PIC32MX575F512L-80I/BG - 80MHz 32-bit MCU, 512KB Flash, USB/CAN | Microchip
부품 번호: PIC32MX575F512L-80I/BG ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.25 | $9.25 |
| 10 | $8.62 | $86.20 |
| 100 | $7.79 | $779.00 |
| 500 | $6.95 | $3,475.00 |
| 1,000 | $6.42 | $6,420.00 |
| 3,000 | $5.88 | $17,640.00 |
PIC32MX575F512L-80I/BG 개요
What is a PIC32MX microcontroller? PIC32MX is Microchip's MIPS32 M4K-core 32-bit MCU family that bridges 8-bit PIC and 32-bit ARM-class performance for USB, CAN, and Ethernet connectivity. Within the power management IC hierarchy it sits as a general-purpose microcontroller -> 32-bit MCU -> MCU. The M4K core delivers 1.53 DMIPS/MHz with hardware multiply/divide and a single-cycle shadow register set for fast interrupt response.
Key features include 512 KB Flash, 64 KB RAM, 80 MHz / 105 DMIPS performance, integrated USB-OTG PHY, CAN 2.0b, 10-bit 1 Msps ADC up to 16 channels, and rich serial peripherals (UART, SPI, I2S, I2C). The chip also supports PMP/PSP parallel interfaces for external graphics or memory. AES and Cryptographic accelerators are absent on this specific MPN (those appear on PIC32MX5XX/6XX/7XX higher-tier variants). The 121-pin TFBGA package suits high-density designs needing >53 I/O lines.
Technical depth: 5-stage pipeline + Harvard architecture + 16-bit MIPS16e instructions = high code density at 32-bit throughput. Dedicated DMA offloads USB and CAN traffic from the CPU, leaving the M4K core free for application code and signal processing.
Typical applications include industrial USB peripherals (HID, CDC, mass storage), CAN-based automotive body controllers, Ethernet-enabled embedded web servers (using external MAC+PHY), medical instrument data loggers, and multi-motor industrial automation. The wide peripheral mix reduces BOM cost versus discrete MCU + USB transceiver designs.
Design consideration: place four decoupling capacitors (100 nF + 1 uF) within 5 mm of each power pin pair, keep the 12 MHz crystal traces short, and route the USB DP/DM differential pair with 90 ohm differential impedance. Ensure the TFBGA's center pad is soldered to a 5 x 5 mm ground plane for thermal relief.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on standalone Microchip product pages or datasheet PDFs.
드롭인 대체품: PIC32MX575F512L-80I/BG — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX575F512L-80I/BG (동일 폼 팩터 및 풋프린트) — 차이점: USB, Package, ADC, CAN, DMA Channels.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX575F512LT-80I/BG
✅ 드롭인✓ 재고 있음
$6.25 / 개
데이터시트 보기 →PIC32MX575F512L-80V/BG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX575F512L-I/BG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MX575F512L-80I/BG
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.88 / 개
데이터시트 보기 →PIC32MX575F256L-80I/BG
✅ 드롭인✓ 재고 있음
$6.12 / 개
데이터시트 보기 →PIC32MX575F256LT-80I/BG
✅ 드롭인✓ 재고 있음
$5.95 / 개
데이터시트 보기 →PIC32MX575F512L-80I/BG 최대 정격 & 전기적 특성
| Core | MIPS32 M4K 32-bit |
| Maximum CPU Speed | 80 MHz (105 DMIPS) |
| Program Memory (Flash) | 512 KB (512K x 8) |
| Data Memory (SRAM) | 64 KB |
| Supply Voltage (VDD) | 2.5 V to 3.6 V |
| I/O Pins | 53 |
| 패키지 | 121-pin TFBGA (10x10 mm) |
| 동작 온도 | -40C to +85C (Industrial, -I suffix) |
| USB | USB 2.0 OTG with integrated PHY |
| CAN | 1 x CAN 2.0b |
| DMA Channels | 4 (dedicated for USB) |
| ADC | 10-bit, 1 Msps, up to 16 channels |
| Instruction Set Features | MIPS16e code compression (up to 40% smaller code) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| Lead-Free / RoHS | Yes (Lead-free) |
PIC32MX575F512L-80I/BG 121-pin tfbga (10x10 mm) 핀 구성 가이드
PIC32MX575F512L-80I/BG(121-pin tfbga (10x10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MX575F512L-80I/BG.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MX575F512L-80I/BG 적합 용도: 6 애플리케이션s: Industrial USB HID / CDC Peripherals, CAN-Based Automotive Body Controllers, Embedded Web Servers with Ethernet, Medical Data Loggers / Patient Monitoring, Industrial Multi-Motor Control, Smart Home Sensor Hubs.
Industrial USB HID / CDC Peripherals
The PIC32MX575F512L-80I/BG is ideally suited for industrial USB peripherals thanks to its integrated USB 2.0 OTG PHY (eliminates an external transceiver), 80 MHz CPU, and 64 KB SRAM for HID/CDC class stacks. The integrated 4-channel USB DMA moves packets at full-speed (12 Mbps) and high-speed (480 Mbps, with external PHY) without CPU intervention. With 512 KB Flash it stores full USB class firmware plus application logic. Place the chip at the device end of a USB-B or USB-C connector, route DP/DM as a 90 ohm differential pair, and use Microchip's MPLAB Harmony framework for HID/CDC/MSD composite stacks. Compared with a discrete MCU + external ULPI PHY design, the integrated PHY cuts BOM cost by ~$1.50 per board.
추천
CAN-Based Automotive Body Controllers
The PIC32MX575F512L-80I/BG is well matched to CAN-based automotive body controllers with its integrated CAN 2.0b module (1 Mbit/s), 80 MHz CPU for SAE J1939 / CANopen stack parsing, and 53 GPIO for driving LEDs, relays, and switches. The CAN module includes 1024 transmit/receive message buffers, reducing host CPU overhead. With 512 KB Flash it fits full UDS diagnostic services plus bootloader; 64 KB is adequate for typical body-controller logic. Place the chip between the CAN bus transceiver (e.g. MCP2551) and the I/O expansion logic. Compared to a discrete MCU + external CAN controller solution, the integrated CAN module cuts board area by ~30% and BOM cost by ~$0.80.
추천
Embedded Web Servers with Ethernet
The PIC32MX575F512L-80I/BG can run an embedded HTTP/MQTT web-server stack (Microchip's TCP/IP Lite or Harmony Net) at 80 MHz with adequate headroom for typical REST APIs. The MCU lacks an integrated Ethernet MAC/PHY, so designers pair it with an external MAC+PHY such as the LAN8742A or ENC28J60 over SPI/parallel PMP. With 512 KB Flash it accommodates the full TCP/IP stack plus a small web UI; 64 KB SRAM handles 4-8 concurrent TCP sockets. Route the SPI/QSPI bus between the MCU and PHY under 50 mm with 50 ohm series termination. Compared to a single-chip Ethernet MCU solution, this 2-chip approach trades board area for $3-5 BOM savings at low volumes.
추천
Medical Data Loggers / Patient Monitoring
The PIC32MX575F512L-80I/BG fits medical data-logger designs with its 10-bit 1 Msps ADC (16 channels), 64 KB SRAM for sample buffering, and 512 KB Flash for storing several days of compressed waveform data. The 53 GPIO can interface directly with ECG/EEG analog front ends. Pair it with the MCP3550 22-bit delta-sigma ADC for higher accuracy applications. The integrated USB-OTG enables fast data offload to a PC host. Compared to a discrete ADC + MCU design, the integrated 10-bit ADC and 53 GPIO eliminate the need for a multiplexer on small-channel-count devices, reducing BOM cost by ~$2 per board.
추천
Industrial Multi-Motor Control
The PIC32MX575F512L-80I/BG can coordinate 4-8 axes of stepper or BLDC motor control when paired with external gate drivers such as the DRV8711 or MCP8024. At 80 MHz / 105 DMIPS it handles trapezoidal and basic FOC commutation algorithms for sub-1 kHz PWM loops; the 53 GPIO provides 8-12 PWM channels. The CAN 2.0b interface ties it into a larger CAN-based multi-motor network. With 512 KB Flash it fits several motor-control libraries plus a CANopen or Modbus slave stack. Compared to a dedicated motor-control MCU, the general-purpose PIC32MX575 trades DSP performance for greater peripheral flexibility and ~$2 BOM savings.
추천
Smart Home Sensor Hubs
The PIC32MX575F512L-80I/BG is suitable for smart-home sensor-hub designs that aggregate Zigbee/Thread/Z-Wave data over UART/SPI and publish it via Wi-Fi or Ethernet. At 80 MHz it parses incoming sensor frames, runs a JSON serialization layer, and forwards packets to the cloud; 512 KB Flash holds firmware for 3-4 wireless stacks plus a small TLS client. 53 GPIO interfaces directly to multiple sensors. Compared to a low-end Cortex-M0+ MCU, the PIC32MX575 trades power consumption (~70 mA active vs ~15 mA) for 4-5x CPU throughput, making it a better fit for multi-protocol hubs.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX575F512L-80I/BG — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX575F512LT-80I/BG | PIC32MX575F512L-80V/BG | PIC32MX575F512L-I/BG | PIC32MX575F256L-80I/BG | PIC32MX575F256LT-80I/BG |
|---|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 256 KB (-50%) |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| CPU Speed | 80 MHz (105 DMIPS) | 80 MHz (105 DMIPS) | 80 MHz (105 DMIPS) | 80 MHz nominal | 80 MHz (105 DMIPS) | 80 MHz (105 DMIPS) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +105C (Extended, +20C upper limit) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| USB OTG PHY | Integrated | Integrated | Integrated | Integrated | Integrated | Integrated |
| CAN 2.0b | 1 module | 1 module | 1 module | 1 module | 1 module | 1 module |
| GPIO Count | 53 | 53 | 53 | 53 | 53 | 53 |
주요 차별점
- Highest-density Flash variant in TFBGA-121 of the 575 family (vs PIC32MX575F256L-80I/BG)
- Only variant with full industrial 80 MHz grade in TFBGA-121 (vs PIC32MX575F512L-80I/PT)
- Integrated USB-OTG PHY eliminates external transceiver (vs PIC32MX460F512L-80I/BG (older 460 family))
설계 노트
Estimated: VDD average current for the PIC32MX575F512L-80I/BG at 80 MHz core clock is approximately 65 mA (per Microchip family datasheet typical DC characteristics, 25C, 3.3V). At maximum CPU activity + USB traffic it can spike to ~75 mA transient. Place one 100 nF + one 1 uF low-ESR ceramic decoupling capacitor within 5 mm of each AVDD/VDD pin pair. Use a dedicated ferrite bead to isolate analog AVDD from digital VDD if the 10-bit ADC noise floor is critical. Avoid switching the core clock to 80 MHz on a noisy rail; use the on-chip PLL with a clean 8 MHz crystal reference.
Estimated: theta_JA for the 121-ball TFBGA (10x10 mm) on a 4-layer JEDEC test board is approximately 28 C/W. At 75 mA active + 3.3V core, internal power dissipation is about 0.25 W, leading to a self-heating rise of ~7 C above ambient. Solder the central ground/thermal balls to a 5x5 mm copper plane on the top PCB layer, plus a via array to the internal ground plane, to keep junction temperature rise below 10 C. For industrial -40C to +85C operation this thermal envelope is well within Microchip's recommended limits.
Route the USB DP/DM pair as a 90 ohm differential with matched trace lengths (<2 mm mismatch) and continuous reference ground beneath. Keep crystal traces short (<5 mm) and shield them with ground traces on both sides. Place the 8 MHz primary crystal within 5 mm of the OSC1/OSC2 pins, with load capacitors sized for the crystal's CL spec (typically 18 pF). Do not route RF or high-current switching signals across the analog PLL loop filter components - keep the loop filter area small (<10 mm^2) and surrounded by ground.
Do not exceed 3.6 V on any VDD/AVDD pin or 5 V on any 5V-tolerant digital I/O. Failing to configure the JTAGEN/PRG bit disables boundary-scan debug access - leave it enabled during development. The Flash endurance spec is 1k cycles per block minimum; for high-write-frequency applications use the external EEPROM MCP24LC256 over I2C. The USB-OTG bus-powered mode needs a soft-start circuit on VBUS to limit inrush current below 50 uF of bus capacitance. Always configure the PMA (Parallel Master Port) bus to high-impedance if unused.
규정 준수 정보
Lead-free per /BG suffix; RoHS compliant per Microchip environmental documentation. For automotive AEC-Q100 qualified lots contact Microchip directly.
