SAK-TC237LP-32F200N AC - 32-bit AURIX TC2 MCU | Infineon | Auto
MPN: SAK-TC237LP-32F200N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $11.6548 | $11.65 |
| 10 | $10.49 | $104.90 |
| 100 | $9.32 | $932.00 |
| 500 | $8.4 | $4,200.00 |
| 1,000 | $7.55 | $7,550.00 |
SAK-TC237LP-32F200N Overview
An AURIX TC2xx microcontroller is a multicore TriCore device designed for functional safety in automotive electronics, typically deployed in powertrain, chassis, body and ADAS subsystems. The TC2xx family sits in the broader AURIX architecture hierarchy (TriCore -> 32-bit automotive MCU -> embedded controller -> semiconductor) and is built around three independent TriCore instruction sets per cluster with hardware-level safety mechanisms targeting ASIL-D/SIL-3 systems per ISO 26262.
Key features include 200 MHz CPU clock with single-precision FPU and DSP extensions, 2 MB program Flash, on-chip SRAM and dedicated peripheral SRAM, up to four CAN nodes with CAN FD protocol support, multiple ASCLIN/LIN, QSPI and I2C channels, a 12-bit ADC, and a hardware Security Module (HSM). The LFBGA-292 package with 0.8 mm pitch supports automotive -40C to +125C ambient operation and is qualified per AEC-Q100.
Technical depth comes from the dual TriCore architecture with lockstep cores for safety, hardware Random Number Generator, ECC-protected Flash/SRAM, and on-chip watchdog and fault collection unit. The CAN FD module - the key differentiator versus the SAK-TC237LP-32F200S AC variant - enables higher bandwidth CAN payloads required by modern automotive ECUs.
Typical applications include electric power steering, braking systems (ABS/ESC), airbag ECUs, body control modules, gateway ECUs, and CAN FD-based chassis domain controllers where functional safety, deterministic behavior and high-speed CAN are essential.
When designing with this part, allocate a 3.3V core supply with bulk decoupling near each VDD/VSS pair and route the SWD/JTAG signals symmetrically. Always validate software against the AURIX safety manual and use the HSM for secure boot.
This page synthesizes distributor pricing, drop-in AURIX alternatives, and practical design notes not found on any single manufacturer or distributor page.
Drop-in alternatives for SAK-TC237LP-32F200N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with SAK-TC237LP-32F200N (same form factor and footprint) — differing in CAN Nodes, Core Architecture, Package, MSL Level, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
SAK-TC237LP-32F200S AC
✅ Drop-In📋 Reference alternative (not in catalog)
SAL-TC237LP-32F200N AC
✅ Drop-In📋 Reference alternative (not in catalog)
SAK-TC233LP-32F200F
✅ Drop-In✓ In Stock
$6.58 / Unit
View Datasheet →SAK-TC234LP-32F200N
✅ Drop-In✓ In Stock
$11.4 / Unit
View Datasheet →TC237LP32F200NACKXUMA1
✅ Drop-In📋 Reference alternative (not in catalog)
SAK-TC237LP-32F200N Maximum Ratings & Electrical Characteristics
| Manufacturer | Infineon Technologies |
| Product Family | AURIX TC2xx (TC23xL) |
| Core Architecture | 32-bit TriCore |
| Core Count | 1 TriCore (single core) |
| Maximum CPU Clock | 200 MHz |
| FPU/DSP Extensions | Single-precision FPU and DSP instructions |
| Program Flash Memory | 2 MB |
| CAN Nodes | Multi-channel with CAN FD support |
| Package | PG-LFBGA-292-6 |
| Package Pitch | 0.8 mm |
| Operating Temperature | -40C to +125C (automotive grade) |
| Automotive Qualification | AEC-Q100 qualified |
| Functional Safety Target | ISO 26262 ASIL-D capable |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Hardware Security Module | Yes (HSM with secure boot) |
| Supply Voltage | 3.3 V core / 5 V I/O domain (typical) |
SAK-TC237LP-32F200N 0.8 mm Pin Configuration Guide
Pin configuration for SAK-TC237LP-32F200N (0.8 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for SAK-TC237LP-32F200N.
Refer to the datasheet for full pin configuration.
Typical Applications
SAK-TC237LP-32F200N is suitable for 6 applications: Electric Power Steering ECU, Anti-lock Braking System (ABS/ESC) ECU, Central Gateway ECU, Airbag / Restraint Control Module, Body Control Module (BCM), Industrial CAN FD Controller.
Electric Power Steering ECU
Why SAK-TC237LP-32F200N fits electric power steering (EPS): the 200 MHz TriCore with single-precision FPU and DSP extensions executes torque-vector and motor-control loops with deterministic interrupt latency under 1 us, while the 2 MB Flash accommodates torque maps, calibration data and the ASIL-D safety software. The CAN FD interface streams sensor data at higher bandwidth than classic CAN, and the integrated HSM with secure boot prevents firmware tampering. Design consideration: the LFBGA-292 package requires a 6+6+2 stack-up PCB with microvia fanout under each ball, and the on-chip watchdog must be paired with the external SBC (TLE926x) for full ASIL-D coverage.
Recommended
Anti-lock Braking System (ABS/ESC) ECU
Why SAK-TC237LP-32F200N fits ABS/ESC: wheel-slip control loops at 200 Hz require deterministic CPU scheduling, which the TriCore lockstep and the integrated Fault Collection Unit (FCU) provide. The 2 MB Flash stores the brake controller, sensor calibration and ISO 26262 safe-state routines, while CAN FD enables high-rate communication with radar and chassis sensors. Performance consideration: redundant sensor inputs are sampled by the 12-bit ADC with hardware oversampling, and the watchdog timeout must be configured within the 50 ms brake-cycle budget. Infineon Pro-Silver and Memtool toolchains debug the device via the JTAG/DAP interface.
Recommended
Central Gateway ECU
Why SAK-TC237LP-32F200N fits a central gateway: the multi-channel CAN FD interface count supports routing between CAN, LIN, and Ethernet subnets, while the 2 MB Flash holds routing tables and diagnostic firmware. The 200 MHz TriCore CPU processes message-filtering and forwarding in real time without external ASICs, lowering BOM cost. Performance consideration: security-critical messages are decrypted by the HSM without offloading to the main CPU, keeping the gateway latency under 1 ms per frame. For higher-port-count gateways step up to the SAK-TC234LP-32F200N with more CAN nodes.
Recommended
Airbag / Restraint Control Module
Why SAK-TC237LP-32F200N fits airbag ECUs: the TriCore architecture is ASIL-D capable per ISO 26262, with hardware fault collection and dual-redundant lockstep on safety-relevant computation paths. The 2 MB Flash hosts the firing-logic firmware, deployment data and the self-test routines mandated by FMVSS 208, while CAN FD communicates crash severity to the ADAS domain. Performance consideration: the SBC (TLE926x) must be paired with a separate voltage supervisor because the AURIX internal VMON has only primary ADC monitoring; the LFBGA-292 package dissipates approximately 1.2 W at 200 MHz and requires thermal vias under the center balls.
Recommended
Body Control Module (BCM)
Why SAK-TC237LP-32F200N fits body control modules: BCMs aggregate lighting, door-locks, mirror control and LIN subnodes, requiring deterministic real-time scheduling that the TriCore CPU and the on-chip RTOS support. The CAN FD interface handles diagnostic UDS over the OBD-II port, and 2 MB Flash stores body-domain firmware plus OTA update staging area. Performance consideration: low-power standby current under 50 uA is achieved by gating the TriCore clocks and switching the SBC to STOP mode; LIN transceivers like TLE7257 drive the LIN subnodes without external MCU pins.
Recommended
Industrial CAN FD Controller
Why SAK-TC237LP-32F200N fits industrial CAN FD controllers outside automotive: the AEC-Q100 temperature range and CAN FD interface are attractive for harsh-environment industrial equipment such as mobile robots, agricultural machinery, and construction vehicles. The 200 MHz TriCore handles EtherCAT-to-CAN-FD bridging or CANopen FD protocol stacks, and the on-chip HSM enables secure firmware. Performance consideration: in non-automotive industrial designs the SBC can be replaced with a simpler buck regulator (TLF50211), but the LFBGA-292 footprint still requires 0.8 mm pitch PCB capability for hand or re-work prototyping.
Recommended
Recommended Products Summary
Engineering reference data for SAK-TC237LP-32F200N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SAK-TC237LP-32F200S AC | SAL-TC237LP-32F200N AC | SAK-TC233LP-32F200F | SAK-TC234LP-32F200N | TC237LP32F200NACKXUMA1 |
|---|---|---|---|---|---|---|
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
| Package | LFBGA-292 (PG-LFBGA-292-6) | LFBGA-292 - same | LFBGA-292 - same | LFBGA-292 - same | LFBGA-292 - same | LFBGA-292 - same |
| CPU Clock | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| CAN FD Support | Yes | No (classic CAN only) | Yes | Yes | Yes | Yes |
| Automotive Grade | AEC-Q100 (SAK) | AEC-Q100 (SAK) | Extended grade (SAL) | AEC-Q100 (SAK) | AEC-Q100 (SAK) | AEC-Q100 (SAK) |
| Functional Safety | ASIL-D capable | ASIL-D capable | ASIL-D capable | ASIL-D capable | ASIL-D capable | ASIL-D capable |
Key Differentiators
- CAN FD support on the N variant - higher bandwidth payload than classic CAN 2.0B (vs SAK-TC237LP-32F200S AC)
- SAL prefix variant offers wider operating temperature range than SAK grade (vs SAL-TC237LP-32F200N AC)
- Pin-compatible step-up path to higher tier AURIX devices within the same LFBGA-292 footprint (vs SAK-TC234LP-32F200N)
Design Notes
Estimated: at 200 MHz TriCore CPU clock and full peripheral activity the LFBGA-292 die consumes approximately 1.2 W. Use the Infineon TLE9262QX or TLE9263QX System Basis Chip (SBC) to provide the 3.3V core and 5V I/O rails, and add at least four 100 nF decoupling capacitors within 2 mm of each VDDP/VSSP pin pair. Place a 10 uF bulk ceramic close to the IC and add 1 uF/100 nF combinations around the perimeter for high-frequency noise suppression.
The LFBGA-292 package at 0.8 mm pitch requires a 4-layer or higher PCB stack-up with laser-drilled microvias for inner fanout. Use an HDI (AnyLayer) stack-up to escape the inner-row balls; route signals in pairs on adjacent layers to control skew. Place a ground flood under the BGA with stitching vias every 2 mm to suppress return-path inductance, and reserve a thermal copper pad connected through 9 thermal vias for heat dissipation.
Do not confuse the SAK-TC237LP-32F200N AC with the SAK-TC237LP-32F200S AC: the N variant supports CAN FD, the S variant supports only classic CAN 2.0B. Selecting the S variant by mistake will break CAN FD-based ECU networking. Also ensure the HSM secure-boot keys are programmed before deployment - leaving the HSM in default state allows any firmware image to boot, which fails ASIL-D audit.
Estimated: at 200 MHz the die dissipates 1.2 W; over a -40C to +125C ambient range the LFBGA-292 thermal resistance (theta_JA) is approximately 20 C/W on a standard 4-layer PCB with thermal vias, giving a junction-to-ambient rise of 24 C. This is well within the -40C to +150C junction specification. For closed-enclosure designs derate by 10-15% based on air-flow test data.
Compliance Information
RoHS compliant and AEC-Q100 qualified per Infineon datasheet. Functional safety target is ISO 26262 ASIL-D capable. SAL grade variants offer extended operating temperature beyond the SAK automotive range.
