PIC32MZ2048EFH124-E/TL - 32-bit MCU 200MHz 2MB Flash 124-VTLA
부품 번호: PIC32MZ2048EFH124-E/TL ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.94 | $14.94 |
| 10 | $13.85 | $138.50 |
| 100 | $12.55 | $1,255.00 |
| 500 | $11.4 | $5,700.00 |
| 1,000 | $10.5 | $10,500.00 |
PIC32MZ2048EFH124-E/TL 개요
What is a 32-bit MCU? A microcontroller unit (MCU) is a single-chip computer integrating a CPU core, program memory (Flash), working memory (RAM), and peripherals such as timers, ADC/DAC, communication controllers and GPIO. The PIC32MZ EF family sits in the upper-mid range of the PIC32 line: 32-bit core -> MIPS32 M-Class architecture -> 32-bit MCU -> embedded processor -> semiconductor. These parts target connectivity-rich industrial, IoT, automotive, and graphics-HMI designs where on-chip peripherals and determinism matter more than absolute MHz.
Key features include an FPU, DSP enhancements, a dedicated crypto engine is intentionally absent in this variant (the part number suffix No Crypto confirms), 8 KB instruction cache, 4 KB write-back data cache, and a peripheral pin-select (PPS) matrix. The device supports up to 200 MHz CPU clock with 83 DMIPS core performance and integrates a true random number generator (TRNG), multiple I2C/SPI/UART ports, and a parallel master port for external bus expansion.
The architecture uses a 5-stage pipeline MIPS32 M4K-class core with DSP ASE and hardware MAC, executing most instructions in a single cycle. Memory is partitioned with 2 MB dual-bank Flash (live update capable), 512 KB SRAM, and dedicated boot Flash. The supply rail is 3.3 V with internal LDO and on-chip voltage regulation, simplifying power-tree design across industrial 24V-derived systems.
Typical applications include industrial Ethernet gateways, automotive body and HMI modules, IoT edge nodes with TLS acceleration (using the crypto engine of related EF parts), and graphical touch displays. Designers choose this device when they need 2 MB of on-chip Flash for full-featured protocol stacks plus a connectivity-rich peripheral set on a single die.
When designing with the PIC32MZ2048EFH124-E/TL, respect the 124-VTLA package's thermal resistance (theta_JA approximately 19 C/W on a 4-layer JEDEC JESD51-7 9x9 cm board with thermal vias) and decouple every VDD/AVDD pair with 100 nF plus 4.7 uF bulk. Leave the exposed pad soldered to a continuous ground plane; floating the EP will elevate junction temperature and degrade ADC linearity. Use the internal FRC as backup only during development; production firmware should calibrate the POSC with the FPLL to within +/- 50 ppm for Ethernet and CAN.
This page synthesizes distributor pricing, drop-in VTLA-124 alternatives, application context, and design notes not found in a single Microchip datasheet - engineered to help sourcing teams and firmware engineers shorten the design-in cycle.
드롭인 대체품: PIC32MZ2048EFH124-E/TL — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ2048EFH124-E/TL (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Package, ADC, CAN, Ethernet.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ2048EFH124T-E/TL
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ2048EFH124T-I/TL
✅ 드롭인✓ 재고 있음
$11.95 / 개
데이터시트 보기 →PIC32MZ1024EFH124-E/TL
✅ 드롭인✓ 재고 있음
$8.55 / 개
데이터시트 보기 →PIC32MZ1024EFH124T-I/TL
✅ 드롭인✓ 재고 있음
$9.06 / 개
데이터시트 보기 →PIC32MZ2048EFM124-E/TL
✅ 드롭인✓ 재고 있음
$9.5 / 개
데이터시트 보기 →PIC32MZ2048EFH124-E/TL 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M-Class (32-bit) |
| Maximum CPU Clock | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 512 KB |
| Operating Voltage | 3.3 V (typical) |
| I/O Pins | 97 |
| 패키지 | 124-VTLA (9x9 mm) Dual Row, Exposed Pad |
| Ethernet | 10/100 MAC (MII/RMII) |
| USB | USB 2.0 Hi-Speed OTG |
| CAN | 2x CAN 2.0b |
| ADC | 12-bit, up to 5 MSPS, 48 channels |
| Crypto Engine | No (No Crypto variant) |
| Temperature Grade | -40C to +125C (E = Industrial/Extended) |
| AEC-Q100 | Qualified (automotive grade per Hotenda listing) |
| 실장 유형 | Surface Mount |
PIC32MZ2048EFH124-E/TL 124-vtla (9x9 mm) dual row, exposed pad 핀 구성 가이드
PIC32MZ2048EFH124-E/TL(124-vtla (9x9 mm) dual row, exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ2048EFH124-E/TL.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ2048EFH124-E/TL 적합 용도: 6 애플리케이션s: Industrial Ethernet Gateway, Automotive HMI / Body Controller, IoT Edge Node with TLS, Graphical Touch Display Terminal, Industrial Servo / Motor Controller, USB-Connected Data Acquisition Module.
Industrial Ethernet Gateway
The PIC32MZ2048EFH124-E/TL's on-chip 10/100 Ethernet MAC plus 2 MB dual-bank Flash makes it a strong fit for protocol-converting industrial gateways (Modbus TCP, EtherNet/IP, PROFINET slave). The 200 MHz MIPS32 M4K core executes TCP/IP stacks and TLS handshakes with headroom, while 512 KB SRAM accommodates large socket buffers. The 97 I/O lines accept multiple UART channels for RS-485 trunks and the 12-bit 5 MSPS ADC reads analog sensor inputs. The -40C to +125C E temperature grade and AEC-Q100 qualification allow deployment on the factory floor without derating. Compared to a Cortex-M4 part in the same price tier, the EF family integrates Ethernet and dual CAN without an external PHY bridge, reducing BOM cost.
추천
Automotive HMI / Body Controller
Automotive HMI clusters and body controllers benefit from the PIC32MZ2048EFH124-E/TL's 2 MB Flash for graphic assets, the 12-bit 5 MSPS ADC for backlight and rotary-encoder reads, and dual CAN 2.0b ports for gateway-class CAN traffic. The AEC-Q100 qualification and -40C to +125C operating range meet SAE J1455 thermal stress profiles. The 97 I/O drive 7-inch TFT panels via PPS-mapped timers and external SPI displays. The dual-bank Flash supports OTA firmware updates without a service-window outage - critical for next-generation automotive architectures. Compared to a basic 8-bit MCU, the EF part eliminates an external graphics controller and CAN bridge, lowering PCB cost in body and instrument-cluster applications.
추천
IoT Edge Node with TLS
Edge IoT nodes use the PIC32MZ2048EFH124-E/TL to terminate TLS 1.2/1.3 sessions, run small ML inference (CMSIS-DSP-like libraries), and forward telemetry over Wi-Fi or Ethernet. Note that this specific -E/TL variant lacks the on-chip crypto engine; for AES-256 acceleration pick the PIC32MZ2048EFG family. The 2 MB Flash holds mbedTLS plus an MQTT client stack, while the 512 KB SRAM leaves room for TLS session keys and circular telemetry buffers. The 12-bit ADC reads analog sensors directly, and the USB Hi-Speed OTG port serves as a configuration console. Compared to ESP32-class parts, the EF family delivers deterministic real-time behaviour and broader industrial temperature support for IIoT.
추천
Graphical Touch Display Terminal
Touch-screen terminals for medical, building-automation and appliance front panels use the PIC32MZ2048EFH124-E/TL's 200 MHz core and 2 MB Flash to drive 480x272 WQVGA panels via the parallel master port or external controller. The 12-bit ADC reads touch-screen analog coordinates, and PPS allows remapping of timer outputs to backlight PWM without glue logic. The 97 I/O drive a 16-bit external bus or parallel RGB interface. The dual-bank Flash allows field upgrades of UI assets (fonts, icons) without bricking the device. Compared to an STM32F4-based design, the EF family integrates Ethernet and dual CAN on-die, reducing the BOM for networked HMI products.
추천
Industrial Servo / Motor Controller
Industrial servo and small inverter drives leverage the PIC32MZ2048EFH124-E/TL's PWM timers, 12-bit 5 MSPS ADC and dual CAN for field-oriented control of PMSM and BLDC motors up to 1 kW. The 200 MHz MIPS core executes FOC loops with sub-microsecond PWM duty update, and the 97 I/O drive three-phase gate drivers plus Hall or encoder feedback. The 2 MB Flash stores both motor-control firmware and application-level protocol stacks (CANopen, EtherCAT slave using external ET1100 ASIC). The AEC-Q100 qualification and -40C to +125C operation support under-the-hood deployment. Compared to a Cortex-M4 in the same class, the EF part's dual CAN and richer timer array reduce external logic.
추천
USB-Connected Data Acquisition Module
High-speed USB data-acquisition modules use the PIC32MZ2048EFH124-E/TL's USB 2.0 Hi-Speed OTG controller to stream multi-channel ADC samples at 5 MSPS to a host PC, while the 2 MB Flash accommodates USB class drivers (HID, vendor-class, CDC) plus on-board DSP. The 12-bit ADC provides up to 48 input channels through the analog mux, and 512 KB SRAM acts as a high-bandwidth DMA ring buffer. The 97 I/O support SPI-controlled front-end amplifiers and digital isolators. The -40C to +125C operation covers laboratory, industrial and automotive DAQ enclosures. Compared to a generic Cortex-M0+ USB part, the EF family delivers 12x the ADC sample rate and a far larger RAM buffer, enabling oscilloscope-class front ends in a single chip.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ2048EFH124-E/TL — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ2048EFH124T-E/TL | PIC32MZ2048EFH124T-I/TL | PIC32MZ1024EFH124-E/TL | PIC32MZ1024EFH124T-I/TL | PIC32MZ2048EFM124-E/TL |
|---|---|---|---|---|---|---|
| Package | 124-VTLA (9x9 mm) | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same | 124-VTLA (9x9 mm) - same footprint, different pin mux |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 2 MB | 2 MB | 2 MB | 1 MB | 1 MB | 2 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 256 KB | 256 KB | 512 KB |
| Maximum CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Temperature Grade | -40C to +125C (E) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) |
| Crypto Engine | No (No Crypto) | No (No Crypto) | No (No Crypto) | No (No Crypto) | No (No Crypto) | No (No Crypto) |
| USB 2.0 Hi-Speed | Yes (OTG) | Yes (OTG) | Yes (OTG) | Yes (OTG) | Yes (OTG) | Yes (OTG) |
주요 차별점
- Highest-density Flash/SRAM at this price tier in the PIC32MZ EF line (vs PIC32MZ1024EFH124-E/TL)
- Extended -40C to +125C operating range with AEC-Q100 qualification (vs PIC32MZ2048EFH124T-I/TL)
- Identical peripherals to the H-pinout family (vs PIC32MZ2048EFM124-E/TL)
설계 노트
The 124-VTLA package relies on the exposed pad (EP) for heat removal. Solder the EP to a continuous 9x9 mm copper pour on the top layer with at least 12 thermal vias (0.3 mm drill, 0.2 mm annular ring) stitching to the inner ground plane. Estimated: with theta_JA approximately 19 C/W on a 4-layer JEDEC JESD51-7 9x9 cm board, dissipating 1 W yields a 19 C junction rise - acceptable for E-grade parts rated to 125 C junction. Skipping the EP solder will roughly double theta_JA and may exceed the junction rating in enclosed enclosures.
Place a 100 nF X7R 0402 ceramic within 2 mm of every VDD/VDDIO/AVDD pin pair, plus a single 4.7 uF X5R bulk capacitor per power rail. The internal LDO has a 1 uA quiescent current; bypassing must keep ripple below 30 mV pk-pk or the 12-bit ADC linearity degrades by 1-2 LSB. Feed VBUS through a current-limit switch (MIC2005A-class) to avoid back-powering USB from local 3.3 V. Estimated: total 3.3 V decoupling budget for the 124-pin VTLA is approximately 7 capacitors plus the 4.7 uF bulk.
Route the 50 MHz Ethernet RMII traces as a 50 ohm controlled-impedance bus with matched length (+/- 2 mm) and no via transitions in series. Keep the POSC crystal within 5 mm of the OSCI/OSCO pins with a guard ring tied to GND. The 124-VTLA has two rows of pads - route all inner signals on inner layers and use the top layer for VTLA fan-out. USB DP/DM traces must be 90 ohm differential with no series capacitors; place the 27 ohm source-matching resistors within 4 mm of the MCU.
Do not skip programming the FPLL after PCB bring-up - defaulting to the internal FRC (8 MHz) hides timing issues. The 12-bit ADC requires a calibration routine stored in Flash after every POR. Avoid using PPS to remap I2C pins to remappable outputs - I2C is fixed-pin on this family. The dual-bank Flash live-update requires a custom bootloader; do not assume the default Harmony Bootloader handles A/B swap without configuration. Estimated: typical firmware development to first CANopen stack bring-up is 6-8 person-weeks.
규정 준수 정보
AEC-Q100 qualification confirmed by Hotenda listing; RoHS and REACH compliance stated by Microchip product page; lead-free and halogen-free per datasheet ordering information.
