NXP Semiconductors

S9S08DZ32F2VLCR - 8-bit S08 MCU, 32KB Flash, CAN, 32-LQFP | NXP

부품 번호: S9S08DZ32F2VLCR ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
2.7 V to 5.5 V (3.3 V / 5 V typical) Vdss 32-LQFP (7x7 mm) Package 40 MHz Speed 32 KB (32K x 8) Memory
시작가 $4.2 USD / 개
MOQ: 1 |
가격 업데이트: 2026-10-19
볼륨 가격
수량 단가 합계
1 $6.42 $6.42
10 $5.78 $57.80
100 $5.18 $518.00
500 $4.66 $2,330.00
1,000 $4.2 $4,200.00
ℹ️ 모든 가격은 USD 기준입니다

S9S08DZ32F2VLCR 개요

The NXP Semiconductors S9S08DZ32F2VLCR is an 8-bit S08 CISC microcontroller with 32 KB of Flash, 40 MHz CPU clock, and automotive-grade qualification (-40C to +105C), housed in a 32-pin LQFP package. It is part of NXP's S08DZ family, the industry's first 8-bit MCU family to integrate CAN, embedded EEPROM, and on-chip emulation/debug for automotive and industrial markets. Key specifications include 32 KB program Flash, 2 KB RAM, an integrated LCD driver, and CAN 2.0 A/B controller.

What is an 8-bit CISC microcontroller (MCU)? An 8-bit MCU is a single-chip computer with an 8-bit data path, optimized for cost-sensitive, deterministic, real-time control. CISC (Complex Instruction Set Computer) architectures provide a rich instruction set with variable-length opcodes that improve code density, reducing Flash pressure in embedded systems. Within the broader taxonomy, an 8-bit MCU belongs to the microcontroller family, sitting alongside 16-bit and 32-bit MCUs in the semiconductor hierarchy. The S08DZ specifically targets automotive and industrial segments requiring CAN networking, low power, and AEC-Q100-grade qualification.

This part features an integrated CAN 2.0 A/B controller, on-chip EEPROM for non-volatile data storage without external serial memory, an LCD driver supporting segmented displays up to 8x32 segments, and an enhanced capture/timer/PWM module. The S08 CPU core delivers 40 MHz throughput with background debug mode (BDM) for non-intrusive in-circuit programming and debugging, reducing development-tool costs compared to boundary-scan solutions.

Typical applications include automotive body control modules, instrument clusters, HVAC controls, industrial sensor nodes, and CAN-based distributed control networks. The integrated LCD driver eliminates external display controller cost in applications with segmented character or graphic displays. AEC-Q100 qualification and the -40C to +105C operating range support under-hood and cabin-mounted automotive electronics where commercial-grade MCUs cannot survive.

When designing with this device, note that the LQFP-32 pin count limits I/O to ~26 usable GPIO pins after LCD, CAN, and oscillator allocations. The 5V-tolerant I/O simplifies interfacing to legacy 5V sensors and actuators in automotive subsystems. Use the BDM interface (background-debug pins BKGD/MS) for in-circuit programming and debugging, eliminating the need for an expensive in-circuit emulator.

This page synthesizes distributor pricing, S08DZ-family drop-in alternatives, and practical design notes for CAN/LCD automotive applications not found in the manufacturer datasheet.

드롭인 대체품: S9S08DZ32F2VLCR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: S9S08DZ32F2VLCR (동일 폼 팩터 및 풋프린트) — 차이점: Core, Package, ADC, Operating Temperature, Supply Voltage.

NXP Semiconductors
Core: HCS08 (8-bit)
Package: 48-LQFP (7x7 mm), 0.5 mm pitch
ADC: 12-bit, 24-channel, 2.5 us conversion
비교 대상: S9S08DZ32F2VLCR →
NXP Semiconductors
Core: HCS08 (S08) 8-bit CPU
Package: 48-pin LQFP (7x7 mm)
ADC: 24-channel, 12-bit, 2.5 us conversion
비교 대상: S9S08DZ32F2VLCR →
NXP Semiconductors
Package: 64-LQFP (10x10 mm)
Supply Voltage: 3.3V / 5V
비교 대상: S9S08DZ32F2VLCR →
NXP Semiconductors
Package: 48-LQFP (7x7 mm)
ADC: 24-channel, 12-bit, 2.5 µs conversion
비교 대상: S9S08DZ32F2VLCR →
NXP Semiconductors
Core: HCS08 (8-bit CISC)
Package: 64-LQFP (10x10 mm)
ADC: 24-channel, 12-bit, 2.5 us conversion
비교 대상: S9S08DZ32F2VLCR →
NXP Semiconductors
Core: HCS08 8-bit
Package: 64-LQFP (10x10 mm)
ADC: 12-bit
비교 대상: S9S08DZ32F2VLCR →
NXP Semiconductors
Core: HCS08 (enhanced S08), 8-bit CISC
Package: 64-LQFP, 10 mm x 10 mm, 0.5 mm pitch
ADC: 24-channel, 12-bit, 2.5 µs conversion time
비교 대상: S9S08DZ32F2VLCR →
NXP Semiconductors
Core: S08 (HCS08 CISC)
Package: 48-LQFP (7x7 mm)
ADC: Yes (multi-channel)
비교 대상: S9S08DZ32F2VLCR →
NXP Semiconductors
Core: HCS08 enhanced 8-bit core
Package: 100-LQFP (14x14)
Operating Temperature: -40°C to +85°C
비교 대상: S9S08DZ32F2VLCR →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

S9S08DZ32F2VLC

✅ 드롭인
📦 32-LQFP
Identical silicon, tray packaging vs tape-and-reel; same 32 KB Flash and 32-LQFP footprint

📋 참조 대체품 (카탈로그에 없음)

S9S08DZ48F2VLCR

✅ 드롭인
📦 32-LQFP
48 KB Flash (+50%) vs 32 KB; same 32-LQFP package and S08 core; pin-to-pin compatible

📋 참조 대체품 (카탈로그에 없음)

S9S08DZ16F2VLCR

✅ 드롭인
📦 32-LQFP
16 KB Flash (-50%) vs 32 KB; same 32-LQFP package; pin-to-pin compatible

📋 참조 대체품 (카탈로그에 없음)

S9S08DZ32F1MLC

✅ 드롭인 ⚠️ 사양 미검증
📦 32-LQFP
Same 32 KB Flash and S08 core, lower speed grade (-25% throughput); same 32-LQFP footprint

📋 참조 대체품 (카탈로그에 없음)

MC9S08DZ32AMLH

✅ 드롭인 ⚠️ 사양 미검증
NXP Semiconductors
📦 64-LQFP
HCS08 (S08 core) · 8-Bit · HC08 with added BGND instruction (CISC) · 40 MHz · 20 MHz · 32KB (32K x 8) FLASH · 3.3V / 5V · 12 bit

✓ 재고 있음

가격 문의

데이터시트 보기 →

MC9S08DZ96CLH

✅ 드롭인 ⚠️ 사양 미검증
NXP Semiconductors
📦 64-LQFP
HCS08 8-bit · S08DZ · 40 MHz · 20 MHz · 96 KB · 6 KB · 2 KB · 64-LQFP (10x10 mm)

✓ 재고 있음

$6.21 / 개

데이터시트 보기 →

S9S08DZ32F2VLCR 최대 정격 & 전기적 특성

Core S08 (8-bit CISC)
Program Flash 32 KB (32K x 8)
RAM 2 KB
EEPROM Embedded (on-chip)
CPU Clock Speed 40 MHz
공급 전압 2.7 V to 5.5 V (3.3 V / 5 V typical)
동작 온도 -40C to +105C
패키지 32-LQFP (7x7 mm)
CAN Controller Yes (CAN 2.0 A/B)
LCD Driver Yes (integrated)
GPIO (approx.) 26 usable
Debug Interface Background Debug Mode (BDM)
AEC-Q100 Qualification Yes (automotive qualified)
실장 유형 Surface Mount
RoHS 상태 Compliant

S9S08DZ32F2VLCR 핀 구성

LQFP-32 Package Pinout Diagram LQFP-32 7x7mm, P0.8mm, JEDEC MS-026. 1 8 LQFP-32
핀 1 PTC0 — GPIO / Timer channel
핀 2 PTC1 — GPIO / Timer channel
핀 3 PTC2 — GPIO / Timer channel
핀 4 PTC3 — GPIO / Timer channel
핀 5 PTC4 — GPIO / Timer channel
핀 6 PTC5 — GPIO / Timer channel
핀 7 PTC6 — GPIO / Timer channel
핀 8 VDD — Supply voltage (2.7V-5.5V)
핀 9 VSS — Ground
핀 10 PTC7 — GPIO / LCD segment
핀 11 PTB0 — GPIO / LCD segment
핀 12 PTB1 — GPIO / LCD segment
핀 13 PTB2 — GPIO / LCD segment
핀 14 PTB3 — GPIO / LCD segment
핀 15 PTB4 — GPIO / LCD segment
핀 16 PTB5 — GPIO / LCD segment
핀 17 PTB7 — GPIO / LCD segment
핀 18 PTA0 — GPIO / CAN TX
핀 19 PTA1 — GPIO / CAN RX
핀 20 PTA2 — GPIO / I2C SDA
핀 21 PTA3 — GPIO / I2C SCL
핀 22 PTA4 — GPIO / BKGD debug
핀 23 PTA5 — GPIO / IRQ interrupt
핀 24 PTA6 — GPIO / Reset
핀 25 PTA7 — GPIO
핀 26 PTD0 — GPIO / LCD segment
핀 27 PTD1 — GPIO / LCD segment
핀 28 PTD2 — GPIO / LCD segment
핀 29 PTD3 — GPIO / LCD segment
핀 30 EXTAL — External oscillator input
핀 31 XTAL — External oscillator output
핀 32 VDDA — Analog supply

일반적인 애플리케이션

S9S08DZ32F2VLCR 적합 용도: 6 애플리케이션s: Automotive Body Control Module (BCM), Automotive Instrument Cluster, Industrial CAN Sensor Node, HVAC Climate Control Module, Battery Management Slave Module, Motor Control for Small BLDC/PMSM.

🚗

Automotive Body Control Module (BCM)

The S9S08DZ32F2VLCR is purpose-built for automotive body control modules where its integrated CAN 2.0 A/B MSCAN controller and -40C to +105C AEC-Q100 qualification eliminate the need for external communication ICs. Its 32 KB Flash comfortably hosts BCM firmware for door/lock/lighting/wiper control with 2 KB RAM for CAN message buffering and task stacks. The 32-LQFP package enables single-layer PCB designs in space-constrained door-module enclosures.

📺

Automotive Instrument Cluster

The S9S08DZ32F2VLCR's integrated LCD driver directly supports segmented automotive instrument cluster displays (up to 8x32 segments) without external display controller cost. Its 8-bit S08 core deterministically scans gauges and odometer displays at refresh rates up to 100 Hz, while 32 KB Flash stores LCD segment patterns and CAN-driven gauge calibration. The 5V-tolerant I/O simplifies interfacing to legacy gauge stepper motors and indicator LEDs.

🏭

Industrial CAN Sensor Node

For distributed industrial sensor networks using CANopen or DeviceNet protocols, the S9S08DZ32F2VLCR provides a cost-effective node controller with on-chip CAN, embedded EEPROM for sensor calibration constants, and industrial temperature tolerance (-40C to +105C). Its 32 KB Flash hosts CANopen CiA40103 device dictionaries, and the BDM interface simplifies factory calibration. AEC-Q100 qualification provides margin against motor-drive EMI and temperature extremes in factory environments.

🌐

HVAC Climate Control Module

Automotive HVAC modules benefit from the S9S08DZ32F2VLCR's LCD driver (climate-control display), CAN bus (body-network integration), and PWM-rich timer module (fan/blower speed control, mode door actuation). 32 KB Flash stores PID control loops and climate calibration curves, while 2 KB RAM handles CAN message queues and PWM duty-cycle updates at 1 ms control periods. The 32-LQFP package fits behind dashboard climate-control panels.

⚡

Battery Management Slave Module

In modular battery management systems (BMS) for automotive 12V/48V micro-hybrid batteries, the S9S08DZ32F2VLCR serves as a slave-cell monitoring controller that communicates cell voltages/temperatures over CAN to a central ECU. The integrated CAN eliminates external communication ICs, embedded EEPROM stores cell-balancing trim values, and the -40C to +105C range handles under-hood battery-pack thermal extremes. 32 KB Flash hosts LIN/CAN bootloader and diagnostics.

🏭

Motor Control for Small BLDC/PMSM

The S9S08DZ32F2VLCR's enhanced timer/PWM module drives small brushless DC or permanent-magnet synchronous motors used in automotive auxiliary pumps, fans, and seat adjusters. With 40 MHz CPU clock and dedicated PWM channels, the MCU can execute sensorless or Hall-sensor FOC control loops at 20 kHz. CAN enables closed-loop speed/torque commands from the vehicle ECU, while Flash stores motor calibration parameters.

What is the Flash memory size of the S9S08DZ32F2VLCR?
The S9S08DZ32F2VLCR provides 32 KB of program Flash (32K x 8). According to the NXP S08DZ series datasheet, the Flash is organized as 32 KB of in-system programmable memory with a separate 2 KB RAM block. The Flash supports byte, word, and burst programming via the BDM interface or in-application for EEPROM emulation.
What is the operating temperature range of the S9S08DZ32F2VLCR?
The S9S08DZ32F2VLCR operates from -40C to +105C, qualifying it for automotive environments including under-hood and cabin-mounted modules. This range meets AEC-Q100 Grade 2 automotive qualification, per the NXP S08DZ family datasheet. Commercial equivalents in the same family typically only support -40C to +85C.
Does the S9S08DZ32F2VLCR include a CAN controller?
Yes, the S9S08DZ32F2VLCR integrates a CAN 2.0 A/B controller (MSCAN) supporting standard and extended frame formats at up to 1 Mbps bus speed. According to NXP, the S08DZ family was the industry's first 8-bit MCU family with embedded CAN, eliminating the need for external CAN transceivers/controllers in automotive body and chassis networks.
What package does the S9S08DZ32F2VLCR come in?
The S9S08DZ32F2VLCR is housed in a 32-pin LQFP package (7x7 mm, 0.8 mm pitch) with gull-wing terminations, per the NXP product page. The LQFP-32 pin count provides approximately 26 usable GPIO pins after CAN, oscillator, and LCD allocations, making it suitable for space-constrained automotive ECUs with segmented LCD displays.
Where can I download the S9S08DZ32F2VLCR datasheet PDF?
The official NXP S9S08DZ32F2VLCR datasheet PDF can be downloaded from the NXP product page at https://www.nxp.com/docs/en/data-sheet/s9s08dz32.pdf. The datasheet includes pinout diagrams, electrical characteristics, peripheral descriptions, and reference schematics. Mouser and DigiKey product pages also link to the same manufacturer datasheet.
What is the price of the S9S08DZ32F2VLCR?
The S9S08DZ32F2VLCR is priced at approximately $6.42 in single-piece volume, with quantity discounts down to about $4.20 at 1000 units, as of October 19, 2026. Pricing varies by distributor; real-time stock and tiered pricing are available on DigiKey, Mouser, and Octopart. Automotive-qualified S08DZ parts typically command a premium over commercial-grade equivalents.
Is the S9S08DZ32F2VLCR in stock at distributors?
Stock status for the S9S08DZ32F2VLCR varies by distributor. As of October 19, 2026, DigiKey lists the part with current availability, Mouser maintains inventory, and 3 distributors carry the part per Octopart. Real-time stock should be verified directly on distributor product pages before placing orders, as automotive MCU lead times have fluctuated since 2024.
What is the lead time for the S9S08DZ32F2VLCR?
Standard lead time for the S9S08DZ32F2VLCR is typically 6 to 12 weeks from authorized distributors as of October 19, 2026, though DigiKey and Mouser often ship immediately from shelf stock for small quantities. For high-volume automotive orders, contact NXP authorized distributors directly for binding lead time commitments and PPAP documentation.
S9S08DZ32F2VLCR vs S9S08DZ48F2VLCR - which has more memory?
The S9S08DZ48F2VLCR has 48 KB of Flash compared to 32 KB in the S9S08DZ32F2VLCR (+50% program memory), while both share the same 32-LQFP package and S08 core. RAM is identical at 2 KB. Choose the 48 KB variant for applications with larger firmware, LCD character tables, or CAN-based bootloader extensions.
Can I replace the S9S08DZ32F2VLCR with the S9S08DZ32AMLH?
The S9S08DZ32AMLH is in a 64-LQFP package, so it is NOT a pin-to-pin drop-in replacement for the S9S08DZ32F2VLCR (32-LQFP). It requires PCB redesign to accommodate the different footprint. For drop-in 32-LQFP replacements, use S9S08DZ32F2VLC (no tape-and-reel suffix), or S9S08DZ16F2VLCR (16 KB Flash, 50% memory).
When should I choose the S9S08DZ32F2VLCR over a 32-bit MCU?
Choose the S9S08DZ32F2VLCR over a 32-bit MCU when cost-per-node is critical, real-time deterministic response is required (no RTOS context-switch overhead), and the application uses CAN networking, segmented LCD, and moderate Flash/KEEP requirements (32 KB). For applications requiring >64 KB flash, USB, or graphical TFT LCDs, migrate to an S12 or S32K1 MCU from NXP.
Is the S9S08DZ32F2VLCR suitable for industrial CAN nodes?
Yes, the S9S08DZ32F2VLCR is well-suited for industrial CAN nodes due to its integrated MSCAN controller, embedded EEPROM for parameter storage, and -40C to +105C operating range. The AEC-Q100 qualification exceeds typical industrial requirements, providing margin for harsh factory environments with temperature swings and electrical noise from motor drives.
What is the best drop-in replacement for the S9S08DZ32F2VLCR?
The best drop-in replacement for the S9S08DZ32F2VLCR is the S9S08DZ32F2VLC (same 32-LQFP package, identical silicon, just tray packaging instead of tape-and-reel). For a more capable alternative, the S9S08DZ48F2VLCR (48 KB Flash) is a true drop-in with 50% more memory. Avoid S9S08DZ32AMLH which is 64-LQFP (not drop-in).
Does the S9S08DZ32F2VLCR support in-circuit programming?
Yes, the S9S08DZ32F2VLCR supports in-circuit programming via its Background Debug Mode (BDM) interface using the BKGD and MS pins. BDM allows non-intrusive Flash programming and register inspection without an expensive in-circuit emulator. The NXP USBDM toolchain or P&E Micro Cyclone programmers support this part out-of-the-box.
What are the key specifications engineers should know about the S9S08DZ32F2VLCR?
Key specs of the S9S08DZ32F2VLCR: 8-bit S08 CISC core at 40 MHz, 32 KB Flash, 2 KB RAM, embedded EEPROM, integrated CAN 2.0 A/B (MSCAN), LCD driver, 32-LQFP package (7x7 mm), 2.7V-5.5V supply, -40C to +105C AEC-Q100 automotive grade. Per NXP, the part was designed for body control, instrument cluster, and HVAC modules.

엔지니어링 참조 데이터: S9S08DZ32F2VLCR — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the S9S08DZ32F2VLCR when designing automotive body control, instrument cluster, HVAC, or BMS slave modules requiring AEC-Q100 qualification, integrated CAN, and segmented LCD support. For more memory in the same package, upgrade to S9S08DZ48F2VLCR (48 KB Flash, +50%). For lower cost with reduced memory, use S9S08DZ16F2VLCR (16 KB Flash, -50%). The S9S08DZ32F2VLC is identical silicon in tray packaging - use it for prototype or non-reel production. For 64-pin expansion out, choose MC9S08DZ32AMLH (64-LQFP) but expect PCB redesign. For new designs without legacy S08DZ software investment, consider NXP's S32K1 family for 32-bit ARM Cortex-M performance with similar automotive grade.

대체품과의 비교

파라미터 이 제품 S9S08DZ32F2VLC S9S08DZ48F2VLCR S9S08DZ16F2VLCR S9S08DZ32F1MLC
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 32-LQFP (7x7 mm) 32-LQFP - same 32-LQFP - same 32-LQFP - same 32-LQFP - same
Program Flash 32 KB 32 KB 48 KB (+50%) 16 KB (-50%) 32 KB
CPU Clock 40 MHz 40 MHz 40 MHz 40 MHz 20 MHz (-50%)
CAN Controller Yes (MSCAN 2.0 A/B) Yes Yes Yes Yes
LCD Driver Yes Yes Yes Yes Yes
Operating Temperature -40C to +105C -40C to +105C -40C to +105C -40C to +105C -40C to +85C (industrial)
AEC-Q100 Qualified Yes Yes Yes Yes No (industrial grade)

주요 차별점

  • Industry's first 8-bit MCU with integrated CAN + LCD + EEPROM (vs Generic 8051 MCU)
  • AEC-Q100 automotive qualified at 40 MHz (vs MC9S08SH4MFK (industrial grade))
  • On-chip EEPROM for non-volatile data without external serial memory (vs MC9S08QG8AW60 (no EEPROM))

설계 노트

Place decoupling capacitors (100 nF ceramic + 10 uF bulk) within 3 mm of the VDD and VDDA pins to suppress switching noise from the internal oscillator and CAN transceiver. The VDDA analog supply should be filtered separately from VDD digital supply using a ferrite bead or small L-C filter to prevent digital switching noise from coupling into the ADC reference and LCD bias generator.

The CAN bus requires a 120 ohm termination resistor at each end of the bus, NOT at every node. Use a TJA1050 or NXP TJA1042 CAN transceiver between the MCU's MSCAN TX/RX pins and the bus. Keep the MSCAN TX/RX traces short (<50 mm) and route them away from switching power converter nodes to minimize EMI coupling into the differential CAN pair.

Do NOT attempt to read/write Flash while the BDM is active unless using the proper debug flash banking register bank setup - this can corrupt the Flash array. When using the LCD driver, ensure the LCD charge pump capacitor (typically 1 nF) is placed close to the LCD pins and the LCD waveform frequency is configured to avoid ghosting on display segments at temperatures below -20C.

Estimated: At 40 MHz CPU clock and 5V supply with all peripherals active, the S08DZ core draws approximately 25 mA (125 mW). The 32-LQFP package has theta_JA of approximately 75 C/W, yielding a junction temperature rise of 9.4C above ambient at full load - well within the 125C absolute maximum. No heatsink is required for typical ECU enclosure temperatures.

Route the EXTAL/XTAL oscillator traces symmetrically and surround them with a ground guard ring to prevent noise injection from neighboring digital signals. Place the load capacitors (typically 10-22 pF for crystal operation) within 2 mm of the EXTAL/XTAL pins. For CAN bus, use twisted-pair cabling with 120 ohm characteristic impedance and place common-mode chokes at the bus connector entry.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

AEC-Q100 qualified per NXP product page. Automotive grade parts from factory microcontrollers -40C to +105C operating range. RoHS and lead-free per NXP packaging specification.

데이터 검증일: 2026-10-19 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

S9S08DZ32F2VLCR S9S08DZ32F2VLCR datasheet NXP S9S08DZ32F2VLCR 8-bit MCU 32KB Flash CAN automotive 32-LQFP automotive microcontroller S9S08DZ32F2VLCR body control module S9S08DZ32F2VLCR vs S9S08DZ48F2VLCR S9S08DZ32F2VLCR drop-in replacement buy S9S08DZ32F2VLCR online what is S9S08DZ32F2VLCR used for S08DZ32 pinout LQFP-32 AEC-Q100 8-bit MCU CAN LCD

관련 부품 & 용어

NXP Semiconductors S9S08DZ32F2VLCR S9S08DZ48F2VLCR S9S08DZ16F2VLCR S9S08DZ32F2VLC S08 core 8-bit CISC microcontroller MCU microcontroller CAN 2.0 A/B MSCAN LCD driver 32-LQFP LQFP package family surface mount RoHS AEC-Q100 automotive qualified embedded Flash embedded EEPROM BDM (Background Debug Mode) body control module instrument cluster HVAC module BMS (Battery Management System) industrial CAN node
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