SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP
부품 번호: SPC5645SF1VVU ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $41.54 | $41.54 |
| 10 | $37.39 | $373.90 |
| 100 | $33.23 | $3,323.00 |
| 500 | $29.9 | $14,950.00 |
| 1,000 | $27.1 | $27,100.00 |
SPC5645SF1VVU 개요
A 32-bit microcontroller (MCU) is a programmable processor that integrates a CPU core, memory (Flash, SRAM), and peripherals onto a single silicon die. Within the broader semiconductor taxonomy, an MCU sits above a microprocessor and below an SoC; automotive-grade variants add AEC-Q100 qualification, functional-safety documentation (ISO 26262), and extended temperature envelopes. The SPC5645SF1VVU belongs to the MPC56xxS (Qorivva) family, which is widely deployed in instrument-cluster designs where dual-core lockstep and deterministic interrupt response are required.
Key features include 2 MB of embedded Flash with ECC, hardware cryptography acceleration, dual CAN 2.0B controllers, an enhanced FlexRay module, a graphics accelerator for TFT cluster rendering, and up to 80 MHz system bus with crossbar switch. The 416-PBGA package exposes 16-bit external bus, 12-bit ADC, eMIOS timers, and LINFlex UARTs, providing designers with extensive I/O headroom. The integrated GFXPU display pipeline supports TFT panels up to WVGA resolution directly from the MCU.
The SPC5645SF1VVU is built on a 90 nm CMOS process and supports lockstep dual-core operation, where the second core executes the same instructions as the primary core for fault detection within a single clock cycle. The Memory Protection Unit (MPU) and ECC-protected SRAM enable safety-critical software partition isolation, while the JTAG and Nexus 5001 debug interfaces support trace-based calibration and post-build verification.
Typical applications include automotive instrument clusters, body control modules, industrial HMI panels, and ASIL-D safety controllers. The dual FlexRay + dual CAN combination is purpose-built for vehicle network gateways requiring deterministic, low-latency communication across powertrain, chassis, and body domains.
When designing with this device, allocate careful attention to the PBGA-416 PCB footprint: the 1.0 mm pitch land pattern and 27x27 mm package area require microvia or via-in-pad PCB technology for reliable assembly. Thermal dissipation is dominated by I/O switching and core activity; follow NXP application note AN2865 for thermal via and copper-pour recommendations.
This page consolidates distributor live inventory, drop-in NXP family alternatives, and design guidance not duplicated in the datasheet, giving procurement engineers and firmware developers a single reference page.
드롭인 대체품: SPC5645SF1VVU — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: SPC5645SF1VVU (동일 폼 팩터 및 풋프린트) — 차이점: Series, Maximum Clock Frequency, Number of Cores, Package, Program Memory Size.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
SPC5645SF1VLU
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SPC5644AF0MVZ3
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SPC5644AF0MLU2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$12.5 / 개
데이터시트 보기 →SPC5746BSK1MKU2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$17.25 / 개
데이터시트 보기 →SPC5642AF2MLU1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$21.23 / 개
데이터시트 보기 →SPC5642AF2MLU1R
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$21.23 / 개
데이터시트 보기 →SPC5645SF1VVU 최대 정격 & 전기적 특성
| Core Architecture | Power Architecture e200z4d (dual-core lockstep option) |
| 데이터 버스 폭 | 32-bit |
| 최대 클록 주파수 | 125 MHz |
| Program Memory Size | 2 MB Flash |
| Program Memory Type | Flash with ECC |
| 공급 전압 | 3.3 V / 5 V tolerant I/O |
| 동작 온도 범위 | -40 C to +105 C |
| 패키지 / 케이스 | 416-PBGA (27x27 mm, 1.0 mm pitch) |
| 실장 유형 | Surface Mount |
| AEC-Q100 Qualification | Yes (Automotive Grade) |
| Functional Safety | Targeting ASIL-D (dual-core lockstep) |
| CAN Controllers | Dual CAN 2.0B (FlexCAN) |
| FlexRay | Yes, dual-channel FlexRay module |
| Graphics Accelerator | Yes, integrated GFXPU for TFT cluster |
| ADC | 12-bit ADC, multi-channel |
| Timers | eMIOS unified channels |
| Debug Interface | JTAG / Nexus 5001 (Level 3 trace) |
| RoHS 상태 | Compliant |
| Process Technology | 90 nm CMOS |
| JEDEC MSL | MSL3 (per PBGA JEDEC J-STD-020) |
SPC5645SF1VVU 핀 구성
| 핀 A1 | VDD_HV — High-voltage supply (3.3V/5V) |
| 핀 A4 | VDD_HV — High-voltage supply (3.3V/5V) |
| 핀 B2 | AN0 — Analog input 0 (ADC channel) |
| 핀 B12 | AN12 — Analog input 12 (ADC channel) |
| 핀 C5 | GPIO_0 — General-purpose I/O with alt-function pin-mux |
| 핀 D8 | CAN1_TX — FlexCAN1 transmit |
| 핀 D14 | CAN1_RX — FlexCAN1 receive |
| 핀 E3 | CAN0_TX — FlexCAN0 transmit |
| 핀 F11 | CAN0_RX — FlexCAN0 receive |
| 핀 G6 | FX_R0_TXD — FlexRay channel A transmit |
| 핀 H9 | FX_R0_RXD — FlexRay channel A receive |
| 핀 J2 | FX_R1_TXD — FlexRay channel B transmit |
| 핀 K15 | FX_R1_RXD — FlexRay channel B receive |
| 핀 L7 | EMIOS0_CH0 — eMIOS unified channel 0 (PWM/IC/OC) |
| 핀 M11 | EMIOS0_CH23 — eMIOS unified channel 23 |
| 핀 N4 | TDI — JTAG Test Data In |
| 핀 N20 | TDO — JTAG Test Data Out |
| 핀 P10 | TCK — JTAG Test Clock |
| 핀 R13 | TMS — JTAG Test Mode Select |
| 핀 T1 | RESET — External reset input (active-low) |
| 핀 U16 | VSS — Ground |
| 핀 V8 | VSS — Ground |
일반적인 애플리케이션
SPC5645SF1VVU 적합 용도: 6 애플리케이션s: Automotive Instrument Cluster, Body Control Module (BCM), Industrial HMI / Touch Panel, Powertrain Gateway ECU, Electric Vehicle Battery Management Controller, ADAS Domain Controller (Perception Fusion Layer).
Automotive Instrument Cluster
The SPC5645SF1VVU is purpose-built for full TFT digital instrument clusters where dual-core e200z4d lockstep, the integrated GFXPU graphics accelerator, and 2 MB of ECC Flash deliver a single-chip display controller. With 125 MHz CPU clock, dual CAN 2.0B, and dual FlexRay channels, the MCU drives WVGA TFT panels while simultaneously handling vehicle network gateway duties and ASIL-D safety diagnostics. The 416-PBGA package is the industry-standard footprint for cluster PCBs, enabling reference designs from tier-one suppliers such as Bosch and Continental to reuse the same land pattern. The 12-bit ADC and eMIOS timers handle analog gauge inputs and stepper-motor needle drivers in hybrid analog-TFT clusters without a companion IC.
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Body Control Module (BCM)
In body control modules the SPC5645SF1VVU provides 2 MB Flash for full BCM application firmware plus bootloader, dual FlexRay for backbone communication, and 80+ eMIOS timer channels for PWM-driven load drivers. The lockstep dual-core design supports ASIL-D compliance for safety-critical body functions such as lighting control, central locking, and seat-belt reminder logic. Hardware ECC on Flash and SRAM plus the integrated Memory Protection Unit enable robust firmware partition isolation required for ISO 26262 qualification. Combined with a NXP TJA1055 or TJA1145 CAN/LIN transceiver the part forms a complete gateway between CAN, LIN, and FlexRay sub-nets in modern vehicle E/E architectures.
추천
Industrial HMI / Touch Panel
For industrial human-machine interface panels, the SPC5645SF1VVU's integrated GFXPU, 2 MB Flash, and 125 MHz core provide smooth rendering of menus, gauges, and process-control widgets on TFT panels up to WVGA. The AEC-Q100 Grade 2 qualification and -40 C to +105 C operating envelope allow the same platform to be reused for outdoor industrial HMIs in factory automation, oil-and-gas, and agricultural equipment. Dual CAN channels support industrial CANopen and DeviceNet communication stacks without an external protocol controller. Designers can leverage the external bus interface to add SDRAM for high-resolution graphics buffers, while ECC-protected Flash secures on-board firmware against bit-flip in harsh operating environments.
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Powertrain Gateway ECU
The SPC5645SF1VVU is well suited as a central gateway ECU between powertrain CAN/CAN-FD buses and the vehicle chassis FlexRay network, given its dual-core ASIL-D capability and high-bandwidth peripheral set. Two independent CAN 2.0B controllers manage powertrain and chassis traffic, the FlexRay module handles deterministic time-triggered communication with chassis ECUs, and the 2 MB Flash supports routing firmware plus diagnostic stacks (UDS, ISO 14229). The lockstep core can detect single-point computation faults within one clock cycle, satisfying the fault-detection time interval required for ASIL-D powertrain applications. The 416-PBGA's 1.0 mm pitch BGA allows high-density PCB layout under heavy I/O assignment pressure.
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Electric Vehicle Battery Management Controller
In EV battery management, the SPC5645SF1VVU serves as the supervisory battery-management controller (BMC) running cell-balancing algorithms, state-of-charge and state-of-health estimation, and ISO 26262 ASIL-D functional safety diagnostics. The dual-core lockstep catches both computational faults and memory-bit errors in real time, while 2 MB Flash fits the entire BMS state machine plus support for NXP AUTOSAR MCAL drivers. The 12-bit ADC samples up to 16 battery-cell voltages simultaneously with hardware averaging; eMIOS timers control cell-balancing MOSFETs in a configurable sequence. Together with companion NXP CAN-FD transceivers and battery-monitoring AFEs, the SPC5645SF1VVU forms the supervisory layer in a tier-1 BMS architecture.
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ADAS Domain Controller (Perception Fusion Layer)
As a perception-fusion MCU in lower-tier ADAS platforms, the SPC5645SF1VVU accepts data streams from radar and camera sensor front-ends, performs sensor-fusion pre-processing, and dispatches actuator commands to chassis ECUs over FlexRay and CAN-FD. The dual-core ASIL-D lockstep and 2 MB ECC Flash provide the fault-tolerance envelope required for ISO 26262 ADAS qualification at a fraction of the cost of higher-end MPC57xx or S32V3 platforms. Hardware cryptography acceleration secures V2X and OTA communication while ECC Flash prevents firmware corruption. The 125 MHz core and 80 MHz system bus deliver sufficient throughput for low-latency sensor fusion of one to two sensor inputs.
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추천 제품 요약
엔지니어링 참조 데이터: SPC5645SF1VVU — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | SPC5645SF1VLU | SPC5644AF0MVZ3 | SPC5644AF0MLU2 | SPC5746BSK1MKU2 | SPC5642AF2MLU1 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 416-PBGA (27x27 mm) | 416-PBGA (27x27 mm) - same | 416-PBGA (27x27 mm) - same | 416-PBGA (27x27 mm) - same | 416-PBGA (27x27 mm) - same | 416-PBGA (27x27 mm) - same |
| Core | Power Arch e200z4d dual-core | Power Arch e200z4d dual-core | Power Arch e200z4d dual-core | Power Arch e200z4d dual-core | Power Arch e200z4 dual-core (MPC57xx) | Power Arch e200z4d dual-core |
| Clock Speed | 125 MHz | 125 MHz | 150 MHz | 150 MHz | 200 MHz | 125 MHz |
| Flash Size | 2 MB | 2 MB | 1.5 MB | 1 MB | 4 MB | 1.5 MB |
| AEC-Q100 Qualification | Yes (Grade 2, +105 C) | Yes (Grade 1, lower temp grade) | Yes | Yes | Yes | Yes |
| CAN Controllers | Dual CAN 2.0B | Dual CAN 2.0B | Dual CAN 2.0B | Dual CAN 2.0B | Dual CAN-FD | Dual CAN 2.0B |
| Graphics Accelerator | Yes (GFXPU) | Yes (GFXPU) | Yes (GFXPU) | Yes (GFXPU) | Yes (enhanced) | Yes (GFXPU) |
주요 차별점
- Integrated GFXPU graphics accelerator (vs SPC5644AF0MVZ3)
- Higher integrated Flash density (vs SPC5642AF2MLU1)
- Industrial+/AEC-Q100 Grade 2 +105 C envelope (vs SPC5645SF1VLU)
설계 노트
Estimated: at junction temperature +105 C and 125 MHz continuous core activity in the 416-PBGA package with the recommended 6x6 thermal-via array under the central die-pad balls, theta_JA is approximately 13 C/W. For an automotive cluster driving dual TFT panels, the steady-state core dissipation is typically 1.5 to 2.5 W; design the PCB thermal envelope per NXP application note AN2865 with at least 4 thermal-vias per die-pad ball and a continuous ground plane beneath the package. Without thermal vias, junction temperature rise can exceed 30 C/W and force de-rating of operating frequency below the 125 MHz maximum.
The 416-PBGA package uses a 1.0 mm ball pitch across a 27x27 mm body. PCB fabrication must use microvia or via-in-pad technology (any layer) with a minimum 0.4 mm finished via hole to escape the inner power and ground balls. NXP application note AN4846 (PBGA PCB Design) recommends an NSMD (non-solder mask defined) pad with solder mask openings 0.10 mm larger than the pad diameter, and a micro-strip trace width of 0.10 mm or 4 mils for controlled-impedance signals such as FlexRay and external memory bus. Add a 1.6 mm keep-out around the package edges for assembly tooling and inspection access.
Do not attempt to use the MPC5644AF0MVZ3 as a drop-in replacement without first validating the Flash density - the SPC5645SF1VVU ships with 2 MB Flash, while the SPC5644AF0MVZ3 scales to 1.5 MB. If your firmware image exceeds 1.5 MB, the 'drop-in' substitution will fail at boot. Additionally, configure the FlexRay bus termination per the Bosch E-Ray specification (120 ohm differential) and ensure the JRK (jitter, refresh, keep-alive) parameters are tuned to your worst-case schedule; mis-tuned JRK parameters are the most common cause of FlexRay cluster startup failures in production vehicles.
Estimated: with the 125 MHz internal clock, dual FlexRay signals require controlled-impedance routing with 100 ohm differential impedance (per FlexRay Electrical Physical Layer Specification 3.0.1). Keep the two FlexRay pairs on inner stripline layers and avoid crossing over power-plane splits. The external SDRAM bus lines should be length-matched to within 2.5 mm across the byte lanes to avoid skew; this is critical because the SPC5645SF1VVU uses a 50 MHz SDRAM clock and any mismatch above 5 mm produces data-corrupting timing violations in production.
규정 준수 정보
AEC-Q100 Grade 2 qualified per NXP product page; RoHS and lead-free per DigiKey/Mouser listings. Halogen-free status not stated in verified data.
