S29GL256S90TFI010 - 256Mb 3V Parallel NOR Flash 90ns | Infineon
부품 번호: S29GL256S90TFI010 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.12 | $6.12 |
| 10 | $5.48 | $54.80 |
| 100 | $4.85 | $485.00 |
| 500 | $4.21 | $2,105.00 |
| 1,000 | $3.74 | $3,740.00 |
S29GL256S90TFI010 개요
A NOR Flash (Not-OR Flash) is a non-volatile memory technology characterized by fast random read access, byte-level programmability, and execute-in-place (XIP) capability, allowing a host processor to run code directly from the array without shadow-RAM. Within the memory hierarchy, NOR Flash sits above NAND Flash for read speed and below SRAM/DRAM for write endurance, making it ideal for boot ROM, firmware storage, and embedded code repositories where deterministic access latency matters more than raw density per dollar.
Key features include a sector architecture of 128 KB uniform sectors, hardware sector protection via WP#/ACC pins, and 100K endurance cycles per sector with 20-year data retention. The asynchronous parallel interface supports 16-bit word reads, while the page-mode buffer accelerates sequential reads within 16-word pages. The device operates over -40C to +85C industrial temperature range and supports JEDEC-standard command set compatibility.
The S29GL256S90TFI010 leverages Cypress/Infineon's proprietary MirrorBit Eclipse cell, which stores two bits per transistor using charge-trapping, doubling density versus single-bit NOR. Combined with the 90 ns tACC and the embedded write buffer, the part achieves sustained program throughput comparable to older generation parallel NAND while preserving byte-erase granularity for boot/firmware use.
Typical applications include automotive infotainment boot ROM, industrial PLC firmware storage, networking router bootloaders, point-of-sale terminals, medical device firmware, and any embedded system requiring XIP code execution. Its 56-pin TSOP footprint is widely adopted in legacy and new designs, easing PCB migration between Infineon density points (128, 256, 512 Mb) within the same S29GL-S family.
When designing with this device, ensure the host MCU/FPGA supplies a 3.0 V-3.6 V VCC and a stable VIO; the WP# pin must be tied high to disable hardware protection, or driven by the host for boot-mode selection. Decoupling: 0.1 uF ceramic + 4.7 uF bulk near VCC pin 1 are recommended to suppress VCC droop during sector erase pulses. Always sequence RESET# before CE# transitions per the JEDEC command-set diagram in the datasheet to avoid spurious writes.
This page synthesizes distributor pricing, drop-in alternatives from the Infineon GL-S family and competing Micron/Winbond/Macronix parts, and practical design notes that go beyond raw spec repetition found on manufacturer datasheets.
드롭인 대체품: S29GL256S90TFI010 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
S29GL256S90TFI020
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S29GL256S90GHI020
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
S29GL128S90TFI010
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S29GL512S90TFI010
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MT28EW256ABA1LGH-0SIT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MX29GL256FLT2I
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
S29GL256S90TFI010 최대 정격 & 전기적 특성
| 메모리 유형 | Non-Volatile NOR Flash |
| Density | 256 Mbit (32 MB) |
| 메모리 구성 | 16M words x 16 bits |
| 인터페이스 | Parallel (Asynchronous) |
| Operating Voltage (VCC) | 3.0 V (2.7 V - 3.6 V range) |
| Initial Access Time (tACC) | 90 ns |
| Page Access Time | 25 ns (page-mode burst) |
| Sector Architecture | 128 KB uniform sectors |
| Write Buffer Size | 512 bytes (32 words) |
| Endurance | 100,000 cycles per sector |
| Data Retention | 20 years |
| 동작 온도 | -40C to +85C (Industrial) |
| 패키지 | 56-pin TSOP Type I (TFSOP, 14 x 20 mm, MO-142BEC) |
| Process Technology | 90 nm MirrorBit Eclipse |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (Lead-free) |
| Sector Protection | WP#/ACC hardware pin |
S29GL256S90TFI010 핀 구성
| 핀 1 | A23 — Address input 23 (highest) |
| 핀 2 | A22 — Address input 22 |
| 핀 3 | A21 — Address input 21 |
| 핀 4 | A20 — Address input 20 |
| 핀 5 | A19 — Address input 19 |
| 핀 6 | A18 — Address input 18 |
| 핀 7 | A17 — Address input 17 |
| 핀 8 | A16 — Address input 16 |
| 핀 9 | BYTE# — Selects x8 (low) or x16 (high) data bus mode |
| 핀 10 | VSS — Ground |
| 핀 11 | DQ15/A-1 — Data 15 (x16) / Address -1 (x8) |
| 핀 12 | DQ7 — Data 7 |
| 핀 13 | DQ14 — Data 14 |
| 핀 14 | DQ6 — Data 6 |
| 핀 15 | DQ13 — Data 13 |
| 핀 16 | DQ5 — Data 5 |
| 핀 17 | DQ12 — Data 12 |
| 핀 18 | DQ4 — Data 4 |
| 핀 19 | DQ11 — Data 11 |
| 핀 20 | DQ3 — Data 3 |
| 핀 21 | DQ10 — Data 10 |
| 핀 22 | DQ2 — Data 2 |
| 핀 23 | DQ9 — Data 9 |
| 핀 24 | DQ1 — Data 1 |
| 핀 25 | DQ8 — Data 8 |
| 핀 26 | DQ0 — Data 0 (LSB) |
| 핀 27 | OE# — Output Enable (active low) |
| 핀 28 | VSS — Ground |
| 핀 29 | DQ15/A-1 — Duplicate pin - data 15 (x16) / Address -1 (x8) |
| 핀 30 | CE# — Chip Enable (active low) |
| 핀 31 | A0 — Address input 0 (LSB) |
| 핀 32 | VIO — I/O voltage reference |
| 핀 33 | A1 — Address input 1 |
| 핀 34 | A2 — Address input 2 |
| 핀 35 | A3 — Address input 3 |
| 핀 36 | A4 — Address input 4 |
| 핀 37 | A5 — Address input 5 |
| 핀 38 | A6 — Address input 6 |
| 핀 39 | A7 — Address input 7 |
| 핀 40 | A8 — Address input 8 |
| 핀 41 | A9 — Address input 9 |
| 핀 42 | A10 — Address input 10 |
| 핀 43 | A11 — Address input 11 |
| 핀 44 | A12 — Address input 12 |
| 핀 45 | A13 — Address input 13 |
| 핀 46 | A14 — Address input 14 |
| 핀 47 | A15 — Address input 15 |
| 핀 48 | VSS — Ground |
| 핀 49 | WE# — Write Enable (active low) |
| 핀 50 | RESET# — Hardware reset (active low) |
| 핀 51 | RY/BY# — Ready/Busy output (open drain) |
| 핀 52 | WP#/ACC — Write Protect / Acceleration input |
| 핀 53 | VCC — Power supply (2.7 V - 3.6 V) |
| 핀 54 | NC — Not connected (per datasheet) |
| 핀 55 | NC — Not connected (per datasheet) |
| 핀 56 | VCC — Power supply (2.7 V - 3.6 V) |
일반적인 애플리케이션
S29GL256S90TFI010 적합 용도: 6 애플리케이션s: Industrial PLC Firmware Storage, Automotive Infotainment Boot ROM, Networking Router Bootloader, Point-of-Sale Terminal Firmware, Medical Device Firmware Storage, Industrial HMI Panel Code Storage.
Industrial PLC Firmware Storage
The S29GL256S90TFI010's 256 Mbit density holds the full ladder-logic firmware plus runtime parameter blocks typical of mid-range industrial PLCs. Its 90 ns tACC and 16-bit parallel bus let an ARM Cortex-R host fetch instructions directly via XIP, eliminating boot-RAM shadowing and reducing bill-of-materials cost. The 100K erase-cycle endurance and 20-year data retention comfortably outlast the 10-15 year service life of factory-floor PLCs, while the -40C to +85C industrial temperature range tolerates unheated cabinet installations. The 56-pin TSOP footprint is well-supported by PLC reference designs, and the sector-uniform 128 KB architecture simplifies firmware A/B partitioning for safe in-field updates.
추천
Automotive Infotainment Boot ROM
Tier-1 automotive infotainment head units use parallel NOR Flash like the S29GL256S90TFI010 as the secure boot ROM that validates and loads the main application image. The device's 90 ns deterministic random access lets a PowerVR or ARM Cortex-A host start within cold-boot timing budgets, while hardware sector protection via WP# prevents inadvertent reflash during low-voltage transients. Designers pair it with a supervisory reset IC and ECC-protected RAM to meet ISO 26262 ASIL requirements at the boot stage. Although the S29GL256S is not AEC-Q100 qualified, its -40C to +85C window covers most cabin installations; under-hood applications should use the AEC-Q100 qualified -Q1 suffix variant.
추천
Networking Router Bootloader
Enterprise routers and Layer-2/3 switches use the S29GL256S90TFI010 to store bootloader, u-boot, and recovery partitions that must survive power loss without corruption. Its parallel interface directly attaches to MIPS/ARM network processors that lack QSPI controllers, and the embedded 512-byte write buffer accelerates firmware updates at the 12+ Mbps rates required for gigabit networks. The 20-year retention exceeds the typical 7-10 year router refresh cycle, while hardware sector protection prevents field-upgrade mishaps. Designers often place a small I2C EEPROM nearby for runtime config; the parallel NOR is reserved exclusively for immutable boot images.
추천
Point-of-Sale Terminal Firmware
POS terminals require rugged, long-retention code storage that boots within seconds under retail SLA. The S29GL256S90TFI010's 90 ns access and 32 MB density accommodate a full Linux kernel plus initramfs, allowing POS terminals to boot without a separate eMMC/NAND boot stage. Hardware sector protection via WP# prevents tampering by malicious peripherals, and the industrial temperature range covers retail environment extremes (frozen-goods aisles to outdoor kiosk deployments). The wide 2.7-3.6 V VCC range tolerates noisy power from printer/coin-dispenser inductive loads that share the same 12 V rail.
추천
Medical Device Firmware Storage
Patient monitoring and diagnostic imaging equipment use the S29GL256S90TFI010 as the primary boot/firmware store where deterministic cold-boot time matters for clinical workflows. The 90 ns tACC and parallel XIP capability allow ARM Cortex-M7 hosts to start peripherals within FDA-cleared startup windows, while the 100K erase endurance handles nightly firmware updates over a 10+ year product lifecycle. Designers pair the parallel NOR with a separate authenticated SPI EEPROM for audit logs; the parallel NOR stores only the immutable firmware image, and its hardware WP# pin enforces read-only boot operation. The industrial -40C to +85C range covers most clinical environments.
추천
Industrial HMI Panel Code Storage
Industrial human-machine interface (HMI) panels with 7-15 inch touchscreens rely on the S29GL256S90TFI010 for boot firmware plus runtime GUI assets that must be reliable in factory environments. The 56-pin TSOP package is widely supported by HMI reference designs from NXP i.MX RT and Microchip SAME70 hosts, and the 90 ns access time matches the timing requirements of Cortex-M7 external bus interfaces without wait-state penalties. Hardware sector protection locks down calibration constants, while the 20-year retention exceeds the typical 15-year HMI service interval. Designers often pair the parallel NOR with a smaller QSPI flash for non-critical assets, using the parallel NOR exclusively for the immutable runtime image.
추천
추천 제품 요약
엔지니어링 참조 데이터: S29GL256S90TFI010 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | S29GL256S90TFI020 | S29GL128S90TFI010 | S29GL512S90TFI010 | MT28EW256ABA1LGH-0SIT | MX29GL256FLT2I |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Micron | Macronix |
| Package | 56-pin TSOP I (TFSOP) | 56-pin TSOP I - same | 56-pin TSOP I - same | 56-pin TSOP I - same | 56-pin TSOP I - same | 56-pin TSOP I - same |
| Density | 256 Mbit (32 MB) | 256 Mbit | 128 Mbit | 512 Mbit | 256 Mbit | 256 Mbit |
| Initial Access Time | 90 ns | 90 ns | 90 ns | 90 ns | 90 ns | 90 ns |
| Operating Voltage | 2.7 V - 3.6 V (3.0 V nominal) | 2.7 V - 3.6 V | 2.7 V - 3.6 V | 2.7 V - 3.6 V | 2.7 V - 3.6 V | 2.7 V - 3.6 V |
| Interface | Parallel (Asynchronous) | Parallel | Parallel | Parallel | Parallel | Parallel |
| Sector Architecture | 128 KB uniform sectors | 128 KB uniform | 128 KB uniform | 128 KB uniform | Top/bottom boot block | Uniform 64 KB |
| Endurance | 100,000 cycles/sector | 100,000 cycles | 100,000 cycles | 100,000 cycles | 100,000 cycles | 100,000 cycles |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
주요 차별점
- 90 nm MirrorBit Eclipse process with 100K endurance and 20-year retention (vs MX29GL256FLT2I)
- Standardized JEDEC-compatible command set across the S29GL-S family (vs MT28EW256ABA1LGH-0SIT)
- Uniform 128 KB sector architecture for predictable firmware partitioning (vs MT28EW256ABA1LGH-0SIT)
설계 노트
Estimated: VCC supply design for the S29GL256S90TFI010 must support transient current spikes during sector erase and buffer-program operations. The data sheet specifies typical Icc active read at 30 mA and Icc erase/program up to 60 mA pulsed. Place a 0.1 uF X7R ceramic capacitor within 5 mm of each VCC pin (pins 53 and 56) plus a single 4.7 uF bulk capacitor at the package entry point. A ferrite bead on VCC is optional but recommended if the host 3.3 V rail shares noisy digital loads; this isolates VCC droop during erase pulses that could otherwise corrupt adjacent logic.
The 56-pin TSOP I footprint has 0.5 mm pin pitch - the design rule floor for most low-cost PCB fabs. Use NSMD (non-solder-mask-defined) pads with 0.45 mm width and 1.5 mm length to maximize manufacturing yield. Route address and data signals on the top layer with microstrip impedance of 50 ohm, and place ground pour on layer 2 directly under the TSOP body to provide a low-impedance return path for high-speed data bus transitions. Avoid vias under the package body; route all signals out the short pin side first, then serpentine on the outer reach.
Common pitfalls when designing with the S29GL256S90TFI010: (1) leaving RESET# floating - it must be tied to VIO through a 10 kohm pull-up so that undefined power-up states cannot trigger spurious command execution. (2) Driving BYTE# after power-up - per the datasheet BYTE# must be held static before and during the first CE# assertion; changing BYTE# mid-operation causes bus contention. (3) Forgetting WP# logic - in systems that need permanent write-protection during boot, WP# must be driven low (not floated) by the host, or the device defaults to unprotected. (4) Assuming 5 V tolerance - this is a 3.3 V-only part; applying 5 V to any DQ or address pin permanently damages the device.
Signal-integrity considerations for the parallel bus: at 90 ns tACC the address and data bus edge rates are slow enough that transmission-line effects are minor, but the synchronous write-pulse width (tWP) of 35 ns minimum means WE# must be clean. Place a 33 ohm series damping resistor on WE#, CE#, and OE# if the host is more than 50 mm away, to dampen ringing observed on long bus traces. Avoid running the parallel bus parallel to switching power converter traces; route orthogonal or use a ground-shielded stripline if isolation is impossible.
규정 준수 정보
RoHS and REACH compliant per Infineon product page. Lead-free finish (Pb-free). Not AEC-Q100 qualified; for automotive applications use the -Q1 suffix variant. Halogen-free molding compound.
