SPC5748GHK0AMMJ6 - 32-bit Tri-Core MCU, 6MB Flash, 256-MAPBGA | NXP
부품 번호: SPC5748GHK0AMMJ6 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $36.2 | $362.00 |
| 100 | $33.95 | $3,395.00 |
| 250 | $31.8 | $7,950.00 |
| 500 | $30.1 | $15,050.00 |
| 1,000 | $28.45 | $28,450.00 |
SPC5748GHK0AMMJ6 개요
Key features include 6 MB (6M x 8) Flash memory with 768 KB SRAM, a hardware security module (HSM) that protects ECUs against various attack scenarios, and enhanced low-power modes for energy-efficient operation. The 256-MAPBGA (17x17) package supports the wide I/O count required for body-domain and gateway MCUs, including multiple CAN FD, LIN, SPI, and Ethernet peripherals. The SPC5748GHK0AMMJ6 is part of NXP's SafeAssure program, providing ASIL-B/D functional safety support.
This tri-core MCU uses the Power Architecture e200z family with asymmetric cores - the e200z2 handles I/O and housekeeping tasks while the two e200z4 cores deliver application compute. The HSM is an isolated subsystem with its own Flash and RAM, dedicated cryptographic accelerators, and a true random number generator, enabling secure boot, secure debug, and runtime message authentication.
Typical applications include automotive central body controllers, in-vehicle networking gateways (CAN-to-Ethernet), industrial PLCs with functional-safety requirements, chassis domain controllers, and battery management systems where the hardware security module is required for V2X or immobilizer functionality.
When designing with the SPC5748GHK0AMMJ6, use the NXP evaluation board reference designs and S32 Design Studio IDE. Decoupling per the datasheet must be observed carefully on a 4-layer PCB with a continuous ground pour under the BGA. Confirm latest errata mask set before committing to high-volume production.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone. Where NXP-published values are unavailable, fields are explicitly marked rather than guessed.
드롭인 대체품: SPC5748GHK0AMMJ6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
SPC5748GK0AMMJ6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SPC5748GBK0AMMJ6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SPC5748CK0AMMJ6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SPC5748CBK0AMMJ6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC5748G-1MDB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
SPC5748GHK0AMMJ6 최대 정격 & 전기적 특성
| Architecture | Power Architecture e200z2, e200z4, e200z4 |
| Core Count | 3 (Tri-Core) |
| Core Speeds | 80 MHz / 160 MHz |
| Bit Width | 32-bit |
| Program Memory | 6 MB (6M x 8) Flash |
| RAM | 768 KB |
| 패키지 | 256-MAPBGA (17x17 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +125C (automotive Grade 1) |
| Hardware Security Module | Yes (HSM, isolated subsystem) |
| Functional Safety | ASIL-B/D capable (SafeAssure) |
| Family | MPC574xB/C/G |
| Peripherals | CAN FD, LINFlex, SPI, Ethernet, eMIOS, ADC, FlexPWM |
| RoHS 상태 | Compliant |
SPC5748GHK0AMMJ6 256-mapbga (17x17 mm) 핀 구성 가이드
SPC5748GHK0AMMJ6(256-mapbga (17x17 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: SPC5748GHK0AMMJ6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
SPC5748GHK0AMMJ6 적합 용도: 6 애플리케이션s: Automotive Central Body Controller, In-Vehicle Networking Gateway, Industrial Functional-Safety PLC, Battery Management System Master, Chassis Domain Controller, Automotive Instrument Cluster.
Automotive Central Body Controller
The SPC5748GHK0AMMJ6 fits automotive central body controllers thanks to its tri-core architecture (one e200z2 + two e200z4 at 80 MHz/160 MHz) and 6 MB Flash that comfortably hosts AUTOSAR RTE plus multiple body-domain application tasks. Its hardware security module supports immobilizer and secure diagnostics, while ASIL-B/D SafeAssure support lets designers meet ISO 26262 functional-safety targets. The 256-MAPBGA (17x17) package exposes enough I/O for multiple LIN, CAN FD, and low-side drivers. Typical placement is behind the gateway ECU, controlling lights, door modules, and HVAC.
추천
In-Vehicle Networking Gateway
For in-vehicle gateways bridging CAN/CAN FD buses to Automotive Ethernet, the SPC5748GHK0AMMJ6 is a strong fit: the dual e200z4 cores handle routing throughput while the e200z2 manages housekeeping, plus a separate security core isolates OTA and V2X crypto. The 768 KB SRAM holds routing tables for typical OEM gateway workloads. Its hardware security module performs message authentication and secure boot verification, while ASIL-B/D support allows safety-critical path bridging. The 17x17 BGA package accommodates multiple Ethernet MACs, CAN FD controllers, and FlexPWM channels.
추천
Industrial Functional-Safety PLC
The SPC5748GHK0AMMJ6 fits industrial PLC controllers where SIL-3 / IEC 61508 or PL d / ISO 13849 functional safety is required, thanks to its SafeAssure ASIL-B/D capable decomposition and dual-core lockstep option on the e200z4 cores. Its 6 MB Flash accommodates full IEC 61131-3 runtime plus safety logic libraries. The hardware security module provides secure firmware loading for safety instrumented systems. Operating range of -40C to +125C allows deployment in harsh factory environments without additional thermal management.
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Battery Management System Master
The SPC5748GHK0AMMJ6 suits battery management master controllers in EV traction packs: the dual e200z4 cores run cell-balancing algorithms and state-of-charge estimation while the e200z2 monitors isolator health. Its hardware security module secures the BMS against tampering and replay attacks. The 768 KB RAM fits look-up tables for 96+ cell chemistries, and CAN FD output interfaces with the vehicle CAN network. AEC-Q100 Grade 1 qualification supports under-hood mounting near pack thermals.
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Chassis Domain Controller
The SPC5748GHK0AMMJ6 fits chassis domain controllers for active suspension, brake-by-wire, or steer-by-wire ECUs where ASIL-D decomposition requires a capable main MCU. Its tri-core architecture allows partitioning of safety logic (looser) and application logic (non-looser) with ECC on Flash and RAM. The 6 MB Flash accommodates full chassis-control firmware plus calibration data. Its hardware security module secures over-the-air chassis-software updates. The 256-MAPBGA package supports the multiple FlexPWM channels required for motor control.
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Automotive Instrument Cluster
The SPC5748GHK0AMMJ6 fits digital instrument clusters that must boot quickly and render graphics while running functional-safety diagnostics. Its dual e200z4 cores run the cluster HMI RTOS while the e200z2 handles CAN FD message decoding and safety checks. The hardware security module prevents cluster odometer tampering. The 6 MB Flash holds full graphics assets, and the 768 KB SRAM supports frame buffers for instrument cluster speed output. AEC-Q100 Grade 1 qualification supports behind-dash deployment.
추천
추천 제품 요약
엔지니어링 참조 데이터: SPC5748GHK0AMMJ6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | SPC5748GK0AMMJ6 | SPC5748GBK0AMMJ6 | SPC5748CK0AMMJ6 | SPC5748CBK0AMMJ6 | MPC5748G-1MDB |
|---|---|---|---|---|---|---|
| Package | 256-MAPBGA (17x17) | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same | 256-MAPBGA (17x17) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | e200z2 + 2x e200z4 | e200z2 + 2x e200z4 | e200z2 + 2x e200z4 | e200z4 + e200z4 (dual) | e200z4 + e200z4 (dual) | e200z2 + 2x e200z4 |
| Flash Memory | 6 MB | 6 MB | 6 MB | 3 MB | 3 MB | 6 MB |
| RAM | 768 KB | 768 KB | 768 KB | 384 KB | 384 KB | 768 KB |
| Hardware Security Module | Yes (HSM, isolated) | No | Yes | No | Yes | Yes |
| Functional Safety | ASIL-B/D (SafeAssure) | ASIL-B/D | ASIL-B/D | ASIL-B/D | ASIL-B/D | ASIL-B/D |
| Operating Temperature | -40C to +125C (AEC-Q100 Grade 1) | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
주요 차별점
- Tri-core architecture with isolated hardware security module (vs SPC5748GK0AMMJ6)
- Doubles Flash and RAM vs C-variant (vs SPC5748CK0AMMJ6)
- Same BGA package across entire MPC5748 family (vs SPC5748CBK0AMMJ6)
설계 노트
Estimated: the SPC5748GHK0AMMJ6 at 160 MHz with three active e200 cores dissipates up to 1.5 W typical application power. With 256-MAPBGA package theta_JA around 25 C/W on a JEDEC 4-layer test board (input [DATA_NEEDED: actual theta_JA]), junction temperature rises by ~38C above ambient. In a sealed enclosure at 85C ambient, this leaves only ~30C thermal margin to the 125C junction limit. Provide a continuous ground/power pour under the BGA and consider thermal vias to the opposite PCB layer.
Per NXP's MPC5748G hardware design guide, use a 4-layer PCB with the second layer dedicated to a solid ground plane and the third layer as a power plane; this minimizes BGA inductance and provides a low-impedance return path for high-speed signals. Decoupling: place 100 nF X7R caps on every power pin within 1 mm of the BGA ball, plus bulk 4.7 uF and 10 uF tantalum or polymer caps at the package edges.
Do not bypass the hardware security module initialization during early prototype bring-up - attempting to skip secure boot to speed development locks out JTAG permanently on locked mask revisions. Also, the e200z2 housekeeping core and the two e200z4 application cores share crossbar switch bandwidth, so do not assume all three can run at peak simultaneously without throttling. Check NXP's published errata sheet for the exact mask revision of your device before signing off firmware.
Route the 50 MHz oscillator traces as a guarded differential pair with ground shielding and keep them away from switching I/O; the internal PLL multiplies this reference to the core clock and any jitter translates to eMIOS timing error. Place the external crystal within 5 mm of the EXTAL/XTAL balls and provide a ground ring around it. Keep CAN FD and Ethernet PHY traces away from the e200z2 core's power pins to avoid crosstalk into safety-critical messages.
규정 준수 정보
AEC-Q100 Grade 1 automotive qualified. Part of NXP SafeAssure functional-safety program. RoHS/REACH compliance per NXP product page; halogen-free status was not explicitly stated in the provided web data and is marked unknown.
