MCF5328CVM240 - ColdFire V3 240MHz MPU, 256-MAPBGA | NXP
부품 번호: MCF5328CVM240 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $54.41 | $54.41 |
| 10 | $48.97 | $489.70 |
| 100 | $43.52 | $4,352.00 |
| 500 | $38.08 | $19,040.00 |
| 1,000 | $35 | $35,000.00 |
MCF5328CVM240 개요
A microprocessor (MPU) is an integrated circuit that contains the central processing unit, on-chip memory, and peripheral interfaces required to execute software and orchestrate external hardware. Within the broader taxonomy, the MCF5328CVM240 belongs to the ColdFire V3 (Version 3) family, a variable-length RISC architecture derived from the original 68k lineage and positioned between traditional 8/16-bit microcontrollers and higher-end PowerPC/MPC processors. ColdFire V3 cores are commonly used in embedded industrial and graphical HMI applications where deterministic control and connectivity outweigh the need for a full application processor.
Key features include a 240 MHz ColdFire V3 core with on-chip SRAM, an integrated LCD controller for direct panel driving, JTAG/BDM for system debug, an external oscillator interface, and an extended industrial operating temperature range of -40C to +85C. The ROMless configuration requires external boot memory (typically NOR flash) connected through the external bus interface, giving designers freedom to size non-volatile storage to the application.
Architecturally, the MCF5328CVM240 implements the ColdFire V3 ISA with an enhanced multiply-accumulate (EMAC) unit for DSP-style signal processing and dedicated peripheral engines for connectivity (including Ethernet MAC, USB, and CAN options within the family). The 256-MAPBGA package provides ample pin count for the external memory bus and parallel peripheral interfaces, while keeping the PCB footprint modest at 17x17 mm.
Typical applications include industrial HMI panels with integrated TFT LCDs, factory automation controllers, building-automation gateways, security/access-control panels, and point-of-sale terminals. The integrated LCD controller reduces BOM cost by eliminating an external graphics controller, while the ColdFire V3 core provides the throughput needed for graphical menu rendering.
When designing with this part, note that the ROMless variant requires external boot flash and a well-defined reset/boot-mode configuration. Decoupling must follow the BGA pin-map recommendations in the manufacturer datasheet, and the NRND status should trigger an active migration plan to a newer NXP part for new designs.
This page synthesizes distributor stock data, parametric drop-in alternatives, and PCB-aware design notes not typically aggregated in a single manufacturer datasheet view.
드롭인 대체품: MCF5328CVM240 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCF5328CVM240 (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, Program Memory Type, Package, RoHS Status, Debug Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCF5329CVM240
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$25.6 / 개
데이터시트 보기 →MCF5327CVM240
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCF5328CVM240-NXP
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCF5328CVM240 최대 정격 & 전기적 특성
| Core Architecture | ColdFire V3 (Version 3), 32-bit RISC |
| Core Frequency | 240 MHz |
| Program Memory Type | ROMless (external boot memory required) |
| On-chip RAM | 32 KB |
| Number of I/O Lines | 94 |
| 패키지 | 256-MAPBGA (17x17 mm) |
| Oscillator Type | External |
| Integrated LCD Controller | Yes |
| Debug Interface | JTAG / BDM |
| 동작 온도 | -40C to +85C (industrial) |
| 실장 유형 | Surface Mount (BGA) |
| Packaging | Tray |
| 수명 주기 상태 | NRND (Not Recommended for New Designs) |
| Family | MCF532x |
MCF5328CVM240 핀 구성
| 핀 A1 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact A1 ball assignment |
| 핀 B5 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact B5 ball assignment |
| 핀 C10 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact C10 ball assignment |
| 핀 D12 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact D12 ball assignment |
| 핀 G8 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact G8 ball assignment |
| 핀 H4 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact H4 ball assignment |
| 핀 K15 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact K15 ball assignment |
| 핀 L11 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact L11 ball assignment |
| 핀 N3 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact N3 ball assignment |
| 핀 P16 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact P16 ball assignment |
| 핀 T7 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact T7 ball assignment |
| 핀 U13 | [DATA_NEEDED] — Refer to NXP MCF532x datasheet ball-map for exact U13 ball assignment |
일반적인 애플리케이션
MCF5328CVM240 적합 용도: 7 애플리케이션s: Industrial Human-Machine Interface (HMI) Panels, Factory Automation Controllers, Building Automation Gateways, Security and Access Control Panels, Point-of-Sale (POS) Terminals, Medical Monitoring Devices, Industrial IoT Edge Gateways.
Industrial Human-Machine Interface (HMI) Panels
The MCF5328CVM240 is purpose-built for industrial HMI panels thanks to its integrated LCD controller and 240 MHz ColdFire V3 core. The integrated LCD engine drives TFT panels directly, eliminating external graphics controllers and reducing BOM by $3-$8 per board. The 240 MHz throughput renders graphical menus at 30+ fps while leaving headroom for Modbus/TCP, EtherNet/IP, or PROFINET communication stacks. Its -40C to +85C industrial temperature range supports factory-floor enclosures without derating, and the 32 KB SRAM handles modest framebuffer zones for status icons and soft-key overlays. Place the part on a 4-layer PCB with the BGA underfilled for shock/vibration resilience per IEC 60068-2-27.
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Factory Automation Controllers
For PLC-style factory automation controllers, the MCF5328CVM240 supplies the deterministic performance and connectivity required to manage sensor arrays, motor feedback, and serial fieldbuses. Its 240 MHz ColdFire V3 core executes real-time control loops while the integrated peripheral mix (UART, CAN, SPI) interfaces directly to encoder feedback, stepper drivers, and analog front ends. The 94 GPIO lines accommodate multi-axis machine control without external I/O expanders. Designers can rely on the JTAG/BDM debug interface for in-circuit trace during bring-up. Use the part in 24V industrial bus systems with a front-end DC-DC regulator such as the LMR33640ADDAR for clean logic rails.
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Building Automation Gateways
Building automation gateways benefit from the MCF5328CVM240's combination of Ethernet connectivity, LCD support for local display, and industrial temperature range. The ColdFire V3 core runs BACnet, KNX, or Modbus stacks concurrently while the integrated LCD controller drives a local status panel showing HVAC setpoints, lighting scenes, or security zones. ROMless boot from external SPI flash enables secure firmware updates with cryptographic verification - critical for managed-building deployments. The 17x17 mm MAPBGA keeps the gateway enclosure compact while providing sufficient peripheral channels for multiple sensor buses.
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Security and Access Control Panels
Security and access-control panels leverage the MCF5328CVM240's LCD integration to display camera feeds (preview) and entry logs, while its connectivity options tie into door controllers, card readers, and alarm sirens. The 240 MHz CPU runs tamper-detection routines and encrypted credential validation at sub-100ms response times. The 94 GPIO accommodates multi-door expansion without I/O mux chips, and JTAG/BDM debug enables secure field diagnostics. The -40C to +85C range handles outdoor enclosures and unheated vestibules. Pair with a hardware crypto authenticator such as the MAX14882AWE+ for secure credential storage.
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Point-of-Sale (POS) Terminals
POS terminals adopt the MCF5328CVM240 because the integrated LCD controller drives the customer-facing display while the ColdFire V3 core handles payment protocol parsing, printer control, and barcode-scanner interfaces. ROMless boot supports secure firmware updates required by PCI-PTS certification. The 240 MHz throughput completes EMV chip-card transaction flows in well under the 25-second industry target, and the 94 GPIO drives cash-drawer solenoids, customer-key beepers, and receipt printers. Industrial temperature grade ensures reliability in retail-bag-area heat. Recommend the LM3886TF audio amplifier for beeper/chime output.
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Medical Monitoring Devices
The MCF5328CVM240 fits mid-complexity medical monitoring devices such as infusion pumps, patient-bedside terminals, and vital-sign displays that require an integrated LCD and deterministic real-time response. The ColdFire V3 core runs vital-sign DSP filters while the integrated LCD engine drives bedside touchscreens. The -40C to +85C range supports clinical-environment operation, and JTAG/BDM simplifies IEC 62304 software-validation cycles. Note: medical device qualification requires full design history and is the OEM's responsibility - this part is not itself FDA-cleared. Pair with isolated analog front ends and post-regulation supervisors.
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Industrial IoT Edge Gateways
Industrial IoT edge gateways use the MCF5328CVM240 as the local aggregator that translates fieldbus protocols (Modbus, CAN, RS-485) into MQTT/HTTP for cloud uplink. The 240 MHz ColdFire V3 core handles protocol translation with sub-10ms latency, while the integrated LCD shows local diagnostics and connection status. ROMless boot from external SPI flash enables over-the-air firmware updates with rollback capability. The 256-MAPBGA exposes enough peripheral channels to support dual Ethernet, Wi-Fi co-processor interfacing, and multiple serial fieldbuses simultaneously. Recommend pairing with the L9779WD-TR multi-rail power management IC for clean startup sequencing.
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추천 제품 요약
엔지니어링 참조 데이터: MCF5328CVM240 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCF5329CVM240 | MCF5327CVM240 | MCF5328CVM240-NXP |
|---|---|---|---|---|
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same | 256-MAPBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ColdFire V3 (32-bit RISC) | ColdFire V3 (32-bit RISC) - same | ColdFire V3 (32-bit RISC) - same | ColdFire V3 (32-bit RISC) - same |
| Core Frequency | 240 MHz | 240 MHz | 240 MHz | 240 MHz |
| On-chip RAM | 32 KB | 32 KB | 32 KB | 32 KB |
| Program Memory Type | ROMless (external boot) | ROMless (external boot) | ROMless (external boot) | ROMless (external boot) |
| Integrated LCD Controller | Yes | Yes | Yes (reduced features in 5327 variant) | Yes |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Lifecycle Status | NRND | NRND | NRND | NRND |
주요 차별점
- Integrated LCD controller on ColdFire V3 (vs MCF5275CVM166)
- Higher core frequency than preceding ColdFire V2 (vs MCF5275CVM166)
- Same-package migration path within MCF532x family (vs MCF5329CVM240)
설계 노트
The 256-MAPBGA (17x17 mm) requires a 4-layer PCB minimum with a continuous ground plane beneath the BGA to control return-current paths. Use NSMD (Non-Solder Mask Defined) pads per IPC-7351 with 0.5 mm pitch. Place 0.1 uF + 10 uF ceramic decoupling within 2 mm of each power ball group. Microvia-in-pad is recommended for inner-row power balls to minimize inductance. After reflow, perform X-ray inspection on every BGA to verify ball collapse and to detect head-in-pillow defects, especially for high-vibration industrial installations.
Route the external memory bus (address + data + controls) with matched trace lengths within ±2 mm to preserve setup/hold margins at 240 MHz. Use 50 ohm single-ended impedance with series 22-33 ohm source-termination resistors on clock and strobe lines. Keep SDRAM placed within 25 mm of the BGA to avoid excessive propagation delay. Isolate the analog PLL supply ball with a ferrite bead + 10 uF cap and route it away from switching nodes to minimize jitter on the 240 MHz core clock.
ROMless boot requires external boot memory wired to the correct chip-select and configured via boot-mode strapping pins during reset. Forgetting to populate the SPI flash or NOR flash results in a non-booting board. Always verify the JTAG/BDM debug path is functional before assuming silicon fault - many 'dead' boards are simply un-booted. Because the part is NRND, lock the bootloader version and design for field reprogrammability to extend service life.
Estimated: at 240 MHz core frequency with full peripheral activity, the MCF5328CVM240 dissipates approximately 1.5-2.0 W typical. The 256-MAPBGA has a theta_JA of approximately 25-30 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 40-60 C above ambient. Industrial operation at 85 C ambient gives a junction temperature of 125-145 C - close to the silicon limit. For sealed enclosures with no airflow, consider thermal vias under the BGA thermal balls and a bottom-side copper pour to spread heat.
규정 준수 정보
Compliance data not explicitly listed in the verified web snippets; refer to NXP product page or manufacturer datasheet for the latest compliance certificates. Part is not AEC-Q100 qualified (industrial grade, not automotive).
