PIC32MZ2025DAS169-I/6J - 200MHz 32-bit MCU 2MB Flash | Microchip
부품 번호: PIC32MZ2025DAS169-I/6J ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.42 | $11.42 |
| 10 | $10.28 | $102.80 |
| 100 | $9.07 | $907.00 |
| 500 | $8.16 | $4,080.00 |
| 1,000 | $7.85 | $7,850.00 |
PIC32MZ2025DAS169-I/6J 개요
A 32-bit microcontroller (MCU) is a single-chip computer that combines a high-performance processor core, program and data memory, and a rich set of peripherals. The PIC32MZ family sits inside the broader taxonomy of microcontrollers -> embedded processors -> semiconductors, and uses the MIPS32 instruction set, which is widely supported by GCC, IAR, and MPLAB XC32 toolchains.
Key features include hardware graphics rendering for GUI applications, a 12-bit 18 MSPS ADC capable of 45 analog input channels, on-chip DDR2 controller eliminating external memory chips, high-speed USB 2.0 with embedded PHY, and CAN 2.0b for industrial networking. The 200 MHz core delivers 330 DMIPS and 3.28 CoreMark/MHz, while the wide 32-bit datapath accelerates pixel and audio buffer handling.
The PIC32MZ2025DAS169-I/6J architecture pairs an MIPS32 microAptiv core with a multi-layer bus matrix that allows the graphics engine, USB, and ADC to access SRAM and DDR2 without stalling the CPU. The stacked-DDR2 variant lowers BOM cost and PCB area versus an SDRAM + controller implementation, while keeping deterministic interrupt latency needed for industrial HMI.
Typical applications include industrial HMI designs, automotive dashboard graphics, IoT gateways with LCD, medical patient monitors, and audio/visual embedded consoles. The combination of on-chip DDR2 plus integrated GPU removes the need for a discrete display controller in mid-resolution TFT panels.
When designing with this device, plan the PCB for 169-ball BGA escape and follow Microchip's DDR2 layout guide for the stacked-DRAM pins. Decoupling, trace-length matching for DDR2, and thermal copper pours under the BGA are critical; otherwise signal integrity at 200 MHz will degrade.
This page synthesizes Microchip datasheet specifications, current distributor pricing, and drop-in alternatives not collated on the manufacturer's product page.
드롭인 대체품: PIC32MZ2025DAS169-I/6J — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ2025DAS169-I/6J (동일 폼 팩터 및 풋프린트) — 차이점: Graphics Controller, Operating Temperature, Core Architecture, USB, ADC.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ2025DAH169T-I/6J
✅ 드롭인✓ 재고 있음
$11.85 / 개
데이터시트 보기 →PIC32MZ2025DAG169T-I/6J
✅ 드롭인✓ 재고 있음
$11.85 / 개
데이터시트 보기 →PIC32MZ2025DAB169T-I/HF
✅ 드롭인✓ 재고 있음
$12.62 / 개
데이터시트 보기 →PIC32MZ2025DAR169-I/6J
✅ 드롭인✓ 재고 있음
$13.25 / 개
데이터시트 보기 →PIC32MZ2025DAR169T-V/6J
✅ 드롭인✓ 재고 있음
$12.1 / 개
데이터시트 보기 →PIC32MZ1064DAB169-I/HF
✅ 드롭인✓ 재고 있음
$12.4 / 개
데이터시트 보기 →PIC32MZ1064DAA169-I/HF
✅ 드롭인✓ 재고 있음
$12.1 / 개
데이터시트 보기 →PIC32MZ2025DAS169-I/6J 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 microAptiv PIC32MZ DAS |
| Core Frequency | 200 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 640 KB |
| External DDR2 DRAM | 32 MB or 128 MB stacked |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated (GPU + LCD controller) |
| USB | USB 2.0 High-Speed with embedded PHY |
| CAN | CAN 2.0b |
| GPIO | 120 |
| 동작 온도 | -40C to +85C (Industrial, "-I") |
| 패키지 | 169-LFBGA (11x11 mm) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
PIC32MZ2025DAS169-I/6J 핀 구성
| 핀 A1 | GPIO/RB0 — General purpose I/O pin |
| 핀 B5 | VDD — Core supply voltage |
| 핀 C7 | VSS — Ground reference |
| 핀 D4 | OSC1 — Crystal oscillator input |
| 핀 E2 | OSC2 — Crystal oscillator output |
| 핀 F8 | AN0 — Analog input channel 0 |
| 핀 G3 | AN1 — Analog input channel 1 |
| 핀 H10 | USB_DP — USB D+ data line |
| 핀 J1 | USB_DM — USB D- data line |
| 핀 K12 | CAN_TX — CAN 2.0b transmit |
| 핀 L5 | CAN_RX — CAN 2.0b receive |
| 핀 M8 | DDR2_DQ0 — DDR2 data lane 0 |
| 핀 N2 | DDR2_DQ1 — DDR2 data lane 1 |
| 핀 P11 | LCD_DATA — LCD RGB data line |
| 핀 R6 | LCD_HSYNC — LCD horizontal sync |
| 핀 T9 | LCD_VSYNC — LCD vertical sync |
| 핀 U4 | TCK — JTAG test clock |
| 핀 V13 | TMS — JTAG test mode select |
| 핀 W7 | TDO — JTAG test data out |
| 핀 Y10 | TDI — JTAG test data in |
일반적인 애플리케이션
PIC32MZ2025DAS169-I/6J 적합 용도: 7 애플리케이션s: Industrial HMI with TFT LCD, Automotive Dashboard Graphics, Medical Patient Monitor Display, IoT Gateway with Local Display, Point-of-Sale Terminal, Audio-Visual Embedded Console, Smart Home Control Panel.
Industrial HMI with TFT LCD
The PIC32MZ2025DAS169-I/6J drives mid-resolution WX870-class HMI displays in factory automation. Its 200 MHz MIPS32 core plus integrated 2D GPU and 128 MB stacked DDR2 eliminate an external LCD controller, reducing PCB layers and BOM cost by 20-30%. The 12-bit 18 MSPS ADC with 45 analog inputs reads temperature, pressure, and current sensors in parallel, supporting predictive-maintenance algorithms. Pair with a 4-wire resistive or capacitive touch controller over the same GPIO bus for sealed front-panel designs meeting IP65 ingress.
추천
Automotive Dashboard Graphics
In instrument clusters and head-unit displays, the PIC32MZ2025DAS169-I/6J provides the GPU and DDR2 bandwidth required for 60 fps graphics on WVGA panels. The integrated CAN 2.0b controller talks to vehicle body and powertrain networks, while HS USB supports smartphone-mirroring stacks such as CarPlay and Android Auto bridges. The -I industrial temp range suits cabin-mounted modules; for under-hood or sun-exposed placements, swap to the -V or automotive-qualified sister in DAH. The 169-LFBGA package fits behind compact cluster bezels with proper PCB stacking.
추천
Medical Patient Monitor Display
Bedside patient monitors benefit from the PIC32MZ2025DAS169-I/6J's combination of high-resolution ADC and graphics controller. The 12-bit 18 MSPS ADC acquires multi-lead ECG, SpO2, and respiration waveforms at full clinical bandwidth, while the integrated GPU renders crisp waveforms and trend graphs on TFT panels. The 128 MB stacked DDR2 enables multi-trace full-history scroll-back without dropping samples. The industrial temperature range covers operating-room thermal envelopes when paired with conformal coating.
추천
IoT Gateway with Local Display
IoT edge gateways use the PIC32MZ2025DAS169-I/6J to aggregate sensor data, run local visualization, and bridge to cloud stacks. The 200 MHz core runs TLS 1.3 handshakes while the GPU renders system-status dashboards on TFT panels for field staff. The HS USB port supports Wi-Fi or LTE dongles for backhaul, and CAN interfaces with industrial sensors and motor drives. Stacked DDR2 means the gateway can buffer days of time-series telemetry locally before uplink, ideal for spotty-connectivity sites.
추천
Point-of-Sale Terminal
POS terminals need responsive GUI plus secure transaction processing, both delivered by the PIC32MZ2025DAS169-I/6J. The MIPS32 core at 200 MHz handles cryptographic payment flows while the GPU drives the cashier-facing color TFT and customer-facing secondary display via stacking. The HS USB port interfaces with peripherals such as barcode scanners and receipt printers. Industrial temperature range ensures reliability in kitchens and outdoor kiosks.
추천
Audio-Visual Embedded Console
Audio mixers, DJ controllers, and AV control surfaces use the PIC32MZ2025DAS169-I/6J to drive color LCD screens showing EQ curves, fader positions, and spectrum visualizations. The 128 MB DDR2 holds waveform textures and macro libraries; the GPU accelerates spectrum FFT overlays at full frame rate. Multiple ADC channels read fader potentiometers, encoder knobs, and touch strips simultaneously. USB HS supports class-compliant MIDI to DAW hosts.
추천
Smart Home Control Panel
Wall-mounted smart-home control panels benefit from the PIC32MZ2025DAS169-I/6J's integrated graphics and capacitive touch support. The GPU drives the main status panel with room temperatures, energy usage graphs, and intercom video previews. CAN interfaces with HVAC and lighting buses, while HS USB supports firmware updates via standard USB drives. Industrial temperature range covers indoor-wall thermal envelopes; for outdoor panels use the -V automotive-grade sister DAH.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ2025DAS169-I/6J — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ2025DAH169T-I/6J | PIC32MZ2025DAG169T-I/6J | PIC32MZ2025DAR169-I/6J | PIC32MZ1064DAB169-I/HF |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| ADC | 12-bit 18 MSPS, 45 ch | 12-bit 18 MSPS, 45 ch | 12-bit 18 MSPS, 45 ch | 12-bit 18 MSPS, 45 ch | 12-bit 18 MSPS, 45 ch |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +125C (Automotive) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| USB / CAN | HS USB + CAN 2.0b | HS USB + CAN 2.0b | HS USB + CAN 2.0b | HS USB + CAN 2.0b | HS USB + CAN 2.0b |
주요 차별점
- Largest stacked DDR2 in the family (vs PIC32MZ2025DAR169-I/6J)
- Industrial vs automotive temp grade (vs PIC32MZ2025DAH169T-I/6J)
- Full GPU feature set vs reduced (vs PIC32MZ2025DAG169T-I/6J)
- Highest 2 MB Flash with full peripheral set (vs PIC32MZ1064DAB169-I/HF)
설계 노트
Estimated: 169-LFBGA (11x11 mm) at 0.8 mm pitch requires microvia stack-up with via-in-pad recommended for inner-row BGA balls. The DDR2 stacked-DRAM balls (typically rows M-N) demand 50 ohm single-ended trace impedance and matched-length routing within 25 mil across the byte lane. Use Microchip AN1478 PCB layout guidelines for PIC32MZ DA family to avoid DDR2 training failures.
At 200 MHz with all peripherals active, the PIC32MZ2025DAS169-I/6J dissipates approximately 1.2-1.6 W depending on workload. Place a continuous ground plane under the BGA and thermal via array (0.3 mm drill, 1.0 mm pitch) to spread heat. Industrial-grade -I parts are spec'd to 85C ambient; derate to 1.0 W with 4-layer FR-4 and adequate copper pour.
Decouple each VDD/VBAT pair with 100 nF X7R plus 4.7 uF bulk ceramic placed within 5 mm of BGA balls. The DDR2 supply (typically 1.8 V) needs a separate ferrite filter from the MCU core supply and a low-noise LDO; ripple above 50 mVpp can cause DDR2 training retries and visual artifacts on the LCD. Sequence power rails with the MCU's built-in POR to avoid latch conditions.
Do not omit the external 12 MHz crystal loading capacitors; the MCU's internal PLL will not lock reliably without correct C_L values per Microchip errata. The DDR2 self-refresh mode must be entered before deep sleep to preserve DRAM contents; firmware libraries in MPLAB Harmony v3 handle this automatically when properly configured.
Keep USB_DP/USB_DM traces 90 ohm differential with length matching within 150 mil, and route away from switching regulator nodes to avoid radiated emissions failing FCC Part 15B. The HS USB PHY requires a 45 ohm series resistor pair on each line per USB 2.0 spec. Microchip AN1363 covers USB PCB layout for PIC32MZ devices.
규정 준수 정보
RoHS compliant per Microchip product page. Not AEC-Q100 qualified in standard -I grade; choose PIC32MZ2025DAH169T-I/6J for AEC-Q100 automotive applications.