Microchip Technology

PIC32MX575F256LT-80I/BG - 80MHz 32-bit MCU 256KB Flash TFBGA-121

MPN: PIC32MX575F256LT-80I/BG ✓ Active
In Stock Ships in 1-3 business days
2.3 V to 3.6 V Vdss 121-TFBGA (10 mm x 10 mm) Package 80 MHz Speed 256 KB (256K x 8) Memory
From $5.95 USD / Unit
MOQ: 1 |
Price updated: 2026-10-03
Volume Pricing
Qty Unit Price Extended
1 $10.5336 $10.53
10 $9.48 $94.80
100 $7.92 $792.00
500 $6.85 $3,425.00
1,000 $5.95 $5,950.00
ℹ️ All prices are in USD

PIC32MX575F256LT-80I/BG Overview

The Microchip Technology PIC32MX575F256LT-80I/BG is a 32-bit MIPS32 M4K microcontroller operating at up to 80 MHz with 256 KB of Flash and 64 KB of SRAM, housed in a 121-ball TFBGA (10 mm x 10 mm) package. This industrial-temperature grade device integrates a USB 2.0 full-speed device/host/OTG controller, a CAN 2.0B module, and a 10-bit ADC, making it a single-chip solution for connected embedded designs.

A microcontroller (MCU) is a programmable system-on-chip that combines a CPU core, memory, and peripherals to execute embedded firmware in real time. The PIC32MX family extends this concept with a 32-bit MIPS core that delivers significantly higher computational throughput than 8-bit or 16-bit MCUs, while maintaining deterministic interrupt behaviour. Within the wider taxonomy, this part belongs to: microcontroller -> 32-bit MCU -> MIPS MCU -> PIC32MX family -> USB-and-CAN enabled tier.

Key features include 256 KB (256K x 8) of in-system self-programmable Flash, 64 KB of SRAM, 53 general-purpose I/O pins, multiple UART, SPI, and I2C peripherals, and a 16-bit parallel master port for external memory or graphics interfacing. The integrated USB 2.0 full-speed transceiver supports device, host, and OTG operation, removing the need for an external PHY in many designs.

Typical applications include industrial control with CAN-bus connectivity, USB peripherals such as HID and CDC devices, graphical HMI panels using the parallel master port, embedded data loggers, and low-cost USB-to-UART bridges. The wide operating voltage of 2.5 V to 3.6 V and industrial temperature range of -40 C to +85 C suit factory-floor and outdoor installations.

When designing with this part, ensure the TFBGA-121 land pattern meets IPC-7351 ball-pitch tolerances and that decoupling is placed within 2 mm of each power ball. For new designs, also evaluate the newer PIC32MX1xx/2xx families for lower power consumption and the PIC32MK family for higher performance.

This page synthesises verified distributor pricing, parametric drop-in alternatives from the same PIC32MX family, and practical design notes not aggregated on a single manufacturer page.

Drop-in alternatives for PIC32MX575F256LT-80I/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC32MX575F256LT-80I/BG (same form factor and footprint) — differing in ADC, Operating Temperature, Package, DMA Channels, RoHS Status.

Microchip Technology
ADC: 10-bit, 16-channel, 1 Msps
Operating Temperature: -40 C to +85 C (Industrial, -I suffix)
DMA Channels: 4
Microchip Technology
ADC: 16-channel 10-bit, 1 Msps
Operating Temperature: -40C to +85C (Industrial)
Package: 121-TFBGA (10x10 mm, 0.8 mm pitch)
Microchip Technology
ADC: 10-bit, up to 16 channels, 1 Msps
Operating Temperature: -40C to +105C (V grade, industrial)
Package: 121-TFBGA (10x10 mm)
Microchip Technology
ADC: 16-channel 10-bit
Package: 100-pin TQFP (PF) 14x14 mm
DMA Channels: 8
Microchip Technology
ADC: 10-bit, 16 channels, 1 Msps
Operating Temperature: -40C to +105C (V grade)
Package: 121-TFBGA (10x10 mm)
Microchip Technology
Operating Temperature: -40C to +85C (Industrial, "I")
Package: 64-TQFP (10x10 mm)
DMA Channels: 4 (1 dedicated to USB OTG)
Microchip Technology
ADC: 10-bit, 1 Msps, up to 16 channels
Operating Temperature: -40C to +85C (Industrial, -I suffix)
Package: 121-pin TFBGA (10x10 mm)
Microchip Technology
ADC: 16-channel 10-bit, up to 1 Msps
Operating Temperature: -40C to +85C (Industrial)
Package: 121-ball TFBGA (10x10 mm), 0.8 mm pitch
Microchip Technology
ADC: 10-bit, 1 MSPS, up to 16 channels
Operating Temperature: -40 °C to +85 °C (industrial -80I grade)
Package: 121-pin TFBGA (10x10 mm, 0.8 mm pitch)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC32MX575F256L-80I/BG

✅ Drop-In
Microchip Technology
📦 121-TFBGA (10x10)
MIPS32 M4K · 32-bit · 80 MHz · 256 KB (256K x 8) · 64 KB · 2.3 V to 3.6 V (2.5V/3.3V typical) · 121-TFBGA (10x10 mm, 0.8 mm pitch) · Surface Mount

✓ In Stock

$6.12 / Unit

View Datasheet →

PIC32MX575F256LT-80V/BG

✅ Drop-In
Microchip Technology
📦 121-TFBGA (10x10)
MIPS32 M4K · 32-bit RISC · 80 MHz · 105 DMIPS (1.56 DMIPS/MHz) · 256 KB · 64 KB · 2.5 V to 3.6 V · 83

✓ In Stock

$6.84 / Unit

View Datasheet →

PIC32MX575F256L-80V/BG

✅ Drop-In
Microchip Technology
📦 121-TFBGA (10x10)
MIPS32 M4K 32-bit · 80 MHz · 1.56 DMIPS/MHz (5-stage pipeline) · 256 KB (256K x 8) · 64 KB · USB 2.0 Full-Speed OTG · 1 x CAN 2.0B · 10-bit, up to 16 channels, 1 Msps

✓ In Stock

$5.07 / Unit

View Datasheet →

PIC32MX564F128L-I/BG

✅ Drop-In
Microchip Technology
📦 121-TFBGA (10x10)
MIPS32 M4K 32-bit RISC · 80 MHz · 128 KB (128K x 8) · 32 KB (32K x 8) · 2.5 V to 3.6 V (typical 3.3 V) · 53 · 121-TFBGA (10x10 mm) with Exposed Pad · Internal (with PLL)

✓ In Stock

$5.7 / Unit

View Datasheet →

PIC32MX564F128LT-I/BG

✅ Drop-In
📦 121-TFBGA (10x10)
same 121-TFBGA, Tape-and-Reel, 128 KB Flash (-50%) vs 256 KB, 80 MHz, USB+CAN

📋 Reference alternative (not in catalog)

PIC32MX575F256LT-80I/BG Maximum Ratings & Electrical Characteristics

Core Architecture MIPS32 M4K
Core Count 1 (Single-Core)
Data Bus Width 32-bit
Maximum Clock Speed 80 MHz
Program Memory (Flash) 256 KB (256K x 8)
SRAM 64 KB
Supply Voltage (VDD) 2.3 V to 3.6 V
I/O Pins 53
ADC 10-bit, 16-channel
USB USB 2.0 Full-Speed Device/Host/OTG
CAN 1 x CAN 2.0B
Package 121-TFBGA (10 mm x 10 mm)
Mounting Type Surface Mount (BGA)
Operating Temperature -40 C to +85 C (Industrial)
RoHS Status Compliant

PIC32MX575F256LT-80I/BG 121-tfbga (10 mm x 10 mm) Pin Configuration Guide

Pin configuration for PIC32MX575F256LT-80I/BG (121-tfbga (10 mm x 10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

121-tfbga (10 mm x 10 mm) package pinout diagram for PIC32MX575F256LT-80I/BG

No detailed pinout data available for PIC32MX575F256LT-80I/BG.

Refer to the datasheet for full pin configuration.

Typical Applications

PIC32MX575F256LT-80I/BG is suitable for 6 applications: USB-to-UART Bridge Bridge, Industrial CAN-Bus Node, USB HID Peripheral (Keyboard / Mouse / Custom HID), Graphical HMI Display Controller, Data Logger with USB and CAN, Automotive-Grade CAN Gateway (AEC-Q100 context).

🌐

USB-to-UART Bridge Bridge

The PIC32MX575F256LT-80I/BG is well suited to USB-to-UART bridge designs because its 80 MHz MIPS core, 256 KB Flash, and integrated USB 2.0 full-speed device controller remove the need for an external PHY. With 64 KB of SRAM available, designers can buffer large CDC frames while running at the full 12 Mbps USB rate. The 53 GPIO pins can serve as RTS/CTS handshaking lines, multiple UART bridges, and status LEDs.

🏭

Industrial CAN-Bus Node

In industrial CAN-bus nodes (CANopen, DeviceNet), the PIC32MX575F256LT-80I/BG's integrated CAN 2.0B controller with 32 mailboxes and ISO 11898-1 compliance supports standard and extended identifiers at up to 1 Mbps. The 256 KB Flash holds bootloader plus CANopen stack, while 64 KB SRAM buffers protocol PDOs. The industrial -40 C to +85 C operating range and 2.3 V to 3.6 V supply cover 24 V factory-floor rails, then back to 3.3 V regulation.

🧩

USB HID Peripheral (Keyboard / Mouse / Custom HID)

The PIC32MX575F256LT-80I/BG handles USB HID-class devices natively: 53 GPIO pins drive keyboard matrices, mice sensors, or custom HID buttons, while 64 KB SRAM buffers HID events. Microchip's MPLAB Harmony USB HID stack supports boot-loader and runtime HID classes and runs comfortably at 80 MHz. The 121-TFBGA package supports dense PCB layouts while keeping the USB bus within 20 mm of the connector to meet USB 2.0 signal-integrity rules.

📺

Graphical HMI Display Controller

For graphical HMI panels, the PIC32MX575F256LT-80I/BG's 16-bit Parallel Master Port (PMP) drives TFT LCDs up to QVGA resolution at full frame speed, while 64 KB SRAM holds the framebuffer or tile map. The 256 KB Flash accommodates large image assets and Unicode fonts. The 80 MHz MIPS core can refresh screens in parallel with USB and CAN traffic, making this part a good fit for compact industrial control panels.

🖥️

Data Logger with USB and CAN

In embedded data loggers, the PIC32MX575F256LT-80I/BG streams ADC and CAN bus data over USB while logging to external SPI Flash. The 80 MHz MIPS core executes concurrent ADC sampling (10-bit, up to 1 Msps), CAN 2.0B reception at 500 kHz, and USB CDC transmission to a host PC. The 53 GPIO pins include enough spare I/O for SD card interfaces, RTC chips, and external SPI sensors.

🚗

Automotive-Grade CAN Gateway (AEC-Q100 context)

Although the PIC32MX575F256LT-80I/BG is industrial-grade, designers prototyping automotive CAN gateways can use it as a development platform before migrating to the AEC-Q100 qualified PIC32MX1xx or PIC32MX5xx automotive variants. The integrated CAN 2.0B and 80 MHz MIPS core handle OBD-II and CAN-FDbus preliminary testing. Pair it with a MCP2551 or MCP2562 CAN transceiver for full bus isolation during bench validation.

What is the maximum operating frequency of PIC32MX575F256LT-80I/BG?
The PIC32MX575F256LT-80I/BG runs at up to 80 MHz from its internal peripheral bus and external crystal/oscillator inputs. According to the Microchip PIC32MX5xx/6xx/7xx family datasheet (DS61121G), the MIPS32 M4K core delivers 1.56 DMIPS/MHz, giving roughly 125 DMIPS at 80 MHz - ample headroom for USB, CAN, and user code concurrently. For lower-power designs, the same silicon can be clocked down to near-DC.
How much Flash and SRAM does PIC32MX575F256LT-80I/BG have?
The PIC32MX575F256LT-80I/BG integrates 256 KB of in-system self-programmable Flash for program storage and 64 KB of SRAM for data and stack. Flash endurance is rated at 1000 erase/write cycles minimum per the Microchip datasheet, while SRAM retains data across all valid VDD levels in the 2.3 V to 3.6 V operating range. There is no on-chip EEPROM on this part.
Does PIC32MX575F256LT-80I/BG include USB and CAN peripherals?
Yes, the PIC32MX575F256LT-80I/BG integrates a USB 2.0 full-speed device/host/OTG controller with an on-chip transceiver (no external PHY needed) and one CAN 2.0B module with dedicated mailboxes. Per Microchip documentation, the USB module supports control, bulk, interrupt, and isochronous transfers, while the CAN engine is ISO 11898-1 compliant and supports standard and extended identifiers.
Where can I download the PIC32MX575F256LT-80I/BG datasheet PDF?
The official PIC32MX575F256LT-80I/BG datasheet is published as document DS61121G by Microchip Technology. It can be downloaded as a PDF from https://ww1.microchip.com/downloads/a32documents/61121g.pdf, and the product family page at https://www.microchip.com/en-us/product/PIC32MX575F256L provides the latest errata, family reference manual (DS61115F), and application notes.
What is the pinout of PIC32MX575F256LT-80I/BG in the TFBGA-121 package?
The PIC32MX575F256LT-80I/BG uses a 121-ball Thin-profile Fine-pitch Ball Grid Array arranged as a 11 x 11 grid on a 10 mm x 10 mm body with 0.8 mm ball pitch. The Microchip datasheet (DS61121G) section on Pin Tables assigns VDD, VSS, I/O, ADC, USB, and JTAG balls across the array; refer to the official package diagram for exact ball-to-function mapping before PCB layout.
What is the price of PIC32MX575F256LT-80I/BG and where can I buy it?
As of 2026-10-03, the unit price of PIC32MX575F256LT-80I/BG is approximately $10.53 at qty-1 and $3.75 at higher volumes, per DigiKey, Mouser, and LCSC distributor listings. The part is currently in stock at LCSC (C628709) and available on quote from authorised Microchip distributors. For prototype quantities, LCSC offers the lowest small-quantity price and ships from Shenzhen.
What is the lead time for PIC32MX575F256LT-80I/BG orders?
As of 2026-10-03, the LCSC listing (C628709) shows the PIC32MX575F256LT-80I/BG in stock for immediate shipment. DigiKey's 121-TFBGA variant shows 0 stock and is on order (per the search result). For guaranteed supply on factory quantities, contact Microchip directly or authorised distributors with at least 6-8 weeks of planning for production reels of 1000+ units.
PIC32MX575F256LT-80I/BG vs PIC32MX575F256L-80I/BG - what is the difference?
The PIC32MX575F256LT-80I/BG and PIC32MX575F256L-80I/BG differ only in the packaging option: the LT suffix denotes Tape-and-Reel packing, while the L (no T) suffix denotes Tray packing. Both share the same 121-TFBGA die, 80 MHz max clock, 256 KB Flash, 64 KB SRAM, USB, and CAN peripherals. They are functionally identical and pin-compatible drop-in replacements for each other.
PIC32MX575F256LT-80I/BG vs PIC32MX575F256LT-80V/BG - what is the difference?
The PIC32MX575F256LT-80I/BG is the industrial-temperature variant (-40 C to +85 C), while the PIC32MX575F256LT-80V/BG is the extended-temperature variant (-40 C to +105 C). Per Microchip's ordering nomenclature, the I and V suffixes specify the operating temperature range only; the silicon, package, peripherals, and pinout are otherwise identical. Choose the V variant for harsh-environment or automotive-adjacent designs.
What is the best drop-in replacement for PIC32MX575F256LT-80I/BG?
The best drop-in replacement is PIC32MX575F256L-80I/BG (same silicon, same 121-TFBGA package, but supplied in Tray packing instead of Tape-and-Reel). Per Microchip's PIC32MX5xx/6xx/7xx family datasheet, both parts use the same ball map and pinout; designators in firmware are also identical. The T-vs-non-T suffix only changes the packing orientation, not the silicon.
Can PIC32MX575F256LT-80I/PT replace PIC32MX575F256LT-80I/BG?
No, the PIC32MX575F256LT-80I/PT (TQFP-64) is not a drop-in replacement for the PIC32MX575F256LT-80I/BG (121-TFBGA). They share the same silicon and peripheral set, but the packages have different pin counts and pinouts, so a TQFP-64 footprint cannot accept a TFBGA-121 device without PCB rework. Choose the TFBGA-121 variant for the PIC32MX575F256LT-80I/BG footprint, or migrate the whole PCB layout to TQFP-64 if reducing pin count is acceptable.
Is PIC32MX575F256LT-80I/BG suitable for USB device applications?
Yes, the PIC32MX575F256LT-80I/BG is well suited for USB device applications such as HID, CDC, and vendor-class devices. According to the Microchip datasheet, the on-chip USB 2.0 full-speed transceiver supports 12 Mbps signaling without an external PHY, the integrated 5 V-to-3.3 V regulator on the VBUS line simplifies bus-powered designs, and Microchip's free MPLAB Harmony USB stack provides ready-made HID, CDC, and MSD drivers.
Is PIC32MX575F256LT-80I/BG suitable for industrial CAN-bus nodes?
Yes, the PIC32MX575F256LT-80I/BG is widely used in industrial CAN-bus nodes because it integrates an ISO 11898-1 compliant CAN 2.0B controller. Per the Microchip datasheet, the module supports standard (11-bit) and extended (29-bit) identifiers, has 32 mailboxes, and operates at up to 1 Mbps. The 80 MHz MIPS core easily handles 100 kHz to 500 kHz industrial CAN traffic with substantial application headroom remaining.
What are the key specifications of PIC32MX575F256LT-80I/BG that engineers should know?
Engineers should know these PIC32MX575F256LT-80I/BG facts: MIPS32 M4K core at 80 MHz (1.56 DMIPS/MHz, ~125 DMIPS), 256 KB Flash + 64 KB SRAM, 53 I/O pins, 2.3 V to 3.6 V supply, industrial -40 C to +85 C, USB 2.0 full-speed OTG on-chip, 1 x CAN 2.0B, 10-bit ADC, and 121-TFBGA package. These figures are directly cited from the Microchip PIC32MX5xx/6xx/7xx family datasheet DS61121G.

Engineering reference data for PIC32MX575F256LT-80I/BG — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC32MX575F256LT-80I/BG when you need 256 KB Flash and 64 KB SRAM in a 121-TFBGA package for a USB 2.0 full-speed + CAN 2.0B design running on an industrial temperature range. Choose the same silicon in Tray packing (PIC32MX575F256L-80I/BG) for prototype builds. Choose the V-temperature variant (PIC32MX575F256LT-80V/BG) for extended -40 C to +105 C environments. Choose the PIC32MX564F128L-I/BG for lower-cost designs where 128 KB Flash and 32 KB SRAM are sufficient - it shares the same 121-TFBGA footprint, enabling a single PCB layout that can be BOM-populated for either memory size.

Comparison with Alternatives

Parameter This Product PIC32MX575F256L-80I/BG PIC32MX575F256LT-80V/BG PIC32MX564F128L-I/BG
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 121-TFBGA (10x10) 121-TFBGA (10x10) - same 121-TFBGA (10x10) - same 121-TFBGA (10x10) - same
Packing Tape & Reel Tray Tape & Reel Tray
Flash 256 KB 256 KB 256 KB 128 KB
SRAM 64 KB 64 KB 64 KB 32 KB
Max Clock Speed 80 MHz 80 MHz 80 MHz 80 MHz
USB USB 2.0 FS OTG USB 2.0 FS OTG USB 2.0 FS OTG USB 2.0 FS OTG
Operating Temperature -40 C to +85 C (I) -40 C to +85 C (I) -40 C to +105 C (V) -40 C to +85 C (I)

Key Differentiators

  • Highest Flash/SRAM in the 121-TFBGA PIC32MX5xx tier (vs PIC32MX564F128L-I/BG)
  • Industrial temperature range with same footprint as extended temp variant (vs PIC32MX575F256LT-80V/BG)
  • Same silicon in Tape-and-Reel packing for production lines (vs PIC32MX575F256L-80I/BG)

Design Notes

For the 121-TFBGA 0.8 mm ball-pitch package, follow IPC-7351 nominal land recommendations: non-solder-mask-defined (NSMD) pads are strongly recommended for modular drilling and reworkability. Place a 0.1 uF X7R decoupling capacitor within 2 mm of each VDD/VSS ball pair, and provide a continuous ground plane on the second layer to ensure low-impedance return paths for USB 2.0 full-speed signalling (12 Mbps).

Decouple the PIC32MX575F256LT-80I/BG's 2.3 V to 3.6 V supply with bulk tantalum or ceramic capacitors plus 100 nF ceramic capacitors near every VDD ball. The internal USB transceiver draws up to 50 mA during bus activity, so a low-noise LDO such as TPS217 is recommended upstream; avoid switching regulators that share the USB signal-return path. Estimate: at 80 MHz with all peripherals active, core draw current varies from a datasheet-specified range; check the latest DS61121G revision for the exact IDD figure before designing the power budget.

Do not assume JTAG pins are 5 V tolerant: they are 3.3 V only, and applying 5 V to any I/O can latch-up the part. For production programming, configure the PPS (Peripheral Pin Select) registers early in init code before configuring USB or CAN - otherwise the USB D+/D- lines will not route to the correct physical pins. Also confirm that the VBUS pin is tied to the 5 V USB VBUS through the recommended 0.1 uF decoupling per the Microchip hardware checklist.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant (TQFP-64 family datasheet notes LEAD FREE, PLASTIC packaging); lead-free per Microchip product page. Not AEC-Q100 qualified - use PIC32MX automotive variants for AEC-Q100 designs. Halogen-free status not stated in verified data.

Data verified on: 2026-10-03 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Microchip Technology PIC32MX575F256LT-80I/BG PIC32MX575F256L-80I/BG PIC32MX575F256LT-80V/BG PIC32MX564F128L-I/BG MIPS32 M4K MIPS core microcontroller 32-bit MCU Flash memory SRAM USB 2.0 full-speed CAN 2.0B TFBGA-121 TQFP-64 TQFP RoHS AEC-Q100 MPLAB Harmony MCP2551 MCP2562 USB OTG PICkit 5 ICD (in-circuit debugger) Peripheral Pin Select (PPS) IPC-7351
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