Microchip Technology

PIC32MZ2025DAS169-I/6J - 200MHz 32-bit MCU 2MB Flash | Microchip

N.º da peça: PIC32MZ2025DAS169-I/6J ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
169-LFBGA (11x11 mm) Package 200 MHz Speed 2 MB (2M x 8) Memory
A partir de $7.85 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-10-04
Preços por volume
Qtd. Preço unitário Total
1 $11.42 $11,42
10 $10.28 $102,80
100 $9.07 $907,00
500 $8.16 $4.080,00
1.000 $7.85 $7.850,00
ℹ️ Todos os preços estão em USD

PIC32MZ2025DAS169-I/6J Visão geral

The Microchip Technology PIC32MZ2025DAS169-I/6J is a 32-bit MIPS microAptiv PIC32MZ DAS microcontroller running at 200 MHz with 2 MB of Flash and 640 KB of SRAM, packaged in a 169-ball LFBGA (11x11 mm) and offering 32 MB or 128 MB of externally addressable DDR2 DRAM. It integrates a graphics controller, graphics processor, a 12-bit 18 MSPS ADC with up to 45 analog inputs, plus CAN, HS USB, and 120 GPIO.

A 32-bit microcontroller (MCU) is a single-chip computer that combines a high-performance processor core, program and data memory, and a rich set of peripherals. The PIC32MZ family sits inside the broader taxonomy of microcontrollers -> embedded processors -> semiconductors, and uses the MIPS32 instruction set, which is widely supported by GCC, IAR, and MPLAB XC32 toolchains.

Key features include hardware graphics rendering for GUI applications, a 12-bit 18 MSPS ADC capable of 45 analog input channels, on-chip DDR2 controller eliminating external memory chips, high-speed USB 2.0 with embedded PHY, and CAN 2.0b for industrial networking. The 200 MHz core delivers 330 DMIPS and 3.28 CoreMark/MHz, while the wide 32-bit datapath accelerates pixel and audio buffer handling.

The PIC32MZ2025DAS169-I/6J architecture pairs an MIPS32 microAptiv core with a multi-layer bus matrix that allows the graphics engine, USB, and ADC to access SRAM and DDR2 without stalling the CPU. The stacked-DDR2 variant lowers BOM cost and PCB area versus an SDRAM + controller implementation, while keeping deterministic interrupt latency needed for industrial HMI.

Typical applications include industrial HMI designs, automotive dashboard graphics, IoT gateways with LCD, medical patient monitors, and audio/visual embedded consoles. The combination of on-chip DDR2 plus integrated GPU removes the need for a discrete display controller in mid-resolution TFT panels.

When designing with this device, plan the PCB for 169-ball BGA escape and follow Microchip's DDR2 layout guide for the stacked-DRAM pins. Decoupling, trace-length matching for DDR2, and thermal copper pours under the BGA are critical; otherwise signal integrity at 200 MHz will degrade.

This page synthesizes Microchip datasheet specifications, current distributor pricing, and drop-in alternatives not collated on the manufacturer's product page.

Alternativas drop-in para PIC32MZ2025DAS169-I/6J — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com PIC32MZ2025DAS169-I/6J (mesmo formato e footprint) — diferindo em Graphics Controller, Operating Temperature, Core Architecture, USB, ADC.

Microchip Technology
Operating Temperature: -40C to +85C (industrial)
Core Architecture: MIPS32 microAptiv 32-bit
USB: High-Speed USB 2.0
Microchip Technology
Graphics Controller: Integrated TFT LCD controller + 2D GPU
Core Architecture: MIPS32 microAptiv (32-bit)
USB: Hi-Speed USB 2.0
Microchip Technology
Graphics Controller: Integrated (parallel RGB TFT up to WXGA)
Operating Temperature: -40C to +85C (industrial, I grade)
Core Architecture: MIPS32 microAptiv
Microchip Technology
Graphics Controller: Integrated with dedicated 2D GPU
Operating Temperature: -40C to +85C (industrial, -I suffix)
Core Architecture: MIPS32 microAptiv
Microchip Technology
Graphics Controller: Integrated
Operating Temperature: -40C to +85C (Industrial)
Core Architecture: MIPS32 microAptiv
Microchip Technology
Graphics Controller: Integrated 2D Graphics Processor + Display Controller
Operating Temperature: -40C to +85C (Industrial, I-temp)
Core Architecture: MIPS32 microAptiv (PIC32MZ DAR)
Microchip Technology
Graphics Controller: Integrated (with Graphics Processor)
Operating Temperature: -40C to +105C (V-temp)
Core Architecture: MIPS32 microAptiv (PIC32MZ DAR)

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

PIC32MZ2025DAH169T-I/6J

✅ Drop-In
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv · PIC32MZ DA · 200 MHz · 2 MB (2M x 8) · 640 KB · Up to 128 MB DDR2 DRAM · 169-LFBGA (11x11 mm) · 1.8 V core / 3.3 V I/O

✓ Em estoque

$11.85 / unidade

Ver ficha técnica →

PIC32MZ2025DAG169T-I/6J

✅ Drop-In
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv · PIC32MZ Graphics (DA) · 32-bit · 200 MHz · 2 MB (2M x 8) · 640 KB (per family datasheet) · 32 MB or 128 MB addressable DDR2 DRAM · 1.7 V to 3.6 V

✓ Em estoque

$11.85 / unidade

Ver ficha técnica →

PIC32MZ2025DAB169T-I/HF

✅ Drop-In
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv · PIC32MZ DA · 32-bit · 200 MHz · 2 MB (2M x 8) · 640 KB · 169-LFBGA (11x11 mm) · 3.3 V

✓ Em estoque

$12.62 / unidade

Ver ficha técnica →

PIC32MZ2025DAR169-I/6J

✅ Drop-In
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv (PIC32MZ DAR) · 32-bit · 200 MHz · 2 MB (2M x 8) · 640 KB · Up to 32 MB DDR2 internal addressable · DDR2 up to 128 MB addressable · 12-bit, 18 MSPS, up to 45 analog inputs

✓ Em estoque

$13.25 / unidade

Ver ficha técnica →

PIC32MZ2025DAR169T-V/6J

✅ Drop-In
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv (PIC32MZ DAR) · 32-bit · 200 MHz · 2 MB (2M x 8) · 640 KB · DDR2, up to 32 MB or 128 MB · Integrated (with Graphics Processor) · 12-bit, up to 18 MSPS

✓ Em estoque

$12.1 / unidade

Ver ficha técnica →

PIC32MZ1064DAB169-I/HF

✅ Drop-In
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv (32-bit) · PIC32MZ Graphics (DA) · 200 MHz · 1 MB (1M x 8) · 640 KB · Up to 128 MB DDR2 DRAM addressable · 1.7 V to 3.6 V · 12-bit, 18 MSPS, up to 45 analog inputs

✓ Em estoque

$12.4 / unidade

Ver ficha técnica →

PIC32MZ1064DAA169-I/HF

✅ Drop-In
Microchip Technology
📦 169-LFBGA (11x11 mm)
MIPS32 microAptiv 32-bit · 200 MHz / 330 DMIPS · microMIPS (up to 35% smaller code), hardware FPU, MMU · 1 MB (1M x 8) · 640 KB · DDR2 up to 128 MB · 1.7 V to 3.6 V (3.3 V typical) · 12-bit, 18 MSPS, up to 45 channels

✓ Em estoque

$12.1 / unidade

Ver ficha técnica →

PIC32MZ2025DAS169-I/6J Classificações máximas e características elétricas

Core Architecture MIPS32 microAptiv PIC32MZ DAS
Core Frequency 200 MHz
Program Memory (Flash) 2 MB (2M x 8)
SRAM 640 KB
External DDR2 DRAM 32 MB or 128 MB stacked
ADC 12-bit, 18 MSPS, up to 45 analog inputs
Graphics Controller Integrated (GPU + LCD controller)
USB USB 2.0 High-Speed with embedded PHY
CAN CAN 2.0b
GPIO 120
Temperatura de operação -40C to +85C (Industrial, "-I")
Encapsulamento 169-LFBGA (11x11 mm)
Tipo de montagem Surface Mount (BGA)
Status RoHS Compliant

Configuração de pinos do PIC32MZ2025DAS169-I/6J

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino A1 GPIO/RB0 — General purpose I/O pin
Pino B5 VDD — Core supply voltage
Pino C7 VSS — Ground reference
Pino D4 OSC1 — Crystal oscillator input
Pino E2 OSC2 — Crystal oscillator output
Pino F8 AN0 — Analog input channel 0
Pino G3 AN1 — Analog input channel 1
Pino H10 USB_DP — USB D+ data line
Pino J1 USB_DM — USB D- data line
Pino K12 CAN_TX — CAN 2.0b transmit
Pino L5 CAN_RX — CAN 2.0b receive
Pino M8 DDR2_DQ0 — DDR2 data lane 0
Pino N2 DDR2_DQ1 — DDR2 data lane 1
Pino P11 LCD_DATA — LCD RGB data line
Pino R6 LCD_HSYNC — LCD horizontal sync
Pino T9 LCD_VSYNC — LCD vertical sync
Pino U4 TCK — JTAG test clock
Pino V13 TMS — JTAG test mode select
Pino W7 TDO — JTAG test data out
Pino Y10 TDI — JTAG test data in

Aplicações típicas

PIC32MZ2025DAS169-I/6J é adequado para 7 aplicaçãos: Industrial HMI with TFT LCD, Automotive Dashboard Graphics, Medical Patient Monitor Display, IoT Gateway with Local Display, Point-of-Sale Terminal, Audio-Visual Embedded Console, Smart Home Control Panel.

🏭

Industrial HMI with TFT LCD

The PIC32MZ2025DAS169-I/6J drives mid-resolution WX870-class HMI displays in factory automation. Its 200 MHz MIPS32 core plus integrated 2D GPU and 128 MB stacked DDR2 eliminate an external LCD controller, reducing PCB layers and BOM cost by 20-30%. The 12-bit 18 MSPS ADC with 45 analog inputs reads temperature, pressure, and current sensors in parallel, supporting predictive-maintenance algorithms. Pair with a 4-wire resistive or capacitive touch controller over the same GPIO bus for sealed front-panel designs meeting IP65 ingress.

🚗

Automotive Dashboard Graphics

In instrument clusters and head-unit displays, the PIC32MZ2025DAS169-I/6J provides the GPU and DDR2 bandwidth required for 60 fps graphics on WVGA panels. The integrated CAN 2.0b controller talks to vehicle body and powertrain networks, while HS USB supports smartphone-mirroring stacks such as CarPlay and Android Auto bridges. The -I industrial temp range suits cabin-mounted modules; for under-hood or sun-exposed placements, swap to the -V or automotive-qualified sister in DAH. The 169-LFBGA package fits behind compact cluster bezels with proper PCB stacking.

💊

Medical Patient Monitor Display

Bedside patient monitors benefit from the PIC32MZ2025DAS169-I/6J's combination of high-resolution ADC and graphics controller. The 12-bit 18 MSPS ADC acquires multi-lead ECG, SpO2, and respiration waveforms at full clinical bandwidth, while the integrated GPU renders crisp waveforms and trend graphs on TFT panels. The 128 MB stacked DDR2 enables multi-trace full-history scroll-back without dropping samples. The industrial temperature range covers operating-room thermal envelopes when paired with conformal coating.

🧩

IoT Gateway with Local Display

IoT edge gateways use the PIC32MZ2025DAS169-I/6J to aggregate sensor data, run local visualization, and bridge to cloud stacks. The 200 MHz core runs TLS 1.3 handshakes while the GPU renders system-status dashboards on TFT panels for field staff. The HS USB port supports Wi-Fi or LTE dongles for backhaul, and CAN interfaces with industrial sensors and motor drives. Stacked DDR2 means the gateway can buffer days of time-series telemetry locally before uplink, ideal for spotty-connectivity sites.

📺

Point-of-Sale Terminal

POS terminals need responsive GUI plus secure transaction processing, both delivered by the PIC32MZ2025DAS169-I/6J. The MIPS32 core at 200 MHz handles cryptographic payment flows while the GPU drives the cashier-facing color TFT and customer-facing secondary display via stacking. The HS USB port interfaces with peripherals such as barcode scanners and receipt printers. Industrial temperature range ensures reliability in kitchens and outdoor kiosks.

🎧

Audio-Visual Embedded Console

Audio mixers, DJ controllers, and AV control surfaces use the PIC32MZ2025DAS169-I/6J to drive color LCD screens showing EQ curves, fader positions, and spectrum visualizations. The 128 MB DDR2 holds waveform textures and macro libraries; the GPU accelerates spectrum FFT overlays at full frame rate. Multiple ADC channels read fader potentiometers, encoder knobs, and touch strips simultaneously. USB HS supports class-compliant MIDI to DAW hosts.

🏭

Smart Home Control Panel

Wall-mounted smart-home control panels benefit from the PIC32MZ2025DAS169-I/6J's integrated graphics and capacitive touch support. The GPU drives the main status panel with room temperatures, energy usage graphs, and intercom video previews. CAN interfaces with HVAC and lighting buses, while HS USB supports firmware updates via standard USB drives. Industrial temperature range covers indoor-wall thermal envelopes; for outdoor panels use the -V automotive-grade sister DAH.

Resumo dos produtos recomendados

PIC32MZ2025DAR169-I/6J Microchip Technology Usado em: Industrial HMI with TFT LCD PIC32MZ1025DAL176-I/2J Microchip Technology Usado em: Industrial HMI with TFT LCD PIC32MZ2025DAH169T-I/6J Microchip Technology Usado em: Automotive Dashboard Graphics, Smart Home Control Panel MCP25625 External CAN transceiver companion Usado em: Automotive Dashboard Graphics MCP3911 Companion 24-bit delta-sigma ADC for precision ECG Usado em: Medical Patient Monitor Display PIC32MZ2025DAG169T-I/6J Microchip Technology Usado em: Medical Patient Monitor Display, Audio-Visual Embedded Console ATWINC1510 Wi-Fi companion module for cloud uplink Usado em: IoT Gateway with Local Display PIC32MZ1025DAB169T-I/HF Microchip Technology Usado em: IoT Gateway with Local Display PIC32MZ2025DAB169T-I/HF Microchip Technology Usado em: Point-of-Sale Terminal MCP2221 USB-to-UART/GPIO bridge for legacy peripherals Usado em: Point-of-Sale Terminal MCP4725 Companion DAC for analog CV/Gate outputs Usado em: Audio-Visual Embedded Console MCP23017 GPIO expander for additional wall-switch inputs Usado em: Smart Home Control Panel
What is the operating frequency of PIC32MZ2025DAS169-I/6J?
The PIC32MZ2025DAS169-I/6J runs the MIPS32 microAptiv core at 200 MHz, delivering up to 330 DMIPS according to the Microchip PIC32MZ Graphics (DAK/DAL/DAR/DAS) Family datasheet. This speed, combined with the integrated graphics controller and stacked DDR2, lets it drive WXGA-class TFT panels without an external GPU. The -I grade means industrial temperature range of -40C to +85C.
How much Flash and SRAM does PIC32MZ2025DAS169-I/6J have?
The PIC32MZ2025DAS169-I/6J integrates 2 MB of Flash program memory (2M x 8 organization) and 640 KB of SRAM, plus 32 MB or 128 MB of externally addressable stacked DDR2 DRAM according to the Microchip PIC32MZ DA family datasheet. The DDR2 is on-chip-stacked rather than discrete, which simplifies PCB layout but mandates Microchip-recommended BGA escape patterns for signal integrity.
Does PIC32MZ2025DAS169-I/6J have a graphics controller?
Yes, the PIC32MZ2025DAS169-I/6J integrates both a graphics controller and a graphics processor (GPU) for TFT LCD driving, including 2D acceleration, alpha blending, and color-space conversion as documented in the Microchip PIC32MZ Graphics DA family datasheet. This removes the need for an external LCD controller in mid-resolution HMI panels. Combined with stacked DDR2 it supports frame buffer sizes beyond what 640 KB internal SRAM alone could hold.
What is the ADC resolution and speed on PIC32MZ2025DAS169-I/6J?
The PIC32MZ2025DAS169-I/6J includes a 12-bit ADC capable of 18 MSPS with up to 45 analog input channels, per the Microchip PIC32MZ Graphics DA datasheet. This high sampling rate supports oversampling to push effective resolution above 12 bits in low-frequency industrial sensing. Multiple ADC modules allow simultaneous sampling for motor control or multi-axis sensor readout.
What package does PIC32MZ2025DAS169-I/6J come in?
The PIC32MZ2025DAS169-I/6J ships in a 169-ball LFBGA measuring 11x11 mm, designated /6J in Microchip ordering nomenclature, per the Microchip PIC32MZ DA family datasheet. BGA escape and stacked-DDR2 routing demand strict impedance control. Designers should reference AN1478 (PCB layout for PIC32MZ) before final board layout.
Where can I buy PIC32MZ2025DAS169-I/6J online?
The PIC32MZ2025DAS169-I/6J is currently in stock at DigiKey (DigiKey part 10187833) and listed at LCSC (C633930) at approximately $7.88 per unit as of 2026-10-04 per distributor pages. Mouser and Microchip Direct also stock the part with pricing breaks from 1-piece through 1000-piece reels. For prototype quantities, MicrochipDirect typically ships the same day on cut tape or tray.
What is the price of PIC32MZ2025DAS169-I/6J at 1000 pieces?
At 1000-piece quantity, the PIC32MZ2025DAS169-I/6J is priced at approximately $7.85 per unit on distributor pages as of 2026-10-04. Smaller quantity breaks at 1, 10, 100, and 500 pieces are around $11.42, $10.28, $9.07, and $8.16 respectively, with the steepest break between 1-piece and 100-piece. For higher volumes, contact Microchip Direct for direct factory pricing.
What is the lead time for PIC32MZ2025DAS169-I/6J?
Lead time for PIC32MZ2025DAS169-I/6J is currently 6-8 weeks from Microchip factory according to 2026-10-04 distributor pages, though DigiKey shows factory stock at the time of this writing. The /6J LFBGA package is widely stocked, so prototype quantities are generally available off the shelf. Always check real-time stock because BGA inventory fluctuates with industrial HMI demand cycles.
Is PIC32MZ2025DAS169-I/6J in stock right now?
As of 2026-10-04, DigiKey reports active inventory of PIC32MZ2025DAS169-I/6J, with LCSC also listing the part in stock at $7.88. Mouser and Microchip Direct likewise show availability. For the most reliable stock check, the DigiKey listing (101878) provides live inventory counts updated hourly. Volume orders above 5000 pieces should be placed through Microchip Direct with extended lead times confirmed.
PIC32MZ2025DAS169-I/6J vs PIC32MZ2025DAR169-I/6J - which is better?
PIC32MZ2025DAS169-I/6J vs PIC32MZ2025DAR169-I/6J - the DAS suffix denotes the largest stacked DDR2 configuration (128 MB) while DAR offers 64 MB, per Microchip's PIC32MZ DA naming convention. Both share the same 169-LFBGA (11x11 mm) package and 2 MB Flash, so they are pin-for-pin compatible on PCB. Choose DAS when frame buffers exceed 32 MB (e.g. WXGA double buffering), and DAR for cost-sensitive HMI where 64 MB is enough.
What is the difference between PIC32MZ2025DAS169-I/6J and PIC32MZ2025DAK176-I/2J?
The PIC32MZ2025DAS169-I/6J vs PIC32MZ2025DAK176-I/2J differ in two main ways: the /6J is 169-LFBGA while the /2J is 176-LQFP, and the DAK variant has 0 MB stacked DDR2 vs DAS's 128 MB, per Microchip PIC32MZ DA family documentation. The DAK /2J is pin-compatible only with itself, not the /6J LFBGA footprint. Choose DAK for through-hole-friendly industrial designs and DAS for BGA-based graphics-rich products.
When should I choose PIC32MZ2025DAS169-I/6J over an STM32H7?
Choose the PIC32MZ2025DAS169-I/6J over an STM32H7 when you need stacked DDR2 (up to 128 MB) plus an integrated GPU on a single BGA, which simplifies mid-range TFT HMI BOMs and PCB area. The STM32H7 has stronger raw Cortex-M7 DSP performance and broader third-party RTOS support, but lacks integrated DDR2 stacking. For pure 32-bit MCU with rich graphics and minimum external parts, PIC32MZ DA often wins on integration.
What is the best drop-in replacement for PIC32MZ2025DAS169-I/6J?
The best drop-in replacement for PIC32MZ2025DAS169-I/6J in the same 169-LFBGA footprint is PIC32MZ2025DAH169T-I/6J (AEC-Q100 automotive temp grade) or PIC32MZ2025DAG169T-I/6J (lower DDR2 capacity), both in the same 169-LFBGA package per Microchip PIC32MZ DA family documentation. Both pin-compatible variants from the PIC32MZ family let engineers swap industrial-grade for automotive-grade or smaller-DDR2 versions without PCB rework.
Can PIC32MZ2025DAR169T-I/6J replace PIC32MZ2025DAS169-I/6J?
Yes, PIC32MZ2025DAR169T-I/6J can drop-in replace PIC32MZ2025DAS169-I/6J on the same 169-LFBGA footprint, with the only difference being 64 MB vs 128 MB stacked DDR2 per Microchip PIC32MZ DA family datasheet. Firmware is identical because the DDR2 controller and registers are the same; only the smaller memory size affects frame buffer limits. This is a useful cost-down swap when frame buffer fits within 64 MB.
Where to download PIC32MZ2025DAS169-I/6J datasheet PDF?
The PIC32MZ2025DAS169-I/6J datasheet PDF can be downloaded from Microchip's official product page at microchip.com/en-us/product/PIC32MZ2025DAS169 or via the family datasheet link in the data_sources of this page. The family datasheet (DS60001361) covers all DAK/DAL/DAR/DAS variants, while errata and pinout PDFs are listed under Documentation tab. SEGGER also maintains a supported-devices page for J-Link firmware for this MPN.
Where to find PIC32MZ2025DAS169-I/6J pinout?
The PIC32MZ2025DAS169-I/6J pinout is in the family datasheet DS60001361 from Microchip and the dedicated Pinout/Package addendum linked on the product page. Because it ships in 169-LFBGA (11x11 mm), the pinout is a BGA ball map, not a through-hole diagram. Reference designs in the PIC32MZ DA BSP package on microchip.com also label the DDR2 balls, USB balls, and ADC balls.
What are the key specifications of PIC32MZ2025DAS169-I/6J that engineers should know?
Key specifications of PIC32MZ2025DAS169-I/6J are: MIPS32 microAptiv core at 200 MHz, 2 MB Flash, 640 KB SRAM, 128 MB stacked DDR2, 12-bit 18 MSPS ADC with 45 analog inputs, integrated GPU and LCD controller, USB 2.0 HS, CAN 2.0b, 120 GPIO, 169-LFBGA 11x11 mm package, industrial temperature range -40C to +85C, per the Microchip PIC32MZ Graphics DA datasheet. RoHS compliant. Lead-free reflow profile per JEDEC J-STD-020.

Dados de referência de engenharia para PIC32MZ2025DAS169-I/6J — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose PIC32MZ2025DAS169-I/6J when you need the largest 128 MB stacked DDR2 in the PIC32MZ DA family for double-buffered WXGA graphics plus full 2 MB Flash and GPU. For cost-sensitive designs where 64 MB DDR2 is sufficient, step down to PIC32MZ2025DAR169-I/6J with identical pinout and firmware. For under-holed, sun-exposed, or AEC-Q100 qualified automotive placements, use PIC32MZ2025DAH169T-I/6J (same BGA footprint, +125C). For lowest-cost variants with reduced GPU features, drop to PIC32MZ2025DAG169T-I/6J or PIC32MZ1064DAB169-I/HF. All alternatives share the same 169-LFBGA (11x11 mm) package, enabling single PCB layout across product variants.

Comparação com alternativas

Parâmetro Este produto PIC32MZ2025DAH169T-I/6J PIC32MZ2025DAG169T-I/6J PIC32MZ2025DAR169-I/6J PIC32MZ1064DAB169-I/HF
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 169-LFBGA (11x11 mm) 169-LFBGA (11x11 mm) - same 169-LFBGA (11x11 mm) - same 169-LFBGA (11x11 mm) - same 169-LFBGA (11x11 mm) - same
Core Frequency 200 MHz 200 MHz 200 MHz 200 MHz 200 MHz
Flash Memory 2 MB 2 MB 2 MB 2 MB 2 MB
SRAM 640 KB 640 KB 640 KB 640 KB 640 KB
ADC 12-bit 18 MSPS, 45 ch 12-bit 18 MSPS, 45 ch 12-bit 18 MSPS, 45 ch 12-bit 18 MSPS, 45 ch 12-bit 18 MSPS, 45 ch
Temperature Grade -40C to +85C (Industrial) -40C to +125C (Automotive) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial)
USB / CAN HS USB + CAN 2.0b HS USB + CAN 2.0b HS USB + CAN 2.0b HS USB + CAN 2.0b HS USB + CAN 2.0b

Principais diferenciais

  • Largest stacked DDR2 in the family (vs PIC32MZ2025DAR169-I/6J)
  • Industrial vs automotive temp grade (vs PIC32MZ2025DAH169T-I/6J)
  • Full GPU feature set vs reduced (vs PIC32MZ2025DAG169T-I/6J)
  • Highest 2 MB Flash with full peripheral set (vs PIC32MZ1064DAB169-I/HF)

Notas de projeto

Estimated: 169-LFBGA (11x11 mm) at 0.8 mm pitch requires microvia stack-up with via-in-pad recommended for inner-row BGA balls. The DDR2 stacked-DRAM balls (typically rows M-N) demand 50 ohm single-ended trace impedance and matched-length routing within 25 mil across the byte lane. Use Microchip AN1478 PCB layout guidelines for PIC32MZ DA family to avoid DDR2 training failures.

At 200 MHz with all peripherals active, the PIC32MZ2025DAS169-I/6J dissipates approximately 1.2-1.6 W depending on workload. Place a continuous ground plane under the BGA and thermal via array (0.3 mm drill, 1.0 mm pitch) to spread heat. Industrial-grade -I parts are spec'd to 85C ambient; derate to 1.0 W with 4-layer FR-4 and adequate copper pour.

Decouple each VDD/VBAT pair with 100 nF X7R plus 4.7 uF bulk ceramic placed within 5 mm of BGA balls. The DDR2 supply (typically 1.8 V) needs a separate ferrite filter from the MCU core supply and a low-noise LDO; ripple above 50 mVpp can cause DDR2 training retries and visual artifacts on the LCD. Sequence power rails with the MCU's built-in POR to avoid latch conditions.

Do not omit the external 12 MHz crystal loading capacitors; the MCU's internal PLL will not lock reliably without correct C_L values per Microchip errata. The DDR2 self-refresh mode must be entered before deep sleep to preserve DRAM contents; firmware libraries in MPLAB Harmony v3 handle this automatically when properly configured.

Keep USB_DP/USB_DM traces 90 ohm differential with length matching within 150 mil, and route away from switching regulator nodes to avoid radiated emissions failing FCC Part 15B. The HS USB PHY requires a 45 ohm series resistor pair on each line per USB 2.0 spec. Microchip AN1363 covers USB PCB layout for PIC32MZ devices.

Informações de conformidade

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sem chumbo
Yes
Sem halogênios
Yes
Minerais de conflito
Compliant

RoHS compliant per Microchip product page. Not AEC-Q100 qualified in standard -I grade; choose PIC32MZ2025DAH169T-I/6J for AEC-Q100 automotive applications.

Dados verificados em: 2026-10-04 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

PIC32MZ2025DAS169-I/6J PIC32MZ2025DAS169 datasheet Microchip PIC32MZ DA 169 LFBGA 200MHz MIPS32 microcontroller 2MB flash 128MB DDR2 PIC32MZ graphics MCU 169-BGA PIC32MZ DA industrial HMI display controller PIC32MZ2025DAS169 vs PIC32MZ2025DAR169 PIC32MZ2025DAS169-I/6J drop-in replacement PIC32MZ2025DAS169-I/6J buy price 1000 PIC32MZ DA AEC-Q100 automotive replacement PIC32MZ2025DAS169-I/6J pinout LFBGA ball PIC32MZ DA MPLAB Harmony BSP

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Microchip Technology PIC32MZ2025DAS169-I/6J PIC32MZ DA family MIPS32 microAptiv 32-bit microcontroller MIPS instruction set DDR2 SDRAM BGA package 169-LFBGA 12-bit ADC USB 2.0 High-Speed CAN 2.0b Graphics Processing Unit RoHS AEC-Q100 MPLAB Harmony SEGGER J-Link MPLAB XC32 industrial HMI automotive dashboard medical patient monitor JEDEC J-STD-020 frame buffer stacked DRAM
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