Microchip Technology

RTAX250SL-CG624V - 250k-Gate Rad-Tolerant FPGA | Microchip

부품 번호: RTAX250SL-CG624V ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.425 V to 1.575 V Vdss 624-pin Ceramic Column Grid Array (CG624) Package Standard (C) commercial flight grade; -1 speed variant available Speed
시작가 $10000 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-02
볼륨 가격
수량 단가 합계
1 $12500 $12,500.00
10 $11875 $118,750.00
100 $11250 $1,125,000.00
500 $10625 $5,312,500.00
1,000 $10000 $10,000,000.00
ℹ️ 모든 가격은 USD 기준입니다

RTAX250SL-CG624V 개요

The Microchip Technology (Actel/Microsemi) RTAX250SL-CG624V is a radiation-tolerant FPGA offering 250,000 equivalent system gates with 2816 CLBs, 4224 logic cells, and 248 inputs and 248 outputs, housed in a 624-pin ceramic column grid array (CG624) package and operating from a 1.425V to 1.575V core supply.

A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of space flight, where total ionizing dose (TID), single-event latchup (SEL), and single-event upset (SEU) would degrade or destroy commercial devices. Within the power-management hierarchy of a spacecraft avionics system, the RTAX250SL sits at the top of Microchip's RTAX-S/SL family of antifuse-based, live-at-power-up FPGAs designed for satellite payloads, buses, and flight control electronics.

Key features include the SEU-resistant D flip-flops of the RTAX-SL architecture, embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and carry-chain logic. The antifuse programmable interconnect is one-time programmable and requires no configuration boot device, delivering true single-chip operation and live-at-power-up behavior that is critical for spacecraft power-on fault recovery.

Technically, the device is fabricated in a CMOS process derived from Microsemi's commercial Accelerator (ProASIC3-class) devices, with enhanced layout and process hardening for the space radiation environment. Densities across the RTAX-S/SL family reach up to four million equivalent system gates, and the CG624 ceramic package provides hermeticity for vacuum operation and outgassing control.

Typical applications include satellite payload data processing, spacecraft bus controllers, telemetry and telecommand interfaces, sensor interface FPGA gluing logic, and reconfigurable computing modules on LEO, MEO, and GEO missions.

Design consideration: because the part is one-time programmable, complete bitstream verification through Libero SoC simulation and the Synplify flow is essential before committing flight hardware.

This page synthesizes distributor listings, drop-in family alternatives, and practical space-design notes not consolidated in the manufacturer datasheet.

드롭인 대체품: RTAX250SL-CG624V — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: RTAX250SL-CG624V (동일 폼 팩터 및 풋프린트) — 차이점: Package, Radiation Tolerance, Family, Process Technology, Core Supply Voltage.

Microchip Technology
Package: 624-pin Ceramic Column Grid Array (CCGA)
Family: RTAX-S Radiation-Tolerant FPGA
Process Technology: 0.15 um CMOS antifuse
비교 대상: RTAX250SL-CG624V →
Microchip Technology
Package: 624-terminal Ceramic Grid Array (CGA)
Family: RTAX-S Radiation-Tolerant FPGA
비교 대상: RTAX250SL-CG624V →
Microchip Technology
Radiation Tolerance: SEU rate < 10^-10 errors/bit-day; SEU-hardened registers
Process Technology: 0.15 um CMOS
Core Supply Voltage: 1.5 V
비교 대상: RTAX250SL-CG624V →
Microchip Technology
Family: RTAX-S radiation-tolerant FPGA
Process Technology: 0.15 um CMOS
Core Supply Voltage: 1.5 V
비교 대상: RTAX250SL-CG624V →
Microchip Technology
Radiation Tolerance: SEU-hardened registers; SEU rate < 10-10 errors per bit-day
Family: RTAX-S RadTolerant FPGA
Process Technology: 0.15 um CMOS
비교 대상: RTAX250SL-CG624V →
Microchip Technology
Package: 624-pin Ceramic Column Grid Array (CCGA)
Family: RTAX-S Radiation-Tolerant FPGA
Process Technology: 0.15 um CMOS
비교 대상: RTAX250SL-CG624V →
Microchip Technology
Package: 624-Pin LGA (LG624)
Radiation Tolerance: Radiation-tolerant (space-grade flow, V grade)
Family: RTAX-S Radiation-Tolerant FPGA
비교 대상: RTAX250SL-CG624V →
Microchip Technology
Package: 624-Pin CCGA (Ceramic Column Grid Array)
Family: RTAX-SL (RTAX-S/SL RadTolerant FPGAs)
Process Technology: 0.15 um
비교 대상: RTAX250SL-CG624V →
Microchip Technology
Package: 624-ball Ceramic Column Grid Array (CCGA-624)
Radiation Tolerance: SEU-immune to specified LET threshold; SEU rate < 10-10 errors/bit-day
Process Technology: 0.15 um CMOS
비교 대상: RTAX250SL-CG624V →
Microchip Technology
Package: 624-terminal ceramic CGA (LG624), 1.270 mm terminal pitch
Family: RTAX-S/SL Radiation-Tolerant FPGA
Core Supply Voltage: 1.5 V nominal
비교 대상: RTAX250SL-CG624V →
Microchip Technology
Package: 624-ball CCGA (CG624)
Radiation Tolerance: Radiation-tolerant (space-flight grade)
Family: RTAX-SL (Radiation-Tolerant FPGA)
비교 대상: RTAX250SL-CG624V →
Microchip Technology
Package: 624-Pin CCGA (Ceramic Column Grid Array)
Radiation Tolerance: SEU-hardened registers; SEU rate < 10-10 errors/bit-day
Family: RTAX-S/SL Radiation-Tolerant FPGA
비교 대상: RTAX250SL-CG624V →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

RTAX250SL-1CG624E

✅ 드롭인
Microchip Technology
📦 624-pin Ceramic Column Grid Array (CG624)
250,000 gates · 2816 · 4224 · 248 inputs / 248 outputs · 1.5 V (1.425 V to 1.575 V) · 0.93 ns · 649 MHz · 0.15 um CMOS

✓ 재고 있음

$1 / 개

데이터시트 보기 →

RTAX250SL-CG624B

✅ 드롭인
Microchip Technology
📦 624-pin Ceramic Column Grid Array (CG624)
RTAX-SL (Radiation-Tolerant FPGA) · 250000 gates · 2816 cells · 649 MHz · 0.930 ns max · 0.15 um antifuse · 1.5 V · 624-ball CCGA (CG624)

✓ 재고 있음

$3950 / 개

데이터시트 보기 →

RTAX250SL-LG624B

✅ 드롭인
Microchip Technology
📦 624-pin Ceramic Column Grid Array (CG624)
RTAX-SL Radiation-Tolerant FPGA · 250,000 · 2816 · 4224 · 649 MHz · 0.15 um CMOS · 1.5 V · 624-pin LGA

✓ 재고 있음

$2380 / 개

데이터시트 보기 →

RTAX250SL-1LG624V

✅ 드롭인
Microchip Technology
📦 624-pin Ceramic Column Grid Array (CG624)
250,000 gates · 4224 · 2816 · CMOS antifuse (Axcelerator-derived) · RTAX-S/SL Radiation-Tolerant FPGA · 1.5 V nominal · -1 · 624-terminal ceramic CGA (LG624), 1.270 mm terminal pitch

✓ 재고 있음

$950 / 개

데이터시트 보기 →

RTAX250S-CG624E

✅ 드롭인
Microchip Technology
📦 624-pin Ceramic Column Grid Array (CG624)
250000 gates · 2816 · 649 MHz · 0.15 um CMOS · 1.5 V · CMOS · 0.930 ns · CCGA-624 (ceramic column grid array, 624 pins)

✓ 재고 있음

가격 문의

데이터시트 보기 →

RTAX250S-LG624V

✅ 드롭인
Microchip Technology
📦 624-pin Ceramic Column Grid Array (CG624)
4224 · 2816 · 250000 gates · 649 MHz · 0.15 um CMOS · 1.5 V · 248

✓ 재고 있음

가격 문의

데이터시트 보기 →

RTAX250SL-CG624V 최대 정격 & 전기적 특성

Equivalent System Gates 250000
Logic Cells 4224
CLB Count 2816
User I/O (Inputs) 248
User I/O (Outputs) 248
Core Supply Voltage 1.425 V to 1.575 V
Process Technology CMOS
Program Technology Antifuse (one-time programmable)
패키지 624-pin Ceramic Column Grid Array (CG624)
Embedded SRAM Yes (with built-in FIFO control logic)
Configuration Device Required No (live at power-up)
Radiation Tolerance Radiation-tolerant (space flight qualified family)
Family RTAX-S/SL and RTAX-DSP RadTolerant FPGAs
Speed Grade Standard (C) commercial flight grade; -1 speed variant available
실장 유형 Surface Mount

RTAX250SL-CG624V 624-pin ceramic column grid array (cg624) 핀 구성 가이드

RTAX250SL-CG624V(624-pin ceramic column grid array (cg624) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

RTAX250SL-CG624V의 624-pin ceramic column grid array (cg624) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: RTAX250SL-CG624V.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

RTAX250SL-CG624V 적합 용도: 6 애플리케이션s: Satellite Payload Data Processing, Spacecraft Bus Control and Housekeeping, Telemetry and Telecommand Interface, Instrument Sensor Interface and Glue Logic, Launch Vehicle and Avionics Interface Electronics, Radiation Test and Prototype Development.

🛰️

Satellite Payload Data Processing

The RTAX250SL-CG624V fits payload data-path processing because its 4224 logic cells and 250,000 equivalent gates implement framing, error correction, and protocol bridging at flight-relevant throughput, while 248 inputs and 248 outputs support wide parallel data buses to ADCs, memories, and downchain ASICs. Embedded SRAM blocks with built-in FIFO control logic buffer asynchronous data-rate domains without external FIFO chips, reducing parts count on the payload board. Its antifuse, live-at-power-up architecture ensures the payload logic is operational the moment spacecraft power is applied, eliminating configuration-readout single-point failures in orbit. The SL-generation SEU-resistant flip-flops lower the upset rate in the data path, improving mission-level availability. Designers typically clock the core from segmentable clock resources per processing chain, trading a modest routing-effort increase for clock-domain isolation and lower simultaneous-switching noise.

🛰️

Spacecraft Bus Control and Housekeeping

For spacecraft bus controllers, the RTAX250SL-CG624V implements command decoding, telemetry formatting, and interface glue between the onboard computer and power, attitude, and thermal subsystems. The 1.425V to 1.575V core supply and CMOS process keep static power low, which matters for eclipse-period power budgets on small buses. True single-chip, live-at-power-up operation means bus control logic is alive during the critical launch-separator release and initial power-on sequence, with no boot device to fail. The hermetic CG624 ceramic package withstands vacuum outgassing and thermal cycling requirements of GEO missions. With 2816 CLBs, one device consolidates discrete 1553-style glue, discrete I/O conditioning, and watchdog functions, freeing the flight processor for application software. Carry-chain logic supports efficient counters and CRC generation for telemetry integrity at low gate cost.

🌐

Telemetry and Telecommand Interface

The RTAX250SL-CG624V serves TT&C interface electronics by bridging the RF transponder baseband with the spacecraft data bus: the 248 inputs and 248 outputs connect parallel telecommand decoders and telemetry encoders, while embedded FIFO-backed SRAM smooths burst downlink data into the modulator. SL SEU-resistant flip-flops protect command decoding state machines from single-event upsets that could otherwise generate spurious commands - a mission-critical requirement per spacecraft reliability practice. The 250,000-gate capacity implements CCSDS-class framing and scrambling at moderate rates without external ASSPs, and the antifuse architecture guarantees that programmed command logic cannot be corrupted in flight, unlike SRAM FPGAs that require continuous scrubbing. Designers benefit from chip-wide highway routing to fan a single clock to distributed encoder blocks with low skew.

🔬

Instrument Sensor Interface and Glue Logic

Scientific instruments on science and Earth-observation missions use the RTAX250SL-CG624V as the sensor front-end FPGA: 248 outputs generate CCD/CMOS imager timing, 248 inputs capture high-speed digitized samples, and carry logic builds fast accumulators for on-board co-adding. The 1.5V-class core keeps dynamic power low in thermally constrained instruments, and the CMOS 4224-logic-cell fabric fits the detector sequencer, ADC interface, and packetizer in one hermetic device. Live-at-power-up behavior matters at instrument turn-on after eclipse, since detector sequencing must begin deterministically with no configuration latency. Embedded FIFO-controlled SRAM buffers imaging frames between acquisition and downlink clocks without external memory devices, improving reliability. Because antifuse devices are one-time programmed, instrument teams validate sequencer timing exhaustively in Libero SoC simulation before flight-lot programming.

🚀

Launch Vehicle and Avionics Interface Electronics

Avionics interface boards in launch vehicles and space transportation systems deploy the RTAX250SL-CG624V to consolidate discrete discretes-to-digital conversion, safe-and-arm bus monitoring, and redundancy management voting logic. The antifuse configuration is immune to configuration-memory upsets from the heavy radiation environment of high-altitude flight, and live-at-power-up operation supports the immediate logic availability required from battery activation to liftoff. The hermetic 624-pin ceramic column grid array satisfies the mechanical robustness and thermal-cycle expectations of launch vibration and ascent environments. With 2816 CLBs and 4224 logic cells, one device implements triple-modular-redundant voting across 248 input channels, and the SL SEU-resistant flip-flops further harden state machines. Segmentable clocks isolate critical timing chains from non-critical housekeeping logic to bound worst-case skew.

✈️

Radiation Test and Prototype Development

Before flight-lot commitment, teams use PROTO-class RTAX250SL units and engineering lots of the RTAX250SL-CG624V family for radiation testing, characterization, and software bring-up. Per the Microchip RTAX-S/SL datasheet, PROTO prototype units have the same timing attributes as flight units but are offered in non-hermetic ceramic packages, enabling cost-effective board bring-up on identical footprints. The same 250,000-gate, 2816-CLB architecture lets the Libero SoC bitstream developed on the prototype carry directly to the flight device, de-risking the design cycle. Teams typically populate TID and SEU test boards with both prototype and flight-flow units to bound performance spread. The CG624 footprint common across V, E, B, and L flows allows a single test PCB to qualify multiple screening flows, reducing qualification hardware cost.

What is the RTAX250SL-CG624V FPGA?
The RTAX250SL-CG624V is a radiation-tolerant FPGA from Microchip Technology (formerly Actel/Microsemi) in the RTAX-S/SL family. It provides 250,000 equivalent system gates organized as 2816 CLBs with 4224 logic cells, 248 inputs and 248 outputs, and a 1.425V to 1.575V core supply, packaged in a 624-pin ceramic column grid array. It uses antifuse, one-time-programmable interconnect and is intended for space-flight applications such as satellite payloads and spacecraft bus control.
What are the key specifications of RTAX250SL-CG624V that engineers should know?
The key specifications are: 250,000 equivalent system gates; 2816 CLBs and 4224 logic cells; 248 inputs and 248 outputs; core supply voltage of 1.425V to 1.575V; CMOS process; antifuse one-time-programmable configuration requiring no external boot device; embedded SRAM with built-in FIFO control logic; and a hermetic 624-pin ceramic column grid array (CG624) package. According to the Microchip RTAX-S/SL datasheet, the family is radiation-tolerant and shares system-level features such as segmentable clocks and chip-wide highway routing with densities up to four million gates.
Where can I buy RTAX250SL-CG624V online?
The RTAX250SL-CG624V is a space-flight-grade component typically sourced through specialized distributors and brokers rather than general catalog sites. Verified listing sources include Microchip USA (microchipusa.com), Jotrin Electronics, Sourcengine, FPGAkey, and VEKEMO, all offering quote-based purchasing. Because these rad-tolerant FPGAs are high-value, low-volume parts, most suppliers operate on request-for-quote terms with traceability documentation. XAIPART also accepts quote inquiries for this MPN with sourcing from authorized or factory-direct channels.
What is the price of RTAX250SL-CG624V?
Exact pricing for the RTAX250SL-CG624V is quote-based and not published on distributor catalogs; FPGAkey and Findchips list it as RFQ-only. Rad-tolerant 250k-gate class flight FPGAs in ceramic CG624 packages typically command four-to-five-figure unit prices depending on traceability (flight vs prototype units), date codes, and quantity. All pricing on this page is an estimate as of 2026-09-02 and must be confirmed with a formal quote including certificate of conformance and radiation lot data where required.
What is the lead time for RTAX250SL-CG624V?
Lead time for the RTAX250SL-CG624V varies by channel: authorized factory-direct sources via Sourcengine quote immediate delivery from stock with traceability, while new factory orders from Microchip for ceramic-packaged RTAX-S/SL flight units historically run many months due to low-volume aerospace manufacturing. Prototype (PROTO) units in non-hermetic ceramic packages can shorten early development schedules. Buyers should request current lead time and lot date codes with each quote, as aerospace-grade stock rotates quickly.
Is RTAX250SL-CG624V the same as RTAX250SL-1CG624V?
No, they are not identical, but they are closely related drop-in alternatives. Both are 250,000-gate RTAX250SL devices in the same 624-pin ceramic column grid array package. The '-1' in RTAX250SL-1CG624V denotes the faster speed grade, so its timing is better across all routing arcs. For designs with timing slack at the standard speed grade, the RTAX250SL-CG624V is pin-to-pin and functionally interchangeable; for tight timing closure, the -1 variant provides margin in the same footprint.
What is the difference between RTAX250SL-CG624V and RTAX250SL-CG624B?
The functional silicon is the same 250k-gate RTAX250SL die; the difference is the flow-level designation. Per Microchip RTAX-S/SL ordering conventions, the 'B' suffix indicates a different flow class (flow-through screening/qualification variant) versus the standard flight 'V' flow of the CG624V. Both are drop-in compatible in the same CG624 footprint, so selection depends on your program's screening, qualification, and traceability requirements rather than electrical performance.
Can RTAX250S-CG624E replace RTAX250SL-CG624V?
Yes, the RTAX250S-CG624E is a pin-compatible drop-in candidate because both parts are 250,000-gate members of the RTAX-S/SL family in the same 624-pin ceramic package. The key difference is the SL versus S silicon generation: the SL variant adds SEU-enhanced flip-flops for improved single-event upset immunity. Radiation performance is therefore not identical, so programs with strict SEU rate requirements should verify that the S-generation device meets their upset budget before substitution.
What is the best drop-in replacement for RTAX250SL-CG624V?
The best drop-in replacements are same-family RTAX250SL devices in the same CG624 package: RTAX250SL-1CG624E (faster -1 speed grade, E flow), RTAX250SL-CG624B (B screening flow), and RTAX250SL-LG624B / RTAX250SL-1LG624V (L flow variants). All are pin-to-pin compatible with identical gate count, logic cells, and I/O. According to the Microchip RTAX-S/SL datasheet, PROTO prototype units share the same timing attributes as flight units but come in non-hermetic ceramic packages, which may matter for hermeticity-driven designs.
Is there an Xilinx equivalent for RTAX250SL-CG624V?
There is no true pin-to-pin cross-brand equivalent for the RTAX250SL-CG624V. Xilinx (AMD) Virtex-5QV and Microsemi's own RTAX4000SL/RTAX2000SL address similar rad-tolerant gate counts, but they use different packages, pinouts, and software toolchains, so they are functional alternatives, not drop-in replacements. For space designs, board-level migration would require a PCB respin and design port from Libero SoC to the target vendor's toolchain. Drop-in substitution for this MPN is realistically limited to the same-family RTAX250SL CG624 variants.
When should I choose RTAX250SL-CG624V over RTAX4000SL?
Choose the RTAX250SL-CG624V when your logic utilization fits within 250,000 equivalent gates (4224 logic cells) and you want lower power, lower cost, and a smaller ceramic package compared to the larger RTAX4000SL devices. The RTAX250SL in CG624 offers 248 inputs and 248 outputs, which is sufficient for many payload and bus interface designs. Choose RTAX4000SL only when your design exceeds the 250SL capacity or needs more I/O; moving to the larger die increases power and package cost without benefit at lower utilization.
Is RTAX250SL-CG624V suitable for satellite payload applications?
Yes. The RTAX250SL-CG624V is specifically designed for space-based applications, offering high performance at densities up to four million equivalent system gates across the family. Its antifuse, live-at-power-up single-chip operation eliminates configuration-device failure modes in orbit, and the SL-generation SEU-resistant flip-flops reduce single-event upset rates in the payload data path. The hermetic CG624 ceramic column grid array suits vacuum and thermal-cycling environments of LEO, MEO, and GEO missions.
Does RTAX250SL-CG624V require a configuration flash device?
No. The RTAX250SL-CG624V uses one-time-programmable antifuse interconnect, so the configuration is permanently programmed at the factory or programming center and the FPGA is live at power-up with no external boot device. This true single-chip form factor reduces board area, eliminates configuration-readout failure modes, and improves spacecraft power-on reliability. It also means design changes require a new programmed device, so thorough Libero SoC simulation and timing verification before programming are essential.
Where to download the RTAX250SL-CG624V datasheet PDF?
The RTAX250SL-CG624V is documented in the Microchip 'RTAX-S/SL and RTAX-DSP Radiation-Tolerant FPGAs' datasheet, available as a PDF from ww1.microchip.com. This single family document covers features, options, ordering information, DC/AC characteristics, and package drawings for all RTAX-S/SL densities, including the CG624 package. XAIPART links directly to the official Microchip datasheet so engineers always receive the current revision rather than archived third-party copies.
Where can I find the pinout of RTAX250SL-CG624V?
The 624-pin ceramic column grid array pinout for the RTAX250SL-CG624V is published in the package pinout tables of the Microchip RTAX-S/SL family datasheet, organized by bank and pin identifier. Because a complete 624-pin listing is extensive and must match the exact die-to-package mapping revision, engineers should consult the official datasheet pin tables rather than secondary sources. The Libero SoC design tools also generate accurate package views for the CG624 footprint during pin assignment.
Is RTAX250SL-CG624V RoHS compliant?
Compliance status for RTAX250SL-CG624V must be verified per purchase because aerospace hermetic ceramic-packaged devices are often exempt from RoHS under category exemptions, and lead-based die-attach or plating may be used for flight reliability. Microchip publishes device-level RoHS and REACH data on its product pages; buyers on space programs typically procure to the military or flight flow specification rather than commercial RoHS declarations. Treat compliance as program-defined and request the material declaration sheet with your quote.

엔지니어링 참조 데이터: RTAX250SL-CG624V — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose RTAX250SL-CG624V when your space design fits within 250,000 equivalent gates (4224 logic cells, 248 in / 248 out) and requires flight-flow qualification with SL-generation SEU-resistant flip-flops in a hermetic 624-pin ceramic package. Select RTAX250SL-1CG624E when the identical design needs faster timing arcs - it is pin-to-pin and bitstream-compatible in intent, differing only in speed grade and flow class. Choose RTAX250SL-CG624B or RTAX250SL-LG624B when your program flow mandates B or L screening classes rather than the V flight flow. Drop to RTAX250S-CG624E or RTAX250S-LG624V only if SEU flip-flop hardening is not required and cost or availability favors the S generation - re-verify upset budgets first. For designs exceeding this density, move up the family to RTAX2000SL or RTAX4000SL in CGS624/CG1272 packages, accepting a larger footprint.

대체품과의 비교

파라미터 이 제품 RTAX250SL-1CG624E RTAX250SL-CG624B RTAX250S-CG624E
Package 624-pin CGA (CG624) CG624 - same CG624 - same CG624 - same
Brand Microchip Technology (Actel/Microsemi) Microchip Technology Microchip Technology Microchip Technology
Equivalent Gates 250000 250000 250000 250000
Logic Cells 4224 4224 4224 4224
User I/O 248 in / 248 out 248 in / 248 out 248 in / 248 out 248 in / 248 out
Core Supply Voltage 1.425 V to 1.575 V 1.425 V to 1.575 V 1.425 V to 1.575 V 1.425 V to 1.575 V
SEU-Enhanced Flip-Flops (SL) Yes Yes Yes No (S generation)
Speed Grade Standard -1 (faster) Standard Standard
Flow / Screening Class C/V flight flow E flow B flow E flow

주요 차별점

  • Faster timing margin in same footprint (vs RTAX250SL-1CG624E)
  • SEU-resistant flip-flops of SL generation (vs RTAX250S-CG624E)
  • Flight V flow qualification (vs RTAX250SL-CG624B)

설계 노트

With 248 inputs and 248 outputs on a 624-ball footprint, plan I/O bank assignment early in Libero SoC to balance bank currents and group same-standard signals. The 1.425V-1.575V core and CMOS output drivers produce simultaneous-switching noise when wide parallel buses toggle; distribute returns across multiple ground columns in the CG624 pattern and stagger bus edge rates within the -1 or standard speed grade timing budget. Simulate series-terminated lines against IBIS models before flight-lot programming since the device is one-time programmable and board respins are costly on flight programs.

Estimate core current from Libero SoC SmartPower reports at the standard or -1 speed grade and design the 1.5V rail within the 1.425V-1.575V window including rail droop during simultaneous switching. Because the antifuse FPGA is live at power-up, ensure the 1.5V and I/O supplies ramp monotonically and within the datasheet slew constraints - no reset controller will mask a marginal power-on sequence. Budget eclipse-period static power separately; the CMOS antifuse fabric has near-zero configuration leakage but I/O termination current on 496 possible user pins can dominate small-satellite power budgets.

The most common program risk with RTAX250SL devices is committing to flight-lot programming before timing closure: antifuse devices cannot be reprogrammed, so a late timing failure forces new die and months of aerospace lead time. Complete static timing analysis at the temperature and voltage extremes, run SEU mitigation (TMR on control state machines where SL flip-flops alone are insufficient), and freeze the netlist before ordering V/E/B/L flow parts. Note that SEU behavior differs between SL and S generation silicon - verify upset-rate budgets against the correct generation when substituting RTAX250S parts.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

Aerospace hermetic ceramic-packaged flight components are often procured to flight-flow specifications rather than commercial RoHS declarations; request material declarations from Microchip or the distributor with each quote.

데이터 검증일: 2026-09-02 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

RTAX250SL-CG624V RTAX250SL-CG624V datasheet Microchip RTAX250SL radiation tolerant FPGA 250000 gate rad tolerant FPGA CG624 624-pin ceramic column grid array FPGA RTAX250SL satellite payload FPGA RTAX250SL-CG624V vs RTAX250SL-1CG624E RTAX250SL-CG624V drop-in replacement buy RTAX250SL-CG624V price RTAX250SL pinout CG624 is RTAX250SL-CG624V RoHS compliant Xilinx equivalent RTAX250SL

관련 부품 & 용어

Microchip Technology Actel Microsemi RTAX250SL-CG624V RTAX250SL-1CG624E RTAX250SL-CG624B RTAX250S-CG624E FPGA radiation-tolerant FPGA field-programmable gate array antifuse single-event upset (SEU) total ionizing dose (TID) CG624 ceramic column grid array RTAX-S/SL family Libero SoC live-at-power-up RoHS satellite payload processing spacecraft bus control TT&C interface CMOS process embedded SRAM FIFO PROTO prototype units
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