PIC32MZ1024EFE144T-E/JWX - 180MHz 1MB Flash 32-bit MCU | Microchip
부품 번호: PIC32MZ1024EFE144T-E/JWX ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.0888 | $14.09 |
| 10 | $13.25 | $132.50 |
| 100 | $11.94 | $1,194.00 |
| 500 | $10.62 | $5,310.00 |
| 1,000 | $9.55 | $9,550.00 |
PIC32MZ1024EFE144T-E/JWX 개요
A 32-bit microcontroller (MCU) is a single-chip computer whose central processing unit manipulates data in 32-bit-wide registers and addresses memory linearly across gigabytes of address space. Within the taxonomy 32-bit MCU -> microcontroller -> embedded processor -> semiconductor IC, the PIC32MZ EF family sits at the high-performance end of Microchip's PIC32 lineup, integrating a MIPS microAptiv core with rich connectivity peripherals for connected-embedded designs.
Key differentiating features of this variant include 1 MB Flash, 256 KB SRAM, no on-chip crypto accelerator, and no CAN module, distinguishing it from sibling PIC32MZ EF devices that add CryptoAuthentication and CAN peripherals. The part exposes up to 120 I/O lines, a 12-bit ADC with up to 48 channels, 9 timers, 2 watchdog timers, 8 DMA channels, and a wide peripheral mix including 6 UART, 5 I2C, 4 SPI, and USB. The PIC32MZ EF family's microAptiv core delivers 252 DMIPS, suiting deterministic real-time control with low interrupt latency.
Typical applications include industrial automation, automotive body and infotainment subsystems, IoT edge nodes, HMI graphics controllers, and motor-control drives. The 1 MB Flash supports over-the-air (OTA) firmware update partitioning typical of connected devices. Design with this MCU, ensure the PCB exposes the TFBGA-144 footprint with controlled-impedance traces for high-speed peripherals and that the on-chip FPU and prefetch module are configured in the startup code to meet the 180 MHz throughput target.
드롭인 대체품: PIC32MZ1024EFE144T-E/JWX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ1024EFE144T-E/JWX (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Core Architecture, Package, Operating Temperature, Ethernet.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1024EFE144-E/JWX
✅ 드롭인✓ 재고 있음
$13.4 / 개
데이터시트 보기 →PIC32MZ1024EFM144
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ1024EFE144T-250E/JWX
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ0512EFE144T-I/JWX
✅ 드롭인✓ 재고 있음
$7.71 / 개
데이터시트 보기 →PIC32MZ0512EFK144T-I/JWX
✅ 드롭인✓ 재고 있음
$9.3 / 개
데이터시트 보기 →PIC32MZ1024EFE144T-E/JWX 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M-Class (microAptiv) |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Frequency | 180 MHz |
| Flash Memory Size | 1 MB (1M x 8) |
| SRAM Size | 256 KB |
| Supply Voltage Range | 2.1 V to 3.6 V |
| 동작 온도 범위 | -40C to +125C (E grade) |
| I/O Pin Count | 120 |
| ADC Resolution | 12-bit |
| 패키지 / 케이스 | 144-TFBGA (7x7 mm) |
| 실장 유형 | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| RoHS 상태 | Compliant |
| Automotive Qualification | AEC-Q100 (per Zeano listing) |
PIC32MZ1024EFE144T-E/JWX 144-tfbga (7x7 mm) 핀 구성 가이드
PIC32MZ1024EFE144T-E/JWX(144-tfbga (7x7 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ1024EFE144T-E/JWX.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ1024EFE144T-E/JWX 적합 용도: 7 애플리케이션s: Industrial Automation Controller, Automotive Body and Infotainment ECU, IoT Edge Gateway and Sensor Hub, HMI Graphics Controller, Motor Control Drive (BLDC/PMSM), Medical Patient Monitoring Device, Connected Lighting and Building Automation.
Industrial Automation Controller
The PIC32MZ1024EFE144T-E/JWX fits industrial automation controllers thanks to its 180 MHz MIPS32 core, 1 MB Flash, and 256 KB SRAM that accommodate ladder-logic interpreters, Modbus stacks, and real-time Ethernet protocols. The 120 GPIO and 5 I2C interfaces drive sensor hubs and multi-drop IO-Link masters, while the 12-bit ADC reads analog process variables at up to 1 MSps. The -40C to +125C operating range and AEC-Q100 qualification allow deployment in factory-floor cabinets and process plants without additional thermal hardening.
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Automotive Body and Infotainment ECU
AEC-Q100 qualification and the extended -40C to +125C temperature grade make PIC32MZ1024EFE144T-E/JWX suitable for automotive body control modules and infotainment head units. The 1 MB Flash supports dual-bank OTA firmware updates over CAN or Ethernet, while 256 KB SRAM runs AUTOSAR-style real-time operating systems comfortably. Six UART channels connect Bluetooth, Wi-Fi, and GNSS modules simultaneously, and the 12-bit ADC multiplexes across body-control sensor inputs. The compact 144-TFBGA 7x7 mm footprint suits space-constrained dashboard and door-module PCBs.
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IoT Edge Gateway and Sensor Hub
PIC32MZ1024EFE144T-E/JWX serves as an IoT edge gateway with its 1 MB Flash and 256 KB SRAM supporting TLS 1.2/1.3 stacks and JSON payload parsing. The Hi-Speed USB with on-chip transceiver connects LTE/NB-IoT modems, while 5 I2C and 4 SPI buses multiplex temperature, humidity, and motion sensors. The 8 DMA channels offload sensor reads from the core, leaving the 180 MHz microAptiv CPU free for MQTT/HTTPS handling. Deep-sleep current in the microamp range enables battery-backed sensor hubs that wake on interrupt.
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HMI Graphics Controller
The 180 MHz MIPS32 core with hardware multiply-accumulate and the 1 MB Flash storage enable PIC32MZ1024EFE144T-E/JWX to drive TFT-LCD panels up to WVGA resolution in HMI applications. The PIC32MZ EF family includes a dedicated graphics controller (GPU-less but with parallel RGB interface) that connects directly to TFT displays. With 256 KB SRAM for framebuffers and 120 GPIO for touch and keypad scanning, designers can build cost-effective appliance and instrument HMIs without an external graphics controller. The 12-bit ADC reads analog front-panel potentiometers.
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Motor Control Drive (BLDC/PMSM)
PIC32MZ1024EFE144T-E/JWX is well matched to BLDC and PMSM motor drives running field-oriented control (FOC) loops at 20-50 kHz PWM. The 9 timers generate 6-channel PWM with dead-band insertion, while the 12-bit ADC with up to 48 channels synchronizes phase-current sampling to PWM edges via hardware trigger. The 180 MHz microAptiv core runs FOC math within 5 us per cycle, and 256 KB SRAM retains state-machine variables. The 144-TFBGA package keeps drive PCBs compact for integrated motor-inverter designs.
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Medical Patient Monitoring Device
The 180 MHz throughput and 1 MB Flash of PIC32MZ1024EFE144T-E/JWX support medical patient monitoring devices such as pulse oximeters, infusion pumps, and portable ECG monitors. The 12-bit ADC acquires analog bio-signals (SpO2, ECG, temperature) with adequate resolution for clinical-grade accuracy, and the deterministic MIPS core delivers real-time waveform processing. The AEC-Q100 qualification and -40C to +125C range suit ambulance and bedside environments, while USB Hi-Speed enables fast data upload to electronic health record systems.
추천
Connected Lighting and Building Automation
PIC32MZ1024EFE144T-E/JWX powers connected LED lighting controllers and building automation nodes with its 6 UART channels for DALI-2, KNX, or BACnet bridges. The 1 MB Flash supports multi-protocol firmware, while the 120 GPIO drive multi-channel LED PWM dimming and occupancy-sensor inputs. The 12-bit ADC reads ambient light and color sensors for circadian-rhythm lighting controls. The 144-TFBGA 7x7 mm package fits within slim ceiling-mounted luminaire housings where PCB area is at a premium.
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추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ1024EFE144T-E/JWX — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1024EFE144-E/JWX | PIC32MZ1024EFM144 | PIC32MZ1024EFE144T-250E/JWX | PIC32MZ0512EFE144T-I/JWX | PIC32MZ0512EFK144T-I/JWX |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-TFBGA (7x7 mm) | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same | 144-TFBGA (7x7 mm) - same |
| Maximum CPU Frequency | 180 MHz | 180 MHz | 180 MHz | 252 MHz | 180 MHz | 200 MHz |
| Flash Memory | 1 MB | 1 MB | 1 MB | 1 MB | 512 KB | 512 KB |
| SRAM Size | 256 KB | 256 KB | 256 KB | 256 KB | 128 KB | 128 KB |
| CAN Module | No | No | Yes (CAN 2.0B) | No | No | No |
| Crypto Accelerator | No | No | Yes | No | No | No |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
주요 차별점
- AEC-Q100 automotive qualification with 1 MB Flash (vs PIC32MX575F512LT-80I/BG)
- Compact 7x7 mm TFBGA with 1 MB Flash (vs PIC32MZ1024EFE144-I/PL)
- 256 KB SRAM for TLS stacks (vs PIC32MX795F512L-80I/TL)
설계 노트
Estimated: the 144-TFBGA (7x7 mm) package uses a 0.65 mm ball pitch, which requires HDI PCB fabrication with laser-drilled microvias and a 1-2-1 or 1-3-1 stackup. Plan at least 4 PCB layers to escape the inner-row balls; place decoupling capacitors on the bottom side directly under their respective VDD/VSS balls. Use a 0.5 oz copper pour on outer layers and 1 oz on inner planes to manage inrush during DMA bursts.
Estimated: at 180 MHz with all peripherals active, the PIC32MZ EF core consumes approximately 80-110 mA from a 3.3 V supply, peaking to 150 mA during Flash programming. Place a 10 uF bulk capacitor near the VDDCORE pin and 100 nF decoupling on each VDD/VSS pair. Add a ferrite bead or pi-filter on the analog AVDD rail to keep ADC readings clean, since switching noise from the digital core can couple through shared planes.
Do not assume the "T" suffix indicates a different silicon - PIC32MZ1024EFE144T-E/JWX and PIC32MZ1024EFE144-E/JWX are the same die, the difference is only tape-and-reel vs tray packaging. For prototype builds, order the tray variant for easier handling. Also, confirm the JTAG/TRACE pin assignments in the datasheet before laying out the PCB - PIC32MZ EF devices support both 2-wire programming and 4-wire JTAG, and the trace pin remap differs from older PIC32MX parts.
Estimated: the TFBGA-144 package has a theta-JA of approximately 25-30 C/W on a 4-layer JEDEC test board. At 150 mA core current and 3.3 V supply, worst-case power dissipation is 0.495 W, yielding a 12-15 C junction temperature rise above ambient. No heatsink is required for industrial environments, but verify thermal margins in enclosed IP65 enclosures where ambient can reach 70 C. Use thermal vias under the center pad to spread heat to internal copper planes.
규정 준수 정보
RoHS compliance confirmed by JLCPCB and Zeano listings; AEC-Q100 automotive qualification per Zeano listing. Halogen-free status not stated in verified web data.