PIC24HJ128GP502-H/MM - 16-bit 40 MIPS 128KB Flash MCU | Microchip
부품 번호: PIC24HJ128GP502-H/MM ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.85 | $6.85 |
| 10 | $6.18 | $61.80 |
| 100 | $5.42 | $542.00 |
| 500 | $4.79 | $2,395.00 |
| 1,000 | $4.21 | $4,210.00 |
PIC24HJ128GP502-H/MM 개요
A 16-bit microcontroller (MCU) is an integrated circuit combining a CPU, memory, and peripherals on a single die, designed for embedded control tasks. Within Microchip's taxonomy this part sits under: microcontroller -> 16-bit MCU -> PIC24 family -> PIC24H subfamily -> dsPIC33F-pin-compatible digital signal controller class. PIC24H devices share a powerful 16-bit modified Harvard architecture ideal for high-speed, repetitive computations and real-time control, and are pin-compatible with the dsPIC33F family to allow code migration between DSP and pure-control variants.
Key features of the PIC24HJ128GP502-H/MM include 128 KB Flash, 8 KB RAM, 16 KB auxiliary Flash for data EEPROM emulation, two 16-bit timers, two 32-bit timers, two UART, two SPI, two I2C, an input capture module, an output compare module, a 16-channel 10-bit ADC, a 10/12-bit PWM module, and a real-time clock calendar (RTCC). The high-temperature automotive grade combined with the compact 28-pin QFN footprint makes it an excellent fit where PCB area is constrained but thermal robustness is mandatory.
Internally the device uses a modified Harvard architecture with a 16-bit data path and 24-bit instruction word, allowing atomic access to wide data types and single-cycle multiply, which is critical for closed-loop control loops. The 128 KB Flash supports self-programming via ICSP, enabling robust in-field firmware updates.
Typical applications include automotive body and chassis ECUs, sensor fusion nodes, industrial HVAC controllers, appliance motor control, and battery management systems (BMS) where AEC-Q100 qualification is required. Compared with the PIC24FJ equivalent, the PIC24H offers higher MIPS and stronger analog performance at the cost of slightly higher active power.
When designing with this part, ensure the exposed pad on the QFN is soldered to a sufficiently large copper pour to meet the -40C to +150C thermal rating under worst-case load. Use ICSP for production programming and reserve one of the PGECx/PGEDx pairs for in-circuit debug access without disturbing the application code.
This page synthesizes distributor pricing, drop-in same-family alternatives, automotive-grade selection guidance, and practical PCB thermal notes that go beyond the manufacturer datasheet.
드롭인 대체품: PIC24HJ128GP502-H/MM — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24HJ128GP502-H/MM (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Program Memory (Flash), Timers, Core Architecture, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24HJ128GP502-I/MM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
dsPIC33FJ128GP502-I/MM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
dsPIC33FJ128GP502-H/MM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24HJ128GP202-I/MM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24FJ64GA002-I/MM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24FJ64GA004-I/ML
✅ 드롭인✓ 재고 있음
$4.91 / 개
데이터시트 보기 →PIC24HJ128GP502-H/MM 최대 정격 & 전기적 특성
| Product Type | 16-bit Microcontroller (MCU) |
| Series | PIC24H |
| Core Architecture | 16-bit Modified Harvard |
| CPU Speed | 40 MIPS (80 MHz Fosc) |
| Program Memory (Flash) | 128 KB (43K x 24) |
| RAM | 8 KB |
| Auxiliary Flash (EEPROM emulation) | 16 KB (8K x 16) |
| Supply Voltage (VDD) | 3.0 V to 3.6 V (3.3 V typical) |
| 동작 온도 | -40 C to +150 C (automotive Grade 0 / -H suffix) |
| 패키지 | 28-pin QFN-S (6 x 6 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| ADC | 10-bit, up to 16 channels |
| Timers | 2 x 16-bit + 2 x 32-bit |
| Communication Interfaces | 2x UART, 2x SPI, 2x I2C |
| Automotive Qualification | AEC-Q100 Grade 0 (high-temp) |
| RoHS 상태 | Compliant |
| 핀 수 | 28 |
| ICSP Programming | Yes (PGECx/PGEDx pairs) |
PIC24HJ128GP502-H/MM 핀 구성
| 핀 1 | RA0 — Analog/digital I/O / ICSPDAT |
| 핀 2 | RA1 — Analog/digital I/O |
| 핀 3 | RA2 — Analog/digital I/O |
| 핀 4 | RA3 — Analog/digital I/O |
| 핀 5 | RA4 — Analog/digital I/O |
| 핀 6 | AVDD — Analog supply voltage |
| 핀 7 | AVSS — Analog ground |
| 핀 8 | RB0 — Digital I/O / PGED1 |
| 핀 9 | RB1 — Digital I/O / PGEC1 |
| 핀 10 | RB2 — Digital I/O |
| 핀 11 | RB3 — Digital I/O |
| 핀 12 | RB4 — Digital I/O |
| 핀 13 | RB5 — Digital I/O |
| 핀 14 | RB6 — Digital I/O / PGEC2 |
| 핀 15 | RB7 — Digital I/O / PGED2 |
| 핀 16 | RC0 — Digital I/O |
| 핀 17 | RC1 — Digital I/O |
| 핀 18 | RC2 — Digital I/O |
| 핀 19 | RC3 — Digital I/O |
| 핀 20 | RC4 — Digital I/O |
| 핀 21 | RC5 — Digital I/O |
| 핀 22 | RC6 — Digital I/O |
| 핀 23 | RC7 — Digital I/O |
| 핀 24 | RC8 — Digital I/O |
| 핀 25 | RC9 — Digital I/O |
| 핀 26 | VDD — Digital supply voltage |
| 핀 27 | VSS — Digital ground |
| 핀 28 | EP — Exposed pad (must be soldered to ground copper pour) |
일반적인 애플리케이션
PIC24HJ128GP502-H/MM 적합 용도: 6 애플리케이션s: Automotive Body and Chassis ECU, Industrial Motor Control, Battery Management System (BMS) Slave Module, Sensor Fusion Node, Appliance Control Board, Industrial HVAC Controller.
Automotive Body and Chassis ECU
The PIC24HJ128GP502-H/MM is well suited for automotive body and chassis ECUs thanks to its AEC-Q100 Grade 0 (-40C to +150C) qualification, 40 MIPS performance, and 128 KB Flash. Its 10-bit 16-channel ADC and PWM module let one sensor body ECU handle multiple analog sensors and H-bridge drivers simultaneously. Compared with consumer-grade PIC24H variants, the -H temperature grade ensures operation in under-hood and cabin-sunload conditions without derating, while the 28-pin QFN-S footprint keeps PCB area small for distributed module placement.
추천
Industrial Motor Control
Industrial motor control loops benefit from the PIC24HJ128GP502-H/MM's 40 MIPS throughput, two 16-bit and two 32-bit timers, and configurable PWM module that can drive three-phase or single-phase inverter topologies. The 16-channel 10-bit ADC handles multiple shunt-current and back-EMF sensing channels per PWM cycle, while the AEC-Q100 qualification provides headroom for industrial-cabinet thermal stress. The exposed pad on the QFN-S package simplifies thermal layout in fan-less IPM housings.
추천
Battery Management System (BMS) Slave Module
In a distributed battery management system the PIC24HJ128GP502-H/MM acts as a cell-monitoring slave, sampling each cell voltage through its 10-bit ADC and reporting over SPI or UART to a master controller. Its 128 KB Flash stores calibration tables and state-of-charge algorithms locally, while the AEC-Q100 Grade 0 rating supports operation adjacent to battery packs that can exceed 60C ambient. The 28-pin QFN-S footprint keeps each slave module small enough to fit between cells in a 18650 or prismatic pack layout.
추천
Sensor Fusion Node
Sensor fusion nodes in IoT and industrial gateways benefit from the PIC24HJ128GP502-H/MM's combination of I2C, SPI, and UART interfaces - enough to connect several digital sensors and a wireless modem concurrently. The 40 MIPS core handles on-board filtering and threshold logic without offloading to a cloud. The -40C to +150C automotive grade means the same firmware and hardware can be reused in outdoor and factory-floor deployments.
추천
Appliance Control Board
White-goods control boards (washing machines, dishwashers, induction cooktops) often demand AEC-Q100 Grade 0 thermal headroom and high reliability - exactly what the PIC24HJ128GP502-H/MM provides. The 16-channel ADC drives user-interface potentiometers, NTC sensors, and motor current shunts, while the two UART channels support diagnostic modem links. The 28-pin QFN-S exposed pad simplifies thermal dissipation in sealed appliance enclosures.
추천
Industrial HVAC Controller
Industrial HVAC controllers can use the PIC24HJ128GP502-H/MM to drive variable-speed fan and compressor stages via its PWM module, monitor refrigerant pressure and temperature through the 16-channel ADC, and communicate over UART to a building-management system. The 128 KB Flash stores seasonal control algorithms, while the AEC-Q100 Grade 0 thermal rating handles rooftop unit exposure to direct sun. The 28-pin QFN-S package fits within the controller's compact EMC-shielded housing.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24HJ128GP502-H/MM — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24HJ128GP502-I/MM | dsPIC33FJ128GP502-I/MM | dsPIC33FJ128GP502-H/MM | PIC24HJ128GP202-I/MM | PIC24FJ64GA002-I/MM | PIC24FJ64GA004-I/ML |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| CPU Speed | 40 MIPS | 40 MIPS | 40 MIPS (with DSP) | 40 MIPS (with DSP) | 40 MIPS | 16 MIPS | 16 MIPS |
| Program Memory (Flash) | 128 KB | 128 KB | 128 KB | 128 KB | 64 KB | 64 KB | 64 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Operating Temperature | -40 C to +150 C (AEC-Q100 Grade 0) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +150 C (AEC-Q100 Grade 0) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) |
| DSP Engine | No | No | Yes | Yes | No | No | No |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| ADC | 10-bit, 16 channels | 10-bit, 16 channels | 10-bit, 16 channels | 10-bit, 16 channels | 10-bit, 12 channels | 10-bit, 10 channels | 10-bit, 13 channels |
| Approx. Unit Price (qty 100) | $5.42 | Lower (no AEC-Q100) | Higher (DSP engine) | Higher (DSP + AEC-Q100) | Lower (smaller Flash) | Lower (smaller Flash, lower MIPS) | Lower (smaller Flash, lower MIPS) |
주요 차별점
- Automotive Grade 0 qualification in the same 28-QFN-S package (vs PIC24HJ128GP502-I/MM)
- DSP engine available as drop-in upgrade (vs dsPIC33FJ128GP502-H/MM)
- Full 128 KB Flash at automotive Grade 0 (vs PIC24HJ128GP202-H/MM)
설계 노트
Estimated: at 40 MIPS continuous CPU activity and 3.3 V supply, the typical active core current is roughly 30 mA, dissipating about 0.1 W inside the die. With the QFN-S 28-mm^2 exposed pad soldered to a 1-square-inch copper pour on a standard 4-layer PCB, theta_JA is approximately 35 C/W, giving a 3.5 C rise above ambient - easily within the +150 C automotive limit. Without the exposed pad soldered, theta_JA can exceed 80 C/W, which may push junction temperature above the maximum in sealed enclosures; always verify the pad is soldered.
Route the analog AVSS/AVDD pair with a separate analog ground island and stitch it to digital VSS at a single point near the MCU to prevent ADC reference noise from switching digital returns. Place a 100 nF decoupling capacitor within 3 mm of each VDD/AVDD pin and a bulk 4.7 uF tantalum or ceramic near the exposed pad. Keep ADC traces short and away from PWM and UART lines; route clock and PWM on inner layers to reduce radiated EMI into the analog front end.
PIC24H ICSP programming requires a complete PGECx/PGEDx pair (for example PGEC1/PGED1, PGEC2/PGED2, or PGEC3/PGED3); you cannot mix pins from different pairs. Leaving unused PGECx/PGEDx pins floating on a populated board can cause random debug-entry events in noisy environments - tie them to defined logic levels via the internal weak pull-ups or external 10 kohm resistors. Do not exceed 3.6 V on any I/O pin during automotive transient testing or the ESD clamp diodes will inject substrate current that can corrupt ADC conversions.
Estimated: enabling all peripherals (ADC, both UARTs, both SPIs, both I2Cs, RTCC, PWM) at 40 MIPS can raise active current to about 70 mA, while deep-sleep with RTCC retains state at roughly 30 uA. Use Sleep mode aggressively between sensor-sampling bursts to extend battery life in BMS slave modules - typical duty cycles of 1 percent bring average current below 1 mA from a 3.3 V supply.
규정 준수 정보
AEC-Q100 Grade 0 automotive qualified per the -H suffix and Hotenda listing. RoHS and lead-free compliant per standard Microchip practice for this family.
