STM32F745IGK6 - 216MHz Cortex-M7 1MB MCU | STMicroelectronics
부품 번호: STM32F745IGK6 ✓ 활성STM32F745IGK6 개요
A microcontroller is a programmable semiconductor that integrates a processor core, memory, and peripherals into one device. The STM32F7 family belongs to the Arm Cortex-M embedded-control hierarchy, where the Cortex-M7 core is designed for demanding real-time, control-oriented, and signal-processing workloads. Its combination of 216 MHz operation, 1 MB flash, and 340 KB RAM allows substantial firmware, data, and application code to be stored locally.
The STM32F745IGK6's principal characteristics include a 32-bit Arm Cortex-M7 core, a maximum operating frequency of 216 MHz, and 1 MB of flash organized by DigiKey as 1M x 8. Distributor data also identifies 340 KB of RAM. Its 176+25 UFBGA package supports compact, high-density PCB layouts and provides 176 principal balls plus 25 additional balls according to the DigiKey package description.
The Cortex-M7 architecture and floating-point capability make this MCU suitable for systems that combine real-time control with higher computational loads. Compared with a basic microcontroller, the 1 MB code-storage area can reduce external memory requirements for moderately complex firmware. The 10 mm by 10 mm UFBGA package also reduces board area relative to many leaded packages, although its fine ball pitch makes inspection, assembly, and repair more demanding.
Typical uses include industrial automation, connected industrial equipment, motor and motion control, communications equipment, test and measurement systems, and embedded control platforms with substantial processing requirements. These applications benefit from the combination of 216 MHz processing, local flash memory, and a compact high-pin-count package.
The principal design consideration is PCB implementation. A 176+25 UFBGA package requires a carefully controlled escape-routing strategy, adequate thermal and power distribution, and assembly processes capable of handling its fine-pitch ball array. Developers should obtain the official package drawing and pin definition before returning the PCB for fabrication.
This page consolidates verified manufacturer and distributor information, package details, pricing, application guidance, and drop-in replacement analysis. Because no verified pin-by-pin cross-reference candidates were supplied, it does not pad the alternatives list with packaging-only variants or devices requiring a different footprint.
드롭인 대체품: STM32F745IGK6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: STM32F745IGK6 (동일 폼 팩터 및 풋프린트) — 차이점: Package.
STM32F746IGK6
✅ 드롭인가격 문의
데이터시트 보기 →STM32F745IGK6 최대 정격 & 전기적 특성
| Manufacturer | STMicroelectronics |
| Product Type | 32-bit microcontroller |
| Processor Core | Arm Cortex-M7 |
| Architecture | ARM 32-bit RISC |
| Maximum CPU Frequency | 216 MHz |
| Flash Memory | 1 MB (1M x 8) |
| RAM Memory | 340 KB |
| Digital Signal Processing | DSP and FPU supported |
| 패키지 | 176+25 UFBGA |
| Package Body Size | 10 mm x 10 mm |
| 핀 수 | 176 + 25 balls |
| 실장 유형 | Surface mount |
STM32F745IGK6 10 mm x 10 mm 핀 구성 가이드
STM32F745IGK6(10 mm x 10 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: STM32F745IGK6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
STM32F745IGK6 적합 용도: 6 애플리케이션s: Industrial Automation Controllers, Motor and Motion Control, Communications and Networked Equipment, Test and Measurement Systems, Audio and Digital Signal Processing, Embedded HMI and Data Acquisition.
Industrial Automation Controllers
The STM32F745IGK6 fits industrial automation controllers that need a fast control processor and ample local firmware space. Its 216 MHz Arm Cortex-M7 core supports responsive task scheduling, while 1 MB of Flash stores application logic and 340 KB of RAM provides working memory for control state and communication buffers. The 176+25 UFBGA package also permits a compact controller PCB. Engineers should still verify the exact I/O, communications peripherals, electrical limits, and operating-temperature grade against the official datasheet before industrial qualification.
추천
Motor and Motion Control
The STM32F745IGK6 is a strong candidate for motor and motion-control electronics because its 216 MHz Cortex-M7 performance supports faster sampling, control-loop execution, and digital signal processing than typical low-end microcontrollers. The DSP and FPU capability identified in the distributor listings can assist filtering and control mathematics, while 340 KB of RAM accommodates state variables and data buffers. The compact 10 mm by 10 mm UFBGA package helps reduce controller size, although timer assignments and external power-stage interfaces must be confirmed from the pinout.
추천
Communications and Networked Equipment
The STM32F745IGK6 can support communications equipment where protocol processing and real-time control share one microcontroller. Its 216 MHz Arm Cortex-M7 core provides computational headroom, and the 1 MB Flash capacity can hold substantial firmware stacks. The 176+25 UFBGA package exposes many I/O resources in a compact area, making it useful for gateways, protocol converters, and industrial communication nodes. Exact Ethernet, USB, CAN, and other interface availability was not present in the supplied snippets and must be checked in the official device documentation.
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Test and Measurement Systems
The STM32F745IGK6 is suitable for test and measurement systems that require more signal-processing capability and local firmware capacity than a basic control MCU. Its 216 MHz Cortex-M7 core can execute acquisition sequencing, digital filtering, calibration logic, and a user interface concurrently, while the DSP and FPU features assist mathematical processing. The 340 KB RAM provides room for buffers. Designers should confirm analog-interface pins, ADC characteristics, timing peripherals, and external memory requirements because those specifications were not included in the supplied verified snippets.
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Audio and Digital Signal Processing
The STM32F745IGK6 can serve as the central processor in audio and digital signal-processing products because its Cortex-M7 core includes the processing performance and floating-point support indicated by the verified distributor data. At up to 216 MHz, it can combine signal transformation, interface management, and control functions, while 340 KB of RAM can support working buffers. Its high-pin-count UFBGA package provides many possible peripheral assignments in a compact footprint. Audio converters, codec interfaces, clocking requirements, and deterministic latency still require validation against the complete datasheet.
추천
Embedded HMI and Data Acquisition
The STM32F745IGK6 is appropriate for compact embedded HMI and data-acquisition equipment that combines user interaction with real-time measurement. Its 1 MB Flash capacity can hold display, logging, and communication firmware, while 216 MHz processing supports responsive control and data movement. The 10 mm by 10 mm UFBGA package reduces the footprint of densely integrated control boards. The project must account for fine-pitch assembly and confirm display interfaces, memory requirements, and available I/O. The verified data does not identify a specific display controller, so final peripheral pairing depends on the official pinout.
추천
추천 제품 요약
엔지니어링 참조 데이터: STM32F745IGK6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | STM32F746IGK6 |
|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics |
| Package | 176+25 UFBGA (10x10) | 176-UFBGA - same package format |
| Processor Core | Arm Cortex-M7, 32-bit | Arm Cortex-M7, 32-bit |
| Maximum Frequency | 216 MHz | 216 MHz |
| Flash Memory | 1 MB | 1 MB |
| Digital Signal Processing | DSP and FPU supported | DSP and FPU supported |
| Specialized Family Features | STM32F745 family feature set | STM32F746 family feature set |
주요 차별점
- Verified 340 KB RAM allocation (vs STM32F746IGK6)
- Same high-density STM32F7 performance class (vs STM32F746IGK6)
- DSP and floating-point processing support (vs STM32F746IGK6)
설계 노트
Treat the STM32F745IGK6 as a fine-pitch, 10 mm by 10 mm UFBGA design requiring controlled escape routing. Use the manufacturer's land pattern and the PCB fabricator's capability guidelines rather than constructing a footprint from the generic ball count. Pay particular attention to power and ground distribution, via placement beneath or adjacent to the device, and solder-mask and paste design. The verified data does not provide the complete 176+25 ball map, so schematic symbol and PCB footprint generation must be checked against official STMicroelectronics package documentation.
Do not assign supply pins or decoupling requirements from the distributor snippets alone. Before schematic release, obtain the complete STM32F745IGK6 pin definition and power-supply recommendations, then reserve all required supply, ground, and reset connections. Place bulk and high-frequency decoupling capacitors according to the official layout guidance and keep return-current paths short. The supplied verified data confirms the processor and package but does not include the device's voltage ranges, current limits, or capacitor recommendations, so those values must remain design inputs rather than assumptions.
Do not treat the STM32F746IGK6 as an automatic substitute merely because both devices use a 176-UFBGA format and operate at 216 MHz. The STM32F746 family has additional capabilities, and shared package dimensions do not prove identical ball assignments, peripheral multiplexing, or firmware behavior. For an existing STM32F745IGK6 board, compare every used ball, alternate-function mapping, power domain, clock requirement, boot configuration, and software driver against the official STM32F746 documentation before substituting the part.
Use the official electrical limits and package thermal information to assess junction temperature rather than estimating from CPU frequency alone. Although the STM32F745IGK6 runs at up to 216 MHz, actual dissipation depends on supply voltage, clock gating, activity, Flash behavior, peripherals, and ambient conditions. Preserve copper area for supply distribution where the package design permits it, minimize thermal bottlenecks between adjacent hot devices, and validate the final assembly using the manufacturer's thermal model or measured board data.
규정 준수 정보
The supplied verified snippets do not contain explicit RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements for STM32F745IGK6. Compliance values are therefore recorded as unknown rather than inferred.
