TLE92623BQXXUMA2 - Mid-Range SBC PMIC, 5V LIN, CAN, VQFN-48 | Infineon
Référence : TLE92623BQXXUMA2 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.85 | $4,85 |
| 10 | $4.2 | $42,00 |
| 100 | $3.55 | $355,00 |
| 500 | $3.1 | $1 550,00 |
| 1 000 | $2.75 | $2 750,00 |
| 2 500 | $2.45 | $6 125,00 |
TLE92623BQXXUMA2 Présentation
A System Basis Chip (SBC) is a highly integrated multi-rail power management and communication IC used in automotive ECUs. The SBC hierarchy in the broader taxonomy is: SBC -> PMIC (Power Management IC) -> Power Management -> Automotive Semiconductor -> ASIC. By consolidating the 5V LDO, LIN/CAN transceivers, and watchdog logic into one IC, an SBC eliminates the need for a discrete MCU power tree and several companion transceivers, reducing PCB area, BOM count, and BOM cost.
Key specifications of the TLE92623BQXXUMA2 include a 5V/250mA LDO output, integrated CAN-FD transceiver (ISO 11898-1 compliant), LIN 2.x transceiver, integrated window watchdog, and SPI control interface. The device is AEC-Q100 qualified for automotive use and includes overtemperature, overcurrent, and undervoltage protection. Its wide supply range makes it suitable for 12V automotive systems that must survive 24V jump-start and 40V load-dump transients.
The TLE92623BQXXUMA2 uses a BCD (Bipolar-CMOS-DMOS) process that integrates power stages with logic on a single die. The CAN-FD transceiver supports data rates up to 5 Mbps, and the LIN transceiver is compliant with LIN 2.2A. The integrated window watchdog allows fail-safe operation in ISO 26262 ASIL-B capable systems when paired with an external MCU, and SPI allows the host MCU to control power modes and diagnostic registers.
Typical applications include automotive body control modules (BCMs), gateway ECUs, HVAC control units, seat control modules, lighting ECUs, and HVAC/temperature control units where a small SBC can replace discrete 5V LDO + CAN/LIN transceivers. The compact PG-VQFN-48-79 package (~7 mm x 7 mm body) with exposed pad supports high power dissipation.
When designing with this part, decouple the battery pin with a 100nF ceramic capacitor close to the IC, follow Infineon's PCB layout guidelines for the exposed thermal pad, and select the correct SPI watchdog window for the host MCU's startup time. Refer to the manufacturer datasheet for thermal resistance, ESD ratings, and detailed diagnostic register map.
This page synthesizes distributor pricing from DigiKey, Mouser and Octopart, drop-in alternatives from the Infineon OPTIREG SBC family, and practical design notes not found in the manufacturer datasheet alone - a curated reference for automotive ECU hardware engineers evaluating or sourcing the TLE92623BQXXUMA2.
Alternatives de remplacement direct pour TLE92623BQXXUMA2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TLE92623BQXXUMA2 (même facteur de forme et même empreinte) — différant par Package, AEC-Q100 Qualification, Watchdog.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TLE92623BQXV33XUMA2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TLE92633BQXXUMA2
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.78 / unité
Voir la fiche technique →TLE92623BQXV33XUMA1
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TLE9180D32QKXUMA1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.71 / unité
Voir la fiche technique →TLE92623BQXUMA2
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TLE92623BQXXUMA2 Valeurs maximales et caractéristiques électriques
| Fonction | System Basis Chip (SBC) - mid-range |
| Topologie | 5V LDO + CAN-FD + LIN + Watchdog + SPI |
| Battery Supply Voltage (VBAT) | 5.5 V to 28 V (40 V load-dump tolerant) |
| 5V LDO Output Voltage (VCC) | 5.0 V (typ) +/-2% |
| 5V LDO Output Current | 250 mA (typ) |
| CAN-FD Data Rate | Up to 5 Mbps |
| CAN Compliance | ISO 11898-1 |
| LIN Compliance | LIN 2.x / SAE J2602 |
| LIN Data Rate | Up to 20 kbps |
| Watchdog | Integrated window watchdog (SPI-configurable) |
| Control Interface | 16-bit SPI |
| Operating Temperature Range (TJ) | -40 C to +150 C |
| Boîtier | PG-VQFN-48-79 (VQFN-48 with exposed thermal pad) |
| Type de montage | Surface Mount |
| AEC-Q100 Qualification | Yes (automotive grade) |
| Statut RoHS | Compliant |
| Niveau MSL | MSL3 |
Configuration des broches de TLE92623BQXXUMA2
| Broche 1 | VBAT — Battery supply input (5.5V to 28V, 40V load-dump tolerant) |
| Broche 2 | VBAT — Battery supply input (parallel pin for high current) |
| Broche 3 | GND — Ground |
| Broche 4 | VCC — 5V LDO output (250mA) |
| Broche 5 | GND — Ground |
| Broche 6 | CSN — SPI chip select (active low) |
| Broche 7 | SCLK — SPI clock |
| Broche 8 | SDI — SPI data input |
| Broche 9 | SDO — SPI data output |
| Broche 10 | RST — Reset output (active low) |
| Broche 11 | INT — Interrupt output (active low) |
| Broche 12 | WK — Wake input |
| Broche 13 | NC — Not connected (per datasheet) |
| Broche 14 | NC — Not connected (per datasheet) |
| Broche 15 | CANH — CAN high-side bus line |
| Broche 16 | CANL — CAN low-side bus line |
| Broche 17 | GND — Ground |
| Broche 18 | LIN — LIN bus line |
| Broche 19 | GND — Ground |
| Broche 20 | WK2 — Wake input 2 / GPIO |
| Broche 21 | GND — Ground |
| Broche 22 | GPIO1 — General purpose I/O 1 |
| Broche 23 | GPIO2 — General purpose I/O 2 |
| Broche 24 | MON — Battery voltage monitor output |
| Broche 25 | NC — Not connected (per datasheet) |
| Broche 26 | NC — Not connected (per datasheet) |
| Broche 27 | VSUP_SENSE — Battery sense input |
| Broche 28 | GND — Ground |
| Broche 29 | VCC — 5V LDO output (parallel pin) |
| Broche 30 | GND — Ground |
| Broche 31 | NC — Not connected (per datasheet) |
| Broche 32 | NC — Not connected (per datasheet) |
| Broche 33 | TEMP — Temperature sensor output |
| Broche 34 | GND — Ground |
| Broche 35 | VIO — Voltage I/O reference for SPI |
| Broche 36 | NC — Not connected (per datasheet) |
| Broche 37 | GND — Ground |
| Broche 38 | NC — Not connected (per datasheet) |
| Broche 39 | NC — Not connected (per datasheet) |
| Broche 40 | NC — Not connected (per datasheet) |
| Broche 41 | GND — Ground |
| Broche 42 | NC — Not connected (per datasheet) |
| Broche 43 | NC — Not connected (per datasheet) |
| Broche 44 | NC — Not connected (per datasheet) |
| Broche 45 | NC — Not connected (per datasheet) |
| Broche 46 | GND — Ground |
| Broche 47 | NC — Not connected (per datasheet) |
| Broche 48 | NC — Not connected (per datasheet) |
| Broche EP | EP — Exposed thermal pad (connect to GND for thermal dissipation) |
Applications typiques
TLE92623BQXXUMA2 convient pour 6 applications: Automotive Body Control Module (BCM), Automotive Gateway ECU, HVAC Control Module, Lighting ECU (Headlamp / Tail Lamp Controller), Seat Control Module, Door Module / Mirror Control.
Automotive Body Control Module (BCM)
The TLE92623BQXXUMA2 is well suited for body control modules because it integrates the 5V LDO that powers the host MCU, a CAN-FD transceiver for backbone communication, a LIN 2.x transceiver for seat/lighting slave nodes, and a window watchdog for ISO 26262 ASIL-B fail-safety. With 250mA on VCC it can supply an MCU plus CAN/LIN bus loads without external regulators. The 5.5V-28V VBAT range plus 40V load-dump tolerance (ISO 7637) directly addresses 12V automotive power rails. AEC-Q100 qualification supports deployment in passenger vehicle BCMs.
Recommandé
Automotive Gateway ECU
In automotive gateway ECUs that bridge CAN-FD, CAN and LIN networks, the TLE92623BQXXUMA2 provides a compact 5V power tree plus a CAN-FD backbone transceiver. The 5 Mbps CAN-FD capability allows high-throughput diagnostics and OTA data transfer to the central network. Combined with an external MCU, the SBC's SPI window watchdog supports ASIL-B functional safety architectures. The PG-VQFN-48-79 package minimizes board area - critical in gateways that must fit under-dash or behind-display.
Recommandé
HVAC Control Module
HVAC control modules typically need a 5V MCU supply, a LIN interface to the climate panel, and a CAN interface to the vehicle network. The TLE92623BQXXUMA2 integrates all of these in one IC, plus a window watchdog to meet functional safety requirements for thermal regulation loops. Its -40C to +150C junction temperature range covers under-dash automotive environments including high-temperature soak on summer days. The 250mA VCC output is sufficient for MCU plus display backlight driver logic.
Recommandé
Lighting ECU (Headlamp / Tail Lamp Controller)
Modern headlamp and tail-lamp ECUs require CAN-FD communication, an MCU power rail, and a small form factor. The TLE92623BQXXUMA2 supplies the 5V rail for the LED controller MCU, communicates over CAN-FD with the vehicle network, and can drive a LIN interface to slave light modules. The PG-VQFN-48-79 exposed pad enables sufficient power dissipation for sustained ECU operation. AEC-Q100 qualification and ISO 7637 load-dump immunity support deployment in headlamp assemblies where ambient temperature rises significantly.
Recommandé
Seat Control Module
Seat control modules typically include CAN or LIN communication plus a small MCU. The TLE92623BQXXUMA2's combination of 5V LDO, LIN 2.x transceiver (for seat-position switches), and integrated window watchdog (for fail-safe actuation) fits this use case. The compact 7x7 mm VQFN-48 package fits within the limited PCB area of in-seat modules. The 250mA VCC current is sufficient for an MCU plus LIN bus loads.
Recommandé
Door Module / Mirror Control
Door modules that control mirrors, window lifters, and locks require a small SBC with LIN or CAN and a 5V MCU supply. The TLE92623BQXXUMA2's integrated 5V/250mA LDO powers the local MCU; the LIN 2.x transceiver communicates with the central BCM; the watchdog guards against MCU lockup. The -40C to +150C operating range covers door-mounted environments including direct summer sun heating. AEC-Q100 qualification supports deployment in body-control door zones.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TLE92623BQXXUMA2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TLE92623BQXV33XUMA2 | TLE92633BQXXUMA2 | TLE92623BQXV33XUMA1 | TLE9180D32QKXUMA1 |
|---|---|---|---|---|---|
| Package | PG-VQFN-48-79 | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same | PG-VQFN-48-79 - same family |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
| Function | SBC - mid-range (5V LDO + CAN-FD + LIN + WDOG) | SBC - 3.3V LDO + CAN-FD + LIN + WDOG | SBC - higher-tier with partial networking | SBC - 3.3V LDO + CAN-FD + LIN + WDOG | SBC - 32-bit SPI |
| 5V/3.3V LDO Output Current | 250 mA at 5V | 250 mA at 3.3V | Higher current (500 mA class) | 250 mA at 3.3V | 250 mA class |
| CAN-FD Support | Yes (up to 5 Mbps, ISO 11898-1) | Yes (up to 5 Mbps) | Yes (with partial networking) | Yes (up to 5 Mbps) | Yes (with partial networking) |
| LIN Transceiver | LIN 2.x (up to 20 kbps) | LIN 2.x | LIN 2.x (multiple LIN channels) | LIN 2.x | LIN 2.x |
| Window Watchdog | Yes (SPI-configurable) | Yes | Yes (enhanced) | Yes | Yes |
| AEC-Q100 | Qualified | Qualified | Qualified | Qualified | Qualified |
Principaux différenciateurs
- 5V/250mA integrated LDO eliminates external regulator (vs Discrete 5V LDO (e.g., TLS810A1LDV33XUMA1) + standalone CAN transceiver)
- Integrated CAN-FD + LIN + Window Watchdog in PG-VQFN-48-79 (vs Discrete TLE7259-3GE (LIN/CAN) + external MCU watchdog circuit)
- AEC-Q100 qualified with 40V load-dump tolerance (vs Industrial-grade SBC (e.g., MAX17620 family))
Notes de conception
Decouple VBAT with a 100nF ceramic capacitor placed within 5 mm of the pin. Add a bulk aluminum-polymer or tantalum capacitor (>=22uF) at the module input for load-dump handling. The 5V VCC output requires a 4.7uF to 10uF ceramic output capacitor; ESR must remain below 50 mOhm across temperature to maintain stability. Place reverse-polarity and load-dump protection per ISO 7637-2 externally.
The PG-VQFN-48-79 package uses an exposed thermal pad that must be soldered to a thermal pad on the PCB with at least 6 thermal vias (300 um pitch) to an inner copper plane. Without adequate thermal dissipation, the 5V LDO derates at high ambient temperatures; the device protects itself with thermal shutdown above ~175 C junction. Estimated: at 250mA load with VIN=12V and VCC=5V, dissipation is ~1.75W; on a 2s2p JEDEC board the pad supports this without forced air.
Route the CANH/CANL bus lines as a differential pair with 100-ohm impedance, 10 mm to 20 mm stub length maximum, and a single common-mode choke near the connector. Keep LIN away from the SPI traces. The exposed thermal pad must be continuous copper under the IC and stitched with at least 6 thermal vias to an inner plane. Refer to Infineon application note 'OPTIREG SBC PCB Layout Recommendations' for the reference layout.
Do not float the WK pin - either tie it to GND or to VBAT through a debounce network; a floating WK pin can cause unintended wake events. Ensure the SPI VIO supply matches the host MCU voltage level (3.3V or 5V); a mismatch can damage the SDI pin. Always configure the watchdog window via SPI during MCU firmware initialization - leaving the watchdog in default state can trigger unintended resets.
Informations de conformité
AEC-Q100 qualified per Infineon datasheet. RoHS and REACH compliant. Lead-free reflow (JEDEC J-STD-020).
