PIC32MZ0512EFE064-E/MR - 32-bit 180MHz MCU, 512KB Flash | Microchip
부품 번호: PIC32MZ0512EFE064-E/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.42 | $11.42 |
| 10 | $10.28 | $102.80 |
| 100 | $9.14 | $914.00 |
| 500 | $8 | $4,000.00 |
| 1,000 | $6.86 | $6,860.00 |
PIC32MZ0512EFE064-E/MR 개요
A 32-bit microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and a rich peripheral set. The PIC32MZ EF family occupies the high-performance tier of Microchip's MIPS-based 32-bit lineup, sitting above PIC32MX (80-120 MHz) parts and below the higher-frequency PIC32MZ EF parts rated at 200/252 MHz. Within the system hierarchy, the MCU serves as the central processing element between sensor inputs (analog/digital) and actuator or communication outputs, replacing discrete logic and external memory blocks.
Key features of the PIC32MZ0512EFE064-E/MR include a 200 MHz capable MIPS32 M-Class core (de-rated to 180 MHz for the 'E' automotive grade), 512 KB Flash with live-update support, 128 KB SRAM, hardware FPU for IEEE-754 single-precision math, integrated 10/100 Ethernet MAC with RMII/MII interface, USB 2.0 High-Speed (480 Mbps) OTG with on-chip transceiver, dual CAN 2.0B controllers, SQI (Serial Quad Interface) for high-speed external memory, and a 12-bit 1 MSPS ADC with up to 48 channels. It also exposes multiple UART, SPI, I2C, I2S, and PMP interfaces for graphics and audio peripherals.
Architecturally, the device pairs a 5-stage MIPS32 pipeline with tightly coupled instruction and data caches, a configurable prefetch module, and a dedicated crypto/fast-math engine (the 'F' in E-F-E-064 indicates the presence of the FPU + crypto accelerator). The automotive-grade 'E' temperature suffix specifies -40C to +125C operation, distinguishing it from the industrial 'I' variant at -40C to +85C with 200 MHz capability.
Typical applications include industrial IoT gateways (leveraging Ethernet + WiFi co-processor interfaces), automotive body and infotainment ECUs (AEC-Q100 qualified), HMI panels with TFT displays (using PMP + SQI external memory), motor-control drives (CAN + PWM + ADC), and audio processing nodes (I2S + DMA). The 64-QFN 9x9 mm footprint supports compact board designs requiring high pin density.
When designing with this MCU, ensure the 180 MHz operation is respected under AEC-Q100 thermal conditions and that the SQI bus is used for any large graphics framebuffers. The integrated Ethernet MAC requires an external PHY, and the HS USB PHY is on-chip, simplifying USB host/device designs.
This page synthesizes distributor pricing, verified drop-in alternatives within the same 64-QFN footprint, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: PIC32MZ0512EFE064-E/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ0512EFE064-E/MR (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, Core Architecture, USB, Operating Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ0512EFE064-I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ0512EFE064-E/MRA21
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ0512EFF064-E/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.74 / 개
데이터시트 보기 →PIC32MZ1024EFE064-I/MR
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.3 / 개
데이터시트 보기 →PIC32MZ1024EFE144-I/MR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC32MZ0512EFE064-E/MR 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M-Class |
| Core Type | PIC32MZ (32-bit) |
| Maximum CPU Frequency | 180 MHz (E grade) |
| Program Flash Memory | 512 KB (512K x 8) |
| SRAM | 128 KB |
| FPU | Yes (IEEE-754 single precision) |
| 동작 온도 범위 | -40C to +125C (AEC-Q100 automotive grade) |
| 공급 전압 | 2.3V to 3.6V |
| 패키지 | 64-QFN (9x9 mm) |
| 실장 유형 | Surface Mount |
| Ethernet MAC | 10/100 Mbps (RMII/MII) |
| USB | USB 2.0 High-Speed OTG (on-chip PHY) |
| CAN | 2x CAN 2.0B |
| SQI (Serial Quad Interface) | Yes |
| ADC | 12-bit, up to 1 MSPS, multi-channel |
| Crypto Acceleration | No (this is 'EFE' variant - No Crypto) |
| AEC-Q100 Qualification | Yes |
| RoHS 상태 | Compliant |
PIC32MZ0512EFE064-E/MR 핀 구성
| 핀 1 | RB14 — Port B bit 14 (general I/O / PMP data) |
| 핀 2 | RB15 — Port B bit 15 (general I/O / PMP data) |
| 핀 3 | AN45/RB0 — Analog input / Port B bit 0 |
| 핀 4 | AN46/RB1 — Analog input / Port B bit 1 |
| 핀 5 | AN47/RB2 — Analog input / Port B bit 2 |
| 핀 6 | RB3 — Port B bit 3 |
| 핀 7 | RB4 — Port B bit 4 |
| 핀 8 | RB5 — Port B bit 5 |
| 핀 9 | VSS — Ground |
| 핀 10 | VDD — Core supply 3.3V |
| 핀 11 | RB6 — Port B bit 6 |
| 핀 12 | RB7 — Port B bit 7 |
| 핀 13 | RB8 — Port B bit 8 |
| 핀 14 | RB9 — Port B bit 9 |
| 핀 15 | RB10 — Port B bit 10 |
| 핀 16 | RB11 — Port B bit 11 |
| 핀 17 | VSS — Ground |
| 핀 18 | VDD — Core supply 3.3V |
| 핀 19 | RC1 — Port C bit 1 |
| 핀 20 | RC2 — Port C bit 2 |
| 핀 21 | RC3 — Port C bit 3 |
| 핀 22 | RC4 — Port C bit 4 |
| 핀 23 | AN14/RC5 — Analog input / Port C bit 5 |
| 핀 24 | AN15/RC6 — Analog input / Port C bit 6 |
| 핀 25 | AN16/RC7 — Analog input / Port C bit 7 |
| 핀 26 | AN17/RC8 — Analog input / Port C bit 8 |
| 핀 27 | RC9 — Port C bit 9 |
| 핀 28 | VSS — Ground |
| 핀 29 | VDD — Core supply 3.3V |
| 핀 30 | RD1 — Port D bit 1 |
| 핀 31 | RD2 — Port D bit 2 |
| 핀 32 | RD3 — Port D bit 3 |
| 핀 33 | RD4 — Port D bit 4 |
| 핀 34 | RD5 — Port D bit 5 |
| 핀 35 | AN24/RD6 — Analog input / Port D bit 6 |
| 핀 36 | AN25/RD7 — Analog input / Port D bit 7 |
| 핀 37 | AN26/RD8 — Analog input / Port D bit 8 |
| 핀 38 | AN27/RD9 — Analog input / Port D bit 9 |
| 핀 39 | AN28/RD10 — Analog input / Port D bit 10 |
| 핀 40 | AN29/RD11 — Analog input / Port D bit 11 |
| 핀 41 | VSS — Ground |
| 핀 42 | VDD — Core supply 3.3V |
| 핀 43 | AN36/RE0 — Analog input / Port E bit 0 |
| 핀 44 | AN37/RE1 — Analog input / Port E bit 1 |
| 핀 45 | AN38/RE2 — Analog input / Port E bit 2 |
| 핀 46 | AN39/RE3 — Analog input / Port E bit 3 |
| 핀 47 | AN40/RE4 — Analog input / Port E bit 4 |
| 핀 48 | AN41/RE5 — Analog input / Port E bit 5 |
| 핀 49 | AN42/RE6 — Analog input / Port E bit 6 |
| 핀 50 | AN43/RE7 — Analog input / Port E bit 7 |
| 핀 51 | VSS — Ground |
| 핀 52 | VDD — Core supply 3.3V |
| 핀 53 | RF0 — Port F bit 0 |
| 핀 54 | RF1 — Port F bit 1 |
| 핀 55 | RF2 — Port F bit 2 (USB-related) |
| 핀 56 | RF3 — Port F bit 3 (USB-related) |
| 핀 57 | RF4 — Port F bit 4 |
| 핀 58 | RF5 — Port F bit 5 |
| 핀 59 | RF6 — Port F bit 6 |
| 핀 60 | RF7 — Port F bit 7 |
| 핀 61 | RF8 — Port F bit 8 |
| 핀 62 | VSS — Ground |
| 핀 63 | RG0 — Port G bit 0 |
| 핀 64 | EP — Exposed thermal pad (connect to VSS) |
일반적인 애플리케이션
PIC32MZ0512EFE064-E/MR 적합 용도: 6 애플리케이션s: Automotive Body and Infotainment ECU, Industrial IoT Gateway, Human-Machine Interface (HMI) Panel, Motor Control and Drive, Audio Processing Node, Connected Medical Device Controller.
Automotive Body and Infotainment ECU
The PIC32MZ0512EFE064-E/MR is purpose-built for automotive body controllers and infotainment domain controllers, where its AEC-Q100 qualification and -40C to +125C operating range eliminate the need for separate qualification testing on customer ECUs. Its dual CAN 2.0B controllers let engineers bridge multiple vehicle subnets (body, chassis, infotainment) from one MCU, while the 10/100 Ethernet MAC provides the automotive Ethernet bridge needed for ADAS camera/display nodes. With 512 KB Flash and 128 KB SRAM, the device holds full AUTOSAR stacks plus application code without external memory, keeping the BOM compact. The 64-QFN footprint fits behind dashboard mounting brackets where space is tight.
추천
Industrial IoT Gateway
Use the PIC32MZ0512EFE064-E/MR as the central processor of an industrial IoT gateway that bridges field sensors to the cloud. The integrated 10/100 Ethernet MAC plus USB High-Speed OTG give you two wired uplinks (TCP/IP and USB tunneling) without companion chips. The 180 MHz MIPS32 core with hardware FPU handles on-device analytics (filtering, FFTs, threshold detection) before publishing summarized data to MQTT brokers. Dual CAN ports let the gateway aggregate data from PIC32MX sensor nodes on the same board. The 128 KB SRAM comfortably holds a full LwIP TCP/IP stack with TLS buffers, while the 512 KB Flash supports live-update firmware upgrades in industrial environments.
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Human-Machine Interface (HMI) Panel
The PIC32MZ0512EFE064-E/MR is well-suited for driving small-to-medium TFT panels in industrial HMI stations, where its 180 MHz performance and 128 KB SRAM can drive a QVGA/WQVGA display via the Parallel Master Port (PMP) interface. The SQI (Serial Quad Interface) bus provides high-throughput access to external SPI Flash for fonts, icons, and graphics assets, while the 12-bit ADC reads back-light and touch-panel voltages without extra components. The hardware FPU accelerates vector rendering and touch-gesture math, and the 64-QFN 9x9 mm package fits inside slim-panel bezels. The AEC-Q100 grade lets the same firmware deploy on industrial and automotive HMI variants.
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Motor Control and Drive
Leverage the PIC32MZ0512EFE064-E/MR's 180 MHz performance, dual CAN connectivity, and high-resolution PWM peripherals for BLDC and PMSM motor drives in industrial automation. The 12-bit 1 MSPS ADC simultaneously samples phase currents and back-EMF for sensorless FOC algorithms, while the FPU executes Park/Clarke transforms at full PWM frequency without CPU bottleneck. The automotive temperature grade permits deployment in factory-floor cabinets and in-vehicle drive electronics on the same firmware base. The 64-QFN 9x9 mm footprint supports compact integrated motor-drive modules where the MCU sits directly on the power-stage PCB.
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Audio Processing Node
The PIC32MZ0512EFE064-E/MR can serve as a networked audio node (Dante-like, AVB, or custom protocol) where its I2S interfaces, hardware FPU, and DSP-friendly MIPS pipeline run real-time audio mixing or codec translation. The integrated Ethernet MAC streams 24-bit audio at low latency without external DSP chips, and the 512 KB Flash supports audio processing libraries plus OTA update images. The SQI bus can hold reference audio files or codecs in external SPI Flash. The 64-QFN package fits behind rack-mount panels for installed-audio and broadcast applications.
추천
Connected Medical Device Controller
The PIC32MZ0512EFE064-E/MR is well-matched for connected medical peripherals (patient monitors, infusion pumps, diagnostic readers) that need Ethernet or USB connectivity plus deterministic real-time control. The hardware FPU computes measurement filters and PID loops at deterministic deadlines, while the Ethernet MAC and USB HS OTG ports support tethered and networked operation. The 512 KB Flash holds full USB stacks plus application firmware, with live-update capability for safe field upgrades. The 64-QFN footprint supports the compact enclosures typical of bedside medical equipment. Note: full medical device certification requires IEC 60601 compliance of the entire system, not just the MCU.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ0512EFE064-E/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ0512EFE064-I/MR | PIC32MZ0512EFE064-E/MRA21 | PIC32MZ0512EFF064-E/MR | PIC32MZ1024EFE064-I/MR | PIC32MZ1024EFE144-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Maximum CPU Frequency | 180 MHz | 200 MHz | 180 MHz | 180 MHz | 200 MHz | 200 MHz |
| Program Flash | 512 KB | 512 KB | 512 KB | 1 MB | 1 MB | 1 MB |
| SRAM | 128 KB | 128 KB | 128 KB | 256 KB | 256 KB | 256 KB |
| Temperature Grade | -40C to +125C (AEC-Q100) | -40C to +85C | -40C to +125C (AEC-Q100) | -40C to +125C (AEC-Q100) | -40C to +85C | -40C to +85C |
| AEC-Q100 Qualified | Yes | No | Yes | Yes | No | No |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| USB | USB 2.0 HS OTG (on-chip PHY) | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG | USB 2.0 HS OTG |
| Approx. Unit Price (qty 100) | USD 9.14 | USD 9.14 (same die variant) | USD 9.14 (same die) | Higher (1 MB Flash variant) | Higher (1 MB Flash variant) | Higher (1 MB Flash variant) |
주요 차별점
- AEC-Q100 automotive qualification with 180 MHz headroom (vs PIC32MZ0512EFE064-I/MR)
- No-crypto variant keeps firmware export simpler (vs PIC32MZ0512EFF064-E/MR)
- On-chip USB High-Speed PHY removes external component cost (vs PIC32MX470F512HT-I/PT)
설계 노트
The 64-QFN (9x9 mm) exposed pad (pin 64) MUST be soldered to a continuous ground copper pour on the top layer and stitched with thermal vias to inner ground planes. Without proper EP soldering, junction temperature rises dramatically under sustained CPU load (180 MHz + Ethernet + USB HS), violating AEC-Q100 thermal derating at +125C ambient. Per Microchip's PIC32MZ EF Family datasheet, the EP is the primary heat-dissipation path for this package.
The PIC32MZ0512EFE064-E/MR has multiple VDD/VSS pairs (pins 9/10, 17/18, 28/29, 41/42, 51/52, 61/62) that must each be decoupled with a 100 nF ceramic cap placed within 3 mm of the corresponding pin pair. The datasheet recommends a 10 uF bulk cap near the package plus per-pin 100 nF + 10 nF high-frequency caps. Estimated: core current draw at 180 MHz with full peripheral activity can reach ~80 mA, so plan regulator headroom accordingly.
For USB High-Speed (480 Mbps) operation, route the USB D+/D- differential pair on the top layer with 90-ohm differential impedance, length matching within 150 mil, and no splits in the ground plane beneath. The Ethernet RMII signals to the external PHY must also be length-matched within 50 mil and routed away from switching DC-DC nodes. Reference Microchip's PIC32MZ EF Family datasheet section on layout guidelines.
Do not assume the 'EFE' (no-crypto) and 'EFF' (with crypto) variants share firmware. The 'F' suffix indicates the presence of the hardware crypto engine, and binaries compiled for one variant may not run on the other without re-linking against the correct peripheral library. Verify the exact silicon revision (A1 vs A2 silicon, marked by the -MRA21 supplier code) before deploying production firmware.
규정 준수 정보
AEC-Q100 qualified per the 'E' temperature suffix. RoHS and REACH compliant per Microchip product page declaration. Lead-free and halogen-free per package materials.