PIC32MZ1024EFH124T-I/TL - 32-bit 200MHz 1MB Flash MCU | Microchip
부품 번호: PIC32MZ1024EFH124T-I/TL ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.2 | $14.20 |
| 10 | $12.78 | $127.80 |
| 100 | $11.36 | $1,136.00 |
| 500 | $10.21 | $5,105.00 |
| 1,000 | $9.06 | $9,060.00 |
PIC32MZ1024EFH124T-I/TL 개요
A microcontroller (MCU) is a single-chip computer containing a CPU core, program and data memory, and a fixed set of peripherals such as timers, ADC/DAC, communication controllers, and GPIO. Within the broader taxonomy, a 32-bit MCU sits between simple 8/16-bit microcontrollers and full microprocessors (MPU), offering enough horsepower for embedded Linux, graphics, and high-speed connectivity stacks while retaining deterministic real-time interrupt response. The PIC32MZ EF family specifically targets industrial, automotive, IoT, and HMI applications that require both compute throughput and rich connectivity on one die.
Key features of this device include a MIPS32 M-Class core with hardware multiply/divide and DSP extensions, 1 MB dual-bank Flash with live-update support, 512 KB SRAM, a 200 MHz system clock, hardware crypto acceleration in selected siblings (this part is the 'No Crypto' variant), a 12-bit ADC up to 18 MSPS, 9-bit DAC outputs, and a Peripheral Pin Select (PPS) remapping engine. Communication peripherals include two USB-HS controllers, two Ethernet MACs with RMII/MII, two CAN 2.0B modules, three SPI/I2S, four I2C, six UART, an SQI interface for serial Quad memory, and an EBI/EMI bus.
The 124-pin VTLA package exposes up to 97 GPIO lines, with PPS allowing flexible function routing. An integrated FPU and 252 MHz MIPS core variants exist in the EF family; the 124T variant in this MPN tops out at 200 MHz. Power management includes multiple low-power modes, a 1.2V internal core LDO, and on-chip voltage regulation for the Flash and SRAM domains.
Typical applications include industrial HMI panels, factory automation gateways, multi-protocol IoT bridges (CAN + Ethernet + Wi-Fi), graphic-display controllers, motor-control front ends, and medical instrumentation front-ends. Use of the dual-bank Flash allows firmware updates over Ethernet/USB without bricking the device, and the 124-pin package supports parallel-bus LCDs via EBI.
When designing with this part, allocate 1-2 layers for power and ground and follow Microchip's decoupling guidance (100 nF + 4.7 uF near each VDD/VBAT pin). Confirm VTLA thermal pad soldering per IPC-7351; the bottom thermal pad is electrically grounded and must be soldered for electrical and thermal performance. This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC32MZ EF family, and practical design notes not found in the standalone manufacturer datasheet.
드롭인 대체품: PIC32MZ1024EFH124T-I/TL — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MZ1024EFH124T-I/TL (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core Architecture, DMA Channels, USB.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MZ1024EFG124T-I/TL
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ1024EFF124T-I/TL
✅ 드롭인✓ 재고 있음
$7.45 / 개
데이터시트 보기 →PIC32MZ1024ECM124T-I/TL
✅ 드롭인✓ 재고 있음
$8.4 / 개
데이터시트 보기 →PIC32MZ1024EFE124-I/TL
✅ 드롭인✓ 재고 있음
$9.4 / 개
데이터시트 보기 →PIC32MZ1024ECK124T-I/TL
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MZ1024ECH124-I/TL
✅ 드롭인✓ 재고 있음
$9.3 / 개
데이터시트 보기 →PIC32MZ1024EFH124T-I/TL 최대 정격 & 전기적 특성
| Core Architecture | MIPS32 M-Class (PIC32MZ EF) |
| 데이터 버스 폭 | 32-bit |
| Maximum CPU Frequency | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| SRAM | 512 KB |
| 패키지 | 124-VTLA (9x9 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 범위 | -40C to +85C (Industrial, 'I') |
| Supply Voltage (Core) | 1.8 V to 3.6 V |
| GPIO Count | 97 (maximum) |
| Communication Peripherals | USB-HS, Ethernet (2x MAC), CAN 2.0B (2x), SPI/I2S (3x), I2C (4x), UART (6x), SQI, EBI |
| ADC Resolution / Channels | 12-bit, up to 40 channels |
| DMA Channels | 16 |
| Cryptographic Hardware | None (No-Crypto variant) |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
PIC32MZ1024EFH124T-I/TL 124-vtla (9x9 mm) 핀 구성 가이드
PIC32MZ1024EFH124T-I/TL(124-vtla (9x9 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC32MZ1024EFH124T-I/TL.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC32MZ1024EFH124T-I/TL 적합 용도: 6 애플리케이션s: Industrial HMI Touch Panels, Factory Automation Gateways (CAN + Ethernet + Wi-Fi), Multi-Protocol IoT Bridges (BLE/Wi-Fi + LoRa + Ethernet), Motor-Control Front Ends (FOC + PFC), Medical Instrumentation Front-Ends, Automotive Infotainment Hubs.
Industrial HMI Touch Panels
The PIC32MZ1024EFH124T-I/TL is a strong fit for industrial HMI touch panels because its 200 MHz MIPS32 core with FPU can drive QVGA/WVGA TFTs via the integrated EBI bus, while the 1 MB dual-bank Flash holds full graphics stacks and localized UI strings. The 124-pin VTLA package exposes up to 97 GPIO lines that drive TFT data, touch-controller I2C, and backlight PWM channels simultaneously. With hardware crypto disabled ('No Crypto' variant) the bill of materials stays lean, and the industrial -40C to +85C operating range supports factory-floor enclosures without additional thermal management.
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Factory Automation Gateways (CAN + Ethernet + Wi-Fi)
This MCU bridges CAN 2.0B fieldbus, 10/100 Ethernet, and a Wi-Fi co-processor in industrial gateways, and the PIC32MZ1024EFH124T-I/TL delivers all three interfaces on one die. The two integrated Ethernet MACs support managed-switch topologies, while the dual CAN modules handle CANopen or DeviceNet master duties. The 512 KB SRAM is sufficient for TCP/IP socket buffers plus a Modbus TCP server, and the 16 DMA channels keep USB-HS, Ethernet, and SPI traffic off the CPU. The 124-pin package also exposes an SQI interface for fast external Flash that holds web-server assets and OTA update staging.
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Multi-Protocol IoT Bridges (BLE/Wi-Fi + LoRa + Ethernet)
In IoT edge bridges the PIC32MZ1024EFH124T-I/TL acts as the host MCU for SPI-attached wireless modules (Wi-Fi, BLE, LoRa) while running the application stack on-chip. The 200 MHz MIPS core is fast enough to parse MQTT-SN or CoAP messages, run JSON serialization, and forward data over Ethernet simultaneously. Six UARTs plus three SPI/I2S give the designer headroom to add multiple radios in parallel, and the dual-bank Flash enables OTA firmware updates with safe rollback. The 124-pin VTLA package supports a compact gateway layout with all radios routed on inner layers.
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Motor-Control Front Ends (FOC + PFC)
Field-Oriented Control (FOC) for 3-phase PMSM motors and Power Factor Correction (PFC) loops require deterministic PWM updates every 10-20 us, which the PIC32MZ1024EFH124T-I/TL delivers through its hardware PWM, 12-bit ADC, and DMA-pumped sample sequencer. The 200 MHz core leaves roughly 100 MIPS headroom after the control loop for housekeeping, and 512 KB SRAM holds a full motor-state observer plus logger buffers. The 124-pin VTLA package also exposes the EBI bus for a parallel color TFT showing motor telemetry, which is typical in premium appliance and HVAC designs.
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Medical Instrumentation Front-Ends
For medical instrumentation such as patient monitors and bench-top analyzers, the PIC32MZ1024EFH124T-I/TL provides the deterministic real-time response needed for sample acquisition while running a TFT-based UI in parallel. Its 12-bit ADC up to 18 MSPS captures sensor front-ends with sufficient dynamic range for ECG, SpO2, or temperature chains, and the dual Ethernet MACs allow isolated network segmentation between the patient side and the hospital LAN. The industrial -40C to +85C temperature range supports the thermal environment of continuous-monitoring carts without active cooling.
추천
Automotive Infotainment Hubs
In automotive infotainment hubs, the PIC32MZ1024EFH124T-I/TL acts as the connectivity co-processor for Bluetooth audio streaming, USB-HS device charging, and CAN bus diagnostics while the main SoC handles the display. The industrial temperature grade supports cabin environments, and the dual-bank Flash enables OTA infotainment map updates over the air. The 124-VTLA package also exposes the SQI interface, which can boot an external serial-Flash containing the audio/voice UI assets. For under-hood or AEC-Q100-qualified deployments, choose the corresponding Q1 suffix variant from the PIC32MZ EF family instead.
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추천 제품 요약
엔지니어링 참조 데이터: PIC32MZ1024EFH124T-I/TL — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MZ1024EFG124T-I/TL | PIC32MZ1024EFF124T-I/TL | PIC32MZ1024ECM124T-I/TL | PIC32MZ1024EFE124-I/TL |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 124-VTLA (9x9) | 124-VTLA (9x9) - same | 124-VTLA (9x9) - same | 124-VTLA (9x9) - same | 124-VTLA (9x9) - same |
| Flash Memory | 1 MB | 2 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| CPU Frequency (max) | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Hardware Crypto | No (No-Crypto variant) | No | Yes (AES/SHA) | No | No |
| Enhanced Analog (ADC/Op-Amps) | Standard | Standard | Standard | Enhanced (more ADC, op-amps) | Standard |
| Operating Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
주요 차별점
- No-Crypto variant at lower cost vs crypto-enabled siblings (vs PIC32MZ1024EFF124T-I/TL)
- Same-package upgrade path to 2 MB Flash without PCB rework (vs PIC32MZ1024EFG124T-I/TL)
- Enhanced industrial peripheral mix vs the base EFH die (vs PIC32MZ1024EFE124-I/TL)
- Mixed-signal analog integration with the same MIPS32 core (vs PIC32MZ1024ECM124T-I/TL)
설계 노트
Decouple every VDD/VBAT pin with a 100 nF X7R ceramic placed within 2 mm of the pin, plus a single 4.7 uF bulk capacitor per voltage domain. The PIC32MZ EF integrates an internal 1.2V core LDO; feed it from a clean 3.3V rail and add a ferrite bead if the 3.3V rail is shared with a switching converter. Estimated: at full CPU load (200 MHz, all peripherals active) core current draw is approximately 90 mA, so size the 3.3V regulator for at least 150 mA headroom including I/O toggling.
The 124-VTLA package uses a 9x9 mm land pattern with a central thermal/ground pad. The center pad MUST be soldered to a properly sized ground plane - per IPC-7351, use at least 50% via-fill in the thermal via array to avoid solder voids. Ground the center pad to a continuous inner-layer ground pour for both electrical reference and thermal dissipation (estimated: theta_JA drops from ~35 C/W to ~22 C/W with 9 thermal vias under the pad).
Route USB-HS differential pairs (D+/D-) as a 90-ohm impedance-matched pair on the top layer over a continuous ground pour, keeping length under 12 mm and matching to within 0.5 mm. For Ethernet RMII/MII, place the 50 MHz reference clock trace away from switching nodes and keep series-termination resistors within 5 mm of the PHY pins. PPS (Peripheral Pin Select) remapping can route digital functions onto analog-capable pins; avoid remapping high-speed peripherals onto pins adjacent to the ADC inputs to prevent digital switching noise coupling into ADC samples.
Do not skip the configuration of the FPLLIDIV/FPLLODIV/FPLLMULT registers in the DEVCFG1 fuse area - leaving defaults will leave the core at 8 MHz instead of 200 MHz. The dual-bank Flash requires the NVMCONbits.BFSWAP setting to enable live update; verify the boot address before enabling BFSWAP to avoid boot loops. Per the PIC32MZ EF errata DS80000496, the SQI module has a silicon work-around for read-while-write corruption - apply the work-around in firmware before relying on concurrent Flash/SQI accesses.
규정 준수 정보
RoHS and REACH compliance confirmed per Microchip product page; lead-free / halogen-free per PIC32MZ EF family datasheet (DS60001320). Not AEC-Q100 qualified in this MPN - choose a Q1 suffix variant for automotive designs.