TMS320C6678ACYPA - Octo-Core C66x DSP 1.25GHz | Texas Instruments
부품 번호: TMS320C6678ACYPA ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $334.69 | $334.69 |
| 10 | $317.96 | $3,179.60 |
| 100 | $285.49 | $28,549.00 |
| 500 | $261.06 | $130,530.00 |
| 1,000 | $226.49 | $226,490.00 |
TMS320C6678ACYPA 개요
A digital signal processor is a specialized microprocessor optimized for real-time numerical computation such as filtering, FFT, and convolution. The C66x core combines fixed-point and floating-point execution, spanning the hierarchy from single-core DSPs up to multicore system-on-chips. Within the broader power/performance hierarchy, this DSP delivers real-time throughput above general-purpose processors while retaining full C-programmability, and it complements FPGAs in high-throughput signal chains.
Key features include eight C66x cores with 32-/64-bit architecture, 4 MB of on-chip L2 memory, 32 KB L1P and 32 KB L1D per core, and a 64-bit DDR3 external memory interface. Multicore navigation peripherals - Hyperlink, SRIO, and EMAC - enable efficient inter-processor communication and high-bandwidth I/O for data-intensive workloads.
Technically, the KeyStone architecture provides a high-bandwidth internal interconnect (TeraNet) so cores share data without bottlenecks. The C66x instruction set includes advanced FFT and Viterbi acceleration instructions, boosting throughput for communication physical-layer processing, radar pulse compression, and beamforming with high dynamic-range floating-point math.
Typical applications include radar and sonar processing, medical imaging (MRI, CT reconstruction), test and measurement instrumentation, industrial machine vision, and high-performance embedded computing. Floating-point capability suits algorithms demanding wide dynamic range, while the octo-core design scales performance by task distribution.
Design consideration: power dissipation is significant at 1.25 GHz operation. Provide dedicated heatsinking and airflow, sequence the core, I/O, and SerDes rails correctly, and use clean PLL supply filtering per TI datasheet (SPRS691) layout guidance.
This page synthesizes distributor pricing, drop-in speed-grade alternatives, design notes, and FAQ content not found together in the manufacturer datasheet.
드롭인 대체품: TMS320C6678ACYPA — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: TMS320C6678ACYPA (동일 폼 팩터 및 풋프린트) — 차이점: Package, Mounting Type, Core Architecture, External Memory Interface, Number of Cores.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
TMS320C6678ACYP
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
TMS320C6678ACYPA25
✅ 드롭인✓ 재고 있음
$410.42 / 개
데이터시트 보기 →TMS320C6678ACYP25
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TMS320C6678CYPAM25
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TMS320C6678ACYPA 사양
| Core Type | C66x fixed/floating-point DSP |
| Number of Cores | 8 |
| 최대 클록 주파수 | 1.25 GHz |
| Aggregate Performance | up to 10 GHz (octo-core) |
| Architecture | KeyStone multicore SoC |
| On-Chip L2 Memory | 4 MB |
| L1 Memory per Core | 32 KB L1P + 32 KB L1D |
| External Memory Interface | 64-bit DDR3 |
| Peripherals | Hyperlink, SRIO, EMAC, EMIF16 |
| 동작 온도 | -40C to +100C |
| 패키지 | 841-pin FCBGA (CYP), 24x24 mm |
| 실장 유형 | Surface Mount |
| Speed Grade Code | ACY = 1.0 GHz to 1.25 GHz family |
TMS320C6678ACYPA 841-pin fcbga (cyp), 24x24 mm 핀 구성 가이드
TMS320C6678ACYPA(841-pin fcbga (cyp), 24x24 mm 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: TMS320C6678ACYPA.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
TMS320C6678ACYPA 적합 용도: 6 애플리케이션s: Radar and Sonar Processing, Medical Imaging (MRI/CT Reconstruction), Test and Measurement Instrumentation, Industrial Machine Vision, Telecom Baseband and Wireless Infrastructure, High-Performance Embedded Computing.
Radar and Sonar Processing
The TMS320C6678ACYPA fits radar and sonar processing because its eight C66x cores provide up to 10 GHz of aggregate throughput, hardware-accelerated FFT and Viterbi instructions, and wide-dynamic-range floating-point math essential for pulse compression, Doppler processing, and beamforming. Its 64-bit DDR3 interface sustains high sustained data rates from multi-channel receivers, while SRIO moves digitized samples to and from FPGAs at multi-gigabit rates. The part runs the full detection chain in C code, shortening development versus RTL designs, and its -40C to +100C rating suits rugged defense platforms.
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Medical Imaging (MRI/CT Reconstruction)
The TMS320C6678ACYPA suits medical imaging reconstruction because the C66x floating-point pipeline executes FFT-heavy k-space and filtered back-projection algorithms with the dynamic range diagnostic imaging demands. Eight cores allow k-space data to be partitioned across processors, and 4 MB of shared L2 plus the TeraNet interconnect keep intermediate datasets on-chip, reducing DDR3 bandwidth bottlenecks during reconstruction loops. The 64-bit DDR3 interface streams large volumetric datasets, and the industrial -40C to +100C operating range supports the thermally varied environment of imaging cabinets with forced airflow.
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Test and Measurement Instrumentation
The TMS320C6678ACYPA fits test and measurement instrumentation because its floating-point C66x cores perform real-time waveform analysis, filtering, and demodulation at sustained multi-gigaflop rates. Eight independent cores let one device run acquisition preprocessing, trigger detection, and analysis simultaneously, while SRIO and Hyperlink provide high-bandwidth links between the analog front end and the processing stage. The 1 GHz per core rating delivers deterministic real-time latency that general-purpose CPUs cannot match, and the industrial temperature rating supports bench and field instruments alike.
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Industrial Machine Vision
The TMS320C6678ACYPA is used in machine vision for real-time image preprocessing such as convolution, histogram analysis, and feature extraction at frame rates beyond what single-core processors achieve. Its octo-core architecture splits the image across cores for line-scan and area-scan pipelines, and floating-point capability preserves accuracy in lens correction and color conversion. The 64-bit DDR3 interface buffers multiple high-resolution frames, and EMAC ports connect directly to GigE Vision style networking. Its -40C to +100C rating allows fanless industrial enclosures at reduced clock rates.
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Telecom Baseband and Wireless Infrastructure
The TMS320C6678ACYPA was designed for wireless base station physical-layer processing: the C66x instruction set's FFT, Viterbi, and turbo-style acceleration instructions map directly onto LTE-style OFDM modulation, channel estimation, and decoding workloads. Eight cores scale by assigning per-carrier or per-user processing tasks, while Hyperlink enables multi-device baseband clustering with low protocol overhead. The 64-bit DDR3 interface handles control-plane buffering, and SRIO connects to standard baseband fronthaul fabrics. The commercial/industrial grades let system integrators match the ACYPA rating to outdoor cabinet requirements.
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High-Performance Embedded Computing
For high-performance embedded computing (HPEC) boards such as 3U/6U VPX processing cards, the TMS320C6678ACYPA delivers dense floating-point compute with predictable real-time behavior. Multiple C6678 devices are clustered over Hyperlink and SRIO on a single board to build scalable processing payloads for defense and aerospace computing. The 841-ball FCBGA package maximizes I/O density per board area, the TeraNet fabric keeps inter-core communication off external buses, and the -40C to +100C rating of the ACYPA grade supports conduction-cooled rugged enclosures common in HPEC deployments.
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추천 제품 요약
엔지니어링 참조 데이터: TMS320C6678ACYPA — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | TMS320C6678ACYP | TMS320C6678ACYPA25 | TMS320C6678ACYP25 |
|---|---|---|---|---|
| Package | 841-pin FCBGA (CYP), 24x24 mm | 841-pin FCBGA (CYP) - same | 841-pin FCBGA (CYP) - same | 841-pin FCBGA (CYP) - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Number of Cores | 8 (C66x) | 8 (C66x) | 8 (C66x) | 8 (C66x) |
| Operating Temperature | -40C to +100C | 0C to +85C (commercial) | -40C to +100C | 0C to +85C (commercial) |
| L2 Memory | 4 MB | 4 MB | 4 MB | 4 MB |
| External Memory Interface | 64-bit DDR3 | 64-bit DDR3 | 64-bit DDR3 | 64-bit DDR3 |
주요 차별점
- Extended temperature range for rugged platforms (vs TMS320C6678ACYP)
- Cost-optimized speed grade (vs TMS320C6678ACYPA25)
- Floating-point throughput density (vs DSPB56720CAG)
설계 노트
The TMS320C6678ACYPA requires multiple supply rails (core, I/O, SerDes, PLL) with correct power sequencing per TI datasheet SPRS691. Use TI-recommended PMIC or point-of-load sequencing so the core rail comes up in the documented order relative to I/O to avoid latch-up or degraded reliability. Estimated: core current at 1.0-1.25 GHz depends heavily on utilization; use TI's Power Estimation Tool with your workload profile before selecting regulators, and allow at least 20% headroom on the core rail.
Power dissipation is significant at full clock rates on this 24x24 mm 841-ball FCBGA. Provide a dedicated heatsink with forced airflow over the lid, and verify the junction temperature stays below the datasheet maximum across your worst-case workload. Estimated: thermal resistance values depend on the exact CYP package specification in SPRS691; model board-level conduction through the BGA balls to the PCB as part of the thermal stack, not just the top-side heatsink path.
Route the 64-bit DDR3 interface with length-matched, tightly coupled trace pairs and follow the TI datasheet layout guidance on fly-by topology and reference planes. Filter each PLL supply pin with dedicated RC networks and keep PLL routing away from SerDes and DDR3 switching regions. Use TI reference designs (e.g., EVM schematics for the C6678) as the baseline for ball escapes, SerDes AC coupling, and JTAG/emulation header placement before customizing.
Do not substitute the commercial-grade ACYP into designs exposed below 0C or above +85C - the ACYPA's -40C to +100C rating is the reason to specify it. Also, boot configuration pins are strap-sampled at reset; incorrect pull resistor settings are the most common bring-up failure on C6678 boards. Verify boot mode, endian, and SerDes reference clock straps against the boot configuration table in SPRS691 before first power-on.
규정 준수 정보
Compliance data not present in the verified web data; consult TI's product page Quality & Environmental section for material declarations.
