PIC32MX150F256LT-V/GJX - 50MHz 32-bit MCU 256KB Flash TFBGA-100 | Microchip
MPN: PIC32MX150F256LT-V/GJX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.58 | $75.80 |
| 100 | $6.74 | $674.00 |
| 500 | $6.05 | $3,025.00 |
| 1,000 | $5.39 | $5,390.00 |
PIC32MX150F256LT-V/GJX Overview
Background: A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (Flash), data memory (SRAM), and peripherals. Within the broader taxonomy, this part is a 32-bit MCU -> MIPS-based microcontroller -> PIC32 family -> PIC32MX sub-family -> automotive-grade general-purpose MCU. The PIC32MX150 series is positioned as the entry-level of the PIC32MX lineup, optimized for cost-sensitive applications that still require USB and graphic connectivity. Compared with PIC24F 16-bit MCUs, PIC32MX devices deliver roughly 2-3x the processing throughput per MHz and full 32-bit data path; compared with PIC32MZ, they consume less power at the cost of fewer peripherals and slower ADC.
Key features include: 50 MHz / 83 DMIPS core, 256 KB Flash (10K erase cycles), 32 KB SRAM, 4 KB EEPROM, 10-bit 1 Msps ADC with 28 channels, USB 2.0 FS OTG, two I2S, four SPI, five UART, two I2C, PMP graphics interface, CTMU, five 16-bit timers, RTCC, and Peripheral Pin Select for flexible I/O multiplexing. The 'V' suffix designates the -40C to +105C automotive temperature range.
Technical depth: The device uses a 5-stage pipeline MIPS32 M4K core with hardware multiply/divide and a prefetch cache controller that mitigates Flash wait-state penalties. The 1.5 KB instruction cache and 256-byte RAM prefetch buffer sustain near-zero-wait-state operation at 50 MHz despite the 256 KB Flash, while PMP with 16-bit addressable data bus supports direct connection to graphical TFT displays without an external controller.
Typical applications: automotive body and HVAC controllers, USB peripherals (HID, CDC, MSD), graphic TFT HMI with PMP, low-cost audio streaming via I2S codecs, capacitive touch keypads using CTMU, and industrial sensor hubs. The AEC-Q100 grade and 105C operating range make it suited to under-hood and cabin modules where consumer-grade MCUs would be inadequate.
Design consideration: layout must isolate the 50 MHz crystal traces from the analog ADC traces, and the USB D+/D- pair requires 90-ohm differential routing per USB 2.0 FS spec; USB VBUS sensing and 3.3V regulator decoupling are critical for OTG compliance. PMP data bus lines need matched lengths when driving larger TFT panels.
This page synthesizes distributor pricing, drop-in PIC32MX alternatives, and practical automotive design notes not consolidated on the manufacturer datasheet.
Drop-in alternatives for PIC32MX150F256LT-V/GJX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX150F256LT-V/GJX (same form factor and footprint) — differing in ADC, Package, Core Architecture, Operating Temperature, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX150F256LT-I/GJX
✅ Drop-In✓ In Stock
$3.79 / Unit
View Datasheet →PIC32MX150F256HT-I/MR
✅ Drop-In✓ In Stock
$5.45 / Unit
View Datasheet →PIC32MX130F256DT-V/TL
✅ Drop-In✓ In Stock
$4.61 / Unit
View Datasheet →PIC32MX170F256L-I/GJX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX230F256L-I/GJX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX150F256LT-V/GJX Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K (32-bit RISC) |
| Maximum CPU Frequency | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Flash Program Memory | 256 KB (256K x 8) |
| SRAM Data Memory | 32 KB |
| EEPROM | 4 KB (simulated, accessed via Flash) |
| Operating Voltage | 2.3 V to 3.6 V |
| ADC | 10-bit, 1 Msps, up to 28 channels |
| USB | USB 2.0 Full-Speed OTG |
| I2S Modules | 2 |
| SPI Modules | 4 |
| UART Modules | 5 |
| I2C Modules | 2 |
| Parallel Master Port (PMP) | Yes, with dual read/write buffers |
| CTMU (Capacitive Touch) | Yes |
| Timers | 5 x 16-bit |
| Peripheral Pin Select (PPS) | Yes |
| Operating Temperature Range | -40 C to +105 C (Grade V / automotive) |
| Package | 100-TFBGA (7x7 mm) |
| Mounting Type | Surface Mount (BGA) |
| AEC-Q100 Qualification | Qualified |
| RoHS Status | Compliant |
| Lead-Free | Yes |
PIC32MX150F256LT-V/GJX Pin Configuration
| Pin A1 | VSS — Ground reference |
| Pin A2 | OSC1/RC13 — Primary oscillator input or GPIO |
| Pin A3 | OSC2/RC15 — Primary oscillator output or GPIO |
| Pin B1 | VDD — Core logic supply 2.3V to 3.6V |
| Pin B2 | PGEC1/AN0 — Programming clock or analog input |
| Pin B3 | PGED1/AN1 — Programming data or analog input |
| Pin C1 | VSS — Ground reference |
| Pin C2 | TMS/AN2 — JTAG test mode select or analog input |
| Pin C3 | TCK/AN3 — JTAG test clock or analog input |
| Pin D1 | VDD — Core logic supply |
| Pin D2 | TDO/AN4 — JTAG test data out or analog input |
| Pin D3 | TDI/AN5 — JTAG test data in or analog input |
| Pin E1 | VSS — Ground reference |
| Pin E2 | USBID/RC11 — USB OTG ID pin or GPIO |
| Pin E3 | VBUS/RG3 — USB VBUS detect or GPIO |
| Pin F1 | VDD — Core logic supply |
| Pin F2 | D+/RG2 — USB D+ differential data |
| Pin F3 | D-/RG1 — USB D- differential data |
| Pin G1 | VSS — Ground reference |
| Pin G2 | RB0 — GPIO/PPS-mappable |
| Pin G3 | RB1 — GPIO/PPS-mappable |
| Pin H1 | VDD — Core logic supply |
| Pin H2 | RB2 — GPIO/PPS-mappable |
| Pin H3 | RB3 — GPIO/PPS-mappable |
| Pin J1 | VSS — Ground reference |
| Pin J2 | RB4 — GPIO/PPS-mappable |
| Pin J3 | RB5 — GPIO/PPS-mappable |
| Pin K1 | VDD — Core logic supply |
| Pin K2 | RB6 — GPIO/PPS-mappable |
| Pin K3 | RB7 — GPIO/PPS-mappable |
| Pin L1 | VSS — Ground reference |
| Pin L2 | RC1 — GPIO/PPS-mappable |
| Pin L3 | RC2 — GPIO/PPS-mappable |
| Pin M1 | VDD — Core logic supply |
| Pin M2 | RC3 — GPIO/PPS-mappable |
| Pin M3 | RC4 — GPIO/PPS-mappable |
| Pin N1 | VSS — Ground reference |
| Pin N2 | RD0 — GPIO/PMP data |
| Pin N3 | RD1 — GPIO/PMP data |
| Pin P1 | AVDD — Analog supply for ADC |
| Pin P2 | AVSS — Analog ground reference |
| Pin P3 | RD3 — GPIO/PMP data |
| Pin R1 | VDD — Core logic supply |
| Pin R2 | RD2 — GPIO/PMP data |
| Pin R3 | RD4 — GPIO/PMP data |
| Pin T1 | VSS — Ground reference |
| Pin T2 | RD5 — GPIO/PMP data |
| Pin T3 | RD6 — GPIO/PMP data |
| Pin U1 | VDD — Core logic supply |
| Pin U2 | RD7 — GPIO/PMP data |
| Pin U3 | RE0 — GPIO/PMP control |
| Pin V1 | VSS — Ground reference |
| Pin V2 | RE1 — GPIO/PMP control |
| Pin V3 | RE2 — GPIO/PMP control |
| Pin W1 | RF0 — GPIO/PPS-mappable |
| Pin W2 | RF1 — GPIO/PPS-mappable |
| Pin W3 | RG6 — GPIO/PPS-mappable |
| Pin Y1 | RF2 — GPIO/PPS-mappable |
| Pin Y2 | RF3 — GPIO/PPS-mappable |
| Pin Y3 | RG7 — GPIO/PPS-mappable |
| Pin AA1 | RF4 — GPIO/PPS-mappable |
| Pin AA2 | RF5 — GPIO/PPS-mappable |
| Pin AA3 | RG8 — GPIO/PPS-mappable |
| Pin AB1 | RF6 — GPIO/PPS-mappable |
| Pin AB2 | RF7 — GPIO/PPS-mappable |
| Pin AB3 | RG9 — GPIO/PPS-mappable |
| Pin AC1 | RF8 — GPIO/PPS-mappable |
| Pin AC2 | RF9 — GPIO/PPS-mappable |
| Pin AC3 | RG10 — GPIO/PPS-mappable |
| Pin AD1 | RF10 — GPIO/PPS-mappable |
| Pin AD2 | RF11 — GPIO/PPS-mappable |
| Pin AD3 | RG12 — GPIO/PPS-mappable |
| Pin AE1 | RF12 — GPIO/PPS-mappable |
| Pin AE2 | RF13 — GPIO/PPS-mappable |
| Pin AE3 | RG13 — GPIO/PPS-mappable |
| Pin AF1 | RF14 — GPIO/PPS-mappable |
| Pin AF2 | RF15 — GPIO/PPS-mappable |
| Pin AF3 | RG14 — GPIO/PPS-mappable |
| Pin AH1 | RA0 — GPIO/PPS-mappable |
| Pin AH2 | RA1 — GPIO/PPS-mappable |
| Pin AH3 | RA2 — GPIO/PPS-mappable |
| Pin AJ1 | RA3 — GPIO/PPS-mappable |
| Pin AJ2 | RA4 — GPIO/PPS-mappable |
| Pin AJ3 | RA5 — GPIO/PPS-mappable |
| Pin AK1 | MCLR — Master clear reset (active-low) |
| Pin AK2 | RA6 — GPIO/PPS-mappable |
| Pin AK3 | RA7 — GPIO/PPS-mappable |
| Pin AL1 | VREF+/AN6 — ADC voltage reference positive or analog input |
| Pin AL2 | VREF-/AN7 — ADC voltage reference negative or analog input |
| Pin AL3 | AN8/RB8 — Analog input 8 or GPIO |
| Pin AM1 | AN9/RB9 — Analog input 9 or GPIO |
| Pin AM2 | AN10/RB10 — Analog input 10 or GPIO |
| Pin AM3 | AN11/RB11 — Analog input 11 or GPIO |
Typical Applications
PIC32MX150F256LT-V/GJX is suitable for 7 applications: Automotive Body Control Module, USB HID / CDC / MSD Peripheral, Graphical TFT HMI with PMP, Capacitive Touch Keypad, Audio Streaming via I2S Codec, Industrial Sensor Hub, HVAC Climate Control Module.
Automotive Body Control Module
The PIC32MX150F256LT-V/GJX's AEC-Q100 qualification and -40C to +105C operating range make it a strong fit for automotive body controllers managing lighting, wipers, and door modules. Its 256 KB Flash accommodates CAN/LIN/J1939 stack plus body-control firmware with comfortable margin for future feature additions. The 50 MHz MIPS32 M4K core executes control loops at well under 1 ms latency, while USB 2.0 FS OTG enables diagnostic firmware updates via service tools. Five UARTs handle LIN bus masters, four SPI ports connect motor drivers, and the CTMU supports capacitive touch door handles.
Recommended
USB HID / CDC / MSD Peripheral
The on-chip USB 2.0 Full-Speed OTG controller eliminates the need for an external USB interface chip, reducing BOM cost by approximately 0.50 USD. The 50 MHz MIPS32 M4K core sustains full-speed USB throughput at 12 Mbps without CPU loading concerns, while 32 KB SRAM accommodates HID report buffers plus CDC/MSD class drivers. The Peripheral Pin Select remaps USB D+/D- to alternate GPIOs for layout flexibility. Designers implement USB stacks via Microchip's free MLA USB framework.
Recommended
Graphical TFT HMI with PMP
The Parallel Master Port (PMP) with dual read/write buffers enables direct connection to small/medium TFT displays without an external graphics controller, saving approximately 1-2 USD in BOM. The 8/16-bit PMP interface delivers up to 50 MHz pixel throughput, sufficient for 320x240 QVGA panels at 30 fps refresh. Combined with two I2S ports, the MCU can drive TFT HMI plus audio simultaneously in kiosks or appliance touch panels.
Recommended
Capacitive Touch Keypad
The Charge Time Measurement Unit (CTMU) enables cost-effective capacitive touch sensing without external touch controller ICs, supporting up to 28 touch channels via the 28-channel ADC mux. A typical 12-key keypad uses less than 10% CPU time for scanning, leaving the MIPS32 M4K core free for application logic, BLE stack, or display updates. The CTMU resolution is approximately 10 fF, suitable for reliable touch through 3 mm plastic overlays.
Recommended
Audio Streaming via I2S Codec
Two on-chip I2S modules support simultaneous codec input and output, enabling bidirectional audio streaming or dual-codec applications like headset + speaker output. With a 50 MHz system clock, the MCU can drive 48 kHz/24-bit audio at one sample per I2S frame with negligible CPU overhead. Common pairings include S/PDIF transmitter ICs for digital audio outputs.
Recommended
Industrial Sensor Hub
The PIC32MX150F256LT-V/GJX aggregates multiple sensor buses (UART, SPI, I2C) into a single processing node for industrial condition-monitoring systems. Five UART ports connect RS-485 modbus devices, four SPI ports interface MEMS sensors, and two I2C ports link environmental sensors. The 32 KB SRAM buffers measurement packets, while 256 KB Flash holds modbus/J1939 protocol stacks plus custom monitoring firmware. AEC-Q100 grade tolerates cabinet environments.
Recommended
HVAC Climate Control Module
Automotive HVAC modules benefit from the PIC32MX150F256LT-V/GJX's combination of AEC-Q100 grade, motor-control peripherals, and LCD drive via PMP. The 50 MHz core runs PID loops for blend/door/mode actuators at sub-100 us intervals, while the 10-bit ADC reads thermistor and potentiometer inputs. Two I2S ports enable audio prompts for climate warnings. Operating reliably from -40C to +105C, it handles the under-dash thermal envelope.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX150F256LT-V/GJX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX150F256LT-I/GJX | PIC32MX150F256HT-I/MR | PIC32MX130F256DT-V/TL | PIC32MX170F256L-I/GJX | PIC32MX230F256L-I/GJX |
|---|---|---|---|---|---|---|
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit - same | MIPS32 M4K 32-bit - same | MIPS32 M4K 32-bit - same | MIPS32 M4K 32-bit - same | MIPS32 M4K 32-bit - same |
| Maximum CPU Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Flash Memory | 256 KB | 256 KB - same | 256 KB - same | 256 KB - same | 256 KB - same | 256 KB - same |
| SRAM | 32 KB | 32 KB - same | 32 KB - same | 32 KB - same | 32 KB - same | 64 KB (+100%) |
| Operating Temperature | -40C to +105C (V/automotive) | -40C to +85C (I/industrial) | -40C to +85C (I/industrial) | -40C to +105C (V/automotive) | -40C to +85C (I/industrial) | -40C to +85C (I/industrial) |
| AEC-Q100 Qualification | Yes (Grade 1-3) | No | No | Yes (Grade 1-3) | No | No |
| USB OTG | USB 2.0 FS OTG | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same | USB 2.0 FS OTG - same |
| Crypto Engine | No | No | No | No | Yes (AES-128/256) | No |
Key Differentiators
- AEC-Q100 qualified with 105C automotive temperature range (vs PIC32MX150F256LT-I/GJX)
- 256 KB Flash in cost-optimized PIC32MX1 sub-family (vs PIC32MX230F256L-I/GJX)
- On-chip CTMU for capacitive touch without external controller (vs PIC32MX170F256L-I/GJX)
- PMP graphics controller eliminates external TFT controller (vs PIC32MX130F256DT-V/TL)
Design Notes
The 100-TFBGA 7x7 mm package requires PCB via-in-pad technology with 0.4 mm pitch BGA land pads. Per Microchip's AN446 application note, a 4-layer PCB stack-up with continuous ground plane beneath the BGA is essential for thermal dissipation and signal integrity. Use ENIG or OSP3PCB surface finish to ensure reliable BGA solder joints; HASL is not recommended for BGA. Decoupling: place a 100 nF X7R capacitor within 2 mm of every VDD/VSS ball pair, plus a bulk 4.7 uF ceramic near the AVDD pin.
Route the USB D+/D- differential pair with 90-ohm differential impedance per USB 2.0 FS specification, with maximum trace length of 50 mm and matching length within 0.15 mm. The 50 MHz crystal oscillator traces (OSC1/OSC2) must be enclosed in a ground guard ring and kept under 10 mm length to avoid EMI susceptibility. Per AN588, the JTAG signals (TMS/TCK/TDO/TDI) require 4.7 kohm pull-ups to VDD on TMS and TDI for reliable boundary-scan operation.
Estimated: at 50 MHz CPU frequency and full peripheral utilization with USB OTG active, the PIC32MX150F256LT-V/GJX dissipates approximately 60 mA at 3.3V (200 mW). The 100-TFBGA package has a theta_JA of approximately 31 C/W with proper PCB thermal vias under the center balls, so junction temperature rise is approximately 6 C above ambient. For AEC-Q100 Grade 3 (85 C ambient automotive cabin), no external heatsink is required. For Grade 1 (125 C ambient under-hood), consider thermal vias arrays of at least 16-thermal per device to maintain junction below 150 C.
The PMP data bus (PMD0-PMD7) for TFT graphics must be length-matched within 5 mm when running at the full 50 MHz peripheral clock rate to avoid display artifacts. Place series damping resistors (22-33 ohm) on each PMP signal if the TFT cable exceeds 50 mm, per Microchip AN587. The ADC analog inputs (AN0-AN15) require separate analog ground routing back to the MCU's AVSS pin to avoid digital switching noise coupling into measurement channels.
Common design pitfalls: (1) Forgetting the MCLR pull-up resistor (recommended 4.7 kohm) - the device will fail to start reliably in noisy environments; (2) Using the internal FRCDIV oscillator instead of the external crystal when USB accuracy is required - USB requires 0.25% clock accuracy, and FRCDIV is only 2% accurate; (3) Leaving the JTAG TMS pin floating during programming - this causes intermittent programming failures. Per AN868, configure unused I/O as outputs low to minimize current consumption in standby.
Compliance Information
AEC-Q100 qualified per Microchip product family qualification. RoHS and REACH compliant per Microchip material declaration. Lead-free and halogen-free per Microchip product page. Conflict minerals 3TG compliant per Microchip CMRT filing.