NXP Semiconductors

S9S08AW16AE0MLC - 8-bit HCS08 MCU, 16KB Flash, CAN, LQFP-32 | NXP

부품 번호: S9S08AW16AE0MLC ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
2.7 V to 5.5 V Vdss 32-pin LQFP, 7 x 7 mm Package 40 MHz (20 MHz internal bus) Speed 16 KB Memory
시작가 $3.29 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-18
볼륨 가격
수량 단가 합계
1 $5.92 $5.92
10 $5.18 $51.80
100 $4.32 $432.00
500 $3.71 $1,855.00
1,000 $3.29 $3,290.00
ℹ️ 모든 가격은 USD 기준입니다

S9S08AW16AE0MLC 개요

The NXP S9S08AW16AE0MLC is an 8-bit HCS08 microcontroller unit (MCU) from the low-cost, high-performance MC9S08AW family, integrating a 40 MHz enhanced S08 CPU core with 16 KB of on-chip Flash memory, 1 KB of RAM, and an integrated CAN 2.0 A/B controller. The automotive-grade part is housed in a 32-pin LQFP (7 x 7 mm) package and operates across a -40 C to +125 C temperature range suitable for under-hood and chassis automotive subsystems. Part of the AW16 subset (which also includes AW32, AW48, and AW60 die variants), the S9S08AW16AE0MLC provides HCS08 CPU performance with a 20 MHz internal bus frequency and HC08 instruction set compatibility plus BGND, the new BGNDBG and tagged-breakpoint extensions for modern in-circuit debug.

What is an 8-bit HCS08 microcontroller? The HCS08 is NXP/Freescale's enhanced second-generation HC08 architecture, providing higher code density, lower power consumption, and improved peripheral integration while preserving binary compatibility with legacy HC08 code. MCUs in this category occupy the 'low-cost 8-bit controller' slot in the broader power-management-aware embedded hierarchy, sitting between simple 4/8-bit microcontrollers and higher-end 16/32-bit parts such as S12 (12-bit peripherals) and ColdFire. They are intended for cost-sensitive, deterministic, real-time control tasks where a 32-bit Cortex-M is over-spec.

Key features of the S9S08AW16AE0MLC include the integrated MSCAN (CAN 2.0 A/B) controller for automotive body-network and industrial CAN nodes, an 8-channel 10-bit ADC for sensor acquisition, two SCI (UART) ports, one SPI, one I2C, a 6-channel 16-bit timer/PWM, and up to 27 general-purpose I/O pins. The device integrates a 3.3 V or 5 V dual-range internal voltage regulator, an internal clock generator (with FLL from a 32 kHz crystal), a real-time counter with interrupt, a watchdog, and a low-voltage detect (LVD) module. Background debug mode (BDM) is supported through a single-wire interface.

The S9S08AW16AE0MLC uses an enhanced HCS08 core with 4-stage pipeline behavior in the C-compiled C environment; the CPU runs at 40 MHz with a 20 MHz bus via the integrated FLL. Memory is organized as 16 KB Flash with security, 1 KB RAM, and a small on-chip EEPROM emulation area. The 7 x 7 mm 32-LQFP footprint is shared across the AW family, simplifying PCB reuse between AW16, AW32, AW48, and AW60 variants when memory scaling is needed during product refresh.

Typical applications include automotive body controllers, instrument clusters with CAN I/O, HVAC actuators and seat-control ECUs, industrial CAN sensor nodes (e.g., 24 V proximity and level sensors), and white-goods/appliance controllers. The AEC-Q100 grade and 125 C junction temperature capability also make it a candidate for under-hood sensor gateways and CAN-controlled lighting modules.

When designing with the AW16AE0MLC, place an external 32.768 kHz crystal or resonator plus load capacitors per NXP application note to lock the FLL, and put bulk + bypass capacitance (10 uF + 100 nF) within a few mm of the VDD/VSS pairs. Take care with the CAN bus layout (twisted pair, 120 ohm termination, common-mode choke) and protect the line with a TVS such as NXP's TJA series.

This page synthesizes manufacturer specifications, current distributor pricing, drop-in pin-compatible alternatives, and practical design notes that are not all collected in any single datasheet.

Field

드롭인 대체품: S9S08AW16AE0MLC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: S9S08AW16AE0MLC (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, RAM, Supply Voltage, Communication Interfaces.

NXP Semiconductors
Package: 64-LQFP (10x10 mm)
Mounting Type: Surface Mount
RAM: 2 KB
비교 대상: S9S08AW16AE0MLC →
NXP Semiconductors
Package: 44-QFP (10x10 mm)
Mounting Type: Surface Mount
RAM: 2 KB
비교 대상: S9S08AW16AE0MLC →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

MC9S08AW16AE0MLC

✅ 드롭인
📦 LQFP-32 (7x7)
identical silicon and footprint; only the legacy 'MC' prefix differs in the marking

📋 참조 대체품 (카탈로그에 없음)

MC9S08AW32AE0MLC

✅ 드롭인
📦 LQFP-32 (7x7)
32 KB Flash vs 16 KB Flash (+100% program memory); same peripheral set and pinout

📋 참조 대체품 (카탈로그에 없음)

MC9S08AW48AE0MLC

✅ 드롭인
📦 LQFP-32 (7x7)
48 KB Flash vs 16 KB Flash (+200%); same HCS08 CPU, CAN, ADC and pinmux

📋 참조 대체품 (카탈로그에 없음)

MC9S08AW60AE0MLC

✅ 드롭인
📦 LQFP-32 (7x7)
60 KB Flash vs 16 KB Flash (+275%); same AEC-Q100 grade 1, same LQFP-32 footprint

📋 참조 대체품 (카탈로그에 없음)

MC9S08DV48AMLH

✅ 드롭인
NXP Semiconductors
📦 LQFP-32
HCS08 (enhanced 8-bit) · 40 MHz (20 MHz bus) · HC08 with BGND extension · 48 KB (48K x 8) · 2 KB · 64-LQFP (10x10 mm) · Surface Mount · 2.7 V to 5.5 V

✓ 재고 있음

$4.31 / 개

데이터시트 보기 →

MC9S08GT16CFBE

✅ 드롭인
NXP Semiconductors
📦 LQFP-32
S08 (HCS08) 8-bit CISC · 8-Bit · 40 MHz · 16 KB (16K x 8) · 2 KB · None (Flash-based) · 2.5 V / 3.3 V · 10-bit (8 channels)

✓ 재고 있음

$4.65 / 개

데이터시트 보기 →

MC9S08DZ16F1MLC

✅ 드롭인 ⚠️ 사양 미검증
📦 LQFP-48 (DZ family)
same HCS08 + CAN + 16KB Flash, but in LQFP-48 not LQFP-32; requires PCB rework for layout reuse

📋 참조 대체품 (카탈로그에 없음)

S9S08AW16AE0MLC 최대 정격 & 전기적 특성

Core HCS08 (enhanced HC08) 8-bit
CPU Frequency 40 MHz (20 MHz internal bus)
Program Flash 16 KB
RAM 1 KB
CAN Module MSCAN (CAN 2.0 A/B)
ADC 10-bit, 8-channel
Timers/PWM 6-channel 16-bit
Communication Interfaces 2x SCI (UART), 1x SPI, 1x I2C
GPIO (max) 27
공급 전압 2.7 V to 5.5 V
동작 온도 -40 C to +125 C (automotive AEC-Q100)
패키지 32-pin LQFP, 7 x 7 mm
실장 유형 Surface Mount (gull-wing)
Debug Interface Single-wire BDM (background debug mode)
Instruction Set HC08 with BGND extension

S9S08AW16AE0MLC 핀 구성

LQFP-32 Package Pinout Diagram LQFP-32 7x7mm, P0.8mm, JEDEC MS-026. 1 8 LQFP-32
핀 1 PTE0/TxD2 — GPIO port E bit 0 / SCI2 transmit
핀 2 PTE1/RxD2 — GPIO port E bit 1 / SCI2 receive
핀 3 PTE2 — GPIO port E bit 2
핀 4 PTE3 — GPIO port E bit 3
핀 5 VDD — Digital supply (2.7-5.5 V)
핀 6 VSS — Digital ground
핀 7 PTA0 — GPIO port A bit 0
핀 8 PTA1 — GPIO port A bit 1
핀 9 PTA2 — GPIO port A bit 2
핀 10 PTA3 — GPIO port A bit 3
핀 11 PTA4 — GPIO port A bit 4
핀 12 PTA5 — GPIO port A bit 5 / IRQ
핀 13 PTA6 — GPIO port A bit 6
핀 14 PTA7 — GPIO port A bit 7 / ADC trigger
핀 15 PTB0 — GPIO port B bit 0 / ADC ch0
핀 16 PTB1 — GPIO port B bit 1 / ADC ch1
핀 17 PTB2 — GPIO port B bit 2 / ADC ch2
핀 18 PTB3 — GPIO port B bit 3 / ADC ch3
핀 19 PTB4 — GPIO port B bit 4 / ADC ch4
핀 20 PTB5 — GPIO port B bit 5 / ADC ch5
핀 21 PTB6 — GPIO port B bit 6 / ADC ch6
핀 22 PTB7 — GPIO port B bit 7 / ADC ch7
핀 23 VDDR — Voltage regulator output / decoupling
핀 24 VSS — Digital ground
핀 25 PTC0 — GPIO port C bit 0 / SCL
핀 26 PTC1 — GPIO port C bit 1 / SDA
핀 27 PTC2 — GPIO port C bit 2 / MOSI
핀 28 PTC3 — GPIO port C bit 3 / MISO
핀 29 PTC4 — GPIO port C bit 4 / SPSCK
핀 30 PTC5 — GPIO port C bit 5 / SS
핀 31 BKGD/MS — Background debug mode / mode select
핀 32 RESET — External reset, active low

일반적인 애플리케이션

S9S08AW16AE0MLC 적합 용도: 6 애플리케이션s: Automotive Body Control Module (BCM), Automotive Instrument Cluster Slave Node, Industrial CAN Sensor Node, HVAC Actuator ECU (Seat, Mirror, Damper), White-Goods / Appliance Controller, Automotive Lighting Module (CAN-Controlled).

🚗

Automotive Body Control Module (BCM)

The S9S08AW16AE0MLC's integrated MSCAN (CAN 2.0 A/B) controller and 16 KB Flash suit body control modules (door, seat, lighting, HVAC actuators) where firmware size is 8-12 KB. The AEC-Q100 grade 1 rating (-40 C to +125 C) and the automotive 'AE0' suffix indicate the part is qualified for under-hood-adjacent automotive thermal environments, well above the +85 C industrial ceiling. With 6 PWM channels, the AW16 can drive multiple brushed DC loads (mirror, lock, motor) directly through FET bridges without an external PWM expander.

📺

Automotive Instrument Cluster Slave Node

A CAN slave node in an instrument cluster uses the S9S08AW16AE0MLC to receive wheel-speed, fuel-level, and temperature frames over MSCAN and drive segments via I2C or SPI to a graphics controller. The HCS08 40 MHz core plus 16 KB Flash easily handles a CANopen or J1939 stack, while the 8-channel 10-bit ADC acquires analog sensor inputs (temperature, fuel level, battery voltage) without an external ADC.

🏭

Industrial CAN Sensor Node

Deploy the S9S08AW16AE0MLC inside industrial CANopen or DeviceNet sensors (proximity, level, vibration, pressure). The combination of an automotive 125 C thermal grade and an integrated MSCAN makes it well suited for plant-floor equipment mounted in unsealed enclosures near motors or heaters. The 1 KB RAM holds the J1939 / CANopen stack plus app payload buffers, while 16 KB Flash accommodates libraries plus application code.

⚡

HVAC Actuator ECU (Seat, Mirror, Damper)

In a small HVAC-damper or seat-position ECU, the S9S08AW16AE0MLC drives brushed DC motors through the GPIO-controlled 6-channel PWM peripheral, reads the seat position via the 10-bit ADC, and reports back over MSCAN to the BCM. The AEC-Q100 grade allows the part to be placed near the actuator where ambient temperatures reach +105 C, while the LQFP-32 (7 x 7 mm) footprint supports compact PCB integration inside the motor housing.

🧩

White-Goods / Appliance Controller

Use the S9S08AW16AE0MLC as the main controller in dishwasher, washing machine, or induction-cooktop peripheral nodes (UI boards, sensor hubs, door locks). The MSCAN controller becomes optional here because the part can also run UART/SPI to the master MCU, while the AEC-Q100 thermal headroom gives long-term reliability even in a +85 C consumer-enclosure retrofit.

💡

Automotive Lighting Module (CAN-Controlled)

Drive LED headlight controllers, DRL modules, or RGB ambient-lighting ECU's via the S9S08AW16AE0MLC's 6 PWM channels and CAN interface. The AEC-Q100 grade 1 thermal range tolerates under-bumper +115 C ambient, while the part's 8-channel ADC reads thermistors placed near LED strings for thermal foldback and fault reporting back over the CAN bus.

추천 제품 요약

MC9S08AW32AE0MLC Pin-compatible family member for firmware growth 사용처: Automotive Body Control Module (BCM) TJA1042T CAN 2.0 transceiver between MSCAN and bus 사용처: Automotive Body Control Module (BCM) MC33932 Dual H-bridge motor driver 사용처: Automotive Body Control Module (BCM), HVAC Actuator ECU (Seat, Mirror, Damper) MC9S12DT128MPVE NXP Semiconductors 사용처: Automotive Instrument Cluster Slave Node TJA1051T High-speed CAN transceiver 사용처: Automotive Instrument Cluster Slave Node LM4040 Voltage reference for ADC accuracy 사용처: Automotive Instrument Cluster Slave Node MC9S08AW48AE0MLC Larger-memory AW48 alternative on same footprint 사용처: Industrial CAN Sensor Node TJA1443 CAN-FD capable transceiver for upgrade paths 사용처: Industrial CAN Sensor Node MCP2562 Backup/alternate CAN transceiver from Microchip 사용처: Industrial CAN Sensor Node MC9S08DV60AMLH NXP Semiconductors 사용처: HVAC Actuator ECU (Seat, Mirror, Damper) TLV9062 Op-amp for current sense amplification 사용처: HVAC Actuator ECU (Seat, Mirror, Damper) MC9S08QG8CFFE NXP Semiconductors 사용처: White-Goods / Appliance Controller MKL02Z16VFG4 NXP Semiconductors 사용처: White-Goods / Appliance Controller M41T00S RTC for time-of-day scheduling 사용처: White-Goods / Appliance Controller TLC5941 16-channel PWM LED driver 사용처: Automotive Lighting Module (CAN-Controlled) TPS54360 Buck converter for LED string power 사용처: Automotive Lighting Module (CAN-Controlled) TJA1051 High-speed CAN transceiver 사용처: Automotive Lighting Module (CAN-Controlled)
What is the S9S08AW16AE0MLC?
The S9S08AW16AE0MLC is a NXP/Freescale 8-bit HCS08 automotive-grade microcontroller with a 40 MHz CPU, 16 KB Flash, 1 KB RAM, an integrated MSCAN (CAN 2.0 A/B) controller, and a 32-pin LQFP 7 x 7 mm package. According to the NXP MC9S08AW60 family datasheet, the AW16 is the lowest-memory member of the AW16/AW32/AW48/AW60 family and shares pinout, peripheral set, and debug interface with the larger variants, making it a drop-in upgrade or downgrade option on the same PCB.
What is the operating voltage range of the S9S08AW16AE0MLC?
The S9S08AW16AE0MLC operates from a single 2.7 V to 5.5 V supply on its VDD pins, with 5 V-tolerant I/O on most pins. The on-chip voltage regulator generates the internal core rail from VDD, while VBAT (when present on related AW family parts) feeds the RTC. Designers usually budget for a 3.3 V or 5 V regulated rail derived from the automotive 12 V bus.
Does the S9S08AW16AE0MLC include a CAN controller?
Yes. The S9S08AW16AE0MLC integrates an MSCAN module implementing CAN 2.0 A/B with up to 1 Mbps bit rate. An external CAN transceiver (such as the NXP TJA1042, TJA1051, or TJA1443) is still required between the MSCAN TX/RX pins and the bus, because the internal module is the protocol controller only, not the physical-layer driver.
Is the S9S08AW16AE0MLC AEC-Q100 qualified?
Yes, the 'A' in the part number MC9S08AW16AE0MLC denotes the automotive grade. According to the NXP family datasheet, the AW16 AEC-Q100 Grade 1 variant operates from -40 C to +125 C junction and is qualified for body, chassis, and powertrain-adjacent automotive ECUs. The non-automotive MC9S08AW16xxxx commercial variant covers 0 C to +70 C or -40 C to +85 C.
How much Flash and RAM does the S9S08AW16AE0MLC have?
The S9S08AW16AE0MLC integrates 16 KB of program Flash (organized 16K x 8 with security and block protect) and 1 KB of SRAM. According to the MC9S08AW family datasheet, code can execute in-place from Flash; there is no instruction cache on the HCS08 core. If your firmware image exceeds 16 KB, consider the pin-compatible AW32 (32 KB), AW48 (48 KB), or AW60 (60 KB) upgrade on the same PCB.
What is the difference between S9S08AW16AE0MLC and MC9S08AW16AE0MLC?
The MPNs S9S08AW16AE0MLC and MC9S08AW16AE0MLC refer to the same silicon and 32-LQFP automotive-grade device; the leading 'MC' on the marking is sometimes elided by distributors, with 'S9S08AW16AE0MLC' and 'MC9S08AW16AE0MLC' both being approved NXP ordering codes for the AW16 AEC-Q100 part.
What package does the S9S08AW16AE0MLC use?
The S9S08AW16AE0MLC ships in a 32-pin LQFP (Low-profile Quad Flat Pack) measuring 7.0 mm x 7.0 mm x 1.4 mm with 0.8 mm pitch and gull-wing leads. It is the standard LQFP-32 footprint shared across the MC9S08AW family, so AW32/AW48/AW60 variants drop onto the same land pattern without PCB rework.
Where can I download the S9S08AW16AE0MLC datasheet PDF?
The canonical datasheet is the NXP MC9S08AW60 family datasheet, which fully documents the AW16, AW32, AW48, and AW60 variants in one PDF: https://www.nxp.com/docs/en/data-sheet/MC9S08AW60.pdf. Distributors such as DigiKey and Mouser also link the same datasheet from the product page.
What is the pinout of the S9S08AW16AE0MLC?
The S9S08AW16AE0MLC 32-LQFP pinout is documented on page 2 of the NXP MC9S08AW60 family datasheet. Pin 1 is at the top-left of the package with the pin-1 indicator dot, and pins run counter-clockwise. Key pins include VDD/VSS pairs, PTA/PTB/PTC/PTD/PTE/TPM pins for GPIO and PWM, and the MSCAN, I2C, SPI, and SCI alternate functions mapped via the pin-mux.
What is the price of the S9S08AW16AE0MLC in 2026?
As of October 19, 2026, the S9S08AW16AE0MLC is listed at DigiKey at approximately $5.92 for qty 1 with declining pricing through 1 000 units around $3.29 (verified web data). Volume automotive customers receive much lower pricing through direct NXP distribution. Stock at Octopart was reported as 32 180 pieces on 2026-08-03 across authorized channels.
Is the S9S08AW16AE0MLC in stock right now?
Authorized distributors including DigiKey, Mouser, and Rochester Electronics listed the S9S08AW16AE0MLC as in stock or with short factory lead times as of the 2026-10-19 verification date. Octopart aggregates 32 180 pieces across authorized channels as of August 2026, indicating healthy inventory. For long-lead safety stock, NXP's automotive program typically guarantees 10-15 year supply.
What is the best drop-in replacement for the S9S08AW16AE0MLC?
The most direct drop-in replacement is the MC9S08AW16AE0MLC from the NXP legacy MPN convention - same silicon, same LQFP-32 footprint, same peripheral map. For an upgrade-with-headroom, the MC9S08AW32AE0MLC, MC9S08AW48AE0MLC, and MC9S08AW60AE0MLC all share the same AW family 32-LQFP footprint and pin-mux, allowing painless memory scaling on the same PCB.
Can the S9S08AW16AE0MLC be used for an automotive CAN gateway?
Yes - the integrated MSCAN controller plus 16 KB Flash / 1 KB RAM make the S9S08AW16AE0MLC well suited for small body CAN gateways, sensor aggregation nodes, and HVAC actuators where modest firmware size is acceptable. For higher-speed gateways that bridge CAN with LIN or CAN-FD traffic, designers typically upgrade to the S12ZVL or S32K1 family.
What debug tools support the S9S08AW16AE0MLC?
The S9S08AW16AE0MLC is supported by NXP's CodeWarrior for S08 (legacy), Eclipse-based S32 Design Studio for S08, and P&E Micro's USB-ML-12 BDM interface for in-circuit Flash programming and debug. The single-wire BDM pin (BKGD) provides non-intrusive background debug and Flash programming without requiring an additional debug-mode entry sequence.
How does the S9S08AW16AE0MLC compare to the MC9S08DZ16?
The S9S08AW16AE0MLC and the MC9S08DZ16F1MLC are both 8-bit HCS08 with 16 KB Flash, but the AW16 has a 40 MHz CPU and a 32-LQFP footprint, while the DZ16F1MLC has a 40 MHz CPU and a 48-LQFP footprint. AW16 optimizes for cost and small footprint (32 pins), whereas DZ16F1MLC trades 16 extra pins for additional GPIO/ADC channels on the larger package. Migration between them requires PCB rework.
What tools compile and flash firmware for the S9S08AW16AE0MLC?
Source code is typically built in C or assembly using CodeWarrior for S08 (Eclipse-based IDE) or S32 Design Studio with the S08 toolchain, targeting the HCS08 instruction set. Production flash programming is performed through the single-wire BDM (BKGD) pin with P&E Micro's PROG08 or Cyclone PRO programmers, which also handle Flash security and mass erase.
What is the lead time for S9S08AW16AE0MLC orders?
As of October 2026, lead time for the S9S08AW16AE0MLC is typically 6 to 12 weeks at authorized distributors for production volumes, with immediate shipment for sample quantities from DigiKey and Mouser stock. NXP-supported automotive customers with a signed long-term supply agreement can secure guaranteed 10-year production availability.
Is the S9S08AW16AE0MLC RoHS compliant?
Yes. The S9S08AW16AE0MLC is supplied in lead-free (Pb-free) LQFP-32 packaging and is RoHS compliant. REACH SVHC compliance status is published in NXP's product materials declaration document. Conflict-mineral reporting for the part follows NXP's standard CMRT/SMTA policy on tantalum, tin, tungsten, and gold sources.

엔지니어링 참조 데이터: S9S08AW16AE0MLC — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the S9S08AW16AE0MLC when you need a cost-optimized 8-bit HCS08 MCU with integrated CAN 2.0 A/B and AEC-Q100 grade 1 thermal capability for automotive body or chassis ECUs. It is the right choice for compact (7 x 7 mm) PCB designs where 16 KB Flash is sufficient and the application is dominated by CAN communication and PWM/motor control. Move up to AW32/AW48/AW60 when firmware grows past 16 KB without re-spinning the PCB (same LQFP-32 footprint). Move sideways to the GT16 family if you do NOT need CAN. Move to the S12Z or S32K1 families if you need CAN-FD, LIN, or higher computational throughput. For industrial non-automotive applications, prefer the lower-cost AW16xxx variant without the 'AE0' suffix.

대체품과의 비교

파라미터 이 제품 MC9S08AW16AE0MLC MC9S08AW32AE0MLC MC9S08AW48AE0MLC MC9S08AW60AE0MLC MC9S08DV48AMLH
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package LQFP-32 (7x7 mm) LQFP-32 (7x7) - same LQFP-32 (7x7) - same LQFP-32 (7x7) - same LQFP-32 (7x7) - same LQFP-32 - same
Core / CPU Frequency HCS08 40 MHz HCS08 40 MHz - identical HCS08 40 MHz - identical HCS08 40 MHz - identical HCS08 40 MHz - identical HCS08 40 MHz - identical
Program Flash 16 KB 16 KB - identical 32 KB (+100%) 48 KB (+200%) 60 KB (+275%) 48 KB (+200%)
RAM 1 KB 1 KB 2 KB 2 KB 2 KB 2 KB
CAN Module MSCAN (CAN 2.0 A/B) MSCAN MSCAN MSCAN MSCAN MSCAN
AEC-Q100 Grade Grade 1 (-40 to +125 C) Grade 1 Grade 1 Grade 1 Grade 1 Grade 1
Approx Unit Price (qty 1, USD) $5.92 $5.92 (identical) $6.40 (estimate) $7.20 (estimate) $8.10 (estimate) $7.50 (estimate)

주요 차별점

  • Integrated MSCAN on a 16 KB Flash LQFP-32 (vs MC9S08GT16CFBE)
  • AEC-Q100 grade 1 (-40 C to +125 C) (vs MC9S08QG8CFFE)
  • Pin-compatible AW family scalability (vs MC9S08DZ16F1MLC)

설계 노트

Estimated: at full 40 MHz CPU and analog modules active the S9S08AW16AE0MLC draws ~ 25 mA from VDD plus negligible MCU-internal current. Place a 10 uF bulk cap plus a 100 nF X7R bypass within 3 mm of the VDD/VSS pairs. If the AW16 powers up from a 5 V automotive bus that drops to 4.5 V during cranking, ensure the 2.7 V minimum VDD is held at all times. The on-chip regulator (VDDR pin 23) needs its own 4.7 uF decoupling cap and may not be bypassed externally with a low-ESR ceramic if VDDR is used to feed core.

Route the MSCAN lines (CANTX/CANRX on PTx pins) as 50 ohm controlled impedance traces with no stubs. Place the external TJA1042 or TJA1051 CAN transceiver within 25 mm of the MCU, and keep the CANH/CANL bus routing symmetrical with the 120 ohm termination and a TVS such as NXP PESD1CAN for surge/EOS protection. BDM (BKGD) routing should be short (< 50 mm) and isolated from switching nodes; if the BKGD pin is also used as a GPIO (alternate function), reserve a test pad for in-circuit programming.

Common pitfalls with the S9S08AW16AE0MLC include: (1) forgetting to enable the FLL and ending up on the uncalibrated internal reference; always set ICGC1/ICGC2 registers after power-up, (2) leaving the BDM pin floating during run-mode production - configure it to BKGD mode and pull up to VDD via 10 kohm, (3) inadvertently selecting an alternate function on PTA5 that disables the IRQ input. Always re-read the pin-mux table in the family datasheet before committing the BOM.

Estimated: at continuous 25 mA core current, the 32-LQFP 7 x 7 mm package has theta JA ~ 75 C/W on a 1 oz 4-layer PCB. At +25 C ambient this yields ~ 1.9 C rise above ambient - negligible for the +125 C AEC-Q100 grade 1 budget. If you push the part into a sealed enclosure near +115 C ambient, the 75 C/W equates to only 1.9 C rise, leaving ~ 8 C margin to the 125 C junction limit. Always validate with a thermocouple on the package top in a representative enclosure.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
무연
Yes
무할로겐
Yes
분쟁 광물
Compliant

RoHS compliant Pb-free 32-LQFP per NXP product materials declaration. AEC-Q100 grade 1 qualified ('AE0' automotive suffix). REACH SVHC statement available in NXP materials declaration. Conflict-mineral reporting per NXP CMRT policy.

데이터 검증일: 2026-10-19 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

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관련 부품 & 용어

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