RTAX250SL-1LG624B - 250K Rad-Tolerant FPGA, 649MHz | Microchip
부품 번호: RTAX250SL-1LG624B ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
RTAX250SL-1LG624B 개요
A radiation-tolerant FPGA is a field-programmable gate array designed to survive the radiation environment of space and high-altitude flight, where single-event effects (SEE) and total ionizing dose (TID) would upset standard commercial devices. The RTAX-SL family sits within Microchip's (formerly Actel/Microsemi) space flight portfolio, forming the programmable logic tier of a satellite avionics hierarchy that includes antifuse RTAX-S devices, flash-based ProASIC3L parts, and radiation-hardened RTG4-generation FPGAs.
Key features of this device include the SL low-power variant of the RTAX architecture, embedded SRAM blocks with built-in FIFO control logic, segmentable clock conditioning circuitry, chip-wide highway routing for low-skew global signaling, and dedicated carry logic for arithmetic functions. These system-level features originate from Microsemi's commercial AXCELERATOR-style fabric, repackaged for space-grade reliability.
Architecturally, the RTAX-SL fabric consists of clustered logic modules (C-cells and R-cells) interconnected through a rich hierarchical routing network, with VersaTiles supporting both combinational and sequential implementations. The -1 speed grade denotes the fastest commercial speed bin available for this die, and the B suffix denotes the radiation-tolerant flow with data derived from the same 0.15 um metallization used across the family.
Typical applications include satellite payload data processing, spacecraft telemetry and command (TM/TC) interfaces, orbit-control and attitude-control electronics, and space-based sensor interfacing, where single-chip form factor, live-at-power-up operation, and low power consumption matter more than raw gate density.
A key design consideration is prototyping: the ceramic LGA-624 footprint cannot be reflowed on standard FR-4 prototypes easily, so Microchip provides footprint-compatible adaptor boards and an EDIF netlist/pinout conversion methodology for prototyping with RTAX-S/SL devices.
This page synthesizes distributor data, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: RTAX250SL-1LG624B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: RTAX250SL-1LG624B (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Equivalent System Gates, Radiation Tolerance, Core Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
RTAX250S-1LG624B
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2020 / 개
데이터시트 보기 →RTAX250S-LG624B
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2350 / 개
데이터시트 보기 →RTAX250SL-LG624B
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2380 / 개
데이터시트 보기 →RTAX250SL-1LG624E
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$2350 / 개
데이터시트 보기 →RTAX250SL-1LG624V
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$950 / 개
데이터시트 보기 →RTAX250SL-1LG624B 최대 정격 & 전기적 특성
| Family | RTAX-SL (Radiation-Tolerant FPGA) |
| Equivalent System Gates | 250,000 |
| Logic Cells (CLBs) | 2816 |
| Logic Cells | 4224 |
| 최대 클록 주파수 | 649 MHz |
| Process Technology | 0.15 um CMOS |
| Core Supply Voltage | 1.5 V |
| Speed Grade | -1 |
| 패키지 | 624-Pin LGA (ceramic) |
| 실장 유형 | Surface Mount |
| Embedded SRAM | Yes, with built-in FIFO control logic |
| Clock Conditioning | Segmentable clocks |
| Routing Resources | Chip-wide highway routing, carry logic |
| Application Domain | Space flight systems |
| Radiation Character | Radiation-tolerant (RadTolerant) |
| Packaging | Box |
RTAX250SL-1LG624B 624-pin lga (ceramic) 핀 구성 가이드
RTAX250SL-1LG624B(624-pin lga (ceramic) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: RTAX250SL-1LG624B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
RTAX250SL-1LG624B 적합 용도: 6 애플리케이션s: Satellite Payload Data Processing, Spacecraft Telemetry and Command (TM/TC) Interface, Attitude and Orbit Control Electronics, Space-Based Sensor and Image Interface, Launch Vehicle Avionics, Prototyping and Flight-Model Development.
Satellite Payload Data Processing
The RTAX250SL-1LG624B fits payload data-path designs because its 250K gates, 2816 logic cells, embedded SRAM with built-in FIFO control logic, and 649 MHz timing capability handle high-rate sensor formatting, packetization, and compression pre-processing without a companion memory controller FPGA. In a typical payload chain, the FPGA sits between the instrument interface and the downlink encoder, using the fabric carry logic for CRC/checksum acceleration and the segmentable clocks to isolate instrument timing from the spacecraft bus timing domain. Because it is radiation-tolerant rather than merely commercial-grade, it tolerates the single-event environment of LEO and GEO orbits where a commercial FPGA would experience configuration upsets. The trade-off versus a larger RTAX2000SL is lower cost and lower static power, at the expense of 250K versus 2M gates of logic capacity.
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Spacecraft Telemetry and Command (TM/TC) Interface
For TM/TC interfaces, the RTAX250SL-1LG624B's live-at-power-up operation and true single-chip form factor are decisive: the spacecraft can rely on deterministic configuration at boot without external configuration flash, a recognized reliability advantage for command-chain electronics that must never be blind. The 4224 logic cells are ample for CCSDS-style frame synchronization, decoders, and housekeeping registers, while chip-wide highway routing keeps low-skew clocking across the 624-pin LGA I/O assignment. Designers typically clock the command decoder from a redundant oscillator and use the fabric's segmentable clocks to switch to a cold-spared oscillator after a latch-up or oscillator failure event. Power drawn from the 1.5V core remains low enough for the spacecraft's always-on power domain.
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Attitude and Orbit Control Electronics
Attitude control units benefit from the RTAX250SL-1LG624B's combination of deterministic low-latency logic and 649 MHz maximum clocking: star-tracker and gyro interfaces demand hard real-time processing that microcontrollers struggle to guarantee under scheduler jitter. The device's carry logic accelerates coordinate-transform arithmetic (quaternion and DCM math pipelines), while embedded SRAM blocks implement ping-pong line buffers for star centroid extraction. With 0.15 um CMOS on a 1.5V core, total power stays compatible with eclipse-mode power budgets. Designers should budget for SEU-sensitive state by applying triple-modular redundancy in the fabric and using Microchip's RTAX-S/SL SEU mitigation guidance from the family datasheet rather than relying on the silicon's tolerance alone.
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Space-Based Sensor and Image Interface
Imaging payloads such as earth-observation cameras and star trackers use the RTAX250SL-1LG624B to deserialize high-speed CCD/CMOS sensor outputs, apply defect correction, and buffer frames in the embedded SRAM with its built-in FIFO control logic - removing the need for external FIFO chips on a radiation-constrained board. The -1 speed grade timing supports the serial link speeds typical of space-qualified LVDS imagers, and the 624-pin LGA offers enough I/O for multi-lane sensor interfaces plus redundant spacecraft bus connections. Power at the 1.5V core suits thermally constrained optical benches where FPGA dissipation would otherwise defocus optics. Trade-off: at 250K gates, very wide on-chip processing (e.g., full image compression) usually moves to a denser RTAX2000SL.
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Launch Vehicle Avionics
Launch-vehicle flight computers and separation-timing units employ the RTAX250SL-1LG624B for deterministic, glitch-free sequencing logic that must work on the first and only flight. Live-at-power-up configuration eliminates configuration-read latency and configuration-memory failure modes during the ascent phase, a genuine system-level advantage over SRAM-configured commercial FPGAs. The -1 speed grade's 649 MHz capability is far above the timing requirements of sequencing logic, giving large timing closure margins under radiation-induced delay shifts and temperature extremes. Designers map the safety-critical state machines into triplicated fabric regions and exploit chip-wide highway routing to distribute low-skill-skew clocks to redundant output channels. The ceramic 624-pin LGA withstands launch vibration better than plastic packaged alternatives.
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Prototyping and Flight-Model Development
Microchip's documented methodology uses a footprint-compatible adaptor board plus an EDIF netlist and pinout converter so that RTAX250SL-1LG624B flight designs can be prototyped cheaply before committing to expensive ceramic space-grade hardware, as described in the application note Prototyping for RTAX-S and RTAX-SL Devices and in the RTAX-S/SL datasheet. Development teams place a commercial Microchip FPGA on the adaptor board to validate RTL, then flow the same netlist to the RTAX target once timing is verified. Using the same 624-pin LGA footprint from the first PCB revision avoids layout respins between the engineering-model and flight-model boards. Recommended practice is to reserve the E-suffix engineering parts (e.g., RTAX250SL-1LG624E) for bring-up and keep B-suffix lots segregated for flight build.
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추천 제품 요약
엔지니어링 참조 데이터: RTAX250SL-1LG624B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | RTAX250S-1LG624B | RTAX250SL-LG624B | RTAX250SL-1LG624E | RTAX250SL-1LG624V |
|---|---|---|---|---|---|
| Package | 624-Pin LGA (ceramic) | 624-Pin LGA (ceramic) - same | 624-Pin LGA (ceramic) - same | 624-Pin LGA (ceramic) - same | 624-Pin LGA (ceramic) - same |
| Brand | Microchip Technology (Actel/Microsemi lineage) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells | 4224 (2816 CLBs) | 4224 (2816 CLBs) | 4224 (2816 CLBs) | 4224 (2816 CLBs) | 4224 (2816 CLBs) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Power Character | SL low-power die | Standard-power S die (higher core power) | SL low-power die | SL low-power die | SL low-power die |
| Qualification Suffix | B (radiation-tolerant flight flow) | B (radiation-tolerant flight flow) | B (radiation-tolerant flight flow) | E (engineering/evaluation flow) | V (alternate qualification flow) |
주요 차별점
- Low-power SL die in the same footprint (vs RTAX250S-1LG624B)
- Fastest -1 speed grade available for this die (vs RTAX250SL-LG624B)
- Flight qualification flow (vs RTAX250SL-1LG624E)
설계 노트
The 624-pin ceramic LGA requires a tightly controlled PCB land pattern and cannot be reflowed like a plastic BGA; follow the Microchip RTAX-S/SL datasheet land-pattern recommendations and specify the solder attachment process with your assembly house early. For prototyping, use Microchip's footprint-compatible adaptor board and the EDIF netlist/pinout converter described in the application note Prototyping for RTAX-S and RTAX-SL Devices, so the flight PCB layout never changes between prototype and flight hardware.
Power the 1.5V core from a low-noise space-grade point-of-load regulator and sequence I/O rails per the RTAX-SL datasheet power-supply requirements. The SL (low-power) die reduces static core current versus the RTAX250S standard die, but total dynamic power depends on design toggle rates - run Microchip's power estimator with your actual netlist rather than using the sibling die's figures. Budget margin for radiation-induced leakage increase over mission life when sizing the spacecraft power bus.
Do not substitute qualification suffixes without program-office approval: the B suffix denotes the radiation-tolerant flight flow, while E and V suffix parts share the same silicon and 624-pin LGA footprint but carry different qualification data. Also remember that although the fabric is radiation-tolerant, single-event upsets in user flip-flops and embedded SRAM still require architectural mitigation (triple modular redundancy, scrubbing-aware design) - tolerance at the process level is not a substitute for SEU-hardened design practice.
규정 준수 정보
Ceramic hermetic space-grade packaging; compliance declarations (RoHS/REACH exemptions for aerospace) must be obtained from Microchip directly; provided web data does not state environmental compliance status.
