputs. Its 2.0 V to 5.5 V range lets it share a CR2032 or two-AA pack directly. Integrated dual op-amps replace external signal conditioning ICs, shrinking BOM and PCB area for compact wireless sensor designs.
추천
Portable Medical Peripheral
Medical peripherals benefit from the PIC24FV16KM202-E/ML's low active current, integrated dual rail-to-rail op-amps, and 12-bit ADC. These features let the MCU condition bioelectric signals such as pulse-oximetry photodiode currents or ECG electrodes without external amplifier ICs. The 8-bit DAC sets LED drive or stimulation levels under closed-loop software, while XLP sleep current preserves battery life during standby. The extended -40 C to +125 C grade supports clinical-device thermal envelopes.
추천
Industrial 4-20 mA Loop Transmitter
In 4-20 mA loops the PIC24FV16KM202-E/ML drives a low-side op-amp and BJT pair to regulate loop current proportional to a sensor reading. Its 2.0 V to 5.5 V range tolerates wide compliance voltages, while the integrated op-amp sets the loop-control PID loop in firmware. RTCC schedules background calibration, and 16 KB Flash accommodates sensor linearization tables. Industrial thermal grade -40 C to +125 C supports plant-cabinet installations.
추천
Low-Power Data Logger
Data loggers pair naturally with the PIC24FV16KM202-E/ML because RTCC provides autonomous wake-ups and EEPROM stores configuration without external memory. The 12-bit ADC at 500 ksps captures sensor waveforms at low duty cycle, and XLP sleep current keeps idle periods at microamp levels. Wide-voltage operation tolerates partially-depleted batteries without brown-out resets. SPI and I2C interfaces connect external Flash cards for long-term archival storage.
추천
USB-Capable Smart Sensor Hub
USB smart sensors use the PIC24FV16KM202-E/ML as the host-side controller because the integrated op-amps and 12-bit ADC condition and digitize analog signals from multiple transducers. CLC offloads event handling from the CPU, freeing cycles for communication stacks. Wide-voltage operation interfaces 3.3 V logic to 5 V USB-bus power. With 16 KB Flash and 2 KB SRAM, this hub handles HID-class firmware without external memory.
추천
Capacitive Touch HMI Module
Capacitive-touch HMIs use the PIC24FV16KM202-E/ML because the CLC and on-chip comparators detect touch events without external charge-time capacitors. Dual op-amps drive piezo or LED indicators in response to touch inputs, while PWM modules generate brightness ramps for visual feedback. The 28-QFN package fits behind small front panels, and XLP current keeps battery-powered remote controls alive for years.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24FV16KM202-E/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24FV16KM202-I/ML | PIC24F16KM202-E/ML | PIC24FV16KM202-E/SO |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-VQFN (ML) 6x6 mm with EP | 28-VQFN (ML) - same | 28-VQFN (ML) - same | 28-SOIC (SO) |
| Operating Voltage | 2.0 V to 5.5 V | 2.0 V to 5.5 V | 1.8 V to 3.6 V | 2.0 V to 5.5 V |
| Flash Memory | 16 KB | 16 KB | 16 KB | 16 KB |
| SRAM | 2 KB | 2 KB | 2 KB | 2 KB |
| Maximum MIPS | 32 MIPS at 32 MHz | 32 MIPS at 32 MHz | 32 MIPS at 32 MHz | 32 MIPS at 32 MHz |
| Operating Temperature | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +125 C (Extended) |
| XLP Sleep Current | nanoamp range (XLP) | nanoamp range (XLP) | nanoamp range (XLP) | nanoamp range (XLP) |
주요 차별점
- Wide-voltage operation simplifies mixed-rail designs (vs PIC24F16KM202-E/ML)
- Same die as industrial variant - firmware-portable (vs PIC24FV16KM202-I/ML)
- VQFN EP package maximizes analog ground integrity (vs PIC24FV16KM202-E/SO)
설계 노트
Estimated: at 32 MHz, VDD=3.3 V, the PIC24FV16KM202-E/ML draws about 4 mA active current per the datasheet DC characteristics. For battery-life calculations, leverage the XLP Sleep mode drawing roughly 20 nA with RTCC active - the RTCC can wake the part autonomously every minute or hour for sensor sampling. Place a 0.1 uF ceramic decoupling capacitor directly at the VDD pin (pin 22) and a 4.7 uF bulk capacitor nearby; the VCAP pin (pin 20) requires a 1 uF to 10 uF low-ESR ceramic to stabilize the internal core regulator. Without proper VCAP capacitance the MCU may fail to start or exhibit erratic brown-out resets.
The 28-pin VQFN exposed thermal pad must be soldered to a sufficiently large copper pour on the PCB - ideally connected to the digital ground (VSS) plane with multiple thermal vias to the inner ground plane. This pad is not primarily for heat dissipation in this low-power MCU but rather serves as a critical electrical reference. Estimated: with theta_JA around 30 C/W on a 4-layer 1-oz copper board, dissipation at 4 mA active x 3.3 V is only 13 mW, yielding a 0.4 C rise above ambient. At the maximum extended grade of +125 C ambient, junction remains well within rated limits under typical XLP duty cycles.
Route analog signals (PORTA analog pins RA0-RA7 and PORTB analog-capable pins RB0-RB5) away from high-speed digital switching lines and clock traces to minimize coupled noise into the ADC. Provide a separate analog ground (AVSS) island or star-ground topology if the system uses both analog and digital ground planes - the VSS pins (9 and 21) should tie to this analog island, and the exposed pad should join via stitching vias. Keep ADC trace lengths below 20 mm and surround them with a guarded analog ground pour to achieve the rated 12-bit ENOB performance.
Do not confuse the PIC24FV16KM202 (wide-voltage 2.0 V-5.5 V) with the PIC24F16KM202 (low-voltage 1.8 V-3.6 V). Substituting the F variant into a 5 V application will permanently damage the part. Similarly, the -E grade covers -40 C to +125 C while the -I grade covers -40 C to +85 C; downgrading temperature grade in a thermally demanding environment causes parametric drift and eventual failure. Always confirm voltage and thermal grade match before firmware bring-up. The VCAP pin must never be left floating - missing capacitance is the most common bring-up failure on this family.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - not intended for automotive safety-critical applications. The -E temperature grade supports industrial environments.
