PIC32MX150F256LT-V/GJX - 50MHz 32-bit MCU 256KB Flash TFBGA-100 | Microchip
부품 번호: PIC32MX150F256LT-V/GJX ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.58 | $75.80 |
| 100 | $6.74 | $674.00 |
| 500 | $6.05 | $3,025.00 |
| 1,000 | $5.39 | $5,390.00 |
PIC32MX150F256LT-V/GJX 개요
Background: A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), data memory (SRAM), and peripherals. Within the broader taxonomy, this part is a 32-bit MCU -> MIPS-based microcontroller -> PIC32 family -> PIC32MX sub-family -> automotive-grade general-purpose MCU. The PIC32MX150 series is positioned as the entry-level of the PIC32MX lineup, optimized for cost-sensitive applications that still require USB and graphic connectivity. Compared with PIC24F 16-bit MCUs, PIC32MX devices deliver roughly 2-3x the processing throughput per MHz and full 32-bit data path; compared with PIC32MZ, they consume less power at the cost of fewer peripherals and slower ADC.
Key features include: 50 MHz / 83 DMIPS core, 256 KB Flash (10K erase cycles), 32 KB SRAM, 4 KB EEPROM, 10-bit 1 Msps ADC with 28 channels, USB 2.0 FS OTG, two I2S, four SPI, five UART, two I2C, PMP graphics interface, CTMU, five 16-bit timers, RTCC, and Peripheral Pin Select for flexible I/O multiplexing. The 'V' suffix designates the -40C to +105C automotive temperature range.
Technical depth: The device uses a 5-stage pipeline MIPS32 M4K core with hardware multiply/divide and a prefetch cache controller that mitigates Flash wait-state penalties. The 1.5 KB instruction cache and 256-byte RAM prefetch buffer sustain near-zero-wait-state operation at 50 MHz despite the 256 KB Flash, while PMP with 16-bit addressable data bus supports direct connection to graphical TFT displays without an external controller.
Typical applications: automotive body and HVAC controllers, USB peripherals (HID, CDC, MSD), graphic TFT HMI with PMP, low-cost audio streaming via I2S codecs, capacitive touch keypads using CTMU, and industrial sensor hubs. The AEC-Q100 grade and 105C operating range make it suited to under-hood and cabin modules where consumer-grade MCUs would be inadequate.
Design consideration: layout must isolate the 50 MHz crystal traces from the analog ADC traces, and the USB D+/D- pair requires 90-ohm differential routing per USB 2.0 FS spec; USB VBUS sensing and 3.3V regulator decoupling are critical for OTG compliance. PMP data bus lines need matched lengths when driving larger TFT panels.
This page synthesizes distributor pricing, drop-in PIC32MX alternatives, and practical automotive design notes not consolidated on the manufacturer datasheet.
드롭인 대체품: PIC32MX150F256LT-V/GJX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX150F256LT-V/GJX (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, Core Architecture, Operating Temperature, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX150F256LT-I/GJX
✅ 드롭인✓ 재고 있음
$3.79 / 개
데이터시트 보기 →PIC32MX150F256HT-I/MR
✅ 드롭인✓ 재고 있음
$5.45 / 개
데이터시트 보기 →PIC32MX130F256DT-V/TL
✅ 드롭인✓ 재고 있음
$4.61 / 개
데이터시트 보기 →PIC32MX170F256L-I/GJX
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX230F256L-I/GJX
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX150F256LT-V/GJX 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M4K (32-bit RISC) |
| Maximum CPU Frequency | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Flash Program Memory | 256 KB (256K x 8) |
| SRAM Data Memory | 32 KB |
| EEPROM | 4 KB (simulated, accessed via Flash) |
| Operating Voltage | 2.3 V to 3.6 V |
| ADC | 10-bit, 1 Msps, up to 28 channels |
| USB | USB 2.0 Full-Speed OTG |
| I2S Modules | 2 |
| SPI Modules | 4 |
| UART Modules | 5 |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes, with dual read/write buffers |
| CTMU (Capacitive Touch) | Yes |
| Timers | 5 x 16-bit |
| Peripheral Pin Select (PPS) | Yes |
| 동작 온도 범위 | -40 C to +105 C (Grade V / automotive) |
| 패키지 | 100-TFBGA (7x7 mm) |
| 실장 유형 | Surface Mount (BGA) |
| AEC-Q100 Qualification | Qualified |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
PIC32MX150F256LT-V/GJX 핀 구성
| 핀 A1 | VSS — Ground reference |
| 핀 A2 | OSC1/RC13 — Primary oscillator input or GPIO |
| 핀 A3 | OSC2/RC15 — Primary oscillator output or GPIO |
| 핀 B1 | VDD — Core logic supply 2.3V to 3.6V |
| 핀 B2 | PGEC1/AN0 — Programming clock or analog input |
| 핀 B3 | PGED1/AN1 — Programming data or analog input |
| 핀 C1 | VSS — Ground reference |
| 핀 C2 | TMS/AN2 — JTAG test mode select or analog input |
| 핀 C3 | TCK/AN3 — JTAG test clock or analog input |
| 핀 D1 | VDD — Core logic supply |
| 핀 D2 | TDO/AN4 — JTAG test data out or analog input |
| 핀 D3 | TDI/AN5 — JTAG test data in or analog input |
| 핀 E1 | VSS — Ground reference |
| 핀 E2 | USBID/RC11 — USB OTG ID pin or GPIO |
| 핀 E3 | VBUS/RG3 — USB VBUS detect or GPIO |
| 핀 F1 | VDD — Core logic supply |
| 핀 F2 | D+/RG2 — USB D+ differential data |
| 핀 F3 | D-/RG1 — USB D- differential data |
| 핀 G1 | VSS — Ground reference |
| 핀 G2 | RB0 — GPIO/PPS-mappable |
| 핀 G3 | RB1 — GPIO/PPS-mappable |
| 핀 H1 | VDD — Core logic supply |
| 핀 H2 | RB2 — GPIO/PPS-mappable |
| 핀 H3 | RB3 — GPIO/PPS-mappable |
| 핀 J1 | VSS — Ground reference |
| 핀 J2 | RB4 — GPIO/PPS-mappable |
| 핀 J3 | RB5 — GPIO/PPS-mappable |
| 핀 K1 | VDD — Core logic supply |
| 핀 K2 | RB6 — GPIO/PPS-mappable |
| 핀 K3 | RB7 — GPIO/PPS-mappable |
| 핀 L1 | VSS — Ground reference |
| 핀 L2 | RC1 — GPIO/PPS-mappable |
| 핀 L3 | RC2 — GPIO/PPS-mappable |
| 핀 M1 | VDD — Core logic supply |
| 핀 M2 | RC3 — GPIO/PPS-mappable |
| 핀 M3 | RC4 — GPIO/PPS-mappable |
| 핀 N1 | VSS — Ground reference |
| 핀 N2 | RD0 — GPIO/PMP data |
| 핀 N3 | RD1 — GPIO/PMP data |
| 핀 P1 | AVDD — Analog supply for ADC |
| 핀 P2 | AVSS — Analog ground reference |
| 핀 P3 | RD3 — GPIO/PMP data |
| 핀 R1 | VDD — Core logic supply |
| 핀 R2 | RD2 — GPIO/PMP data |
| 핀 R3 | RD4 — GPIO/PMP data |
| 핀 T1 | VSS — Ground reference |
| 핀 T2 | RD5 — GPIO/PMP data |
| 핀 T3 | RD6 — GPIO/PMP data |
| 핀 U1 | VDD — Core logic supply |
| 핀 U2 | RD7 — GPIO/PMP data |
| 핀 U3 | RE0 — GPIO/PMP control |
| 핀 V1 | VSS — Ground reference |
| 핀 V2 | RE1 — GPIO/PMP control |
| 핀 V3 | RE2 — GPIO/PMP control |
| 핀 W1 | RF0 — GPIO/PPS-mappable |
| 핀 W2 | RF1 — GPIO/PPS-mappable |
| 핀 W3 | RG6 — GPIO/PPS-mappable |
| 핀 Y1 | RF2 — GPIO/PPS-mappable |
| 핀 Y2 | RF3 — GPIO/PPS-mappable |
| 핀 Y3 | RG7 — GPIO/PPS-mappable |
| 핀 AA1 | RF4 — GPIO/PPS-mappable |
| 핀 AA2 | RF5 — GPIO/PPS-mappable |
| 핀 AA3 | RG8 — GPIO/PPS-mappable |
| 핀 AB1 | RF6 — GPIO/PPS-mappable |
| 핀 AB2 | RF7 — GPIO/PPS-mappable |
| 핀 AB3 | RG9 — GPIO/PPS-mappable |
| 핀 AC1 | RF8 — GPIO/PPS-mappable |
| 핀 AC2 | RF9 — GPIO/PPS-mappable |
| 핀 AC3 | RG10 — GPIO/PPS-mappable |
| 핀 AD1 | RF10 — GPIO/PPS-mappable |
| 핀 AD2 | RF11 — GPIO/PPS-mappable |
| 핀 AD3 | RG12 — GPIO/PPS-mappable |
| 핀 AE1 | RF12 — GPIO/PPS-mappable |
| 핀 AE2 | RF13 — GPIO/PPS-mappable |
| 핀 AE3 | RG13 — GPIO/PPS-mappable |
| 핀 AF1 | RF14 — GPIO/PPS-mappable |
| 핀 AF2 | RF15 — GPIO/PPS-mappable |
| 핀 AF3 | RG14 — GPIO/PPS-mappable |
| 핀 AH1 | RA0 — GPIO/PPS-mappable |
| 핀 AH2 | RA1 — GPIO/PPS-mappable |
| 핀 AH3 | RA2 — GPIO/PPS-mappable |
| 핀 AJ1 | RA3 — GPIO/PPS-mappable |
| 핀 AJ2 | RA4 — GPIO/PPS-mappable |
| 핀 AJ3 | RA5 — GPIO/PPS-mappable |
| 핀 AK1 | MCLR — Master clear reset (active-low) |
| 핀 AK2 | RA6 — GPIO/PPS-mappable |
| 핀 AK3 | RA7 — GPIO/PPS-mappable |
| 핀 AL1 | VREF+/AN6 — ADC voltage reference positive or analog input |
| 핀 AL2 | VREF-/AN7 — ADC voltage reference negative or analog input |
| 핀 AL3 | AN8/RB8 — Analog input 8 or GPIO |
| 핀 AM1 | AN9/RB9 — Analog input 9 or GPIO |
| 핀 AM2 | AN10/RB10 — Analog input 10 or GPIO |
| 핀 AM3 | AN11/RB11 — Analog input 11 or GPIO |
일반적인 애플리케이션
PIC32MX150F256LT-V/GJX 적합 용도: 7 애플리케이션s: Automotive Body Control Module, USB HID / CDC / MSD Peripheral, Graphical TFT HMI with PMP, Capacitive Touch Keypad, Audio Streaming via I2S Codec, Industrial Sensor Hub, HVAC Climate Control Module.
Automotive Body Control Module
The PIC32MX150F256LT-V/GJX's AEC-Q100 qualification and -40C to +105C operating range make it a strong fit for automotive body controllers managing lighting, wipers, and door modules. Its 256 KB Flash accommodates CAN/LIN/J1939 stack plus body-control firmware with comfortable margin for future feature additions. The 50 MHz MIPS32 M4K core executes control loops at well under 1 ms latency, while USB 2.0 FS OTG enables diagnostic firmware updates via service tools. Five UARTs handle LIN bus masters, four SPI ports connect motor drivers, and the CTMU supports capacitive touch door handles.
추천
USB HID / CDC / MSD Peripheral
The on-chip USB 2.0 Full-Speed OTG controller eliminates the need for an external USB interface chip, reducing BOM cost by approximately 0.50 USD. The 50 MHz MIPS32 M4K core sustains full-speed USB throughput at 12 Mbps without CPU loading concerns, while 32 KB SRAM accommodates HID report buffers plus CDC/MSD class drivers. The Peripheral Pin Select remaps USB D+/D- to alternate GPIOs for layout flexibility. Designers implement USB stacks via Microchip's free MLA USB framework.
추천
Graphical TFT HMI with PMP
The Parallel Master Port (PMP) with dual read/write buffers enables direct connection to small/medium TFT displays without an external graphics controller, saving approximately 1-2 USD in BOM. The 8/16-bit PMP interface delivers up to 50 MHz pixel throughput, sufficient for 320x240 QVGA panels at 30 fps refresh. Combined with two I2S ports, the MCU can drive TFT HMI plus audio simultaneously in kiosks or appliance touch panels.
추천
Capacitive Touch Keypad
The Charge Time Measurement Unit (CTMU) enables cost-effective capacitive touch sensing without external touch controller ICs, supporting up to 28 touch channels via the 28-channel ADC mux. A typical 12-key keypad uses less than 10% CPU time for scanning, leaving the MIPS32 M4K core free for application logic, BLE stack, or display updates. The CTMU resolution is approximately 10 fF, suitable for reliable touch through 3 mm plastic overlays.
추천
Audio Streaming via I2S Codec
Two on-chip I2S modules support simultaneous codec input and output, enabling bidirectional audio streaming or dual-codec applications like headset + speaker output. With a 50 MHz system clock, the MCU can drive 48 kHz/24-bit audio at one sample per I2S frame with negligible CPU overhead. Common pairings include S/PDIF transmitter ICs for digital audio outputs.
추천
Industrial Sensor Hub
The PIC32MX150F256LT-V/GJX aggregates multiple sensor buses (UART, SPI, I2C) into a single processing node for industrial condition-monitoring systems. Five UART ports connect RS-485 modbus devices, four SPI ports interface MEMS sensors, and two I2C ports link environmental sensors. The 32 KB SRAM buffers measurement packets, while 256 KB Flash holds modbus/J1939 protocol stacks plus custom monitoring firmware. AEC-Q100 grade tolerates cabinet environments.
추천
HVAC Climate Control Module
Automotive HVAC modules benefit from the PIC32MX150F256LT-V/GJX's combination of AEC-Q100 grade, motor-control peripherals, and LCD drive via PMP. The 50 MHz core runs PID loops for blend/door/mode actuators at sub-100 us intervals, while the 10-bit ADC reads thermistor and potentiometer inputs. Two I2S ports enable audio prompts for climate warnings. Operating reliably from -40C to +105C, it handles the under-dash thermal envelope.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX150F256LT-V/GJX — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX150F256LT-I/GJX | PIC32MX150F256HT-I/MR | PIC32MX130F256DT-V/TL | PIC32MX170F256L-I/GJX | PIC32MX230F256L-I/GJX |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit - same | MIPS32 M4K 32-bit - same | MIPS32 M4K 32-bit - same | MIPS32 M4K 32-bit - same | MIPS32 M4K 32-bit - same |
| Maximum CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 256 KB | 256 KB - same | 256 KB - same | 256 KB - same | 256 KB - same | 256 KB - same |
| SRAM | 32 KB | 32 KB - same | 32 KB - same | 32 KB - same | 32 KB - same | 64 KB (+100%) |
| Operating Temperature | -40C to +105C (V/automotive) | -40C to +85C (I/industrial) | -40C to +85C (I/industrial) | -40C to +105C (V/automotive) | -40C to +85C (I/industrial) | -40C to +85C (I/industrial) |
| AEC-Q100 Qualification | Yes (Grade 1-3) | No | No | Yes (Grade 1-3) | No | No |
| USB OTG | USB 2.0 FS OTG | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same |
| Crypto Engine | No | No | No | No | Yes (AES-128/256) | No |
주요 차별점
- AEC-Q100 qualified with 105C automotive temperature range (vs PIC32MX150F256LT-I/GJX)
- 256 KB Flash in cost-optimized PIC32MX1 sub-family (vs PIC32MX230F256L-I/GJX)
- On-chip CTMU for capacitive touch without external controller (vs PIC32MX170F256L-I/GJX)
- PMP graphics controller eliminates external TFT controller (vs PIC32MX130F256DT-V/TL)
설계 노트
The 100-TFBGA 7x7 mm package requires PCB via-in-pad technology with 0.4 mm pitch BGA land pads. Per Microchip's AN446 application note, a 4-layer PCB stack-up with continuous ground plane beneath the BGA is essential for thermal dissipation and signal integrity. Use ENIG or OSP3PCB surface finish to ensure reliable BGA solder joints; HASL is not recommended for BGA. Decoupling: place a 100 nF X7R capacitor within 2 mm of every VDD/VSS ball pair, plus a bulk 4.7 uF ceramic near the AVDD pin.
Route the USB D+/D- differential pair with 90-ohm differential impedance per USB 2.0 FS specification, with maximum trace length of 50 mm and matching length within 0.15 mm. The 50 MHz crystal oscillator traces (OSC1/OSC2) must be enclosed in a ground guard ring and kept under 10 mm length to avoid EMI susceptibility. Per AN588, the JTAG signals (TMS/TCK/TDO/TDI) require 4.7 kohm pull-ups to VDD on TMS and TDI for reliable boundary-scan operation.
Estimated: at 50 MHz CPU frequency and full peripheral utilization with USB OTG active, the PIC32MX150F256LT-V/GJX dissipates approximately 60 mA at 3.3V (200 mW). The 100-TFBGA package has a theta_JA of approximately 31 C/W with proper PCB thermal vias under the center balls, so junction temperature rise is approximately 6 C above ambient. For AEC-Q100 Grade 3 (85 C ambient automotive cabin), no external heatsink is required. For Grade 1 (125 C ambient under-hood), consider thermal vias arrays of at least 16-thermal per device to maintain junction below 150 C.
The PMP data bus (PMD0-PMD7) for TFT graphics must be length-matched within 5 mm when running at the full 50 MHz peripheral clock rate to avoid display artifacts. Place series damping resistors (22-33 ohm) on each PMP signal if the TFT cable exceeds 50 mm, per Microchip AN587. The ADC analog inputs (AN0-AN15) require separate analog ground routing back to the MCU's AVSS pin to avoid digital switching noise coupling into measurement channels.
Common design pitfalls: (1) Forgetting the MCLR pull-up resistor (recommended 4.7 kohm) - the device will fail to start reliably in noisy environments; (2) Using the internal FRCDIV oscillator instead of the external crystal when USB accuracy is required - USB requires 0.25% clock accuracy, and FRCDIV is only 2% accurate; (3) Leaving the JTAG TMS pin floating during programming - this causes intermittent programming failures. Per AN868, configure unused I/O as outputs low to minimize current consumption in standby.
규정 준수 정보
AEC-Q100 qualified per Microchip product family qualification. RoHS and REACH compliant per Microchip material declaration. Lead-free and halogen-free per Microchip product page. Conflict minerals 3TG compliant per Microchip CMRT filing.