PIC32MZ0512EFK064T-I/MR - 200MHz 32-bit MCU, 512KB Flash | Microchip
부품 번호: PIC32MZ0512EFK064T-I/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $9.43 | $9.43 |
| 10 | $8.55 | $85.50 |
| 100 | $7.41 | $741.00 |
| 500 | $6.62 | $3,310.00 |
| 1,000 | $5.93 | $5,930.00 |
PIC32MZ0512EFK064T-I/MR 개요
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory, data memory, and programmable peripherals. The PIC32MZ EF family sits in the high-performance tier of 32-bit MCUs, above Cortex-M0/M0+ parts and comparable to Cortex-M4F-class devices. It belongs to the broader category of embedded microcontrollers used for connected industrial, IoT, graphics/HMI, and motor-control applications.
Key features include up to 46 user I/O pins, twelve direct memory access (DMA) channels, nine 16-bit timers/counters, twelve UART/SPI/I2C peripherals, dual CAN modules, and a 12-bit ADC at 500 ksps. The device supports Dual Panel Flash for live firmware updates without downtime, an 8-channel hardware crypto accelerator, and a 32-bit MIPS Warrior M-class DSP-enhanced core with saturating and fractional arithmetic.
The PIC32MZ0512EFK064T-I/MR is built on a low-power CMOS process and includes multiple low-power modes (Idle, Sleep, Deep Sleep, and VBAT) for battery-aware designs. Integrated peripherals such as USB 2.0 High-Speed OTG, 10/100 Ethernet MAC with dedicated DMA, and SQI (Serial Quad Interface) provide flexible connectivity. Operating voltage is 2.5V to 3.6V with industrial temperature range of -40C to +85C.
Typical applications include industrial IoT gateways, automotive infotainment clusters, HMI touch panels, motor control (BLDC/PMSM FOC), medical instrumentation, multi-axis robotics controllers, secure IoT edge nodes, and graphical display terminals. Its combination of crypto acceleration and high-throughput peripherals makes it well suited to connected industrial products requiring TLS/DTLS secure communications.
When designing with this MCU, allocate sufficient decoupling (100 nF + 10 uF) near each VDD/VSS pair and connect the exposed pad (EP) to a clean ground plane for thermal dissipation. Reserve dedicated PGECx/PGEDx pairs for ICSP programming; the device supports four pairs and any pair can be used as long as PGEC and PGED pins are matched.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: PIC32MZ0512EFK064T-I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ0512EFK064T-I/MR (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, Core Architecture, USB, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ0512EFK064-E/MR
✅ 드롭인✓ 재고 있음
$4.76 / 개
데이터시트 보기 →PIC32MZ0512EFE064-E/MR
✅ 드롭인✓ 재고 있음
$6.86 / 개
데이터시트 보기 →PIC32MZ0512EFE064T-I/MR
✅ 드롭인✓ 재고 있음
$6.25 / 개
데이터시트 보기 →PIC32MZ0512EFF064T-I/MR
✅ 드롭인✓ 재고 있음
$2.55 / 개
데이터시트 보기 →PIC32MZ0512EFK064T-250I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ0512EFK064T-I/MR 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M-Class (MIPS Warrior) |
| Core Width | 32-bit |
| Maximum CPU Frequency | 200 MHz (330 DMIPS) |
| Program Memory (Flash) | 512 KB |
| Data SRAM | 128 KB |
| 패키지 | 64-pin QFN (9x9 mm) with exposed pad |
| 실장 유형 | Surface Mount (Tape & Reel) |
| Operating Voltage | 2.5 V to 3.6 V |
| 동작 온도 | -40 C to +85 C (Industrial) |
| I/O Pins | 46 |
| ADC | 12-bit, up to 500 ksps |
| DMA Channels | 12 |
| Timers | 9 x 16-bit timers/counters |
| Crypto Hardware Engine | AES, DES, 3DES, SHA, MD5, HMAC |
| FPU | IEEE 754-compliant single/double precision |
| Communication Peripherals | USB 2.0 HS OTG, 10/100 Ethernet MAC, 2x CAN, SQI, 6x UART, 3x SPI, 4x I2C |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 |
PIC32MZ0512EFK064T-I/MR 핀 구성
| 핀 1 | RPB0/AN0 — Remappable I/O, ADC input 0 |
| 핀 2 | RPB1/AN1 — Remappable I/O, ADC input 1 |
| 핀 3 | RPB2/AN2 — Remappable I/O, ADC input 2 |
| 핀 4 | RPB3/AN3 — Remappable I/O, ADC input 3 |
| 핀 5 | VDD — Core/IO supply 2.5V-3.6V |
| 핀 6 | VSS — Ground reference |
| 핀 7 | RPB4/AN4 — Remappable I/O, ADC input 4 |
| 핀 8 | RPB5/AN5 — Remappable I/O, ADC input 5 |
| 핀 9 | RPB6/AN6 — Remappable I/O, ADC input 6 |
| 핀 10 | RPB7/AN7 — Remappable I/O, ADC input 7 |
| 핀 11 | RPC0 — Remappable I/O |
| 핀 12 | RPC1 — Remappable I/O |
| 핀 13 | RPC2 — Remappable I/O |
| 핀 14 | RPC3 — Remappable I/O |
| 핀 15 | RPC4 — Remappable I/O |
| 핀 16 | RPC5 — Remappable I/O |
| 핀 17 | RPC6 — Remappable I/O |
| 핀 18 | RPC7 — Remappable I/O |
| 핀 19 | VSS — Ground reference |
| 핀 20 | VDD — Core/IO supply 2.5V-3.6V |
| 핀 21 | RPD0/INT0 — Remappable I/O, external interrupt 0 |
| 핀 22 | RPD1/INT1 — Remappable I/O, external interrupt 1 |
| 핀 23 | RPD2/INT2 — Remappable I/O, external interrupt 2 |
| 핀 24 | RPD3/INT3 — Remappable I/O, external interrupt 3 |
| 핀 25 | RPD4/RTCC — Remappable I/O, RTCC output |
| 핀 26 | RPD5 — Remappable I/O |
| 핀 27 | RPD6 — Remappable I/O |
| 핀 28 | RPD7 — Remappable I/O |
| 핀 29 | RPE0/PMA3 — Remappable I/O, parallel master address 3 |
| 핀 30 | RPE1/PMA4 — Remappable I/O, parallel master address 4 |
| 핀 31 | RPE2/PMA5 — Remappable I/O, parallel master address 5 |
| 핀 32 | RPE3/PMA6 — Remappable I/O, parallel master address 6 |
| 핀 33 | RPE4/PMA7 — Remappable I/O, parallel master address 7 |
| 핀 34 | RPE5/PMRD — Remappable I/O, parallel master read strobe |
| 핀 35 | RPE6/PMWR — Remappable I/O, parallel master write strobe |
| 핀 36 | RPE7/PMCS — Remappable I/O, parallel master chip select |
| 핀 37 | AVDD — Analog supply |
| 핀 38 | AVSS — Analog ground |
| 핀 39 | VBAT — RTCC battery backup supply |
| 핀 40 | OSCI/CLKI — Crystal input or external clock |
| 핀 41 | OSCO/CLKO — Crystal output or system clock out |
| 핀 42 | SOSCI — Secondary oscillator crystal input |
| 핀 43 | SOSCO — Secondary oscillator crystal output |
| 핀 44 | RPF0 — Remappable I/O |
| 핀 45 | RPF1 — Remappable I/O |
| 핀 46 | RPF2/SDA3 — Remappable I/O, I2C3 data |
| 핀 47 | RPF3/SCL3 — Remappable I/O, I2C3 clock |
| 핀 48 | RPF4/USBID — Remappable I/O, USB ID |
| 핀 49 | RPF5 — Remappable I/O |
| 핀 50 | VSS — Ground reference |
| 핀 51 | RPF6/SCK2 — Remappable I/O, SPI2 clock |
| 핀 52 | RPF7 — Remappable I/O |
| 핀 53 | VUSB — USB transceiver supply |
| 핀 54 | VDD — Core/IO supply 2.5V-3.6V |
| 핀 55 | RPG0 — Remappable I/O |
| 핀 56 | RPG1 — Remappable I/O |
| 핀 57 | RPG2 — Remappable I/O |
| 핀 58 | RPG3 — Remappable I/O |
| 핀 59 | RPG6 — Remappable I/O |
| 핀 60 | RPG7 — Remappable I/O |
| 핀 61 | PGEC1 — ICSP programming clock 1 |
| 핀 62 | PGED1 — ICSP programming data 1 |
| 핀 63 | PGEC2 — ICSP programming clock 2 |
| 핀 64 | PGED2 — ICSP programming data 2 |
일반적인 애플리케이션
PIC32MZ0512EFK064T-I/MR 적합 용도: 6 애플리케이션s: Industrial IoT Gateways, Automotive HMI / Infotainment, BLDC / PMSM Motor Control, Medical Instrumentation, Secure Connected Edge Nodes, Graphical HMI / Display Terminals.
Industrial IoT Gateways
The PIC32MZ0512EFK064T-I/MR fits industrial IoT gateways because its 200 MHz MIPS M-class core and 128 KB SRAM sustain TLS/DTLS stacks while the 512 KB Flash stores both secure firmware and application logic. The integrated AES/SHA hardware crypto engine offloads secure handshakes, and the 10/100 Ethernet MAC with dedicated DMA eliminates the need for an external PHY controller in many designs. Industrial -40 C to +85 C operation supports deployment in factory cabinets and outdoor enclosures. The part's dual CAN interfaces also bridge to legacy industrial fieldbus networks alongside modern Ethernet connectivity.
추천
Automotive HMI / Infotainment
The PIC32MZ0512EFK064T-I/MR is suited to automotive HMI clusters and infotainment touch panels where 512 KB Flash holds graphics libraries and CAN stacks while the FPU accelerates gesture and rendering math. Dual CAN interfaces provide gatewaying to body and powertrain buses, and the 12-bit ADC supports backlight and temperature sensing channels. The 64-pin QFN package and industrial temperature rating allow placement behind the dashboard near heat sources. For AEC-Q100-qualified designs, the same family offers automotive-grade variants under different ordering part numbers.
추천
BLDC / PMSM Motor Control
The PIC32MZ0512EFK064T-I/MR's single-precision FPU and four 64-bit accumulators deliver the throughput required for field-oriented control (FOC) of BLDC and PMSM motors. Its nine 16-bit timers support complementary PWM generation, while the 12-bit ADC at 500 ksps captures phase currents with sub-microsecond latency. The 128 KB SRAM is sufficient for control-loop buffers and the 200 MHz core leaves headroom for Ethernet-connected smart-motor controllers. Industrial temperature grade supports factory-floor mounting, and QFN package suits compact integrated motor drives.
추천
Medical Instrumentation
The PIC32MZ0512EFK064T-I/MR fits medical instrumentation such as portable patient monitors and laboratory analyzers because its FPU accelerates DSP-style filtering of bio-signals while 512 KB Flash stores calibration tables and USB stack. USB 2.0 High-Speed OTG enables fast data offload to host PCs, and the 12-bit ADC captures analog front-end channels. The hardware crypto engine supports authenticated firmware updates required for FDA 21 CFR Part 11 compliance pathways. Industrial temperature rating and robust peripherals suit handheld and benchtop medical designs.
추천
Secure Connected Edge Nodes
The PIC32MZ0512EFK064T-I/MR is well matched to secure connected edge nodes that require TLS authentication to cloud services but cannot afford a separate crypto coprocessor. Its AES/SHA hardware engine accelerates handshake computations while 128 KB SRAM buffers TLS records and MQTT payloads. The Dual Panel Flash supports live firmware updates without downtime, a critical feature for deployed edge devices. Industrial temperature grade supports outdoor and factory deployments, and the 64-pin QFN package enables compact form factors.
추천
Graphical HMI / Display Terminals
The PIC32MZ0512EFK064T-I/MR drives graphical HMI panels by combining a 200 MHz MIPS M-class core with 128 KB SRAM to render menus, gauges, and touch widgets at smooth frame rates. The Serial Quad Interface (SQI) connects to high-throughput serial Flash for asset graphics, while the integrated LCD controller (on compatible package variants) drives small-to-medium WVGA panels directly. Dual CAN and Ethernet enable machine-to-machine connectivity on factory floors. The 64-pin QFN package is suitable for space-constrained panel designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ0512EFK064T-I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ0512EFK064-E/MR | PIC32MZ0512EFE064-E/MR | PIC32MZ0512EFE064T-I/MR | PIC32MZ0512EFF064T-I/MR | PIC32MZ0512EFK064T-250I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm) | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same | 64-pin QFN (9x9 mm) - same |
| Maximum CPU Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 250 MHz |
| Flash | 512 KB | 512 KB | 1 MB | 1 MB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 256 KB | 256 KB | 128 KB | 128 KB |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +125 C (Extended) | -40 C to +125 C (Extended) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Hardware Crypto Engine | Yes (AES/SHA/DES/MD5/HMAC) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| FPU | IEEE 754 single/double precision | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) |
| Supply Voltage | 2.5 V to 3.6 V | 2.5 V to 3.6 V | 2.5 V to 3.6 V | 2.5 V to 3.6 V | 2.5 V to 3.6 V | 2.5 V to 3.6 V |
주요 차별점
- Highest-density same-package upgrade available (vs PIC32MZ0512EFE064T-I/MR)
- Faster speed grade available in same package (vs PIC32MZ0512EFK064T-250I/MR)
- Industrial vs extended temperature selection (vs PIC32MZ0512EFK064-E/MR)
설계 노트
Decouple each VDD/VSS pair with a 100 nF ceramic plus a bulk 10 uF tantalum or ceramic, placed within 5 mm of the package pin to suppress switching noise from the MIPS core. Use separate analog (AVDD/AVSS) decoupling from digital rails to avoid ADC reference contamination. The VUSB pin requires its own 100 nF bypass when USB High-Speed is enabled. Estimated: total decoupling budget for the 64-pin QFN is approximately 12-15 capacitors; layout them in a star pattern around the package.
The 64-pin QFN exposed pad (EP) is the primary thermal path and must be soldered to a continuous ground plane with multiple thermal vias (typically 9 to 16 vias in a 3x3 grid) for adequate heat dissipation. At 200 MHz with all peripherals active, the device can dissipate up to ~700 mW; without the EP soldered, junction temperature can rise above the 85 C industrial limit in enclosed housings. Always solder the EP - even prototype boards - to keep the thermal path intact.
Route the high-speed USB differential pair (D+/D-) as a 90 ohm differential impedance match within 4 mm of the package, keeping them length-matched within 150 mil. Place the USB common-mode choke as close to the connector as possible and avoid routing other signals beneath the USB pair. The Ethernet MII/RMII traces to an external PHY should be length-matched within 50 mil to preserve timing margins.
Avoid mixing PGEC1 with PGED2 (or any mismatched pair) when using ICSP - the device requires matched PGECx/PGEDx pairs for programming, per the PIC32M Family Reference Manual. Common pitfall: leaving unused pins floating can cause excess current draw; configure all unused I/O as outputs low or inputs with internal pull-downs. Also note that 5 V tolerance is not guaranteed on all pins - verify the pin-by-pin electrical characteristics before connecting to 5 V peripherals.
규정 준수 정보
RoHS compliant per Microchip product page. The -I suffix denotes industrial -40 C to +85 C temperature grade; AEC-Q100 automotive variants are ordered under separate part numbers in the PIC32MZ EF family. Lead-free and halogen-free per Microchip material declarations.
