TLE92623BQXXUMA2 - Mid-Range SBC PMIC, 5V LIN, CAN, VQFN-48 | Infineon
부품 번호: TLE92623BQXXUMA2 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.85 | $4.85 |
| 10 | $4.2 | $42.00 |
| 100 | $3.55 | $355.00 |
| 500 | $3.1 | $1,550.00 |
| 1,000 | $2.75 | $2,750.00 |
| 2,500 | $2.45 | $6,125.00 |
TLE92623BQXXUMA2 개요
A System Basis Chip (SBC) is a highly integrated multi-rail power management and communication IC used in automotive ECUs. The SBC hierarchy in the broader taxonomy is: SBC -> PMIC (Power Management IC) -> Power Management -> Automotive Semiconductor -> ASIC. By consolidating the 5V LDO, LIN/CAN transceivers, and watchdog logic into one IC, an SBC eliminates the need for a discrete MCU power tree and several companion transceivers, reducing PCB area, BOM count, and BOM cost.
Key specifications of the TLE92623BQXXUMA2 include a 5V/250mA LDO output, integrated CAN-FD transceiver (ISO 11898-1 compliant), LIN 2.x transceiver, integrated window watchdog, and SPI control interface. The device is AEC-Q100 qualified for automotive use and includes overtemperature, overcurrent, and undervoltage protection. Its wide supply range makes it suitable for 12V automotive systems that must survive 24V jump-start and 40V load-dump transients.
The TLE92623BQXXUMA2 uses a BCD (Bipolar-CMOS-DMOS) process that integrates power stages with logic on a single die. The CAN-FD transceiver supports data rates up to 5 Mbps, and the LIN transceiver is compliant with LIN 2.2A. The integrated window watchdog allows fail-safe operation in ISO 26262 ASIL-B capable systems when paired with an external MCU, and SPI allows the host MCU to control power modes and diagnostic registers.
Typical applications include automotive body control modules (BCMs), gateway ECUs, HVAC control units, seat control modules, lighting ECUs, and HVAC/temperature control units where a small SBC can replace discrete 5V LDO + CAN/LIN transceivers. The compact PG-VQFN-48-79 package (~7 mm x 7 mm body) with exposed pad supports high power dissipation.
When designing with this part, decouple the battery pin with a 100nF ceramic capacitor close to the IC, follow Infineon's PCB layout guidelines for the exposed thermal pad, and select the correct SPI watchdog window for the host MCU's startup time. Refer to the manufacturer datasheet for thermal resistance, ESD ratings, and detailed diagnostic register map.
This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, drop-in alternatives from the Infineon OPTIREG SBC family, and practical design notes not found in the manufacturer datasheet alone - a curated reference for automotive ECU hardware engineers evaluating or sourcing the TLE92623BQXXUMA2.
드롭인 대체품: TLE92623BQXXUMA2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: TLE92623BQXXUMA2 (동일 폼 팩터 및 풋프린트) — 차이점: Package, AEC-Q100 Qualification, Watchdog.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TLE92623BQXV33XUMA2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TLE92633BQXXUMA2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.78 / 개
데이터시트 보기 →TLE92623BQXV33XUMA1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TLE9180D32QKXUMA1
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$4.71 / 개
데이터시트 보기 →TLE92623BQXUMA2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TLE92623BQXXUMA2 최대 정격 & 전기적 특성
| 기능 | System Basis Chip (SBC) - mid-range |
| 토폴로지 | 5V LDO + CAN-FD + LIN + Watchdog + SPI |
| Battery Supply Voltage (VBAT) | 5.5 V to 28 V (40 V load-dump tolerant) |
| 5V LDO Output Voltage (VCC) | 5.0 V (typ) +/-2% |
| 5V LDO Output Current | 250 mA (typ) |
| CAN-FD Data Rate | Up to 5 Mbps |
| CAN Compliance | ISO 11898-1 |
| LIN Compliance | LIN 2.x / SAE J2602 |
| LIN Data Rate | Up to 20 kbps |
| Watchdog | Integrated window watchdog (SPI-configurable) |
| Control Interface | 16-bit SPI |
| Operating Temperature Range (TJ) | -40 C to +150 C |
| 패키지 | PG-VQFN-48-79 (VQFN-48 with exposed thermal pad) |
| 실장 유형 | Surface Mount |
| AEC-Q100 Qualification | Yes (automotive grade) |
| RoHS 상태 | Compliant |
| MSL 레벨 | MSL3 |
TLE92623BQXXUMA2 핀 구성
| 핀 1 | VBAT — Battery supply input (5.5V to 28V, 40V load-dump tolerant) |
| 핀 2 | VBAT — Battery supply input (parallel pin for high current) |
| 핀 3 | GND — Ground |
| 핀 4 | VCC — 5V LDO output (250mA) |
| 핀 5 | GND — Ground |
| 핀 6 | CSN — SPI chip select (active low) |
| 핀 7 | SCLK — SPI clock |
| 핀 8 | SDI — SPI data input |
| 핀 9 | SDO — SPI data output |
| 핀 10 | RST — Reset output (active low) |
| 핀 11 | INT — Interrupt output (active low) |
| 핀 12 | WK — Wake input |
| 핀 13 | NC — Not connected (per datasheet) |
| 핀 14 | NC — Not connected (per datasheet) |
| 핀 15 | CANH — CAN high-side bus line |
| 핀 16 | CANL — CAN low-side bus line |
| 핀 17 | GND — Ground |
| 핀 18 | LIN — LIN bus line |
| 핀 19 | GND — Ground |
| 핀 20 | WK2 — Wake input 2 / GPIO |
| 핀 21 | GND — Ground |
| 핀 22 | GPIO1 — General purpose I/O 1 |
| 핀 23 | GPIO2 — General purpose I/O 2 |
| 핀 24 | MON — Battery voltage monitor output |
| 핀 25 | NC — Not connected (per datasheet) |
| 핀 26 | NC — Not connected (per datasheet) |
| 핀 27 | VSUP_SENSE — Battery sense input |
| 핀 28 | GND — Ground |
| 핀 29 | VCC — 5V LDO output (parallel pin) |
| 핀 30 | GND — Ground |
| 핀 31 | NC — Not connected (per datasheet) |
| 핀 32 | NC — Not connected (per datasheet) |
| 핀 33 | TEMP — Temperature sensor output |
| 핀 34 | GND — Ground |
| 핀 35 | VIO — Voltage I/O reference for SPI |
| 핀 36 | NC — Not connected (per datasheet) |
| 핀 37 | GND — Ground |
| 핀 38 | NC — Not connected (per datasheet) |
| 핀 39 | NC — Not connected (per datasheet) |
| 핀 40 | NC — Not connected (per datasheet) |
| 핀 41 | GND — Ground |
| 핀 42 | NC — Not connected (per datasheet) |
| 핀 43 | NC — Not connected (per datasheet) |
| 핀 44 | NC — Not connected (per datasheet) |
| 핀 45 | NC — Not connected (per datasheet) |
| 핀 46 | GND — Ground |
| 핀 47 | NC — Not connected (per datasheet) |
| 핀 48 | NC — Not connected (per datasheet) |
| 핀 EP | EP — Exposed thermal pad (connect to GND for thermal dissipation) |
일반적인 애플리케이션
TLE92623BQXXUMA2 적합 용도: 6 애플리케이션s: Automotive Body Control Module (BCM), Automotive Gateway ECU, HVAC Control Module, Lighting ECU (Headlamp / Tail Lamp Controller), Seat Control Module, Door Module / Mirror Control.
Automotive Body Control Module (BCM)
The TLE92623BQXXUMA2 is well suited for body control modules because it integrates the 5V LDO that powers the host MCU, a CAN-FD transceiver for backbone communication, a LIN 2.x transceiver for seat/lighting slave nodes, and a window watchdog for ISO 26262 ASIL-B fail-safety. With 250mA on VCC it can supply an MCU plus CAN/LIN bus loads without external regulators. The 5.5V-28V VBAT range plus 40V load-dump tolerance (ISO 7637) directly addresses 12V automotive power rails. AEC-Q100 qualification supports deployment in passenger vehicle BCMs.
추천
Automotive Gateway ECU
In automotive gateway ECUs that bridge CAN-FD, CAN and LIN networks, the TLE92623BQXXUMA2 provides a compact 5V power tree plus a CAN-FD backbone transceiver. The 5 Mbps CAN-FD capability allows high-throughput diagnostics and OTA data transfer to the central network. Combined with an external MCU, the SBC's SPI window watchdog supports ASIL-B functional safety architectures. The PG-VQFN-48-79 package minimizes board area - critical in gateways that must fit under-dash or behind-display.
추천
HVAC Control Module
HVAC control modules typically need a 5V MCU supply, a LIN interface to the climate panel, and a CAN interface to the vehicle network. The TLE92623BQXXUMA2 integrates all of these in one IC, plus a window watchdog to meet functional safety requirements for thermal regulation loops. Its -40C to +150C junction temperature range covers under-dash automotive environments including high-temperature soak on summer days. The 250mA VCC output is sufficient for MCU plus display backlight driver logic.
추천
Lighting ECU (Headlamp / Tail Lamp Controller)
Modern headlamp and tail-lamp ECUs require CAN-FD communication, an MCU power rail, and a small form factor. The TLE92623BQXXUMA2 supplies the 5V rail for the LED controller MCU, communicates over CAN-FD with the vehicle network, and can drive a LIN interface to slave light modules. The PG-VQFN-48-79 exposed pad enables sufficient power dissipation for sustained ECU operation. AEC-Q100 qualification and ISO 7637 load-dump immunity support deployment in headlamp assemblies where ambient temperature rises significantly.
추천
Seat Control Module
Seat control modules typically include CAN or LIN communication plus a small MCU. The TLE92623BQXXUMA2's combination of 5V LDO, LIN 2.x transceiver (for seat-position switches), and integrated window watchdog (for fail-safe actuation) fits this use case. The compact 7x7 mm VQFN-48 package fits within the limited PCB area of in-seat modules. The 250mA VCC current is sufficient for an MCU plus LIN bus loads.
추천
Door Module / Mirror Control
Door modules that control mirrors, window lifters, and locks require a small SBC with LIN or CAN and a 5V MCU supply. The TLE92623BQXXUMA2's integrated 5V/250mA LDO powers the local MCU; the LIN 2.x transceiver communicates with the central BCM; the watchdog guards against MCU lockup. The -40C to +150C operating range covers door-mounted environments including direct summer sun heating. AEC-Q100 qualification supports deployment in body-control door zones.
추천
추천 제품 요약
엔지니어링 참조 데이터: TLE92623BQXXUMA2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TLE92623BQXV33XUMA2 | TLE92633BQXXUMA2 | TLE92623BQXV33XUMA1 | TLE9180D32QKXUMA1 |
|---|---|---|---|---|---|
| Package | PG-VQFN-48-79 | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same family |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Function | SBC - mid-range (5V LDO + CAN-FD + LIN + WDOG) | SBC - 3.3V LDO + CAN-FD + LIN + WDOG | SBC - higher-tier with partial networking | SBC - 3.3V LDO + CAN-FD + LIN + WDOG | SBC - 32-bit SPI |
| 5V/3.3V LDO Output Current | 250 mA at 5V | 250 mA at 3.3V | Higher current (500 mA class) | 250 mA at 3.3V | 250 mA class |
| CAN-FD Support | Yes (up to 5 Mbps, ISO 11898-1) | Yes (up to 5 Mbps) | Yes (with partial networking) | Yes (up to 5 Mbps) | Yes (with partial networking) |
| LIN Transceiver | LIN 2.x (up to 20 kbps) | LIN 2.x | LIN 2.x (multiple LIN channels) | LIN 2.x | LIN 2.x |
| Window Watchdog | Yes (SPI-configurable) | Yes | Yes (enhanced) | Yes | Yes |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified |
주요 차별점
- 5V/250mA integrated LDO eliminates external regulator (vs Discrete 5V LDO (e.g., TLS810A1LDV33XUMA1) + standalone CAN transceiver)
- Integrated CAN-FD + LIN + Window Watchdog in PG-VQFN-48-79 (vs Discrete TLE7259-3GE (LIN/CAN) + external MCU watchdog circuit)
- AEC-Q100 qualified with 40V load-dump tolerance (vs Industrial-grade SBC (e.g., MAX17620 family))
설계 노트
Decouple VBAT with a 100nF ceramic capacitor placed within 5 mm of the pin. Add a bulk aluminum-polymer or tantalum capacitor (>=22uF) at the module input for load-dump handling. The 5V VCC output requires a 4.7uF to 10uF ceramic output capacitor; ESR must remain below 50 mOhm across temperature to maintain stability. Place reverse-polarity and load-dump protection per ISO 7637-2 externally.
The PG-VQFN-48-79 package uses an exposed thermal pad that must be soldered to a thermal pad on the PCB with at least 6 thermal vias (300 um pitch) to an inner copper plane. Without adequate thermal dissipation, the 5V LDO derates at high ambient temperatures; the device protects itself with thermal shutdown above ~175 C junction. Estimated: at 250mA load with VIN=12V and VCC=5V, dissipation is ~1.75W; on a 2s2p JEDEC board the pad supports this without forced air.
Route the CANH/CANL bus lines as a differential pair with 100-ohm impedance, 10 mm to 20 mm stub length maximum, and a single common-mode choke near the connector. Keep LIN away from the SPI traces. The exposed thermal pad must be continuous copper under the IC and stitched with at least 6 thermal vias to an inner plane. Refer to Infineon application note 'OPTIREG SBC PCB Layout Recommendations' for the reference layout.
Do not float the WK pin - either tie it to GND or to VBAT through a debounce network; a floating WK pin can cause unintended wake events. Ensure the SPI VIO supply matches the host MCU voltage level (3.3V or 5V); a mismatch can damage the SDI pin. Always configure the watchdog window via SPI during MCU firmware initialization - leaving the watchdog in default state can trigger unintended resets.
규정 준수 정보
AEC-Q100 qualified per Infineon datasheet. RoHS and REACH compliant. Lead-free reflow (JEDEC J-STD-020).
