TMS320C6678ACYPA25 - Octo-Core C66x DSP 1.25GHz | Texas Instruments
MPN: TMS320C6678ACYPA25 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $548.24 | $548.24 |
| 10 | $520.83 | $5,208.30 |
| 100 | $479.16 | $47,916.00 |
| 500 | $437.49 | $218,745.00 |
| 1,000 | $410.42 | $410,420.00 |
TMS320C6678ACYPA25 Overview
A digital signal processor (DSP) is a specialized microprocessor whose architecture is optimized for the numeric-intensive, real-time workloads that general-purpose CPUs handle inefficiently — FIR/IIR filtering, FFTs, convolutions, matrix math, and baseband signal processing. The C66x family combines VLIW (very-long-instruction-word) dispatch with SIMD (single-instruction multiple-data) lanes, so each core can issue multiple parallel MACs per clock and process packed 16-bit or 32-bit data words in a single cycle. Fixed-point and IEEE-754 floating-point arithmetic are both native, eliminating scaling overhead. Compared to a generic microcontroller, the C66x delivers orders-of-magnitude higher throughput per watt for DSP kernels while still offering cache-coherent multi-core shared memory and a standard ARM-style toolchain.
Key features of the TMS320C6678ACYPA25 include eight C66x cores at 1.25 GHz, 32 KB of L1 program cache and 32 KB of L1 data cache per core, 512 KB of configurable L2 cache per core with full ECC support, four lanes of Serial RapidIO v2.1, two PCIe Gen2 endpoints/root-complex ports, a HyperLink 50-Gbaud companion interface, dual SGMII Gigabit Ethernet MACs, I2C, SPI, UART, GPIO, sixteen 64-bit timers, and a 64-bit DDR3 EMIF with ECC supporting up to 8 GB of addressable memory.
The device uses TI's 40-nm CMOS process and operates on a 1.0 V core rail with 1.5 V / 1.8 V I/O, drawing roughly 5–10 W under typical loads depending on core utilization and clock gating. On-die thermal sensors and per-core power-down modes let systems trade throughput against power for thermal envelopes in air-cooled chassis.
Typical applications include LTE and WiMAX baseband processing, medical imaging (ultrasound beamforming, MRI reconstruction), military radar and electronic-warfare processing, test-and-measurement instrumentation, oil-and-gas seismic processing, and high-performance embedded computing payloads in aerospace and industrial systems. The HyperLink and Serial RapidIO fabrics also make the device a drop-in DSP node for heterogeneous multiprocessor boards using TI's Keystone multiprocessor topology.
When designing with the TMS320C6678ACYPA25, allocate proper power-rail decoupling (low-ESL ceramics at every VDDS rail), enforce matched-length routing on the DDR3 byte lanes, and provide an external heat spreader or heatsink because the 841-ball FCBGA typically dissipates more than 5 W under sustained load. Use TI's MCSDK / Processor SDK to leverage validated board-support packages and BIOS real-time kernel examples.
This page synthesizes distributor pricing, drop-in alternatives within the TMS320C66x family, and practical hardware design notes not found in the manufacturer datasheet, giving engineers an at-a-glance comparison set for procurement and architecture decisions.
Drop-in alternatives for TMS320C6678ACYPA25 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with TMS320C6678ACYPA25 (same form factor and footprint) — differing in External Memory Interface, Mounting Type, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TMS320C6678ACYPA
✅ Drop-In✓ In Stock
$226.49 / Unit
View Datasheet →TMS320C6678ACYPA20
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TMS320C6678ACYP4
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TMS320C6674ACYPA25
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TMS320C6672ACYPA25
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
TMS320C6678ACYPA25 Specifications
| Device Type | Digital Signal Processor (DSP) - Fixed/Floating Point |
| Core Architecture | C66x (8 cores) |
| Maximum Core Frequency | 1.25 GHz |
| Package | FCBGA-841 (CYP) 24x24 mm |
| Operating Temperature Range | -40 C to +100 C |
| L1 Program Cache (per core) | 32 KB |
| L1 Data Cache (per core) | 32 KB |
| L2 Cache (per core) | 512 KB (configurable as cache/SRAM, with ECC) |
| External Memory Interface | 64-bit DDR3 EMIF with ECC, up to 8 GB addressable |
| High-Speed Serial Interfaces | 4x Serial RapidIO v2.1, 2x PCIe Gen2, HyperLink (50 Gbaud), 2x SGMII Gigabit Ethernet |
| Other Peripherals | I2C, SPI, UART, GPIO, 16x 64-bit timers, EMIF16 (NAND/NOR), Telecom Serial Interface Port |
| Process Technology | 40 nm CMOS |
| Core Supply Voltage | 1.0 V |
| I/O Supply Voltages | 1.5 V / 1.8 V |
| Approximate Power Dissipation | 5-10 W typical load (depends on core activity) |
| ECC Support | Yes (L2 cache, DDR3 EMIF) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
TMS320C6678ACYPA25 fcbga-841 (cyp) 24x24 mm Pin Configuration Guide
Pin configuration for TMS320C6678ACYPA25 (fcbga-841 (cyp) 24x24 mm package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for TMS320C6678ACYPA25.
Refer to the datasheet for full pin configuration.
Typical Applications
TMS320C6678ACYPA25 is suitable for 6 applications: LTE / 4G Baseband Processing, Medical Imaging (Ultrasound / MRI), Military Radar / Electronic Warfare, Test & Measurement Instrumentation, Oil & Gas Seismic Processing, High-Performance Industrial Embedded Computing.
LTE / 4G Baseband Processing
The TMS320C6678ACYPA25 is well-suited for LTE and LTE-Advanced baseband processing because its eight C66x cores deliver up to 320 GMACs of fixed-point throughput at 1.25 GHz, sufficient for multi-antenna MIMO receiver chains and 100 MHz carrier aggregation. The on-die Serial RapidIO v2.1 and HyperLink interfaces let multiple TMS320C6678 nodes scale to macro-cell capacities, while the 64-bit DDR3 EMIF with ECC handles multi-gigabit IQ sample streams without bottleneck. Per TI's C66x baseband reference designs, the device typically sits between the RF front-end (ADC/DAC) and the L2/L3 protocol stack, performing channel estimation, FFT/iFFT, and turbo/Viterbi decoding. Compared with a CPU-only solution, the C66x SIMD lanes execute FFTs and Viterbi kernels 5-10x more efficiently per watt.
Recommended
Medical Imaging (Ultrasound / MRI)
The TMS320C6678ACYPA25 is widely used in ultrasound beamforming and MRI reconstruction because its SIMD DSP architecture executes channel-domain beamforming, FIR filtering, and 2D/3D FFT reconstruction at near-real-time rates. Eight C66x cores allow parallel processing of 64-128 receive channels with per-sample-rate decimators, and the dedicated HyperLink port enables tiling multiple TMS320C6678 chips for higher channel-count carts. At 1.0 V core supply, the device consumes roughly 5-10 W which fits within typical cart-mounted thermal envelopes. Per TI's medical-imaging reference designs, the DSP is paired with high-speed ADC front-ends and DDR3 buffers, then hands reconstructed pixel data over PCIe to a host SoC for display rendering.
Recommended
Military Radar / Electronic Warfare
The TMS320C6678ACYPA25 targets military radar and electronic-warfare processing where its eight 1.25 GHz C66x cores deliver floating-point pulse-Doppler, SAR, and digital-RF compute at the system level. The four Serial RapidIO lanes and HyperLink companion interface let multiple TMS320C6678 nodes be ganged into tile-based architectures for phased-array beamforming, while the -40 C to +100 C operating range covers most ground-mobile and shipboard environments. Per TI's defense-reference designs, the device is paired with high-speed JESD204B ADC/DAC converters and low-latency DDR3 buffers, with rapid task migration enabled by the multicore shared-memory controller. ECC on L2 and DDR3 also helps meet safety-critical reliability targets.
Recommended
Test & Measurement Instrumentation
The TMS320C6678ACYPA25 fits modular test-and-measurement instruments (spectrum analyzers, vector signal analyzers, real-time oscilloscopes) because its eight C66x cores can sustain FFTs, demodulation, and modulation-error-rate computations at multi-GHz sample rates. The dual SGMII Gigabit Ethernet and PCIe Gen2 interfaces give the instrument a clean path to backplane aggregation, while the DDR3 EMIF with ECC supports long acquisition captures. Per TI's T&M reference designs, the device is paired with a JESD204B ADC front-end and a host FPGA that routes trigger, gating, and timestamp signals. The multicore shared memory lets software assign per-core DSP kernels (acquisition, demod, display) without contention.
Recommended
Oil & Gas Seismic Processing
The TMS320C6678acyPA25 is used in downhole and surface seismic systems because its eight C66x cores execute seismic migration, deconvolution, and noise-attenuation kernels at near-real-time rates, and the 841-ball FCBGA tolerates industrial -40 C to +100 C operating environments. The HyperLink and Serial RapidIO fabrics let seismic subsystems chain multiple TMS320C6678 boards into larger compute farms over ruggedized backplanes. Per TI's seismic reference designs, the DSP is paired with multi-channel 24-bit sigma-delta ADCs and large DDR3 buffers, with results streamed to host PCs for stacking and migration. ECC on L2 and DDR3 also helps meet long-deployment data-integrity targets.
Recommended
High-Performance Industrial Embedded Computing
The TMS320C6678ACYPA25 serves high-performance industrial embedded computing payloads where deterministic DSP performance is required alongside rich peripheral connectivity. Eight C66x cores handle deterministic motion-control loops, machine-vision pre-processing, and predictive-maintenance FFTs, while dual Gigabit Ethernet, PCIe Gen2, and Serial RapidIO provide the board-level fabric to industrial networking and control backplanes. Per TI's industrial-control reference designs, the device is paired with isolated digital I/O and industrial Ethernet PHYs, running SYS/BIOS or Linux on the host SoC for supervisory logic. ECC on DDR3 and L2 helps meet long-lifecycle reliability targets in factory-automation deployments.
Recommended
Recommended Products Summary
Engineering reference data for TMS320C6678ACYPA25 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TMS320C6678ACYP | TMS320C6678ACYPA20 | TMS320C6678ACYP4 | TMS320C6674ACYPA25 | TMS320C6672ACYPA25 |
|---|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | FCBGA-841 (CYP) 24x24 mm | FCBGA-841 (CYP) 24x24 mm - same | FCBGA-841 (CYP) 24x24 mm - same | FCBGA-841 (CYP) 24x24 mm - same | FCBGA-841 (CYP) 24x24 mm - same | FCBGA-841 (CYP) 24x24 mm - same |
| Core Count | 8 C66x cores | 8 C66x cores | 8 C66x cores | 8 C66x cores | 4 C66x cores | 2 C66x cores |
| Maximum Core Frequency | 1.25 GHz | 1.25 GHz | 1.0 GHz (-20%) | 1.25 GHz | 1.25 GHz | 1.25 GHz |
| Aggregate L2 Cache | 4 MB (8 x 512 KB) | 4 MB | 4 MB | 4 MB | 2 MB (-50%) | 1 MB (-75%) |
| Serial RapidIO Lanes | 4x SRIO v2.1 | 4x SRIO v2.1 | 4x SRIO v2.1 | 4x SRIO v2.1 | 4x SRIO v2.1 | 4x SRIO v2.1 |
| PCIe Gen2 Ports | 2 | 2 | 2 | 2 | 2 | 2 |
| HyperLink | Yes (50 Gbaud) | Yes (50 Gbaud) | Yes (50 Gbaud) | Yes (50 Gbaud) | Yes (50 Gbaud) | Yes (50 Gbaud) |
| DDR3 EMIF | 64-bit with ECC, up to 8 GB | 64-bit with ECC, up to 8 GB | 64-bit with ECC, up to 8 GB | 64-bit with ECC, up to 8 GB | 64-bit with ECC, up to 8 GB | 64-bit with ECC, up to 8 GB |
| Operating Temperature | -40 C to +100 C | -40 C to +100 C | -40 C to +100 C | Extended | -40 C to +100 C | -40 C to +100 C |
Key Differentiators
- Highest DSP compute density in the TI Keystone CYP family (vs TMS320C6674ACYPA25)
- Same package across the speed grade family preserves layout investment (vs TMS320C6678ACYPA20)
- Standard 1.25 GHz speed grade vs extended screening (vs TMS320C6678ACYP4)
Design Notes
The TMS320C6678ACYPA25 in the CYP 841-FCBGA package typically dissipates 5-10 W under sustained DSP load across all eight cores. Estimated: at 8 W dissipation and a typical theta_JA of ~5-6 C/W (CYP BGA with minimal PCB copper), junction temperature rise can reach 40-50 C above ambient. Provide a heat spreader or heatsink with thermal interface material, and ensure sufficient airflow in chassis designs targeting industrial 70 C ambient. Use the on-die thermal sensor with TI's SmartReflex dynamic voltage/frequency scaling to throttle gracefully under thermal limits.
The 841-ball CYP package at 24x24 mm requires a high-layer-count PCB (typically 10+ layers) with microvia-in-pad technology for breakout. Per TI's Keystone CYP layout guidelines, route the DDR3 byte lanes with matched-length within tight tolerances and use length-matching for the Serial RapidIO and HyperLink differential pairs. Place low-ESL ceramic decoupling capacitors as close as possible to every VDDS supply ball, and provide solid ground planes beneath the CYP footprint to control return paths for high-speed interfaces.
Design the power-supply tree for the TMS320C6678ACYPA25 with a 1.0 V core rail capable of delivering at least 8 A (recommend 10 A peak with margin) and a separate 1.5 V/1.8 V I/O rail. Use a multi-phase PWM controller with inductor DCR current sensing for the core rail to minimize switching noise. Place bulk decoupling (e.g., 470 uF polymer) near the CYP package and add 22 uF + 100 nF + 10 nF ceramic decoupling at every VDDS pin pair. The SmartReflex voltage scaling interface requires accurate voltage feedback - avoid series ferrite beads on the SmartReflex rail.
Maintain 100 ohm differential impedance for the Serial RapidIO, PCIe Gen2, and HyperLink pairs, and 90 ohm for the SGMII Ethernet pairs. Keep AC coupling capacitors on the high-speed serial links within 200 mils of the DSP balls, and use reference planes with continuous return paths. For DDR3, follow JEDEC DDR3 fly-by topology recommendations and place VTT termination voltage at the middle of the memory channel to avoid simultaneous-switching noise. Always validate with IBIS-AMI simulations before tape-out.
Common pitfalls with the TMS320C6678ACYPA25 include: (1) forgetting to configure SmartReflex properly leads to thermal runaway under load; (2) booting from NOR without a valid IBL (intermediate boot loader) image halts the device; (3) using the wrong CYP ball map variant (the CYP vs ACYP package symbols are not identical) causes routing errors; (4) underestimating PCB layer count leads to DDR3 timing violations; (5) not connecting unused balls to ground or supply per the datasheet introduces floating pins and EMC issues.
Compliance Information
RoHS compliant per TI product page. Not AEC-Q100 qualified - this part is targeted at industrial and defense designs, not automotive. Lead-free and halogen-free per TI's environmental compliance program.
