SAK-TC237LP-32F200N AC - 32-bit AURIX TC2 MCU | Infineon | Auto
부품 번호: SAK-TC237LP-32F200N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $11.6548 | $11.65 |
| 10 | $10.49 | $104.90 |
| 100 | $9.32 | $932.00 |
| 500 | $8.4 | $4,200.00 |
| 1,000 | $7.55 | $7,550.00 |
SAK-TC237LP-32F200N 개요
An AURIX TC2xx microcontroller is a multicore TriCore device designed for functional safety in automotive electronics, typically deployed in powertrain, chassis, body and ADAS subsystems. The TC2xx family sits in the broader AURIX architecture hierarchy (TriCore -> 32-bit automotive MCU -> embedded controller -> semiconductor) and is built around three independent TriCore instruction sets per cluster with hardware-level safety mechanisms targeting ASIL-D/SIL-3 systems per ISO 26262.
Key features include 200 MHz CPU clock with single-precision FPU and DSP extensions, 2 MB program Flash, on-chip SRAM and dedicated peripheral SRAM, up to four CAN nodes with CAN FD protocol support, multiple ASCLIN/LIN, QSPI and I2C channels, a 12-bit ADC, and a hardware Security Module (HSM). The LFBGA-292 package with 0.8 mm pitch supports automotive -40C to +125C ambient operation and is qualified per AEC-Q100.
Technical depth comes from the dual TriCore architecture with lockstep cores for safety, hardware Random Number Generator, ECC-protected Flash/SRAM, and on-chip watchdog and fault collection unit. The CAN FD module - the key differentiator versus the SAK-TC237LP-32F200S AC variant - enables higher bandwidth CAN payloads required by modern automotive ECUs.
Typical applications include electric power steering, braking systems (ABS/ESC), airbag ECUs, body control modules, gateway ECUs, and CAN FD-based chassis domain controllers where functional safety, deterministic behavior and high-speed CAN are essential.
When designing with this part, allocate a 3.3V core supply with bulk decoupling near each VDD/VSS pair and route the SWD/JTAG signals symmetrically. Always validate software against the AURIX safety manual and use the HSM for secure boot.
This page synthesizes distributor pricing, drop-in AURIX alternatives, and practical design notes not found on any single manufacturer or distributor page.
드롭인 대체품: SAK-TC237LP-32F200N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: SAK-TC237LP-32F200N (동일 폼 팩터 및 풋프린트) — 차이점: CAN Nodes, Core Architecture, Package, MSL Level, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
SAK-TC237LP-32F200S AC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAL-TC237LP-32F200N AC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAK-TC233LP-32F200F
✅ 드롭인✓ 재고 있음
$6.58 / 개
데이터시트 보기 →SAK-TC234LP-32F200N
✅ 드롭인✓ 재고 있음
$11.4 / 개
데이터시트 보기 →TC237LP32F200NACKXUMA1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SAK-TC237LP-32F200N 최대 정격 & 전기적 특성
| Manufacturer | Infineon Technologies |
| Product Family | AURIX TC2xx (TC23xL) |
| Core Architecture | 32-bit TriCore |
| Core Count | 1 TriCore (single core) |
| Maximum CPU Clock | 200 MHz |
| FPU/DSP Extensions | Single-precision FPU and DSP instructions |
| Program Flash Memory | 2 MB |
| CAN Nodes | Multi-channel with CAN FD support |
| 패키지 | PG-LFBGA-292-6 |
| Package Pitch | 0.8 mm |
| 동작 온도 | -40C to +125C (automotive grade) |
| Automotive Qualification | AEC-Q100 qualified |
| Functional Safety Target | ISO 26262 ASIL-D capable |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Hardware Security Module | Yes (HSM with secure boot) |
| 공급 전압 | 3.3 V core / 5 V I/O domain (typical) |
SAK-TC237LP-32F200N 0.8 mm 핀 구성 가이드
SAK-TC237LP-32F200N(0.8 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SAK-TC237LP-32F200N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SAK-TC237LP-32F200N 적합 용도: 6 애플리케이션s: Electric Power Steering ECU, Anti-lock Braking System (ABS/ESC) ECU, Central Gateway ECU, Airbag / Restraint Control Module, Body Control Module (BCM), Industrial CAN FD Controller.
Electric Power Steering ECU
Why SAK-TC237LP-32F200N fits electric power steering (EPS): the 200 MHz TriCore with single-precision FPU and DSP extensions executes torque-vector and motor-control loops with deterministic interrupt latency under 1 us, while the 2 MB Flash accommodates torque maps, calibration data and the ASIL-D safety software. The CAN FD interface streams sensor data at higher bandwidth than classic CAN, and the integrated HSM with secure boot prevents firmware tampering. Design consideration: the LFBGA-292 package requires a 6+6+2 stack-up PCB with microvia fanout under each ball, and the on-chip watchdog must be paired with the external SBC (TLE926x) for full ASIL-D coverage.
추천
Anti-lock Braking System (ABS/ESC) ECU
Why SAK-TC237LP-32F200N fits ABS/ESC: wheel-slip control loops at 200 Hz require deterministic CPU scheduling, which the TriCore lockstep and the integrated Fault Collection Unit (FCU) provide. The 2 MB Flash stores the brake controller, sensor calibration and ISO 26262 safe-state routines, while CAN FD enables high-rate communication with radar and chassis sensors. Performance consideration: redundant sensor inputs are sampled by the 12-bit ADC with hardware oversampling, and the watchdog timeout must be configured within the 50 ms brake-cycle budget. Infineon Pro-Silver and Memtool toolchains debug the device via the JTAG/DAP interface.
추천
Central Gateway ECU
Why SAK-TC237LP-32F200N fits a central gateway: the multi-channel CAN FD interface count supports routing between CAN, LIN, and Ethernet subnets, while the 2 MB Flash holds routing tables and diagnostic firmware. The 200 MHz TriCore CPU processes message-filtering and forwarding in real time without external ASICs, lowering BOM cost. Performance consideration: security-critical messages are decrypted by the HSM without offloading to the main CPU, keeping the gateway latency under 1 ms per frame. For higher-port-count gateways step up to the SAK-TC234LP-32F200N with more CAN nodes.
추천
Airbag / Restraint Control Module
Why SAK-TC237LP-32F200N fits airbag ECUs: the TriCore architecture is ASIL-D capable per ISO 26262, with hardware fault collection and dual-redundant lockstep on safety-relevant computation paths. The 2 MB Flash hosts the firing-logic firmware, deployment data and the self-test routines mandated by FMVSS 208, while CAN FD communicates crash severity to the ADAS domain. Performance consideration: the SBC (TLE926x) must be paired with a separate voltage supervisor because the AURIX internal VMON has only primary ADC monitoring; the LFBGA-292 package dissipates approximately 1.2 W at 200 MHz and requires thermal vias under the center balls.
추천
Body Control Module (BCM)
Why SAK-TC237LP-32F200N fits body control modules: BCMs aggregate lighting, door-locks, mirror control and LIN subnodes, requiring deterministic real-time scheduling that the TriCore CPU and the on-chip RTOS support. The CAN FD interface handles diagnostic UDS over the OBD-II port, and 2 MB Flash stores body-domain firmware plus OTA update staging area. Performance consideration: low-power standby current under 50 uA is achieved by gating the TriCore clocks and switching the SBC to STOP mode; LIN transceivers like TLE7257 drive the LIN subnodes without external MCU pins.
추천
Industrial CAN FD Controller
Why SAK-TC237LP-32F200N fits industrial CAN FD controllers outside automotive: the AEC-Q100 temperature range and CAN FD interface are attractive for harsh-environment industrial equipment such as mobile robots, agricultural machinery, and construction vehicles. The 200 MHz TriCore handles EtherCAT-to-CAN-FD bridging or CANopen FD protocol stacks, and the on-chip HSM enables secure firmware. Performance consideration: in non-automotive industrial designs the SBC can be replaced with a simpler buck regulator (TLF50211), but the LFBGA-292 footprint still requires 0.8 mm pitch PCB capability for hand or re-work prototyping.
추천
추천 제품 요약
엔지니어링 참조 데이터: SAK-TC237LP-32F200N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | SAK-TC237LP-32F200S AC | SAL-TC237LP-32F200N AC | SAK-TC233LP-32F200F | SAK-TC234LP-32F200N | TC237LP32F200NACKXUMA1 |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | LFBGA-292 (PG-LFBGA-292-6) | LFBGA-292 - same | LFBGA-292 - same | LFBGA-292 - same | LFBGA-292 - same | LFBGA-292 - same |
| CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| CAN FD Support | Yes | No (classic CAN only) | Yes | Yes | Yes | Yes |
| Automotive Grade | AEC-Q100 (SAK) | AEC-Q100 (SAK) | Extended grade (SAL) | AEC-Q100 (SAK) | AEC-Q100 (SAK) | AEC-Q100 (SAK) |
| Functional Safety | ASIL-D capable | ASIL-D capable | ASIL-D capable | ASIL-D capable | ASIL-D capable | ASIL-D capable |
주요 차별점
- CAN FD support on the N variant - higher bandwidth payload than classic CAN 2.0B (vs SAK-TC237LP-32F200S AC)
- SAL prefix variant offers wider operating temperature range than SAK grade (vs SAL-TC237LP-32F200N AC)
- Pin-compatible step-up path to higher tier AURIX devices within the same LFBGA-292 footprint (vs SAK-TC234LP-32F200N)
설계 노트
Estimated: at 200 MHz TriCore CPU clock and full peripheral activity the LFBGA-292 die consumes approximately 1.2 W. Use the Infineon TLE9262QX or TLE9263QX System Basis Chip (SBC) to provide the 3.3V core and 5V I/O rails, and add at least four 100 nF decoupling capacitors within 2 mm of each VDDP/VSSP pin pair. Place a 10 uF bulk ceramic close to the IC and add 1 uF/100 nF combinations around the perimeter for high-frequency noise suppression.
The LFBGA-292 package at 0.8 mm pitch requires a 4-layer or higher PCB stack-up with laser-drilled microvias for inner fanout. Use an HDI (AnyLayer) stack-up to escape the inner-row balls; route signals in pairs on adjacent layers to control skew. Place a ground flood under the BGA with stitching vias every 2 mm to suppress return-path inductance, and reserve a thermal copper pad connected through 9 thermal vias for heat dissipation.
Do not confuse the SAK-TC237LP-32F200N AC with the SAK-TC237LP-32F200S AC: the N variant supports CAN FD, the S variant supports only classic CAN 2.0B. Selecting the S variant by mistake will break CAN FD-based ECU networking. Also ensure the HSM secure-boot keys are programmed before deployment - leaving the HSM in default state allows any firmware image to boot, which fails ASIL-D audit.
Estimated: at 200 MHz the die dissipates 1.2 W; over a -40C to +125C ambient range the LFBGA-292 thermal resistance (theta_JA) is approximately 20 C/W on a standard 4-layer PCB with thermal vias, giving a junction-to-ambient rise of 24 C. This is well within the -40C to +150C junction specification. For closed-enclosure designs derate by 10-15% based on air-flow test data.
규정 준수 정보
RoHS compliant and AEC-Q100 qualified per Infineon datasheet. Functional safety target is ISO 26262 ASIL-D capable. SAL grade variants offer extended operating temperature beyond the SAK automotive range.
