PIC32MX570F512LT-I/GJX - 50MHz 32-bit MCU 512KB Flash TFBGA-100
부품 번호: PIC32MX570F512LT-I/GJX ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $7.62 | $7.62 |
| 10 | $6.85 | $68.50 |
| 100 | $6.1 | $610.00 |
| 500 | $5.42 | $2,710.00 |
| 1,000 | $4.78 | $4,780.00 |
PIC32MX570F512LT-I/GJX 개요
A 32-bit microcontroller (MCU) is an integrated circuit that combines a processor core, program memory (Flash), data memory (SRAM), and a rich set of on-chip peripherals such as timers, communication controllers, and analog blocks. In the system hierarchy, an MCU sits above discrete logic and below a system-on-chip (SoC); the PIC32MX570F512L family targets cost-sensitive embedded applications where MIPS architecture, deterministic interrupt response, and Microchip's MPLAB Harmony toolchain deliver faster development cycles than ARM Cortex-M parts at similar Flash densities.
Key differentiating features include the 50 MHz/83 DMIPS M4K core, integrated Full-Speed USB OTG and CAN 2.0B, an on-chip 16-channel 10-bit ADC with up to 1 Msps sampling, three analog comparators plus a CTMU (Charge Time Measurement Unit) for capacitive touch sensing, and a real-time clock/calendar (RTCC). The 100-pin TFBGA (7x7) footprint provides ample I/O for parallel graphics and PMP-driven LCD interfaces while keeping PCB area minimal.
Architecturally, the part uses a 5-stage pipelined M4K core with hardware multiply/divide, dual I-cache/S-cache, a flexible DMA controller, and Microchip's PPS - allowing most digital peripherals to be remapped to a wide choice of physical pins, which simplifies PCB layout and BOM reuse across family members.
Typical applications include industrial USB peripherals, CAN-based automotive body controllers, audio HMI with I2S codecs, capacitive-touch human-machine interfaces, low-cost graphics terminals, and embedded data-acquisition front-ends. The combination of USB device/host/OTG plus CAN in a single 100-pin BGA makes this MCU particularly attractive for industrial-control gateways.
A key design trade-off is the TFBGA-7x7 package: it minimizes PCB area but requires careful via-in-pad design and X-ray inspection during assembly. Engineers should budget for an additional PCB layer and reflow profile tuning to obtain reliable BGA solder joints in production.
This page synthesizes distributor pricing, drop-in alternatives, and design notes not found in the manufacturer datasheet, giving buyers and engineers a single authoritative source for procurement and design decisions.
드롭인 대체품: PIC32MX570F512LT-I/GJX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MX570F512LT-I/GJX (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core Architecture, Parallel Master Port (PMP), I/O Pins.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MX570F512LT-50I/GJX
✅ 드롭인✓ 재고 있음
$5.47 / 개
데이터시트 보기 →PIC32MX270F512LT-I/GJX
✅ 드롭인✓ 재고 있음
$5.1 / 개
데이터시트 보기 →PIC32MX270F512LT-50I/GJX
✅ 드롭인✓ 재고 있음
$4.45 / 개
데이터시트 보기 →PIC32MX570F512L-I/PT
✅ 드롭인✓ 재고 있음
$4.82 / 개
데이터시트 보기 →PIC32MX570F512LT-50I/PF
✅ 드롭인✓ 재고 있음
$4.61 / 개
데이터시트 보기 →PIC32MX570F512LT-I/GJX 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 50 MHz |
| DMIPS Performance | 83 DMIPS |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 64 KB |
| 패키지 | 100-pin TFBGA (7x7 mm), GJX suffix |
| 핀 수 | 100 |
| 동작 온도 범위 | -40C to +85C (industrial, 'I' grade) |
| Supply Voltage Range | 2.3 V to 3.6 V |
| USB | USB 2.0 Full-Speed OTG controller |
| CAN | CAN 2.0B with DeviceNet addressing |
| SPI Modules | 4 (shared with I2S) |
| I2S Modules | 2 |
| Parallel Master Port (PMP) | Yes, with dual read/write buffers for graphics |
| Peripheral Pin Select (PPS) | Yes |
| ADC | 10-bit, up to 1 Msps, up to 16 channels |
| Analog Comparators | 3 |
| CTMU | Yes (for capacitive touch / time measurement) |
| RTCC | Yes (Real-Time Clock/Calendar) |
| DMA Channels | Yes |
| 실장 유형 | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| RoHS | Compliant |
| Lead-Free | Yes |
PIC32MX570F512LT-I/GJX 핀 구성
| 핀 A1 | OSC1/CLKI/RC13 — External oscillator input / digital I/O RC13 |
| 핀 A2 | OSC2/CLKO/RC15 — External oscillator output / digital I/O RC15 |
| 핀 A3 | VSS — Ground reference |
| 핀 A4 | PMA0/RG15 — Parallel Master Port address bit 0 / digital I/O RG15 |
| 핀 A5 | PMA1/RG12 — Parallel Master Port address bit 1 / digital I/O RG12 |
| 핀 A6 | PMA2/RG13 — Parallel Master Port address bit 2 / digital I/O RG13 |
| 핀 A7 | PMA3/RG14 — Parallel Master Port address bit 3 / digital I/O RG14 |
| 핀 A8 | VDD — Positive supply voltage (2.3-3.6 V) |
| 핀 A9 | RC14/SOSCO — Secondary oscillator output / digital I/O RC14 |
| 핀 A10 | RC13/SOSCI — Secondary oscillator input / digital I/O RC13 |
| 핀 B1 | PGED1/AN0/RB0 — Programming data / analog input 0 / digital I/O RB0 |
| 핀 B2 | PGEC1/AN1/RB1 — Programming clock / analog input 1 / digital I/O RB1 |
| 핀 B3 | AN2/RB2 — Analog input 2 / digital I/O RB2 |
| 핀 B4 | AN4/RB4 — Analog input 4 / digital I/O RB4 |
| 핀 B5 | AN6/RB6 — Analog input 6 / digital I/O RB6 |
| 핀 B6 | AN8/RB8 — Analog input 8 / digital I/O RB8 |
| 핀 B7 | AN10/RB10 — Analog input 10 / digital I/O RB10 |
| 핀 B8 | AN12/RB12 — Analog input 12 / digital I/O RB12 |
| 핀 B9 | AN14/RB14 — Analog input 14 / digital I/O RB14 |
| 핀 B10 | VDD — Positive supply voltage |
| 핀 C1 | VSS — Ground reference |
| 핀 C2 | CVREF+/AN3/RB3 — Comparator voltage reference+ / analog input 3 / digital I/O RB3 |
| 핀 C3 | CVREF-/AN5/RB5 — Comparator voltage reference- / analog input 5 / digital I/O RB5 |
| 핀 C4 | AN7/RB7 — Analog input 7 / digital I/O RB7 |
| 핀 C5 | AN9/RB9 — Analog input 9 / digital I/O RB9 |
| 핀 C6 | AN11/RB11 — Analog input 11 / digital I/O RB11 |
| 핀 C7 | AN13/RB13 — Analog input 13 / digital I/O RB13 |
| 핀 C8 | AN15/RB15 — Analog input 15 / digital I/O RB15 |
| 핀 C9 | VSS — Ground reference |
| 핀 C10 | VBUS — USB VBUS sense input |
| 핀 D1 | PGED2/RF0 — Alternate programming data / digital I/O RF0 |
| 핀 D2 | PGEC2/RF1 — Alternate programming clock / digital I/O RF1 |
| 핀 D3 | CN0/RD8 — Change notification input / digital I/O RD8 |
| 핀 D4 | CN1/RD9 — Change notification input / digital I/O RD9 |
| 핀 D5 | CN2/RD10 — Change notification input / digital I/O RD10 |
| 핀 D6 | CN3/RD11 — Change notification input / digital I/O RD11 |
| 핀 D7 | PMRD/CN4/RD4 — Parallel Master Port read / digital I/O RD4 |
| 핀 D8 | PMWR/CN5/RD5 — Parallel Master Port write / digital I/O RD5 |
| 핀 D9 | D-/RF3 — USB D- data line / digital I/O RF3 |
| 핀 D10 | D+/RF2 — USB D+ data line / digital I/O RF2 |
| 핀 E1 | RG6 — Digital I/O RG6 |
| 핀 E2 | RG7 — Digital I/O RG7 |
| 핀 E3 | RG8 — Digital I/O RG8 |
| 핀 E4 | RG9 — Digital I/O RG9 |
| 핀 E5 | RG0 — Digital I/O RG0 |
| 핀 E6 | RG1 — Digital I/O RG1 |
| 핀 E7 | RD6 — Digital I/O RD6 |
| 핀 E8 | RD7 — Digital I/O RD7 |
| 핀 E9 | RF5 — Digital I/O RF5 |
| 핀 E10 | RF4 — Digital I/O RF4 |
| 핀 F1 | PMD0/RE0 — Parallel Master Port data bit 0 / digital I/O RE0 |
| 핀 F2 | PMD1/RE1 — Parallel Master Port data bit 1 / digital I/O RE1 |
| 핀 F3 | PMD2/RE2 — Parallel Master Port data bit 2 / digital I/O RE2 |
| 핀 F4 | PMD3/RE3 — Parallel Master Port data bit 3 / digital I/O RE3 |
| 핀 F5 | PMD4/RE4 — Parallel Master Port data bit 4 / digital I/O RE4 |
| 핀 F6 | PMD5/RE5 — Parallel Master Port data bit 5 / digital I/O RE5 |
| 핀 F7 | PMD6/RE6 — Parallel Master Port data bit 6 / digital I/O RE6 |
| 핀 F8 | PMD7/RE7 — Parallel Master Port data bit 7 / digital I/O RE7 |
| 핀 F9 | RD0 — Digital I/O RD0 |
| 핀 F10 | RD1 — Digital I/O RD1 |
| 핀 G1 | RF6 — Digital I/O RF6 |
| 핀 G2 | RF7 — Digital I/O RF7 |
| 핀 G3 | RF8 — Digital I/O RF8 |
| 핀 G4 | RG2 — Digital I/O RG2 |
| 핀 G5 | RG3 — Digital I/O RG3 |
| 핀 G6 | PMCS1/RD12 — PMP chip select 1 / digital I/O RD12 |
| 핀 G7 | PMCS2/RD13 — PMP chip select 2 / digital I/O RD13 |
| 핀 G8 | PMD8/RD2 — PMP data bit 8 / digital I/O RD2 |
| 핀 G9 | PMD9/RD3 — PMP data bit 9 / digital I/O RD3 |
| 핀 G10 | PMD10/RC1 — PMP data bit 10 / digital I/O RC1 |
| 핀 H1 | PMD11/RC2 — PMP data bit 11 / digital I/O RC2 |
| 핀 H2 | PMD12/RC3 — PMP data bit 12 / digital I/O RC3 |
| 핀 H3 | PMD13/RC4 — PMP data bit 13 / digital I/O RC4 |
| 핀 H4 | PMD14/RC5 — PMP data bit 14 / digital I/O RC5 |
| 핀 H5 | PMD15/RC6 — PMP data bit 15 / digital I/O RC6 |
| 핀 H6 | PMA4/RF13 — Parallel Master Port address bit 4 / digital I/O RF13 |
| 핀 H7 | PMA5/RF12 — Parallel Master Port address bit 5 / digital I/O RF12 |
| 핀 H8 | PMA6/RD15 — Parallel Master Port address bit 6 / digital I/O RD15 |
| 핀 H9 | PMA7/RD14 — Parallel Master Port address bit 7 / digital I/O RD14 |
| 핀 H10 | PMA8/RC7 — Parallel Master Port address bit 8 / digital I/O RC7 |
| 핀 J1 | PMD/RE8 — PMP data/control signal / digital I/O RE8 |
| 핀 J2 | PMALL/RE9 — PMP address latch low / digital I/O RE9 |
| 핀 J3 | PMALH/RE10 — PMP address latch high / digital I/O RE10 |
| 핀 J4 | RF0 — Digital I/O RF0 (alternate function) |
| 핀 J5 | RF1 — Digital I/O RF1 (alternate function) |
| 핀 J6 | PMA9/RG0 — PMP address bit 9 / digital I/O RG0 |
| 핀 J7 | PMA10/RG1 — PMP address bit 10 / digital I/O RG1 |
| 핀 J8 | PMA11/RF5 — PMP address bit 11 / digital I/O RF5 |
| 핀 J9 | PMA12/RF4 — PMP address bit 12 / digital I/O RF4 |
| 핀 J10 | PMA13/RG14 — PMP address bit 13 / digital I/O RG14 |
| 핀 K1 | TCK/RPA0 — JTAG Test Clock / digital I/O |
| 핀 K2 | TDO/RPA1 — JTAG Test Data Out / digital I/O |
| 핀 K3 | TDI/RPA2 — JTAG Test Data In / digital I/O |
| 핀 K4 | TMS/RPA3 — JTAG Test Mode Select / digital I/O |
| 핀 K5 | MCLR/RPA8 — Master Clear reset input / digital I/O |
| 핀 K6 | RA0 — Digital I/O RA0 |
| 핀 K7 | RA1 — Digital I/O RA1 |
| 핀 K8 | RA2 — Digital I/O RA2 |
| 핀 K9 | RA3 — Digital I/O RA3 |
| 핀 K10 | RA4 — Digital I/O RA4 |
일반적인 애플리케이션
PIC32MX570F512LT-I/GJX 적합 용도: 6 애플리케이션s: Industrial USB-CAN Communication Gateway, Capacitive-Touch Human-Machine Interface (HMI), Audio HMI with I2S Codec and DSP Pre-Processing, Low-Cost Graphics Terminal with PMP, Automotive Body and Comfort Module (CAN Bus Node), Embedded Data Acquisition Front-End.
Industrial USB-CAN Communication Gateway
The PIC32MX570F512LT-I/GJX's integrated USB 2.0 Full-Speed OTG controller and CAN 2.0B module with DeviceNet addressing make it ideal for industrial USB-to-CAN gateways used in factory automation and SCADA systems. At 50 MHz/83 DMIPS, the M4K core can simultaneously service USB HID/CDC bulk transfers and run a 1 Mbps CAN bus with full error handling, leaving headroom for protocol translation. The 512 KB Flash fits a complete USB-CAN bridge stack plus Microchip's free TCP/IP libraries for Ethernet-over-USB variants. Designers typically pair this MCU with an MCP2551 CAN transceiver and USB type-B connector; the TFBGA-100 7x7 footprint enables compact DIN-rail enclosures.
추천
Capacitive-Touch Human-Machine Interface (HMI)
The PIC32MX570F512LT-I/GJX integrates Microchip's CTMU (Charge Time Measurement Unit) and up to 16 ADC channels, enabling robust capacitive-touch keypads and sliders for white-goods HMI panels and consumer appliances. The CTMU measures capacitance deltas at microsecond resolution using a constant current source, supporting projected-capacitive (PCAP) overlays and proximity sensing without an external touch controller. With 64 KB SRAM and a hardware PMP, the part can drive small TFT displays for visual feedback alongside touch input. Engineers commonly pair this MCU with the Microchip MTCH6301 touch firmware library and route the TFBGA-100 to a 7-inch TFT via the PMP parallel interface.
추천
Audio HMI with I2S Codec and DSP Pre-Processing
The PIC32MX570F512LT-I/GJX provides two I2S interfaces plus four SPI/I2S modules, supporting direct connection to 24-bit audio codecs for voice-prompt and audio playback HMI applications. At 83 DMIPS the M4K core can run audio sample-rate conversion, basic AEC (acoustic echo cancellation), and MP3 decoding concurrently with USB host mass-storage playback. The 512 KB Flash is sufficient for ADPCM audio libraries and bootloader images, while the 64 KB SRAM accommodates double-buffered I2S sample streams without external memory. Typical designs pair this MCU with a Microchip LAN8740A Ethernet PHY for networked audio HMI panels in industrial intercom systems.
추천
Low-Cost Graphics Terminal with PMP
The PIC32MX570F512LT-I/GJX's Parallel Master Port (PMP) with dual read/write buffers can drive 3.5-inch to 4.3-inch TFT displays at refresh rates sufficient for menu-driven graphics terminals used in point-of-sale kiosks, vending machines, and industrial operator panels. With 64 KB SRAM the part can store a full graphics framebuffer for WQVGA 480x272 panels in 16-bit color, and the 50 MHz core sustains smooth scrolling animations. Microchip's free MLA graphics library provides primitives, fonts, and widgets to accelerate development. Designers typically pair this MCU with an SPI NOR flash for asset images and route the PMP data bus through the TFBGA's generous I/O count.
추천
Automotive Body and Comfort Module (CAN Bus Node)
While not AEC-Q100 qualified, the PIC32MX570F512LT-I/GJX is widely used in non-safety automotive body electronics such as door modules, seat controllers, and interior lighting nodes where its CAN 2.0B with DeviceNet addressing provides seamless integration with the vehicle bus. The 50 MHz/83 DMIPS core handles LIN-to-CAN bridging, LED-matrix driving via PWM, and peripheral diagnostics with low interrupt latency. The 100-pin TFBGA footprint and industrial -40C to +85C temperature range suit behind-the-dashboard enclosures where PCB area is constrained but full automotive certification is not required. For safety-critical ECUs, designers should migrate to AEC-Q100-qualified PIC32MK or SAM E70 family parts instead.
추천
Embedded Data Acquisition Front-End
The PIC32MX570F512LT-I/GJX integrates a 10-bit ADC with up to 1 Msps sampling across 16 input channels, suitable for low-to-mid-speed data acquisition front-ends in process-control and instrumentation applications. Combined with three on-chip analog comparators and the CTMU, the part can condition signals from thermocouples, RTDs, and 4-20 mA current loops while the USB OTG port streams digitized data to a host PC for analysis. The 512 KB Flash accommodates calibration tables and Look-Up-RoMs for linearization. Designers commonly pair this MCU with an external SPI 24-bit ADC like the MCP3564 for higher-precision applications where the on-chip 10-bit ADC is insufficient.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MX570F512LT-I/GJX — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MX570F512LT-50I/GJX | PIC32MX270F512LT-I/GJX | PIC32MX270F512LT-50I/GJX | PIC32MX570F512L-I/PT |
|---|---|---|---|---|---|
| Package | 100-pin TFBGA (7x7 mm) | 100-pin TFBGA (7x7) - same | 100-pin TFBGA (7x7) - same | 100-pin TFBGA (7x7) - same | 100-pin TQFP (12x12) - different footprint |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Maximum CPU Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 40 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| USB OTG | Yes (Full-Speed) | Yes | No | No | Yes |
| CAN 2.0B | Yes (with DeviceNet) | Yes | Yes | Yes | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Approx. Price (qty 1, USD) | $7.62 | $8.10 - $8.50 (as of 2026-10-03) | $6.50 - $7.20 (as of 2026-10-03) | $7.30 (as of 2026-10-03) | $7.85 (as of 2026-10-03) |
주요 차별점
- Combines USB 2.0 OTG and CAN 2.0B in single TFBGA-100 (vs PIC32MX270F512LT-I/GJX)
- Higher-grade 50 MHz speed bin available in same package (vs PIC32MX570F512LT-50I/GJX)
- Smallest 100-pin footprint in PIC32MX5XX family (vs PIC32MX570F512L-I/PT (TQFP-100 12x12))
설계 노트
The TFBGA-100 (7x7 mm) package requires a carefully designed PCB land pattern with via-in-pad for the BGA balls. Use a 0.4 mm ball pitch and 0.5 mm pad diameter per IPC-7351, with filled-and-capped microvias (typically 0.2-0.25 mm diameter) under each ball for signal escape. Solder mask defined (SMD) pads are preferred over non-solder mask defined (NSMD) pads for BGA packages because they reduce the risk of pad lifting during rework. Plan for at least 4 PCB layers (top signal, ground, power, bottom signal) to provide adequate routing channels between BGA escape vias.
The PIC32MX570F512LT-I/GJX operates from a single 2.3 V to 3.6 V supply. Decouple each VDD/VSS pair with a 100 nF X7R ceramic capacitor placed within 2 mm of the corresponding balls, plus a 4.7 uF bulk capacitor near the package. The USB transceiver pins (D+, D-, VBUS) require separate 100 nF decoupling close to the package to meet USB 2.0 Full-Speed signal-integrity specifications. For battery-powered designs, the on-chip LDO regulator and brown-out reset (BOR) should be enabled in the configuration bits to ensure clean startup; disable the secondary oscillator (SOSC) if not used to reduce quiescent current by approximately 30 uA.
Estimated: at the maximum 50 MHz clock with USB and CAN active and all peripherals enabled, the PIC32MX570F512LT-I/GJX dissipates approximately 75 mW. The TFBGA-100 package has a theta_JA of approximately 35 C/W on a standard JEDEC 4-layer test board, resulting in a junction temperature rise of only 2.6 C above ambient - well within the 125 C maximum junction rating. For sealed enclosures without airflow, ensure that ambient temperature plus this modest self-heating margin does not exceed 85 C, which is the upper limit of the industrial temperature grade. No heatsink is required under any reasonable operating condition.
Three common pitfalls with this MCU: (1) the 'I' suffix in the part number denotes the industrial temperature grade, but does NOT imply USB peripheral is present - some PIC32MX5XX variants ship without USB and the engineer must verify the full MPN against the datasheet ordering table; (2) the Peripheral Pin Select (PPS) feature requires unlock sequences to remap peripheral functions - forgetting the PPSUnlock macro in MPLAB Harmony causes silent I/O failures that are difficult to debug; (3) the 100-pin TFBGA is NOT pin-compatible with the 100-pin TQFP (12x12) or TQFP (14x14) variants, so footprint differences must be verified before substituting PF-suffix or PT-suffix parts onto a GJX-design PCB.
규정 준수 정보
Per Microchip product page; -40C to +85C industrial temperature grade; Pb-free and RoHS compliant; not AEC-Q100 qualified (use PIC32MK family for automotive).
